JP2015038962A5 - - Google Patents
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- Publication number
- JP2015038962A5 JP2015038962A5 JP2014096477A JP2014096477A JP2015038962A5 JP 2015038962 A5 JP2015038962 A5 JP 2015038962A5 JP 2014096477 A JP2014096477 A JP 2014096477A JP 2014096477 A JP2014096477 A JP 2014096477A JP 2015038962 A5 JP2015038962 A5 JP 2015038962A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- substrate
- glass
- board
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 description 23
- 239000011521 glass Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 229910004205 SiNX Inorganic materials 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000005345 chemically strengthened glass Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical group [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- BDVZHDCXCXJPSO-UHFFFAOYSA-N indium(3+) oxygen(2-) titanium(4+) Chemical compound [O-2].[Ti+4].[In+3] BDVZHDCXCXJPSO-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000006089 photosensitive glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014096477A JP6308007B2 (ja) | 2013-07-16 | 2014-05-08 | 配線基板および配線基板の製造方法 |
| US14/327,389 US9723724B2 (en) | 2013-07-16 | 2014-07-09 | Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate |
| CN201410325675.3A CN104299916B (zh) | 2013-07-16 | 2014-07-09 | 配线基板及制造方法，部件嵌入式玻璃基板及制造方法 |
| US15/634,976 US10410884B2 (en) | 2013-07-16 | 2017-06-27 | Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013147551 | 2013-07-16 | ||
| JP2013147551 | 2013-07-16 | ||
| JP2014096477A JP6308007B2 (ja) | 2013-07-16 | 2014-05-08 | 配線基板および配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015038962A JP2015038962A (ja) | 2015-02-26 |
| JP2015038962A5 true JP2015038962A5 (https=) | 2017-04-06 |
| JP6308007B2 JP6308007B2 (ja) | 2018-04-11 |
Family
ID=52319590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014096477A Expired - Fee Related JP6308007B2 (ja) | 2013-07-16 | 2014-05-08 | 配線基板および配線基板の製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US9723724B2 (https=) |
| JP (1) | JP6308007B2 (https=) |
| CN (1) | CN104299916B (https=) |
Families Citing this family (52)
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| TW201510798A (zh) * | 2013-09-13 | 2015-03-16 | Hon Hai Prec Ind Co Ltd | 單片式玻璃觸控屏及其製造方法 |
| KR102244002B1 (ko) * | 2014-02-14 | 2021-04-27 | 삼성디스플레이 주식회사 | 댐 부재 및 이를 포함하는 표시 장치 |
| JP2015210242A (ja) * | 2014-04-30 | 2015-11-24 | キヤノン株式会社 | 流路デバイス、流路デバイスの製造方法、および検査方法 |
| CN106795044A (zh) * | 2014-10-03 | 2017-05-31 | 日本板硝子株式会社 | 带贯通电极玻璃基板的制造方法以及玻璃基板 |
| US10264669B2 (en) * | 2015-05-01 | 2019-04-16 | Research Triangle Institute | Flexible electronic assemblies with embedded electronic devices and methods for their fabrication |
| TWI561891B (en) | 2016-01-04 | 2016-12-11 | Au Optronics Corp | Pixel array substrate |
| CN105633099B (zh) * | 2016-01-28 | 2018-11-30 | 京东方科技集团股份有限公司 | 一种阵列基板、其制作方法及显示面板 |
| JP6761592B2 (ja) * | 2016-03-31 | 2020-09-30 | 大日本印刷株式会社 | 電子デバイス及びその製造方法 |
| JP6848209B2 (ja) * | 2016-05-13 | 2021-03-24 | 大日本印刷株式会社 | 実装基板及びそれを備える電子機器 |
