TWI486723B - 在微影系統中處理基板的方法 - Google Patents

在微影系統中處理基板的方法 Download PDF

Info

Publication number
TWI486723B
TWI486723B TW101115338A TW101115338A TWI486723B TW I486723 B TWI486723 B TW I486723B TW 101115338 A TW101115338 A TW 101115338A TW 101115338 A TW101115338 A TW 101115338A TW I486723 B TWI486723 B TW I486723B
Authority
TW
Taiwan
Prior art keywords
substrate
unit
load lock
robot
nth
Prior art date
Application number
TW101115338A
Other languages
English (en)
Chinese (zh)
Other versions
TW201250402A (en
Inventor
芬森特 席爾菲斯特 庫柏
歐文 史羅特
克芬尼克 馬賽 尼可拉斯 賈考柏斯 凡
包爾 古伊杜 迪
將 亨卓克傑 迪
Original Assignee
瑪波微影Ｉｐ公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑪波微影Ｉｐ公司 filed Critical 瑪波微影Ｉｐ公司
Publication of TW201250402A publication Critical patent/TW201250402A/zh
Application granted granted Critical
Publication of TWI486723B publication Critical patent/TWI486723B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW101115338A 2011-04-28 2012-04-30 在微影系統中處理基板的方法 TWI486723B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161480163P 2011-04-28 2011-04-28

Publications (2)

Publication Number Publication Date
TW201250402A TW201250402A (en) 2012-12-16
TWI486723B true TWI486723B (zh) 2015-06-01

Family

ID=46017897

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101115338A TWI486723B (zh) 2011-04-28 2012-04-30 在微影系統中處理基板的方法
TW101115340A TWI514089B (zh) 2011-04-28 2012-04-30 在微影系統中用於轉移基板的設備

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101115340A TWI514089B (zh) 2011-04-28 2012-04-30 在微影系統中用於轉移基板的設備

Country Status (7)

Country Link
US (4) US9176397B2 (enExample)
EP (1) EP2702452B1 (enExample)
JP (2) JP5787331B2 (enExample)
KR (4) KR20180031082A (enExample)
CN (3) CN103649837B (enExample)
TW (2) TWI486723B (enExample)
WO (2) WO2012146789A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101907433B1 (ko) * 2010-12-14 2018-10-12 마퍼 리쏘그라피 아이피 비.브이. 리소그라피 시스템 및 이러한 리소그라피 시스템에서 기판을 프로세싱하는 방법
JP6049367B2 (ja) 2012-09-13 2016-12-21 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理システム
NL2010624C2 (en) 2013-04-08 2014-10-09 Mapper Lithography Ip Bv Cabinet for electronic equipment.
CN106462084B (zh) * 2014-05-07 2018-10-19 迈普尔平版印刷Ip有限公司 用于目标处理机械的封闭件
KR101681185B1 (ko) * 2014-11-04 2016-12-02 세메스 주식회사 인터페이스 모듈 및 이를 포함하는 기판 처리 장치 및 방법
EP3218926A2 (en) 2014-11-14 2017-09-20 Mapper Lithography IP B.V. Load lock system and method for transferring substrates in a lithography system
NL2015784B1 (en) * 2015-11-13 2017-06-02 Mapper Lithography Ip Bv Load lock system and method for transferring substrates in a lithography system.
US10153282B1 (en) * 2017-08-11 2018-12-11 Lam Research Corporation Ultra-high vacuum transport and storage
CN108287454A (zh) * 2018-01-29 2018-07-17 信利（惠州）智能显示有限公司 掩膜板装载系统
WO2020094371A1 (en) 2018-11-06 2020-05-14 Asml Netherlands B.V. Systems and methods for thermally conditioning a wafer in a charged particle beam apparatus
KR101977100B1 (ko) * 2018-11-15 2019-05-10 이지메카시스템(주) 렌즈 어셈블리 어닐링 시스템
US10910239B1 (en) * 2019-07-10 2021-02-02 Mikro Mesa Technology Co., Ltd. Method of transferring micro devices and device transfer system
JP2021086889A (ja) * 2019-11-27 2021-06-03 株式会社日立ハイテク 荷電粒子線装置
US20250266285A1 (en) * 2024-02-15 2025-08-21 Tel Manufacturing And Engineering Of America, Inc. Multi-wafer handling system
CN119742259B (zh) * 2025-03-05 2025-05-23 常州科瑞尔科技有限公司 集成式dsc芯片输送治具及其工作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200426531A (en) * 2003-03-11 2004-12-01 Asml Netherlands Bv Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate.
US7084414B2 (en) * 2003-05-28 2006-08-01 Mapper Lithography Ip B.V. Charged particle beamlet exposure system
US7129502B2 (en) * 2003-03-10 2006-10-31 Mapper Lithography Ip B.V. Apparatus for generating a plurality of beamlets
TW200952022A (en) * 2008-02-26 2009-12-16 Mapper Lithography Ip Bv Projection lens arrangement
TW201003711A (en) * 2008-04-15 2010-01-16 Mapper Lithography Ip Bv Projection lens arrangement
WO2010094802A1 (en) * 2009-02-22 2010-08-26 Mapper Lithography Ip B.V. Preparation unit for lithogrpahy machine

