KR100940544B1 - 기판 지지 유닛 - Google Patents
기판 지지 유닛 Download PDFInfo
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- KR100940544B1 KR100940544B1 KR1020090059596A KR20090059596A KR100940544B1 KR 100940544 B1 KR100940544 B1 KR 100940544B1 KR 1020090059596 A KR1020090059596 A KR 1020090059596A KR 20090059596 A KR20090059596 A KR 20090059596A KR 100940544 B1 KR100940544 B1 KR 100940544B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Abstract
Description
Claims (12)
- 기판이 삽입되어 상기 기판의 둘레를 감싸도록 몸체의 중앙부에 상하로 관통되는 삽입홀이 형성되는 원판형의 에지윙을 구비하는 에지링과;상기 기판의 하부면과 선접촉되어 상기 기판을 지지하는 실린더링과;상기 실린더링의 하단에 결합되어 상기 실린더링을 회전시키는 회전링;을 포함하고,상기 에지윙은 상기 실린더링의 상면에 이격되어 설치되거나 또는 부착되어 설치되는 기판 지지 유닛.
- 제 1항에 있어서,상기 실린더링은,상하 양단이 개방된 원통형의 실린더링 몸체와;상기 실린더링 몸체의 상하 연장되는 방향과 교차하는 방향으로 상기 실린더링 몸체의 상단부에서 내측면 둘레에 돌출 형성되는 실린더링 수평리브와;상기 실린더링 수평리브의 상면에서 돌출 형성되는 기판 지지돌기;를 포함하고,상기 실린더링 몸체, 상기 실린더링 수평리브 및 상기 기판 지지돌기는 일체형으로 이루어지는 기판 지지 유닛.
- 제 2항에 있어서,상기 실린더링 수평리브가 상기 실린더링 몸체로부터 돌출되는 길이는 상기 실린더링 몸체의 내부 직경 크기와 상기 기판의 직경 크기의 차이보다 크게 형성되 는 기판 지지 유닛.
- 제 2항에 있어서,상기 기판 지지돌기는 반구 형상, 반타원 형상, 절두원뿔 형상 또는 절두다각뿔 형상으로 이루어진 군에서 어느 하나가 선택되며, 상기 절두원뿔 형상 및 상기 절두다각뿔 형상의 최상단부는 곡면 처리가 이루어진 기판 지지 유닛.
- 삭제
- 제 1항에 있어서,상기 에지윙의 두께는 상기 기판의 두께보다 같거나 크게 형성되는 기판 지지 유닛.
- 제 2항에 있어서,상기 에지윙의 하부면에는 상기 삽입홀의 둘레를 따라 에지윙 수직리브가 돌출 형성되고, 상기 실린더링 몸체의 외측면 상단에는 상기 외측면 둘레를 따라 상기 에지윙 수직리브가 끼워지는 에지윙 장착홈이 형성되는 기판 지지 유닛.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020090059596A KR100940544B1 (ko) | 2009-07-01 | 2009-07-01 | 기판 지지 유닛 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020090059596A KR100940544B1 (ko) | 2009-07-01 | 2009-07-01 | 기판 지지 유닛 |
Related Child Applications (1)
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KR1020090112268A Division KR100990746B1 (ko) | 2009-11-19 | 2009-11-19 | 기판 처리 장치 |
Publications (1)
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KR100940544B1 true KR100940544B1 (ko) | 2010-02-10 |
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KR1020090059596A KR100940544B1 (ko) | 2009-07-01 | 2009-07-01 | 기판 지지 유닛 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013148468A1 (en) * | 2012-03-30 | 2013-10-03 | Applied Materials, Inc. | Substrate processing system having susceptorless substrate support with enhanced substrate heating control |
WO2015102781A1 (en) * | 2013-12-31 | 2015-07-09 | Applied Materials, Inc. | Support ring with masked edge |
JP2019161148A (ja) * | 2018-03-16 | 2019-09-19 | 東京エレクトロン株式会社 | 熱処理装置 |
KR102640928B1 (ko) * | 2022-09-26 | 2024-02-28 | (주)앤피에스 | 적층체 지지 장치 및 소성 설비 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US4958061A (en) | 1988-06-27 | 1990-09-18 | Tokyo Electron Limited | Method and apparatus for heat-treating a substrate |
US6051512A (en) | 1997-04-11 | 2000-04-18 | Steag Rtp Systems | Apparatus and method for rapid thermal processing (RTP) of a plurality of semiconductor wafers |
KR20010029912A (ko) * | 1999-07-09 | 2001-04-16 | 조셉 제이. 스위니 | 반도체 처리 시스템 및 기판 처리 장치 |
KR20020086378A (ko) * | 2002-10-04 | 2002-11-18 | 코닉 시스템 주식회사 | 급속열처리 장치용 에지링 |
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2009
- 2009-07-01 KR KR1020090059596A patent/KR100940544B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US4958061A (en) | 1988-06-27 | 1990-09-18 | Tokyo Electron Limited | Method and apparatus for heat-treating a substrate |
US6051512A (en) | 1997-04-11 | 2000-04-18 | Steag Rtp Systems | Apparatus and method for rapid thermal processing (RTP) of a plurality of semiconductor wafers |
KR20010029912A (ko) * | 1999-07-09 | 2001-04-16 | 조셉 제이. 스위니 | 반도체 처리 시스템 및 기판 처리 장치 |
KR20020086378A (ko) * | 2002-10-04 | 2002-11-18 | 코닉 시스템 주식회사 | 급속열처리 장치용 에지링 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013148468A1 (en) * | 2012-03-30 | 2013-10-03 | Applied Materials, Inc. | Substrate processing system having susceptorless substrate support with enhanced substrate heating control |
US9682398B2 (en) | 2012-03-30 | 2017-06-20 | Applied Materials, Inc. | Substrate processing system having susceptorless substrate support with enhanced substrate heating control |
US10376916B2 (en) | 2012-03-30 | 2019-08-13 | Applied Materials, Inc | Substrate processing system having susceptorless substrate support with enhanced substrate heating control |
US10610884B2 (en) | 2012-03-30 | 2020-04-07 | Applied Materials, Inc. | Substrate processing system having susceptorless substrate support with enhanced substrate heating control |
WO2015102781A1 (en) * | 2013-12-31 | 2015-07-09 | Applied Materials, Inc. | Support ring with masked edge |
US9330955B2 (en) | 2013-12-31 | 2016-05-03 | Applied Materials, Inc. | Support ring with masked edge |
US9842759B2 (en) | 2013-12-31 | 2017-12-12 | Applied Materials, Inc. | Support ring with masked edge |
US10056286B2 (en) | 2013-12-31 | 2018-08-21 | Applied Materials, Inc. | Support ring with masked edge |
US10373859B2 (en) | 2013-12-31 | 2019-08-06 | Applied Materials, Inc. | Support ring with masked edge |
JP2019161148A (ja) * | 2018-03-16 | 2019-09-19 | 東京エレクトロン株式会社 | 熱処理装置 |
JP7025964B2 (ja) | 2018-03-16 | 2022-02-25 | 東京エレクトロン株式会社 | 熱処理装置 |
KR102640928B1 (ko) * | 2022-09-26 | 2024-02-28 | (주)앤피에스 | 적층체 지지 장치 및 소성 설비 |
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