TWI486723B - 在微影系統中處理基板的方法 - Google Patents

在微影系統中處理基板的方法 Download PDF

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Publication number
TWI486723B
TWI486723B TW101115338A TW101115338A TWI486723B TW I486723 B TWI486723 B TW I486723B TW 101115338 A TW101115338 A TW 101115338A TW 101115338 A TW101115338 A TW 101115338A TW I486723 B TWI486723 B TW I486723B
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TW
Taiwan
Prior art keywords
substrate
unit
load lock
robot
nth
Prior art date
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TW101115338A
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English (en)
Chinese (zh)
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TW201250402A (en
Inventor
芬森特 席爾菲斯特 庫柏
歐文 史羅特
克芬尼克 馬賽 尼可拉斯 賈考柏斯 凡
包爾 古伊杜 迪
將 亨卓克傑 迪
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瑪波微影Ｉｐ公司
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Publication of TW201250402A publication Critical patent/TW201250402A/zh
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Publication of TWI486723B publication Critical patent/TWI486723B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H10P72/0458—
    • H10P72/0474—
    • H10P72/3304—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW101115338A 2011-04-28 2012-04-30 在微影系統中處理基板的方法 TWI486723B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161480163P 2011-04-28 2011-04-28

Publications (2)

Publication Number Publication Date
TW201250402A TW201250402A (en) 2012-12-16
TWI486723B true TWI486723B (zh) 2015-06-01

Family

ID=46017897

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101115338A TWI486723B (zh) 2011-04-28 2012-04-30 在微影系統中處理基板的方法
TW101115340A TWI514089B (zh) 2011-04-28 2012-04-30 在微影系統中用於轉移基板的設備

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101115340A TWI514089B (zh) 2011-04-28 2012-04-30 在微影系統中用於轉移基板的設備

Country Status (7)

Country Link
US (4) US8936994B2 (enExample)
EP (1) EP2702452B1 (enExample)
JP (2) JP5805851B2 (enExample)
KR (4) KR101607618B1 (enExample)
CN (3) CN106896650A (enExample)
TW (2) TWI486723B (enExample)
WO (2) WO2012146788A1 (enExample)

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US10087019B2 (en) 2014-11-14 2018-10-02 Mapper Lithography Ip B.V. Load lock system and method for transferring substrates in a lithography system
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JP7130127B2 (ja) 2018-11-06 2022-09-02 エーエスエムエル ネザーランズ ビー．ブイ． 荷電粒子ビーム装置内のウェーハを熱調節するためのシステム及び方法
KR101977100B1 (ko) * 2018-11-15 2019-05-10 이지메카시스템(주) 렌즈 어셈블리 어닐링 시스템
US10910239B1 (en) * 2019-07-10 2021-02-02 Mikro Mesa Technology Co., Ltd. Method of transferring micro devices and device transfer system
JP2021086889A (ja) * 2019-11-27 2021-06-03 株式会社日立ハイテク 荷電粒子線装置
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CN119742259B (zh) * 2025-03-05 2025-05-23 常州科瑞尔科技有限公司 集成式dsc芯片输送治具及其工作方法

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Also Published As

Publication number Publication date
KR20160047590A (ko) 2016-05-02
JP5805851B2 (ja) 2015-11-10
CN103649837A (zh) 2014-03-19
EP2702452B1 (en) 2016-08-03
US20130034421A1 (en) 2013-02-07
US20160004173A1 (en) 2016-01-07
US9575418B2 (en) 2017-02-21
CN106919006A (zh) 2017-07-04
TWI514089B (zh) 2015-12-21
WO2012146789A1 (en) 2012-11-01
KR20140041501A (ko) 2014-04-04
JP2014513429A (ja) 2014-05-29
US20130044305A1 (en) 2013-02-21
CN106896650A (zh) 2017-06-27
TW201250402A (en) 2012-12-16
USRE48903E1 (en) 2022-01-25
KR101892460B1 (ko) 2018-08-28
CN106919006B (zh) 2020-03-13
US9176397B2 (en) 2015-11-03
CN103649837B (zh) 2017-04-12
EP2702452A1 (en) 2014-03-05
KR20180031082A (ko) 2018-03-27
KR101614475B1 (ko) 2016-04-21
WO2012146788A1 (en) 2012-11-01
KR101607618B1 (ko) 2016-04-11
TW201250403A (en) 2012-12-16
US8936994B2 (en) 2015-01-20
JP5787331B2 (ja) 2015-09-30
KR20140025495A (ko) 2014-03-04
JP2014514769A (ja) 2014-06-19

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