TWI486723B - 在微影系統中處理基板的方法 - Google Patents

在微影系統中處理基板的方法 Download PDF

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Publication number
TWI486723B
TWI486723B TW101115338A TW101115338A TWI486723B TW I486723 B TWI486723 B TW I486723B TW 101115338 A TW101115338 A TW 101115338A TW 101115338 A TW101115338 A TW 101115338A TW I486723 B TWI486723 B TW I486723B
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TW
Taiwan
Prior art keywords
substrate
unit
load lock
robot
nth
Prior art date
Application number
TW101115338A
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English (en)
Chinese (zh)
Other versions
TW201250402A (en
Inventor
芬森特 席爾菲斯特 庫柏
歐文 史羅特
克芬尼克 馬賽 尼可拉斯 賈考柏斯 凡
包爾 古伊杜 迪
將 亨卓克傑 迪
Original Assignee
瑪波微影Ｉｐ公司
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Application filed by 瑪波微影Ｉｐ公司 filed Critical 瑪波微影Ｉｐ公司
Publication of TW201250402A publication Critical patent/TW201250402A/zh
Application granted granted Critical
Publication of TWI486723B publication Critical patent/TWI486723B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H10P72/0458—
    • H10P72/0474—
    • H10P72/3304—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW101115338A 2011-04-28 2012-04-30 在微影系統中處理基板的方法 TWI486723B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161480163P 2011-04-28 2011-04-28

Publications (2)

Publication Number Publication Date
TW201250402A TW201250402A (en) 2012-12-16
TWI486723B true TWI486723B (zh) 2015-06-01

Family

ID=46017897

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101115338A TWI486723B (zh) 2011-04-28 2012-04-30 在微影系統中處理基板的方法
TW101115340A TWI514089B (zh) 2011-04-28 2012-04-30 在微影系統中用於轉移基板的設備

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101115340A TWI514089B (zh) 2011-04-28 2012-04-30 在微影系統中用於轉移基板的設備

Country Status (7)

Country Link
US (4) US8936994B2 (enExample)
EP (1) EP2702452B1 (enExample)
JP (2) JP5787331B2 (enExample)
KR (4) KR101607618B1 (enExample)
CN (3) CN106919006B (enExample)
TW (2) TWI486723B (enExample)
WO (2) WO2012146789A1 (enExample)

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JP6049367B2 (ja) 2012-09-13 2016-12-21 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理システム
NL2010624C2 (en) 2013-04-08 2014-10-09 Mapper Lithography Ip Bv Cabinet for electronic equipment.
JP2017520015A (ja) * 2014-05-07 2017-07-20 マッパー・リソグラフィー・アイピー・ビー．ブイ． ターゲット処理マシン用囲い
KR101681185B1 (ko) * 2014-11-04 2016-12-02 세메스 주식회사 인터페이스 모듈 및 이를 포함하는 기판 처리 장치 및 방법
CN107111251B (zh) 2014-11-14 2020-10-20 Asml荷兰有限公司 用于在光刻系统中转移基材的加载锁定系统和方法
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Also Published As

Publication number Publication date
WO2012146789A1 (en) 2012-11-01
US20160004173A1 (en) 2016-01-07
USRE48903E1 (en) 2022-01-25
CN106919006B (zh) 2020-03-13
CN106919006A (zh) 2017-07-04
JP2014514769A (ja) 2014-06-19
CN106896650A (zh) 2017-06-27
WO2012146788A1 (en) 2012-11-01
JP5787331B2 (ja) 2015-09-30
JP2014513429A (ja) 2014-05-29
US9176397B2 (en) 2015-11-03
TWI514089B (zh) 2015-12-21
US9575418B2 (en) 2017-02-21
JP5805851B2 (ja) 2015-11-10
US20130034421A1 (en) 2013-02-07
TW201250403A (en) 2012-12-16
KR101614475B1 (ko) 2016-04-21
KR101892460B1 (ko) 2018-08-28
KR20140041501A (ko) 2014-04-04
CN103649837B (zh) 2017-04-12
KR20140025495A (ko) 2014-03-04
EP2702452B1 (en) 2016-08-03
KR20160047590A (ko) 2016-05-02
KR20180031082A (ko) 2018-03-27
US20130044305A1 (en) 2013-02-21
CN103649837A (zh) 2014-03-19
TW201250402A (en) 2012-12-16
US8936994B2 (en) 2015-01-20
EP2702452A1 (en) 2014-03-05
KR101607618B1 (ko) 2016-04-11

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