TW201606902A - 具有保護覆蓋的基板載體系統 - Google Patents

具有保護覆蓋的基板載體系統 Download PDF

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Publication number
TW201606902A
TW201606902A TW104111860A TW104111860A TW201606902A TW 201606902 A TW201606902 A TW 201606902A TW 104111860 A TW104111860 A TW 104111860A TW 104111860 A TW104111860 A TW 104111860A TW 201606902 A TW201606902 A TW 201606902A
Authority
TW
Taiwan
Prior art keywords
substrate
substrate carrier
electrode
protective layer
carrier system
Prior art date
Application number
TW104111860A
Other languages
English (en)
Chinese (zh)
Inventor
王作乾
約翰 懷特
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201606902A publication Critical patent/TW201606902A/zh

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Classifications

    • H10P72/7616—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10P72/72—
    • H10P72/74—
    • H10P72/7624—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW104111860A 2014-05-09 2015-04-14 具有保護覆蓋的基板載體系統 TW201606902A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201461991350P 2014-05-09 2014-05-09

Publications (1)

Publication Number Publication Date
TW201606902A true TW201606902A (zh) 2016-02-16

Family

ID=54392836

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104111860A TW201606902A (zh) 2014-05-09 2015-04-14 具有保護覆蓋的基板載體系統

Country Status (6)

Country Link
US (1) US10096509B2 (enExample)
JP (1) JP2017515301A (enExample)
KR (1) KR20170002603A (enExample)
CN (1) CN106575720B (enExample)
TW (1) TW201606902A (enExample)
WO (1) WO2015171226A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI670789B (zh) * 2017-02-24 2019-09-01 Applied Materials, Inc. 用於一真空系統中使用之載體、用以真空處理之系統、及用於一基板之真空處理之方法

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* Cited by examiner, † Cited by third party
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JP6533835B2 (ja) * 2017-01-31 2019-06-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板を処理する方法、及び基板を保持するための基板キャリア
KR20190087996A (ko) * 2017-09-05 2019-07-25 어플라이드 머티어리얼스, 인코포레이티드 마스크 디바이스를 핸들링하는 방법들, 마스크 디바이스를 교환하기 위한 장치, 마스크 교환 챔버, 및 진공 시스템
JP2020503663A (ja) * 2017-11-23 2020-01-30 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板を支持するための基板キャリア、マスクチャッキング装置、真空処理システム、及び基板キャリアを動作させる方法
KR20190114216A (ko) * 2018-03-29 2019-10-10 어플라이드 머티어리얼스, 인코포레이티드 정전척 및 기판처리장치
WO2020037494A1 (en) * 2018-08-21 2020-02-27 Applied Materials, Inc. Ultra-thin ceramic coating on separator for batteries
US11586160B2 (en) * 2021-06-28 2023-02-21 Applied Materials, Inc. Reducing substrate surface scratching using machine learning

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JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
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WO2005004229A1 (ja) 2003-07-08 2005-01-13 Future Vision Inc. 基板ステージ用静電チャック及びそれに用いる電極ならびにそれらを備えた処理システム
US20070223173A1 (en) 2004-03-19 2007-09-27 Hiroshi Fujisawa Bipolar Electrostatic Chuck
CN100470756C (zh) 2004-06-28 2009-03-18 京瓷株式会社 静电卡盘
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JP2013163837A (ja) * 2012-02-09 2013-08-22 Canon Tokki Corp 蒸着装置並びに蒸着装置を用いた成膜方法
JP2013197465A (ja) * 2012-03-22 2013-09-30 Toshiba Corp 静電チャック装置および露光装置
KR102047001B1 (ko) 2012-10-16 2019-12-03 삼성디스플레이 주식회사 정전 척
US9740111B2 (en) 2014-05-16 2017-08-22 Applied Materials, Inc. Electrostatic carrier for handling substrates for processing
US10978334B2 (en) 2014-09-02 2021-04-13 Applied Materials, Inc. Sealing structure for workpiece to substrate bonding in a processing chamber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI670789B (zh) * 2017-02-24 2019-09-01 Applied Materials, Inc. 用於一真空系統中使用之載體、用以真空處理之系統、及用於一基板之真空處理之方法

Also Published As

Publication number Publication date
WO2015171226A1 (en) 2015-11-12
JP2017515301A (ja) 2017-06-08
CN106575720B (zh) 2019-01-15
US10096509B2 (en) 2018-10-09
CN106575720A (zh) 2017-04-19
KR20170002603A (ko) 2017-01-06
US20180166316A1 (en) 2018-06-14

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