CN106575720B - 具有保护覆盖物的基板载体系统 - Google Patents

具有保护覆盖物的基板载体系统 Download PDF

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Publication number
CN106575720B
CN106575720B CN201580024181.4A CN201580024181A CN106575720B CN 106575720 B CN106575720 B CN 106575720B CN 201580024181 A CN201580024181 A CN 201580024181A CN 106575720 B CN106575720 B CN 106575720B
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China
Prior art keywords
substrate
substrate carrier
electrode
protective layer
group
Prior art date
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Expired - Fee Related
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CN201580024181.4A
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English (en)
Chinese (zh)
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CN106575720A (zh
Inventor
王作乾
J·M·怀特
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN106575720A publication Critical patent/CN106575720A/zh
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Publication of CN106575720B publication Critical patent/CN106575720B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201580024181.4A 2014-05-09 2015-04-02 具有保护覆盖物的基板载体系统 Expired - Fee Related CN106575720B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461991350P 2014-05-09 2014-05-09
US61/991,350 2014-05-09
PCT/US2015/024147 WO2015171226A1 (en) 2014-05-09 2015-04-02 Substrate carrier system with protective covering

Publications (2)

Publication Number Publication Date
CN106575720A CN106575720A (zh) 2017-04-19
CN106575720B true CN106575720B (zh) 2019-01-15

Family

ID=54392836

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580024181.4A Expired - Fee Related CN106575720B (zh) 2014-05-09 2015-04-02 具有保护覆盖物的基板载体系统

Country Status (6)

Country Link
US (1) US10096509B2 (enExample)
JP (1) JP2017515301A (enExample)
KR (1) KR20170002603A (enExample)
CN (1) CN106575720B (enExample)
TW (1) TW201606902A (enExample)
WO (1) WO2015171226A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110199384B (zh) * 2017-01-31 2020-08-14 应用材料公司 处理基板的方法及用于保持基板的基板载体
CN108738365B (zh) * 2017-02-24 2022-03-01 应用材料公司 用于真空系统中使用的载体、用于真空处理的系统、和用于基板的真空处理的方法
KR20190087996A (ko) * 2017-09-05 2019-07-25 어플라이드 머티어리얼스, 인코포레이티드 마스크 디바이스를 핸들링하는 방법들, 마스크 디바이스를 교환하기 위한 장치, 마스크 교환 챔버, 및 진공 시스템
KR20190062380A (ko) * 2017-11-23 2019-06-05 어플라이드 머티어리얼스, 인코포레이티드 기판을 지지하기 위한 기판 캐리어, 마스크 척킹 장치, 진공 프로세싱 시스템, 및 기판 캐리어를 동작시키는 방법
KR20190114216A (ko) * 2018-03-29 2019-10-10 어플라이드 머티어리얼스, 인코포레이티드 정전척 및 기판처리장치
CN112534636A (zh) * 2018-08-21 2021-03-19 应用材料公司 在用于电池的隔板上的超薄陶瓷涂层
US11586160B2 (en) * 2021-06-28 2023-02-21 Applied Materials, Inc. Reducing substrate surface scratching using machine learning

