JP2014514769A5 - - Google Patents

Download PDF

Info

Publication number
JP2014514769A5
JP2014514769A5 JP2014506912A JP2014506912A JP2014514769A5 JP 2014514769 A5 JP2014514769 A5 JP 2014514769A5 JP 2014506912 A JP2014506912 A JP 2014506912A JP 2014506912 A JP2014506912 A JP 2014506912A JP 2014514769 A5 JP2014514769 A5 JP 2014514769A5
Authority
JP
Japan
Prior art keywords
substrate
support structure
substrate support
fingers
transport device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014506912A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014514769A (ja
JP5787331B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2012/057959 external-priority patent/WO2012146789A1/en
Publication of JP2014514769A publication Critical patent/JP2014514769A/ja
Publication of JP2014514769A5 publication Critical patent/JP2014514769A5/ja
Application granted granted Critical
Publication of JP5787331B2 publication Critical patent/JP5787331B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014506912A 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を搬送するための装置 Active JP5787331B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161480163P 2011-04-28 2011-04-28
US61/480,163 2011-04-28
PCT/EP2012/057959 WO2012146789A1 (en) 2011-04-28 2012-05-01 Apparatus for transferring a substrate in a lithography system

Publications (3)

Publication Number Publication Date
JP2014514769A JP2014514769A (ja) 2014-06-19
JP2014514769A5 true JP2014514769A5 (enExample) 2015-06-25
JP5787331B2 JP5787331B2 (ja) 2015-09-30

Family

ID=46017897

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014506912A Active JP5787331B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を搬送するための装置
JP2014506911A Expired - Fee Related JP5805851B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を処理する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014506911A Expired - Fee Related JP5805851B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を処理する方法

Country Status (7)

Country Link
US (4) US8936994B2 (enExample)
EP (1) EP2702452B1 (enExample)
JP (2) JP5787331B2 (enExample)
KR (4) KR101607618B1 (enExample)
CN (3) CN106919006B (enExample)
TW (2) TWI486723B (enExample)
WO (2) WO2012146789A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101907433B1 (ko) * 2010-12-14 2018-10-12 마퍼 리쏘그라피 아이피 비.브이. 리소그라피 시스템 및 이러한 리소그라피 시스템에서 기판을 프로세싱하는 방법
JP6049367B2 (ja) 2012-09-13 2016-12-21 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理システム
NL2010624C2 (en) 2013-04-08 2014-10-09 Mapper Lithography Ip Bv Cabinet for electronic equipment.
JP2017520015A (ja) * 2014-05-07 2017-07-20 マッパー・リソグラフィー・アイピー・ビー．ブイ． ターゲット処理マシン用囲い
KR101681185B1 (ko) * 2014-11-04 2016-12-02 세메스 주식회사 인터페이스 모듈 및 이를 포함하는 기판 처리 장치 및 방법
CN107111251B (zh) 2014-11-14 2020-10-20 Asml荷兰有限公司 用于在光刻系统中转移基材的加载锁定系统和方法
NL2015784B1 (en) * 2015-11-13 2017-06-02 Mapper Lithography Ip Bv Load lock system and method for transferring substrates in a lithography system.
US10153282B1 (en) * 2017-08-11 2018-12-11 Lam Research Corporation Ultra-high vacuum transport and storage
CN108287454A (zh) * 2018-01-29 2018-07-17 信利（惠州）智能显示有限公司 掩膜板装载系统
KR102634804B1 (ko) 2018-11-06 2024-02-08 에이에스엠엘 네델란즈 비.브이. 하전 입자 빔 장치에서 웨이퍼를 열적으로 컨디셔닝하는 시스템들 및 방법들
KR101977100B1 (ko) * 2018-11-15 2019-05-10 이지메카시스템(주) 렌즈 어셈블리 어닐링 시스템
US10910239B1 (en) * 2019-07-10 2021-02-02 Mikro Mesa Technology Co., Ltd. Method of transferring micro devices and device transfer system
JP2021086889A (ja) * 2019-11-27 2021-06-03 株式会社日立ハイテク 荷電粒子線装置
US20250266285A1 (en) * 2024-02-15 2025-08-21 Tel Manufacturing And Engineering Of America, Inc. Multi-wafer handling system
CN119742259B (zh) * 2025-03-05 2025-05-23 常州科瑞尔科技有限公司 集成式dsc芯片输送治具及其工作方法