| CN112542468A (zh) * | 2016-07-05 | 2021-03-23 | 群创光电股份有限公司 | 显示装置 |
| US10529745B2 (en) | 2016-07-05 | 2020-01-07 | Innolux Corporation | Display device |
| JP6627666B2 (ja) * | 2016-07-07 | 2020-01-08 | 株式会社オートネットワーク技術研究所 | 回路基板及び電気接続箱 |
| KR102614612B1 (ko) * | 2016-10-25 | 2023-12-19 | 엘지디스플레이 주식회사 | 관통홀을 통해 기판의 앞면과 배면을 연결한 평판 표시장치 |
| CN106653819B (zh) * | 2017-02-17 | 2020-02-14 | 京东方科技集团股份有限公司 | 阵列基板和显示装置 |
| CN107256870A (zh) * | 2017-06-09 | 2017-10-17 | 京东方科技集团股份有限公司 | 一种阵列基板及制作方法、柔性显示面板、显示装置 |
| CN109390351B (zh) * | 2017-08-02 | 2021-01-22 | 京东方科技集团股份有限公司 | 布线结构及其制备方法、oled阵列基板、显示装置 |
| KR102019349B1 (ko) | 2017-10-19 | 2019-09-09 | 삼성전자주식회사 | 반도체 패키지 |
| CN109786399B (zh) | 2017-11-13 | 2022-04-05 | 睿生光电股份有限公司 | 检测装置 |
| US10571758B2 (en) | 2018-01-05 | 2020-02-25 | Innolux Corporation | Display device |
| US11910520B2 (en) * | 2018-02-02 | 2024-02-20 | Kuprion Inc. | Thermal management in circuit board assemblies |
| CN112218833B (zh) * | 2018-04-03 | 2023-02-28 | 康宁股份有限公司 | 具有电和光连接的集成电路封装件及其制造方法 |
| US10692799B2 (en) | 2018-06-01 | 2020-06-23 | Innolux Corporation | Semiconductor electronic device |
| US10998361B2 (en) * | 2018-09-22 | 2021-05-04 | Omnivision Technologies, Inc. | Image-sensor package and associated method |
| CN109496352A (zh) * | 2018-10-16 | 2019-03-19 | 深圳市汇顶科技股份有限公司 | 具有薄膜晶体管器件的集成装置及其制备方法 |
| TWI671572B (zh) * | 2018-10-22 | 2019-09-11 | 友達光電股份有限公司 | 顯示面板及其製造方法 |
| US11507087B2 (en) * | 2018-11-07 | 2022-11-22 | Gm Cruise Holdings Llc | Distributed integrated sensing and communication module |
| WO2020140294A1 (zh) | 2019-01-04 | 2020-07-09 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法和电子装置 |
| WO2020183881A1 (ja) | 2019-03-12 | 2020-09-17 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置 |
| CN110265432B (zh) * | 2019-04-11 | 2022-06-07 | 京东方科技集团股份有限公司 | 显示面板及其制作方法、显示装置 |
| US11637166B2 (en) * | 2019-04-12 | 2023-04-25 | Boe Technology Group Co., Ltd. | Array substrate, manufacturing method thereof, and display apparatus |
| IT201900006736A1 (it) | 2019-05-10 | 2020-11-10 | Applied Materials Inc | Procedimenti di fabbricazione di package |
| CN110400809A (zh) * | 2019-07-24 | 2019-11-01 | 深圳市华星光电半导体显示技术有限公司 | TFT驱动背板及Micro-LED显示器 |
| US11978685B2 (en) * | 2019-07-25 | 2024-05-07 | Intel Corporation | Glass core patch with in situ fabricated fan-out layer to enable die tiling applications |
| CN110491853B (zh) * | 2019-09-16 | 2024-08-09 | 中国电子科技集团公司第五十八研究所 | 一种硅基三维扇出集成封装方法及结构 |
| CN111081655B (zh) * | 2019-12-19 | 2021-10-22 | 青岛歌尔智能传感器有限公司 | 电子封装结构及其制作方法 |
| KR102855333B1 (ko) * | 2020-03-05 | 2025-09-08 | 삼성디스플레이 주식회사 | 표시 장치, 이의 제조 방법, 및 이를 포함하는 타일드 표시 장치 |
| KR20220007754A (ko) * | 2020-07-09 | 2022-01-19 | 삼성디스플레이 주식회사 | 표시 장치 및 이를 포함하는 타일형 표시 장치 |
| CN112312654B (zh) * | 2020-08-14 | 2021-09-17 | 珠海越亚半导体股份有限公司 | 一种嵌埋在玻璃介质中的无源器件结构及其制造方法 |
| KR20220021985A (ko) * | 2020-08-14 | 2022-02-23 | 삼성디스플레이 주식회사 | 표시 장치 및 이를 포함하는 타일형 표시 장치 |
| US11527485B2 (en) * | 2020-08-27 | 2022-12-13 | Intel Corporation | Electrical shield for stacked heterogeneous device integration |