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101030550A (zh) * 2006-03-03 2007-09-05 日本碍子株式会社 静电吸盘及其制造方法
CN101261952A (zh) * 2007-03-06 2008-09-10 东京毅力科创株式会社 基板载置台以及基板处理装置
JP2013197465A (ja) * 2012-03-22 2013-09-30 Toshiba Corp 静電チャック装置および露光装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3095790B2 (ja) 1991-01-22 2000-10-10 富士電機株式会社 静電チャック
JPH09151362A (ja) * 1995-11-30 1997-06-10 Honda Electron Co Ltd 保護用積層粘着フィルム
JP3847855B2 (ja) * 1996-07-31 2006-11-22 三島 満 抗菌、抗カビ、抗汚染性を有する多層剥離再生型保護シート
JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP2001035907A (ja) * 1999-07-26 2001-02-09 Ulvac Japan Ltd 吸着装置
KR20020046214A (ko) 2000-12-11 2002-06-20 어드밴스드 세라믹스 인터내셔날 코포레이션 정전척 및 그 제조방법
JP2003060020A (ja) * 2001-06-07 2003-02-28 Komatsu Ltd 静電チャック装置
JP2002357838A (ja) 2001-05-31 2002-12-13 Hitachi Industries Co Ltd 基板貼り合わせ方法及びその装置
JP4166449B2 (ja) * 2001-07-30 2008-10-15 株式会社アルバック 真空処理装置
JP2003179128A (ja) 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 静電チャック
JP2003243493A (ja) 2002-02-15 2003-08-29 Taiheiyo Cement Corp 双極型静電チャック
US7916447B2 (en) 2003-07-08 2011-03-29 Future Vision Inc. Electrostatic chuck for substrate stage, electrode used for the chuck, and treating system having the chuck and electrode
US20070223173A1 (en) 2004-03-19 2007-09-27 Hiroshi Fujisawa Bipolar Electrostatic Chuck
WO2006001425A1 (ja) * 2004-06-28 2006-01-05 Kyocera Corporation 静電チャック
JP4825220B2 (ja) 2005-12-06 2011-11-30 株式会社クリエイティブ テクノロジー 静電チャック用電極シート及び静電チャック
US20080062609A1 (en) 2006-08-10 2008-03-13 Shinji Himori Electrostatic chuck device
US7989022B2 (en) 2007-07-20 2011-08-02 Micron Technology, Inc. Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
JP5112808B2 (ja) 2007-10-15 2013-01-09 筑波精工株式会社 静電型補強装置
JP2010034510A (ja) * 2008-07-02 2010-02-12 Murata Mfg Co Ltd 静電チャック
US8730644B2 (en) 2008-07-08 2014-05-20 Creative Technology Corporation Bipolar electrostatic chuck
JP2009088558A (ja) * 2008-12-22 2009-04-23 Canon Anelva Corp 静電チャック装置
KR101001454B1 (ko) 2009-01-23 2010-12-14 삼성모바일디스플레이주식회사 정전척 및 이를 구비한 유기전계발광 소자의 제조장치
WO2011137373A2 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Vertical inline cvd system
EP2649218B1 (en) 2010-12-08 2017-08-23 Evatec AG Apparatus and method for depositing a layer onto a substrate
US20120227886A1 (en) * 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
JP5665679B2 (ja) * 2011-07-14 2015-02-04 住友重機械工業株式会社 不純物導入層形成装置及び静電チャック保護方法
JP2013163837A (ja) * 2012-02-09 2013-08-22 Canon Tokki Corp 蒸着装置並びに蒸着装置を用いた成膜方法
KR102047001B1 (ko) 2012-10-16 2019-12-03 삼성디스플레이 주식회사 정전 척
US9740111B2 (en) 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
US10978334B2 (en) 2014-09-02 2021-04-13 Applied Materials, Inc. Sealing structure for workpiece to substrate bonding in a processing chamber

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101030550A (zh) * 2006-03-03 2007-09-05 日本碍子株式会社 静电吸盘及其制造方法
CN101261952A (zh) * 2007-03-06 2008-09-10 东京毅力科创株式会社 基板载置台以及基板处理装置
JP2013197465A (ja) * 2012-03-22 2013-09-30 Toshiba Corp 静電チャック装置および露光装置

Also Published As

Publication number Publication date
JP2017515301A (ja) 2017-06-08
TW201606902A (zh) 2016-02-16
KR20170002603A (ko) 2017-01-06
US10096509B2 (en) 2018-10-09
US20180166316A1 (en) 2018-06-14
WO2015171226A1 (en) 2015-11-12
CN106575720A (zh) 2017-04-19

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