TW201606902A - 具有保護覆蓋的基板載體系統 - Google Patents

具有保護覆蓋的基板載體系統 Download PDF

Info

Publication number
TW201606902A
TW201606902A TW104111860A TW104111860A TW201606902A TW 201606902 A TW201606902 A TW 201606902A TW 104111860 A TW104111860 A TW 104111860A TW 104111860 A TW104111860 A TW 104111860A TW 201606902 A TW201606902 A TW 201606902A
Authority
TW
Taiwan
Prior art keywords
substrate
substrate carrier
electrode
protective layer
carrier system
Prior art date
Application number
TW104111860A
Other languages
English (en)
Chinese (zh)
Inventor
王作乾
約翰 懷特
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201606902A publication Critical patent/TW201606902A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW104111860A 2014-05-09 2015-04-14 具有保護覆蓋的基板載體系統 TW201606902A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201461991350P 2014-05-09 2014-05-09

Publications (1)

Publication Number Publication Date
TW201606902A true TW201606902A (zh) 2016-02-16

Family

ID=54392836

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111860A TW201606902A (zh) 2014-05-09 2015-04-14 具有保護覆蓋的基板載體系統

Country Status (6)

Country Link
US (1) US10096509B2 (enExample)
JP (1) JP2017515301A (enExample)
KR (1) KR20170002603A (enExample)
CN (1) CN106575720B (enExample)
TW (1) TW201606902A (enExample)
WO (1) WO2015171226A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI670789B (zh) * 2017-02-24 2019-09-01 Applied Materials, Inc. 用於一真空系統中使用之載體、用以真空處理之系統、及用於一基板之真空處理之方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101952718B1 (ko) * 2017-01-31 2019-02-27 어플라이드 머티어리얼스, 인코포레이티드 기판을 프로세싱하는 방법 및 기판을 홀딩하기 위한 기판 캐리어
WO2019050507A1 (en) * 2017-09-05 2019-03-14 Applied Materials, Inc. METHODS OF MANIPULATING A MASKING DEVICE, APPARATUS FOR EXCHANGING A MASKING DEVICE, MASK EXCHANGING CHAMBER, AND VACUUM SYSTEM
WO2019101319A1 (en) * 2017-11-23 2019-05-31 Applied Materials, Inc. Substrate carrier for supporting a substrate, mask chucking apparatus, vacuum processing system, and method of operating a substrate carrier
KR20190114216A (ko) * 2018-03-29 2019-10-10 어플라이드 머티어리얼스, 인코포레이티드 정전척 및 기판처리장치
KR102657356B1 (ko) 2018-08-21 2024-04-16 어플라이드 머티어리얼스, 인코포레이티드 배터리들을 위한 분리기 상의 초박형 세라믹 코팅
US11586160B2 (en) * 2021-06-28 2023-02-21 Applied Materials, Inc. Reducing substrate surface scratching using machine learning