Family Cites Families (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157308A (en) 1961-09-05 1964-11-17 Clark Mfg Co J L Canister type container and method of making the same
US3159408A (en) 1961-10-05 1964-12-01 Grace W R & Co Chuck
US4524308A (en) 1984-06-01 1985-06-18 Sony Corporation Circuits for accomplishing electron beam convergence in color cathode ray tubes
US4951601A (en) 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US5536128A (en) 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
JPH05136247A (ja) * 1991-11-13 1993-06-01 Fuji Electric Co Ltd 半導体ウエハ処理装置
AU6449994A (en) 1993-04-30 1994-11-21 Board Of Regents, The University Of Texas System Megavoltage scanning imager and method for its use
JPH0729787A (ja) 1993-07-15 1995-01-31 Toshiba Mach Co Ltd 恒温部材の温度保持装置
DE634699T1 (de) * 1993-07-16 1996-02-15 Semiconductor Systems Inc Gruppiertes fotolithografisches System.
DE4446489C1 (de) 1994-12-23 1996-05-15 Fraunhofer Ges Forschung Verfahren zum Manipulieren von Mikrobauteilen und Vorrichtung zur Durchführung des Verfahrens
EP0766405A1 (en) 1995-09-29 1997-04-02 STMicroelectronics S.r.l. Successive approximation register without redundancy
JP3892494B2 (ja) * 1996-01-26 2007-03-14 東京エレクトロン株式会社 基板搬送装置
JP3579228B2 (ja) * 1997-01-24 2004-10-20 大日本スクリーン製造株式会社 基板処理装置
US5944476A (en) * 1997-03-26 1999-08-31 Kensington Laboratories, Inc. Unitary specimen prealigner and continuously rotatable multiple link robot arm mechanism
JP4048387B2 (ja) * 1997-09-10 2008-02-20 東京エレクトロン株式会社 ロードロック機構及び処理装置
JPH11121362A (ja) 1997-10-20 1999-04-30 Canon Inc 露光装置およびデバイス製造方法
US6719516B2 (en) * 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
JP3019260B1 (ja) 1999-03-26 2000-03-13 株式会社日立製作所 電子ビ―ム描画装置
US6364762B1 (en) 1999-09-30 2002-04-02 Lam Research Corporation Wafer atmospheric transport module having a controlled mini-environment
US6949143B1 (en) 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
JP2002009139A (ja) 2000-06-20 2002-01-11 Nikon Corp 静電チャック
AU2001286946A1 (en) * 2000-09-01 2002-03-13 Asyst Technologies, Inc. Edge grip aligner with buffering capabilities
TW559855B (en) * 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
EP1319243A2 (en) 2000-09-15 2003-06-18 Applied Materials, Inc. Double dual slot load lock for process equipment
ATE417356T1 (de) 2000-10-31 2008-12-15 Sez Ag Vorrichtung zur flüssigkeitsbehandlung von scheibenförmigen gegenständen
JP2004535681A (ja) 2001-07-14 2004-11-25 ブルックス オートメーション インコーポレイテッド 統合マッピングセンサを備えた中心位置決め用両側エッジグリップ・エンドエフェクタ
JP2003045947A (ja) * 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
JP2003068600A (ja) 2001-08-22 2003-03-07 Canon Inc 露光装置、および基板チャックの冷却方法
US6786996B2 (en) 2001-10-16 2004-09-07 Applied Materials Inc. Apparatus and method for edge bead removal
US6778258B2 (en) 2001-10-19 2004-08-17 Asml Holding N.V. Wafer handling system for use in lithography patterning
CN101105637B (zh) * 2002-02-22 2011-02-02 Asml控股股份有限公司 使用两件式盖子保护模版的系统和方法
KR101058597B1 (ko) 2002-08-31 2011-08-22 어플라이드 머티어리얼스, 인코포레이티드 프로세싱 툴에 기판을 공급하는 방법 및 장치
AU2003274829A1 (en) 2002-10-25 2004-05-13 Mapper Lithography Ip B.V. Lithography system
EP2701178B1 (en) 2002-10-30 2020-02-12 ASML Netherlands B.V. Electron beam exposure system
TWI601199B (zh) * 2002-11-15 2017-10-01 荏原製作所股份有限公司 基板處理裝置及基板處理方法
KR101068607B1 (ko) 2003-03-10 2011-09-30 마퍼 리쏘그라피 아이피 비.브이. 복수 개의 빔렛 발생 장치
SG115631A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
TWI234692B (en) * 2003-03-11 2005-06-21 Asml Netherlands Bv Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
EP1457829A1 (en) 2003-03-11 2004-09-15 ASML Netherlands B.V. Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
JP2004281474A (ja) 2003-03-12 2004-10-07 Seiko Epson Corp 製造対象物の受け渡し装置および製造対象物の受け渡し装置を有する搬送システム
JP3674864B2 (ja) 2003-03-25 2005-07-27 忠素 玉井 真空処理装置
