TWD186396S - 電漿處理裝置用環 - Google Patents

電漿處理裝置用環

Info

Publication number
TWD186396S
TWD186396S TW106301394F TW106301394F TWD186396S TW D186396 S TWD186396 S TW D186396S TW 106301394 F TW106301394 F TW 106301394F TW 106301394 F TW106301394 F TW 106301394F TW D186396 S TWD186396 S TW D186396S
Authority
TW
Taiwan
Prior art keywords
article
rings
plasma treatment
treatment equipment
gas
Prior art date
Application number
TW106301394F
Other languages
English (en)
Inventor
Takamasa Ichino
Kohei Sato
Kazunori Nakamoto
Original Assignee
日立全球先端科技股份有限&#x5
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立全球先端科技股份有限&#x5, Hitachi High Tech Corp filed Critical 日立全球先端科技股份有限&#x5
Publication of TWD186396S publication Critical patent/TWD186396S/zh

Links

Abstract

【物品用途】;本設計的物品是電漿處理裝置用環，在半導體製造時供電漿處理裝置使用，本物品的外周部設有可供氣體通過的複數孔，可使氣體內不必要的物質附著於本物品，是用於抑制氣體流量降低的環。;【設計說明】
TW106301394F 2017-01-31 2017-03-17 電漿處理裝置用環 TWD186396S (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2017-1754F JP1584784S (zh) 2017-01-31 2017-01-31

Publications (1)

Publication Number Publication Date
TWD186396S true TWD186396S (zh) 2017-11-01

Family

ID=59677648

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106301394F TWD186396S (zh) 2017-01-31 2017-03-17 電漿處理裝置用環

Country Status (3)

Country Link
US (1) USD836573S1 (zh)
JP (1) JP1584784S (zh)
TW (1) TWD186396S (zh)

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USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
JP1638282S (zh) * 2018-09-20 2019-08-05
JP1640255S (zh) * 2018-10-25 2019-09-02
US11859915B1 (en) 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD896767S1 (en) * 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber

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KR0164618B1 (ko) * 1992-02-13 1999-02-01 이노우에 쥰이치 플라즈마 처리방법
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
JP4602532B2 (ja) * 2000-11-10 2010-12-22 東京エレクトロン株式会社 プラズマ処理装置
USD490450S1 (en) * 2002-05-20 2004-05-25 Tokyo Electron Limited Exhaust ring for semiconductor equipment
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JP5269335B2 (ja) * 2007-03-30 2013-08-21 東京エレクトロン株式会社 プラズマ処理装置
USD606952S1 (en) * 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
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JP1551512S (zh) 2015-06-12 2016-06-13
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Also Published As

Publication number Publication date
JP1584784S (zh) 2017-08-28
USD836573S1 (en) 2018-12-25

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