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3095790B2 (ja) 1991-01-22 2000-10-10 富士電機株式会社 静電チャック
JPH09151362A (ja) * 1995-11-30 1997-06-10 Honda Electron Co Ltd 保護用積層粘着フィルム
JP3847855B2 (ja) * 1996-07-31 2006-11-22 三島 満 抗菌、抗カビ、抗汚染性を有する多層剥離再生型保護シート
JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP2001035907A (ja) * 1999-07-26 2001-02-09 Ulvac Japan Ltd 吸着装置
KR20020046214A (ko) 2000-12-11 2002-06-20 어드밴스드 세라믹스 인터내셔날 코포레이션 정전척 및 그 제조방법
JP2003060020A (ja) * 2001-06-07 2003-02-28 Komatsu Ltd 静電チャック装置
JP2002357838A (ja) 2001-05-31 2002-12-13 Hitachi Industries Co Ltd 基板貼り合わせ方法及びその装置
JP4166449B2 (ja) * 2001-07-30 2008-10-15 株式会社アルバック 真空処理装置
JP2003179128A (ja) 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 静電チャック
JP2003243493A (ja) 2002-02-15 2003-08-29 Taiheiyo Cement Corp 双極型静電チャック
US7916447B2 (en) 2003-07-08 2011-03-29 Future Vision Inc. Electrostatic chuck for substrate stage, electrode used for the chuck, and treating system having the chuck and electrode
DE112005000621B4 (de) 2004-03-19 2019-01-31 Creative Technology Corporation Bipolare elektrostatische Haltevorrichtung
US7586734B2 (en) * 2004-06-28 2009-09-08 Kyocera Corporation Electrostatic chuck
WO2007066572A1 (ja) 2005-12-06 2007-06-14 Creative Technology Corporation 静電チャック用電極シート及び静電チャック
TW200735254A (en) * 2006-03-03 2007-09-16 Ngk Insulators Ltd Electrostatic chuck and producing method thereof
US20080062609A1 (en) 2006-08-10 2008-03-13 Shinji Himori Electrostatic chuck device
JP5059450B2 (ja) * 2007-03-06 2012-10-24 東京エレクトロン株式会社 基板載置台及び基板処理装置
US7989022B2 (en) 2007-07-20 2011-08-02 Micron Technology, Inc. Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto
JP5112808B2 (ja) 2007-10-15 2013-01-09 筑波精工株式会社 静電型補強装置
JP2010034510A (ja) * 2008-07-02 2010-02-12 Murata Mfg Co Ltd 静電チャック
WO2010004915A1 (ja) 2008-07-08 2010-01-14 株式会社クリエイティブ テクノロジー 双極型静電チャック
JP2009088558A (ja) * 2008-12-22 2009-04-23 Canon Anelva Corp 静電チャック装置
KR101001454B1 (ko) 2009-01-23 2010-12-14 삼성모바일디스플레이주식회사 정전척 및 이를 구비한 유기전계발광 소자의 제조장치
KR101796656B1 (ko) * 2010-04-30 2017-11-13 어플라이드 머티어리얼스, 인코포레이티드 수직 인라인 화학기상증착 시스템
CN103261477B (zh) 2010-12-08 2015-09-30 欧瑞康先进科技股份公司 用于向基底上沉积层的设备和方法
US20120227886A1 (en) * 2011-03-10 2012-09-13 Taipei Semiconductor Manufacturing Company, Ltd. Substrate Assembly Carrier Using Electrostatic Force
JP5665679B2 (ja) 2011-07-14 2015-02-04 住友重機械工業株式会社 不純物導入層形成装置及び静電チャック保護方法
JP2013163837A (ja) * 2012-02-09 2013-08-22 Canon Tokki Corp 蒸着装置並びに蒸着装置を用いた成膜方法
JP2013197465A (ja) * 2012-03-22 2013-09-30 Toshiba Corp 静電チャック装置および露光装置
KR102047001B1 (ko) 2012-10-16 2019-12-03 삼성디스플레이 주식회사 정전 척
US9740111B2 (en) 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
US10978334B2 (en) 2014-09-02 2021-04-13 Applied Materials, Inc. Sealing structure for workpiece to substrate bonding in a processing chamber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI670789B (zh) * 2017-02-24 2019-09-01 Applied Materials, Inc. 用於一真空系統中使用之載體、用以真空處理之系統、及用於一基板之真空處理之方法

Also Published As

Publication number Publication date
CN106575720A (zh) 2017-04-19
US20180166316A1 (en) 2018-06-14
JP2017515301A (ja) 2017-06-08
CN106575720B (zh) 2019-01-15
WO2015171226A1 (en) 2015-11-12
KR20170002603A (ko) 2017-01-06
US10096509B2 (en) 2018-10-09

Similar Documents

Publication Publication Date Title
TWI647780B (zh) 基板載體系統及應用其之方法
TW201606902A (zh) 具有保護覆蓋的基板載體系統
KR101876501B1 (ko) 인-시츄 제거 가능한 정전 척
US9463543B2 (en) Electromagnetic chuck for OLED mask chucking
KR101001454B1 (ko) 정전척 및 이를 구비한 유기전계발광 소자의 제조장치
US10460969B2 (en) Bipolar electrostatic chuck and method for using the same
KR102391430B1 (ko) 다이 본딩 장치
WO2017059373A1 (en) Wafer plate and mask arrangement for substrate fabrication
KR20160040656A (ko) 얇은 기판 취급을 위한 정전 캐리어
WO2019101319A1 (en) Substrate carrier for supporting a substrate, mask chucking apparatus, vacuum processing system, and method of operating a substrate carrier
US9082804B2 (en) Triboelectric charge controlled electrostatic clamp
CN114762097A (zh) 一种吸附抓取装置及客体表面加工方法
US20070014073A1 (en) Transfer-ESC based on a wafer
CN204792743U (zh) 处理系统和用于工艺腔室中的基板载体
JP5785862B2 (ja) 静電チャック及びその製造方法、基板温調固定装置
KR102318117B1 (ko) 기판 처리 장치 및 방법
JP2008205509A (ja) 絶縁基板搬送方法、位置合わせ方法
KR100554046B1 (ko) 기판 홀딩장치 및 이를 이용한 박막 제작장치
WO2017211422A1 (en) Method of processing a substrate and substrate carrier system