US7010388B2 (en) 2003-05-22 2006-03-07 Axcelis Technologies, Inc. Work-piece treatment system having load lock and buffer
CN100543920C (zh) 2003-05-28 2009-09-23 迈普尔平版印刷Ip有限公司 带电粒子小射束曝光系统
WO2005010618A2 (en) 2003-07-30 2005-02-03 Mapper Lithography Ip B.V. Modulator circuitry
US7158211B2 (en) 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1749116B1 (en) 2004-05-14 2015-03-04 Ferrotec (USA) Corporation Methods and apparatuses for transferring articles through a load lock chamber under vacuum
JP2006066690A (ja) 2004-08-27 2006-03-09 Hitachi High-Technologies Corp 電子線描画装置、電子線描画装置の温度制御方法、および回路パターン製造装置
US20070134821A1 (en) * 2004-11-22 2007-06-14 Randhir Thakur Cluster tool for advanced front-end processing
JP2008530804A (ja) * 2005-02-22 2008-08-07 オー・ツェー・エリコン・バルザース・アクチェンゲゼルシャフト ウェーハを位置決めする方法
TWI424260B (zh) 2005-03-18 2014-01-21 尼康股份有限公司 A board member, a substrate holding device, an exposure apparatus and an exposure method, and a device manufacturing method
JP4667140B2 (ja) * 2005-06-30 2011-04-06 キヤノン株式会社 露光装置およびデバイス製造方法
US7522267B2 (en) 2005-07-11 2009-04-21 Brooks Automation, Inc. Substrate transport apparatus with automated alignment
KR20070029032A (ko) * 2005-09-08 2007-03-13 주성엔지니어링(주) 이동식 이송챔버와 이를 포함하는 기판처리장치
US7709815B2 (en) 2005-09-16 2010-05-04 Mapper Lithography Ip B.V. Lithography system and projection method
DE102006021647A1 (de) 2005-11-09 2007-11-15 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
KR100655079B1 (ko) 2005-11-11 2006-12-08 삼성전자주식회사 트랜스퍼 챔버와 프로세스 챔버 사이의 기밀유지장치
US8325321B2 (en) 2006-07-28 2012-12-04 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
JP5048352B2 (ja) 2007-01-31 2012-10-17 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US8950998B2 (en) * 2007-02-27 2015-02-10 Brooks Automation, Inc. Batch substrate handling
US20080225261A1 (en) 2007-03-13 2008-09-18 Noriyuki Hirayanagi Exposure apparatus and device manufacturing method
WO2008144668A1 (en) 2007-05-17 2008-11-27 Brooks Automation, Inc. Side opening substrate carrier and load port
US7817241B2 (en) 2007-07-05 2010-10-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8705010B2 (en) * 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI541615B (zh) 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 在微影裝置中交換晶圓的方法
US20090110532A1 (en) * 2007-10-29 2009-04-30 Sokudo Co., Ltd. Method and apparatus for providing wafer centering on a track lithography tool
CN102017052B (zh) 2008-02-26 2013-09-04 迈普尔平版印刷Ip有限公司 投影透镜装置
JP5619629B2 (ja) * 2008-02-26 2014-11-05 マッパー・リソグラフィー・アイピー・ビー．ブイ． 投影レンズ構成体
NL1036673A1 (nl) 2008-04-09 2009-10-12 Asml Holding Nv Robot Position Calibration Tool (RPCT).
KR101605865B1 (ko) * 2008-04-15 2016-03-24 마퍼 리쏘그라피 아이피 비.브이. 투사 렌즈 배열체
US8757026B2 (en) 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
WO2009141428A1 (en) 2008-05-23 2009-11-26 Mapper Lithography Ip B.V. Imaging system
CN102113083B (zh) 2008-06-04 2016-04-06 迈普尔平版印刷Ip有限公司 对目标进行曝光的方法和系统
EP2406810B1 (en) 2008-10-01 2014-09-17 Mapper Lithography IP B.V. Electrostatic lens structure
JP5548430B2 (ja) 2008-11-26 2014-07-16 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP5000627B2 (ja) * 2008-11-27 2012-08-15 東京エレクトロン株式会社 基板処理システム
JP5670351B2 (ja) 2009-02-22 2015-02-18 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィ機械装置のための準備ユニット
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
CN102414781B (zh) * 2009-02-22 2015-07-15 迈普尔平版印刷Ip有限公司 基板支撑结构、箝制准备单元及微影系统
JP5249098B2 (ja) * 2009-03-17 2013-07-31 東京エレクトロン株式会社 基板処理システム及び基板処理方法
WO2014116681A2 (en) 2013-01-22 2014-07-31 Brooks Automation, Inc. Substrate transport
EP3279624B1 (en) 2015-04-03 2019-08-28 Hitachi High-Technologies Corporation Light quantity detection device, and immunoanalysis device and charged particle beam device using same