| CN111863768B (zh) * | 2020-08-28 | 2025-03-04 | 中国电子科技集团公司第五十八研究所 | 一种具备微流道散热功能的tsv转接板及其制备方法 |
| KR102876781B1 (ko) * | 2020-09-02 | 2025-10-27 | 삼성디스플레이 주식회사 | 타일형 표시 장치 |
| KR102904020B1 (ko) * | 2020-10-23 | 2025-12-26 | 삼성전자주식회사 | 디스플레이 모듈 및 그 제조 방법 |
| KR102460449B1 (ko) | 2021-03-31 | 2022-10-31 | 한국전자기술연구원 | 고주파 캐패시터 및 이의 제조방법 |
| TWI773541B (zh) | 2021-09-27 | 2022-08-01 | 友達光電股份有限公司 | 主動元件基板的製造方法 |
| KR20230099764A (ko) * | 2021-12-27 | 2023-07-05 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| JP2024046350A (ja) * | 2022-09-22 | 2024-04-03 | Ｔｏｐｐａｎホールディングス株式会社 | 配線基板 |
| CN115857224B (zh) * | 2022-11-23 | 2024-07-09 | 安徽繁盛显示科技有限公司 | 玻璃基板以及显示面板的基板制造方法 |
| CN116314010A (zh) * | 2023-03-01 | 2023-06-23 | 深圳飞特尔科技有限公司 | 一种用于ltcc封装玻璃射频信号屏蔽孔及其制作方法 |
| US20250079324A1 (en) * | 2023-08-30 | 2025-03-06 | Absolics Inc. | Method of manufacturing packaging substrate and packaging substrate manufactured thereby |
| EP4560693A1 (en) * | 2023-11-23 | 2025-05-28 | Absolics Inc. | Packaging substrate and manufacturing method of packaging substrate |
| KR20250146471A (ko) * | 2024-04-01 | 2025-10-13 | 주식회사 하스 | 글라스 기판 및 감광성 글라스 웨이퍼 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH04238826A (ja) * | 1990-12-28 | 1992-08-26 | Seikosha Co Ltd | ガラスのエッチング方法 |
| JP2873412B2 (ja) * | 1991-11-19 | 1999-03-24 | セイコープレシジョン株式会社 | 感光性ガラスの加工方法 |
| FI119583B (fi) * | 2003-02-26 | 2008-12-31 | Imbera Electronics Oy | Menetelmä elektroniikkamoduulin valmistamiseksi |
| JP4672689B2 (ja) * | 2006-02-22 | 2011-04-20 | 日本板硝子株式会社 | レーザを用いたガラスの加工方法および加工装置 |
| JP5286893B2 (ja) * | 2007-04-27 | 2013-09-11 | 日立化成株式会社 | 接続端子、接続端子を用いた半導体パッケージ及び半導体パッケージの製造方法 |
| US8440916B2 (en) * | 2007-06-28 | 2013-05-14 | Intel Corporation | Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method |
| JP2011199674A (ja) * | 2010-03-19 | 2011-10-06 | Seiko Instruments Inc | ガラス基板の製造方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計 |
| JP5525618B2 (ja) * | 2010-10-01 | 2014-06-18 | 株式会社メイコー | 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 |
| US20130245167A1 (en) * | 2010-11-24 | 2013-09-19 | Jsr Corporation | Resin composition, insulating film, film forming method, and electronic part |
| TW201238387A (en) * | 2011-01-06 | 2012-09-16 | Asahi Glass Co Ltd | Method and device for manufacturing glass members with sealing material layer, and method for manufacturing electronic devices |
| JP2012216773A (ja) * | 2011-03-29 | 2012-11-08 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
| US10115671B2 (en) * | 2012-08-03 | 2018-10-30 | Snaptrack, Inc. | Incorporation of passives and fine pitch through via for package on package |
-
2014
- 2014-05-08 JP JP2014096477A patent/JP6308007B2/ja not_active Expired - Fee Related
- 2014-07-09 US US14/327,389 patent/US9723724B2/en active Active
- 2014-07-09 CN CN201410325675.3A patent/CN104299916B/zh not_active Expired - Fee Related
-
2017
- 2017-06-27 US US15/634,976 patent/US10410884B2/en not_active Expired - Fee Related
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