JP6408606B2 - マスキングされたエッジを有する支持リング - Google Patents

マスキングされたエッジを有する支持リング Download PDF

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Publication number
JP6408606B2
JP6408606B2 JP2016561588A JP2016561588A JP6408606B2 JP 6408606 B2 JP6408606 B2 JP 6408606B2 JP 2016561588 A JP2016561588 A JP 2016561588A JP 2016561588 A JP2016561588 A JP 2016561588A JP 6408606 B2 JP6408606 B2 JP 6408606B2
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JP
Japan
Prior art keywords
coating
tapered
region
thickness
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2016561588A
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English (en)
Japanese (ja)
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JP2017508303A5 (enExample
JP2017508303A (ja
Inventor
メヘラン ベジャット，
メヘラン ベジャット，
ノーマン エル． タム，
ノーマン エル． タム，
アーロン ミュアー ハンター，
アーロン ミュアー ハンター，
ジョゼフ エム． ラニッシュ，
ジョゼフ エム． ラニッシュ，
中西　孝之
孝之 中西
中川　敏之
敏之 中川
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2017508303A5 publication Critical patent/JP2017508303A5/ja
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Publication of JP6408606B2 publication Critical patent/JP6408606B2/ja
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    • H10P72/7616—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • H10P72/0436—
    • H10P72/7611—
    • H10P72/70—

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Drying Of Semiconductors (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
JP2016561588A 2013-12-31 2014-11-25 マスキングされたエッジを有する支持リング Active JP6408606B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361922451P 2013-12-31 2013-12-31
US61/922,451 2013-12-31
US14/218,597 2014-03-18
US14/218,597 US9330955B2 (en) 2013-12-31 2014-03-18 Support ring with masked edge
PCT/US2014/067367 WO2015102781A1 (en) 2013-12-31 2014-11-25 Support ring with masked edge

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018176528A Division JP6758353B2 (ja) 2013-12-31 2018-09-20 マスキングされたエッジを有する支持リング

Publications (3)

Publication Number Publication Date
JP2017508303A JP2017508303A (ja) 2017-03-23
JP2017508303A5 JP2017508303A5 (enExample) 2018-01-18
JP6408606B2 true JP6408606B2 (ja) 2018-10-17

Family

ID=53482656

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016561588A Active JP6408606B2 (ja) 2013-12-31 2014-11-25 マスキングされたエッジを有する支持リング
JP2018176528A Active JP6758353B2 (ja) 2013-12-31 2018-09-20 マスキングされたエッジを有する支持リング

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018176528A Active JP6758353B2 (ja) 2013-12-31 2018-09-20 マスキングされたエッジを有する支持リング

Country Status (6)

Country Link
US (4) US9330955B2 (enExample)
JP (2) JP6408606B2 (enExample)
KR (3) KR102279150B1 (enExample)
CN (2) CN110223949B (enExample)
TW (3) TWI667735B (enExample)
WO (1) WO2015102781A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103649158B (zh) * 2011-05-13 2016-04-06 陶氏环球技术有限责任公司 绝缘制剂
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge
JP2020516770A (ja) 2017-04-07 2020-06-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板端部上のプラズマ密度制御
CN107121892B (zh) * 2017-04-26 2018-12-28 武汉华星光电技术有限公司 一种基板曝边设备
US11594445B2 (en) 2018-03-13 2023-02-28 Applied Materials, Inc. Support ring with plasma spray coating
CN110920254B (zh) 2018-09-19 2021-03-16 精工爱普生株式会社 打印头控制电路及液体喷出装置
US12134835B2 (en) * 2021-09-01 2024-11-05 Applied Materials, Inc. Quartz susceptor for accurate non-contact temperature measurement
US20250305141A1 (en) * 2024-03-27 2025-10-02 Applied Materials, Inc. Multi-section substrate supports and related methods, process kits, and processing chambers for semiconductor manufacturing