Similar Documents

Publication Publication Date Title
JP2014514769A5 (enExample)
JP2010153808A5 (ja) 基板処理装置及び半導体装置の製造方法
WO2009069224A1 (ja) 移載装置
MX2009009456A (es) Aparato y metodo para transferir miembro de talon.
EP2537822A3 (en) Composite article including silicon oxycarbide layer
JP2015524358A5 (enExample)
TWD119910S1 (zh) 晶舟
JP2012522385A5 (enExample)
PH12017550123A1 (en) Film
JP2014513429A5 (enExample)
JP2012506789A5 (enExample)
KR20140018694A (ko) 중량물과 기판 겸용 이송 로봇
MY179986A (en) Rectangular mold-forming substrate
JP2017515301A5 (enExample)
JP2011146506A5 (enExample)
JP2014007299A5 (enExample)
ITMO20100217A1 (it) Dispositivo di supporto per un oggetto.
JP2015116730A5 (enExample)
CN202307835U (zh) 真空机械手晶圆托盘
JP2010041059A5 (enExample)
CN203231085U (zh) 工业气瓶存放防倾倒装置
JP2010510092A5 (enExample)
CN203033145U (zh) 支撑传动轴的泡沫支架
WO2011147485A8 (en) Apparatus for digital printing on articles constituted by containers made of sintered expanded polystyrene
JP2006086180A5 (enExample)