JP2017508303A5 - - Google Patents
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- Publication number
- JP2017508303A5 JP2017508303A5 JP2016561588A JP2016561588A JP2017508303A5 JP 2017508303 A5 JP2017508303 A5 JP 2017508303A5 JP 2016561588 A JP2016561588 A JP 2016561588A JP 2016561588 A JP2016561588 A JP 2016561588A JP 2017508303 A5 JP2017508303 A5 JP 2017508303A5
- Authority
- JP
- Japan
- Prior art keywords
- coating
- region
- thickness
- tapered
- support ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361922451P | 2013-12-31 | 2013-12-31 | |
| US61/922,451 | 2013-12-31 | ||
| US14/218,597 | 2014-03-18 | ||
| US14/218,597 US9330955B2 (en) | 2013-12-31 | 2014-03-18 | Support ring with masked edge |
| PCT/US2014/067367 WO2015102781A1 (en) | 2013-12-31 | 2014-11-25 | Support ring with masked edge |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018176528A Division JP6758353B2 (ja) | 2013-12-31 | 2018-09-20 | マスキングされたエッジを有する支持リング |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017508303A JP2017508303A (ja) | 2017-03-23 |
| JP2017508303A5 true JP2017508303A5 (enExample) | 2018-01-18 |
| JP6408606B2 JP6408606B2 (ja) | 2018-10-17 |
Family
ID=53482656
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016561588A Active JP6408606B2 (ja) | 2013-12-31 | 2014-11-25 | マスキングされたエッジを有する支持リング |
| JP2018176528A Active JP6758353B2 (ja) | 2013-12-31 | 2018-09-20 | マスキングされたエッジを有する支持リング |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018176528A Active JP6758353B2 (ja) | 2013-12-31 | 2018-09-20 | マスキングされたエッジを有する支持リング |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US9330955B2 (enExample) |
| JP (2) | JP6408606B2 (enExample) |
| KR (3) | KR102279150B1 (enExample) |
| CN (2) | CN110223949B (enExample) |
| TW (3) | TWI578437B (enExample) |
| WO (1) | WO2015102781A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2707411B1 (en) * | 2011-05-13 | 2015-09-30 | Dow Global Technologies LLC | Insulation formulations |
| US9330955B2 (en) * | 2013-12-31 | 2016-05-03 | Applied Materials, Inc. | Support ring with masked edge |
| JP2020516770A (ja) | 2017-04-07 | 2020-06-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板端部上のプラズマ密度制御 |
| CN107121892B (zh) * | 2017-04-26 | 2018-12-28 | 武汉华星光电技术有限公司 | 一种基板曝边设备 |
| KR102723235B1 (ko) * | 2018-03-13 | 2024-10-31 | 어플라이드 머티어리얼스, 인코포레이티드 | 플라즈마 분무 코팅을 갖는 지지 링 |
| CN110920254B (zh) | 2018-09-19 | 2021-03-16 | 精工爱普生株式会社 | 打印头控制电路及液体喷出装置 |
| US12134835B2 (en) * | 2021-09-01 | 2024-11-05 | Applied Materials, Inc. | Quartz susceptor for accurate non-contact temperature measurement |
| US20250305141A1 (en) * | 2024-03-27 | 2025-10-02 | Applied Materials, Inc. | Multi-section substrate supports and related methods, process kits, and processing chambers for semiconductor manufacturing |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61217561A (ja) * | 1985-03-25 | 1986-09-27 | Sumitomo Metal Ind Ltd | Ni基合金の製造方法 |
| US5690795A (en) * | 1995-06-05 | 1997-11-25 | Applied Materials, Inc. | Screwless shield assembly for vacuum processing chambers |
| US5884412A (en) * | 1996-07-24 | 1999-03-23 | Applied Materials, Inc. | Method and apparatus for purging the back side of a substrate during chemical vapor processing |
| US5848889A (en) * | 1996-07-24 | 1998-12-15 | Applied Materials Inc. | Semiconductor wafer support with graded thermal mass |
| US6395363B1 (en) * | 1996-11-05 | 2002-05-28 | Applied Materials, Inc. | Sloped substrate support |
| US6530994B1 (en) | 1997-08-15 | 2003-03-11 | Micro C Technologies, Inc. | Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing |
| JP2001522142A (ja) | 1997-11-03 | 2001-11-13 | エーエスエム アメリカ インコーポレイテッド | 改良された低質量ウェハ支持システム |
| US6200388B1 (en) * | 1998-02-11 | 2001-03-13 | Applied Materials, Inc. | Substrate support for a thermal processing chamber |
| US6280183B1 (en) * | 1998-04-01 | 2001-08-28 | Applied Materials, Inc. | Substrate support for a thermal processing chamber |
| US6048403A (en) * | 1998-04-01 | 2000-04-11 | Applied Materials, Inc. | Multi-ledge substrate support for a thermal processing chamber |
| US6264467B1 (en) * | 1999-04-14 | 2001-07-24 | Applied Materials, Inc. | Micro grooved support surface for reducing substrate wear and slip formation |