Family Cites Families (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157308A (en) 1961-09-05 1964-11-17 Clark Mfg Co J L Canister type container and method of making the same
US3159408A (en) 1961-10-05 1964-12-01 Grace W R & Co Chuck
US4524308A (en) 1984-06-01 1985-06-18 Sony Corporation Circuits for accomplishing electron beam convergence in color cathode ray tubes
US4951601A (en) 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US5536128A (en) 1988-10-21 1996-07-16 Hitachi, Ltd. Method and apparatus for carrying a variety of products
JPH05136247A (ja) * 1991-11-13 1993-06-01 Fuji Electric Co Ltd 半導体ウエハ処理装置
WO1994025880A1 (en) 1993-04-30 1994-11-10 Board Of Regents, The University Of Texas System Megavoltage scanning imager and method for its use
JPH0729787A (ja) 1993-07-15 1995-01-31 Toshiba Mach Co Ltd 恒温部材の温度保持装置
DE634699T1 (de) * 1993-07-16 1996-02-15 Semiconductor Systems Inc Gruppiertes fotolithografisches System.
DE4446489C1 (de) 1994-12-23 1996-05-15 Fraunhofer Ges Forschung Verfahren zum Manipulieren von Mikrobauteilen und Vorrichtung zur Durchführung des Verfahrens
EP0766405A1 (en) 1995-09-29 1997-04-02 STMicroelectronics S.r.l. Successive approximation register without redundancy
JP3892494B2 (ja) * 1996-01-26 2007-03-14 東京エレクトロン株式会社 基板搬送装置
JP3579228B2 (ja) * 1997-01-24 2004-10-20 大日本スクリーン製造株式会社 基板処理装置
US5944476A (en) * 1997-03-26 1999-08-31 Kensington Laboratories, Inc. Unitary specimen prealigner and continuously rotatable multiple link robot arm mechanism
JP4048387B2 (ja) * 1997-09-10 2008-02-20 東京エレクトロン株式会社 ロードロック機構及び処理装置
JPH11121362A (ja) 1997-10-20 1999-04-30 Canon Inc 露光装置およびデバイス製造方法
US6719516B2 (en) * 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
JP3019260B1 (ja) 1999-03-26 2000-03-13 株式会社日立製作所 電子ビ―ム描画装置
US6364762B1 (en) * 1999-09-30 2002-04-02 Lam Research Corporation Wafer atmospheric transport module having a controlled mini-environment
US6949143B1 (en) 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
JP2002009139A (ja) 2000-06-20 2002-01-11 Nikon Corp 静電チャック
KR100885082B1 (ko) * 2000-09-01 2009-02-25 어사이스트 테크놀로지스, 인코포레이티드 버퍼링 성능을 가진 에지 그립 얼라이너
TW559855B (en) * 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
KR20070037517A (ko) 2000-09-15 2007-04-04 어플라이드 머티어리얼스, 인코포레이티드 처리 장비용 더블 이중 슬롯 로드록
EP1202326B1 (de) 2000-10-31 2004-01-02 Sez Ag Vorrichtung zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen
WO2003008157A2 (en) 2001-07-14 2003-01-30 Brooks Automation, Inc. Centering double side edge grip end effector with integrated mapping sensor
JP2003045947A (ja) 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
JP2003068600A (ja) 2001-08-22 2003-03-07 Canon Inc 露光装置、および基板チャックの冷却方法
US6786996B2 (en) 2001-10-16 2004-09-07 Applied Materials Inc. Apparatus and method for edge bead removal
