JP1584784S - - Google Patents

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Publication number
JP1584784S
JP1584784S JPD2017-1754F JP2017001754F JP1584784S JP 1584784 S JP1584784 S JP 1584784S JP 2017001754 F JP2017001754 F JP 2017001754F JP 1584784 S JP1584784 S JP 1584784S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2017-1754F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2017-1754F priority Critical patent/JP1584784S/ja
Priority to TW106301394F priority patent/TWD186396S/zh
Priority to US29/610,998 priority patent/USD836573S1/en
Application granted granted Critical
Publication of JP1584784S publication Critical patent/JP1584784S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2017-1754F 2017-01-31 2017-01-31 Active JP1584784S (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2017-1754F JP1584784S (ja) 2017-01-31 2017-01-31
TW106301394F TWD186396S (zh) 2017-01-31 2017-03-17 電漿處理裝置用環
US29/610,998 USD836573S1 (en) 2017-01-31 2017-07-18 Ring for a plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2017-1754F JP1584784S (ja) 2017-01-31 2017-01-31

Publications (1)

Publication Number Publication Date
JP1584784S true JP1584784S (ja) 2017-08-28

Family

ID=59677648

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2017-1754F Active JP1584784S (ja) 2017-01-31 2017-01-31

Country Status (3)

Country Link
US (1) USD836573S1 (ja)
JP (1) JP1584784S (ja)
TW (1) TWD186396S (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
JP1638282S (ja) * 2018-09-20 2019-08-05
JP1640255S (ja) * 2018-10-25 2019-09-02
US11859915B1 (en) 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD896767S1 (en) 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD943539S1 (en) 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0164618B1 (ko) * 1992-02-13 1999-02-01 이노우에 쥰이치 플라즈마 처리방법
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
JP4602532B2 (ja) * 2000-11-10 2010-12-22 東京エレクトロン株式会社 プラズマ処理装置
USD490450S1 (en) * 2002-05-20 2004-05-25 Tokyo Electron Limited Exhaust ring for semiconductor equipment
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD494551S1 (en) 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD496008S1 (en) * 2002-12-12 2004-09-14 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US7029386B2 (en) * 2004-06-10 2006-04-18 R & B Plastics, Inc. Retaining ring assembly for use in chemical mechanical polishing
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
JP5269335B2 (ja) * 2007-03-30 2013-08-21 東京エレクトロン株式会社 プラズマ処理装置
USD606952S1 (en) * 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
JP1438319S (ja) * 2011-09-20 2015-04-06
JP1438745S (ja) * 2011-09-20 2015-04-06
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD699199S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
KR101455311B1 (ko) * 2013-07-11 2014-10-27 주식회사 윌비에스엔티 화학적 기계 연마 장치의 리테이너 링
JP1551512S (ja) 2015-06-12 2016-06-13
JP1546800S (ja) 2015-06-12 2016-03-28
TWD179095S (zh) * 2015-08-25 2016-10-21 荏原製作所股份有限公司 基板保持環
JP1556433S (ja) * 2015-10-06 2016-08-15
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring

Also Published As

Publication number Publication date
USD836573S1 (en) 2018-12-25
TWD186396S (zh) 2017-11-01

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