| US6383931B1 (en) * | 2000-02-11 | 2002-05-07 | Lam Research Corporation | Convertible hot edge ring to improve low-K dielectric etch |
| KR20010087542A (ko) | 2000-03-07 | 2001-09-21 | 윤종용 | 반도체 확산 공정용 석영 보트의 웨이퍼 지지장치 |
| KR20020073814A (ko) * | 2001-03-16 | 2002-09-28 | 삼성전자 주식회사 | 웨이퍼 열처리 장치 |
| JP4323764B2 (ja) * | 2002-07-16 | 2009-09-02 | 大日本スクリーン製造株式会社 | 熱処理装置 |
| JP4067858B2 (ja) * | 2002-04-16 | 2008-03-26 | 東京エレクトロン株式会社 | Ald成膜装置およびald成膜方法 |
| US7734439B2 (en) | 2002-06-24 | 2010-06-08 | Mattson Technology, Inc. | System and process for calibrating pyrometers in thermal processing chambers |
| US7704327B2 (en) | 2002-09-30 | 2010-04-27 | Applied Materials, Inc. | High temperature anneal with improved substrate support |
| US7241345B2 (en) | 2003-06-16 | 2007-07-10 | Applied Materials, Inc. | Cylinder for thermal processing chamber |
| US7582166B2 (en) * | 2003-08-01 | 2009-09-01 | Sgl Carbon, Llc | Holder for supporting wafers during semiconductor manufacture |
| JPWO2005017988A1 (ja) * | 2003-08-15 | 2006-10-12 | 株式会社日立国際電気 | 基板処理装置および半導体デバイスの製造方法 |
| US6888104B1 (en) * | 2004-02-05 | 2005-05-03 | Applied Materials, Inc. | Thermally matched support ring for substrate processing chamber |
| EP1719167B1 (en) * | 2004-02-13 | 2011-10-26 | ASM America, Inc. | Substrate support system for reduced autodoping and backside deposition |
| KR100733269B1 (ko) * | 2005-08-18 | 2007-06-28 | 피에스케이 주식회사 | 반도체 식각 장비의 척 조립체 |
| US7960293B2 (en) * | 2006-05-31 | 2011-06-14 | Tokyo Electron Limited | Method for forming insulating film and method for manufacturing semiconductor device |
| US7972973B2 (en) * | 2006-09-29 | 2011-07-05 | Tokyo Electron Limited | Method for forming silicon oxide film, plasma processing apparatus and storage medium |
| KR101207593B1 (ko) * | 2007-03-28 | 2012-12-03 | 도쿄엘렉트론가부시키가이샤 | Cvd 성막 장치 |
| KR100856019B1 (ko) * | 2008-02-22 | 2008-09-02 | (주)타이닉스 | 플라즈마 처리장치의 기판 홀더 |
| JP2010114190A (ja) | 2008-11-05 | 2010-05-20 | Mitsubishi Heavy Ind Ltd | 光電変換装置の製造方法および光電変換装置 |
| KR100940544B1 (ko) | 2009-07-01 | 2010-02-10 | (주)앤피에스 | 기판 지지 유닛 |
| DE202010015933U1 (de) * | 2009-12-01 | 2011-03-31 | Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont | Eine Randringanordnung für Plasmaätzkammern |
| US8744250B2 (en) * | 2011-02-23 | 2014-06-03 | Applied Materials, Inc. | Edge ring for a thermal processing chamber |
| US8979087B2 (en) * | 2011-07-29 | 2015-03-17 | Applied Materials, Inc. | Substrate supporting edge ring with coating for improved soak performance |
| SG11201501085TA (en) * | 2012-08-31 | 2015-04-29 | Semiconductor Tech & Instr Inc | Single ultra-planar wafer table structure for both wafers and film frames |
| TWI675721B (zh) * | 2013-07-11 | 2019-11-01 | 日商荏原製作所股份有限公司 | 研磨裝置及研磨狀態監視方法 |
| US9385004B2 (en) * | 2013-08-15 | 2016-07-05 | Applied Materials, Inc. | Support cylinder for thermal processing chamber |
| US9330955B2 (en) * | 2013-12-31 | 2016-05-03 | Applied Materials, Inc. | Support ring with masked edge |
-
2014
- 2014-03-18 US US14/218,597 patent/US9330955B2/en active Active
- 2014-11-25 KR KR1020167020960A patent/KR102279150B1/ko active Active
- 2014-11-25 JP JP2016561588A patent/JP6408606B2/ja active Active
- 2014-11-25 CN CN201910393303.7A patent/CN110223949B/zh active Active
- 2014-11-25 CN CN201480069163.3A patent/CN105830207B/zh active Active
- 2014-11-25 KR KR1020217022002A patent/KR102424719B1/ko active Active
- 2014-11-25 WO PCT/US2014/067367 patent/WO2015102781A1/en not_active Ceased
- 2014-11-25 KR KR1020227025236A patent/KR102569159B1/ko active Active
- 2014-12-31 TW TW103146598A patent/TWI578437B/zh active
- 2014-12-31 TW TW106118280A patent/TWI667735B/zh active
- 2014-12-31 TW TW105121783A patent/TWI594361B/zh active
-
2016
- 2016-05-02 US US15/144,446 patent/US9842759B2/en active Active
-
2017
- 2017-12-11 US US15/838,060 patent/US10056286B2/en active Active
-
2018
- 2018-07-06 US US16/029,159 patent/US10373859B2/en active Active
- 2018-09-20 JP JP2018176528A patent/JP6758353B2/ja active Active
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