CN106575720B - 具有保护覆盖物的基板载体系统 - Google Patents

具有保护覆盖物的基板载体系统 Download PDF

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Publication number
CN106575720B
CN106575720B CN201580024181.4A CN201580024181A CN106575720B CN 106575720 B CN106575720 B CN 106575720B CN 201580024181 A CN201580024181 A CN 201580024181A CN 106575720 B CN106575720 B CN 106575720B
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China
Prior art keywords
substrate
substrate carrier
protective layer
electrode
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201580024181.4A
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English (en)
Chinese (zh)
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CN106575720A (zh
Inventor
王作乾
J·M·怀特
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Applied Materials Inc
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Applied Materials Inc
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    • H10P72/7616—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10P72/72—
    • H10P72/74—
    • H10P72/7624—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201580024181.4A 2014-05-09 2015-04-02 具有保护覆盖物的基板载体系统 Expired - Fee Related CN106575720B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461991350P 2014-05-09 2014-05-09
US61/991,350 2014-05-09
PCT/US2015/024147 WO2015171226A1 (en) 2014-05-09 2015-04-02 Substrate carrier system with protective covering

Publications (2)

Publication Number Publication Date
CN106575720A CN106575720A (zh) 2017-04-19
CN106575720B true CN106575720B (zh) 2019-01-15

Family

ID=54392836

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580024181.4A Expired - Fee Related CN106575720B (zh) 2014-05-09 2015-04-02 具有保护覆盖物的基板载体系统

Country Status (6)

Country Link
US (1) US10096509B2 (enExample)
JP (1) JP2017515301A (enExample)
KR (1) KR20170002603A (enExample)
CN (1) CN106575720B (enExample)
TW (1) TW201606902A (enExample)
WO (1) WO2015171226A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6533835B2 (ja) * 2017-01-31 2019-06-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板を処理する方法、及び基板を保持するための基板キャリア
CN108738365B (zh) * 2017-02-24 2022-03-01 应用材料公司 用于真空系统中使用的载体、用于真空处理的系统、和用于基板的真空处理的方法
KR20190087996A (ko) * 2017-09-05 2019-07-25 어플라이드 머티어리얼스, 인코포레이티드 마스크 디바이스를 핸들링하는 방법들, 마스크 디바이스를 교환하기 위한 장치, 마스크 교환 챔버, 및 진공 시스템
JP2020503663A (ja) * 2017-11-23 2020-01-30 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板を支持するための基板キャリア、マスクチャッキング装置、真空処理システム、及び基板キャリアを動作させる方法
KR20190114216A (ko) * 2018-03-29 2019-10-10 어플라이드 머티어리얼스, 인코포레이티드 정전척 및 기판처리장치
WO2020037494A1 (en) * 2018-08-21 2020-02-27 Applied Materials, Inc. Ultra-thin ceramic coating on separator for batteries
US11586160B2 (en) * 2021-06-28 2023-02-21 Applied Materials, Inc. Reducing substrate surface scratching using machine learning

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101030550A (zh) * 2006-03-03 2007-09-05 日本碍子株式会社 静电吸盘及其制造方法
CN101261952A (zh) * 2007-03-06 2008-09-10 东京毅力科创株式会社 基板载置台以及基板处理装置
JP2013197465A (ja) * 2012-03-22 2013-09-30 Toshiba Corp 静電チャック装置および露光装置