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61217561A (ja) * 1985-03-25 1986-09-27 Sumitomo Metal Ind Ltd Ｎｉ基合金の製造方法
US5690795A (en) * 1995-06-05 1997-11-25 Applied Materials, Inc. Screwless shield assembly for vacuum processing chambers
US5884412A (en) * 1996-07-24 1999-03-23 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
US5848889A (en) * 1996-07-24 1998-12-15 Applied Materials Inc. Semiconductor wafer support with graded thermal mass
US6395363B1 (en) * 1996-11-05 2002-05-28 Applied Materials, Inc. Sloped substrate support
US6530994B1 (en) 1997-08-15 2003-03-11 Micro C Technologies, Inc. Platform for supporting a semiconductor substrate and method of supporting a substrate during rapid high temperature processing
EP1036406B1 (en) 1997-11-03 2003-04-02 ASM America, Inc. Improved low mass wafer support system
US6200388B1 (en) * 1998-02-11 2001-03-13 Applied Materials, Inc. Substrate support for a thermal processing chamber
US6048403A (en) * 1998-04-01 2000-04-11 Applied Materials, Inc. Multi-ledge substrate support for a thermal processing chamber
US6280183B1 (en) * 1998-04-01 2001-08-28 Applied Materials, Inc. Substrate support for a thermal processing chamber
US6264467B1 (en) * 1999-04-14 2001-07-24 Applied Materials, Inc. Micro grooved support surface for reducing substrate wear and slip formation
US6383931B1 (en) * 2000-02-11 2002-05-07 Lam Research Corporation Convertible hot edge ring to improve low-K dielectric etch
KR20010087542A (ko) 2000-03-07 2001-09-21 윤종용 반도체 확산 공정용 석영 보트의 웨이퍼 지지장치
KR20020073814A (ko) * 2001-03-16 2002-09-28 삼성전자 주식회사 웨이퍼 열처리 장치
JP4323764B2 (ja) * 2002-07-16 2009-09-02 大日本スクリーン製造株式会社 熱処理装置
JP4067858B2 (ja) * 2002-04-16 2008-03-26 東京エレクトロン株式会社 Ａｌｄ成膜装置およびａｌｄ成膜方法
US7734439B2 (en) 2002-06-24 2010-06-08 Mattson Technology, Inc. System and process for calibrating pyrometers in thermal processing chambers
US7704327B2 (en) 2002-09-30 2010-04-27 Applied Materials, Inc. High temperature anneal with improved substrate support
US7241345B2 (en) * 2003-06-16 2007-07-10 Applied Materials, Inc. Cylinder for thermal processing chamber
KR101116510B1 (ko) * 2003-08-01 2012-02-28 에스지엘 카본 에스이 반도체 제조시 웨이퍼를 지지하는 홀더
JPWO2005017988A1 (ja) * 2003-08-15 2006-10-12 株式会社日立国際電気 基板処理装置および半導体デバイスの製造方法
US6888104B1 (en) * 2004-02-05 2005-05-03 Applied Materials, Inc. Thermally matched support ring for substrate processing chamber
EP1719167B1 (en) * 2004-02-13 2011-10-26 ASM America, Inc. Substrate support system for reduced autodoping and backside deposition
KR100733269B1 (ko) * 2005-08-18 2007-06-28 피에스케이 주식회사 반도체 식각 장비의 척 조립체
WO2007139141A1 (ja) * 2006-05-31 2007-12-06 Tokyo Electron Limited 絶縁膜の形成方法および半導体装置の製造方法
KR101070568B1 (ko) * 2006-09-29 2011-10-05 도쿄엘렉트론가부시키가이샤 실리콘 산화막의 형성 방법, 플라즈마 처리 장치 및 기억 매체
KR101207593B1 (ko) * 2007-03-28 2012-12-03 도쿄엘렉트론가부시키가이샤 Cvd 성막 장치
KR100856019B1 (ko) * 2008-02-22 2008-09-02 (주)타이닉스 플라즈마 처리장치의 기판 홀더
JP2010114190A (ja) 2008-11-05 2010-05-20 Mitsubishi Heavy Ind Ltd 光電変換装置の製造方法および光電変換装置
KR100940544B1 (ko) 2009-07-01 2010-02-10 (주)앤피에스 기판 지지 유닛
DE202010015933U1 (de) * 2009-12-01 2011-03-31 Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont Eine Randringanordnung für Plasmaätzkammern
US8744250B2 (en) * 2011-02-23 2014-06-03 Applied Materials, Inc. Edge ring for a thermal processing chamber
US8979087B2 (en) * 2011-07-29 2015-03-17 Applied Materials, Inc. Substrate supporting edge ring with coating for improved soak performance
CN104641461B (zh) * 2012-08-31 2017-06-06 联达科技设备私人有限公司 多功能晶圆及膜片架操持系统
TWI635929B (zh) * 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
US9385004B2 (en) * 2013-08-15 2016-07-05 Applied Materials, Inc. Support cylinder for thermal processing chamber
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge

Also Published As

Publication number Publication date
CN110223949B (zh) 2023-03-21
US20180102274A1 (en) 2018-04-12
KR20160103128A (ko) 2016-08-31
US9842759B2 (en) 2017-12-12
US10056286B2 (en) 2018-08-21
TWI578437B (zh) 2017-04-11
KR102424719B1 (ko) 2022-07-25
US20160247708A1 (en) 2016-08-25
CN105830207A (zh) 2016-08-03
KR20220107084A (ko) 2022-08-01
KR102569159B1 (ko) 2023-08-23
JP2019036736A (ja) 2019-03-07
JP2017508303A (ja) 2017-03-23
US20150187630A1 (en) 2015-07-02
CN105830207B (zh) 2019-05-31
KR20210091360A (ko) 2021-07-21
CN110223949A (zh) 2019-09-10
US20180315639A1 (en) 2018-11-01
TWI594361B (zh) 2017-08-01
TW201532183A (zh) 2015-08-16
TW201639073A (zh) 2016-11-01
US10373859B2 (en) 2019-08-06
JP6758353B2 (ja) 2020-09-23
TW201737409A (zh) 2017-10-16
US9330955B2 (en) 2016-05-03
KR102279150B1 (ko) 2021-07-19
TWI667735B (zh) 2019-08-01
WO2015102781A1 (en) 2015-07-09

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