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JP3095790B2 (ja) 1991-01-22 2000-10-10 富士電機株式会社 静電チャック
JPH09151362A (ja) * 1995-11-30 1997-06-10 Honda Electron Co Ltd 保護用積層粘着フィルム
JP3847855B2 (ja) * 1996-07-31 2006-11-22 三島 満 抗菌、抗カビ、抗汚染性を有する多層剥離再生型保護シート
JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP2001035907A (ja) * 1999-07-26 2001-02-09 Ulvac Japan Ltd 吸着装置
KR20020046214A (ko) 2000-12-11 2002-06-20 어드밴스드 세라믹스 인터내셔날 코포레이션 정전척 및 그 제조방법
JP2003060020A (ja) * 2001-06-07 2003-02-28 Komatsu Ltd 静電チャック装置
JP2002357838A (ja) 2001-05-31 2002-12-13 Hitachi Industries Co Ltd 基板貼り合わせ方法及びその装置
JP4166449B2 (ja) * 2001-07-30 2008-10-15 株式会社アルバック 真空処理装置
JP2003179128A (ja) 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 静電チャック
JP2003243493A (ja) 2002-02-15 2003-08-29 Taiheiyo Cement Corp 双極型静電チャック
WO2005004229A1 (ja) 2003-07-08 2005-01-13 Future Vision Inc. 基板ステージ用静電チャック及びそれに用いる電極ならびにそれらを備えた処理システム
US20070223173A1 (en) 2004-03-19 2007-09-27 Hiroshi Fujisawa Bipolar Electrostatic Chuck
CN100470756C (zh) 2004-06-28 2009-03-18 京瓷株式会社 静电卡盘
CN101326627B (zh) 2005-12-06 2010-06-09 创意科技股份有限公司 静电卡盘用电极片以及静电卡盘
US20080062609A1 (en) 2006-08-10 2008-03-13 Shinji Himori Electrostatic chuck device
US7989022B2 (en) 2007-07-20 2011-08-02 Micron Technology, Inc. Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
JP5112808B2 (ja) 2007-10-15 2013-01-09 筑波精工株式会社 静電型補強装置
JP2010034510A (ja) * 2008-07-02 2010-02-12 Murata Mfg Co Ltd 静電チャック
JP5283699B2 (ja) 2008-07-08 2013-09-04 株式会社クリエイティブ テクノロジー 双極型静電チャック
JP2009088558A (ja) 2008-12-22 2009-04-23 Canon Anelva Corp 静電チャック装置
KR101001454B1 (ko) 2009-01-23 2010-12-14 삼성모바일디스플레이주식회사 정전척 및 이를 구비한 유기전계발광 소자의 제조장치
WO2011137371A2 (en) * 2010-04-30 2011-11-03 Applied Materials, Inc. Vertical inline cvd system
KR101903199B1 (ko) 2010-12-08 2018-10-01 에바텍 아크티엔게젤샤프트 기판 상에 레이어를 증착하는 방법 및 장치
US20120227886A1 (en) * 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
JP5665679B2 (ja) 2011-07-14 2015-02-04 住友重機械工業株式会社 不純物導入層形成装置及び静電チャック保護方法
JP2013163837A (ja) * 2012-02-09 2013-08-22 Canon Tokki Corp 蒸着装置並びに蒸着装置を用いた成膜方法
KR102047001B1 (ko) 2012-10-16 2019-12-03 삼성디스플레이 주식회사 정전 척
US9740111B2 (en) 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
US10978334B2 (en) 2014-09-02 2021-04-13 Applied Materials, Inc. Sealing structure for workpiece to substrate bonding in a processing chamber

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101030550A (zh) * 2006-03-03 2007-09-05 日本碍子株式会社 静电吸盘及其制造方法
CN101261952A (zh) * 2007-03-06 2008-09-10 东京毅力科创株式会社 基板载置台以及基板处理装置
JP2013197465A (ja) * 2012-03-22 2013-09-30 Toshiba Corp 静電チャック装置および露光装置

Also Published As

Publication number Publication date
WO2015171226A1 (en) 2015-11-12
JP2017515301A (ja) 2017-06-08
US10096509B2 (en) 2018-10-09
TW201606902A (zh) 2016-02-16
CN106575720A (zh) 2017-04-19
KR20170002603A (ko) 2017-01-06
US20180166316A1 (en) 2018-06-14

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