US6778258B2 (en) * 2001-10-19 2004-08-17 Asml Holding N.V. Wafer handling system for use in lithography patterning
CN101105637B (zh) * 2002-02-22 2011-02-02 Asml控股股份有限公司 使用两件式盖子保护模版的系统和方法
AU2003265798A1 (en) 2002-08-31 2004-03-19 Applied Materials, Inc. Method and apparatus for supplying substrates to a processing tool
CN100524026C (zh) 2002-10-25 2009-08-05 迈普尔平版印刷Ip有限公司 光刻系统
CN101414534B (zh) 2002-10-30 2012-10-03 迈普尔平版印刷Ip有限公司 电子束曝光系统
JP4425801B2 (ja) * 2002-11-15 2010-03-03 株式会社荏原製作所 基板処理装置
EP1457829A1 (en) 2003-03-11 2004-09-15 ASML Netherlands B.V. Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
SG115631A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, load lock and method for transferring objects
JP2004281474A (ja) 2003-03-12 2004-10-07 Seiko Epson Corp 製造対象物の受け渡し装置および製造対象物の受け渡し装置を有する搬送システム
JP3674864B2 (ja) 2003-03-25 2005-07-27 忠素 玉井 真空処理装置
US7010388B2 (en) * 2003-05-22 2006-03-07 Axcelis Technologies, Inc. Work-piece treatment system having load lock and buffer
JP4664293B2 (ja) 2003-07-30 2011-04-06 マッパー・リソグラフィー・アイピー・ビー．ブイ． 変調器回路
US7158211B2 (en) 2003-09-29 2007-01-02 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI502694B (zh) 2004-05-14 2015-10-01 費洛鐵股份有限公司 轉移物件通過低壓狀態下之負荷固定艙的裝置及方法
JP2006066690A (ja) 2004-08-27 2006-03-09 Hitachi High-Technologies Corp 電子線描画装置、電子線描画装置の温度制御方法、および回路パターン製造装置
US20070134821A1 (en) * 2004-11-22 2007-06-14 Randhir Thakur Cluster tool for advanced front-end processing
ATE493757T1 (de) * 2005-02-22 2011-01-15 Oc Oerlikon Balzers Ag Verfahren zur positionierung eines wafers
JP4844186B2 (ja) 2005-03-18 2011-12-28 株式会社ニコン プレート部材、基板保持装置、露光装置及び露光方法、並びにデバイス製造方法
JP4667140B2 (ja) * 2005-06-30 2011-04-06 キヤノン株式会社 露光装置およびデバイス製造方法
KR101363591B1 (ko) 2005-07-11 2014-02-14 브룩스 오토메이션 인코퍼레이티드 자동 정렬 기능을 갖는 기판 이송 장치
KR20070029032A (ko) * 2005-09-08 2007-03-13 주성엔지니어링(주) 이동식 이송챔버와 이를 포함하는 기판처리장치
US7709815B2 (en) 2005-09-16 2010-05-04 Mapper Lithography Ip B.V. Lithography system and projection method
DE102006021647A1 (de) 2005-11-09 2007-11-15 Coenen, Wolfgang, Dipl.-Ing. Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften
KR100655079B1 (ko) 2005-11-11 2006-12-08 삼성전자주식회사 트랜스퍼 챔버와 프로세스 챔버 사이의 기밀유지장치
US8325321B2 (en) 2006-07-28 2012-12-04 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
JP5048352B2 (ja) 2007-01-31 2012-10-17 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US8950998B2 (en) * 2007-02-27 2015-02-10 Brooks Automation, Inc. Batch substrate handling
US20080225261A1 (en) 2007-03-13 2008-09-18 Noriyuki Hirayanagi Exposure apparatus and device manufacturing method
WO2008144668A1 (en) 2007-05-17 2008-11-27 Brooks Automation, Inc. Side opening substrate carrier and load port
US7817241B2 (en) 2007-07-05 2010-10-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI450047B (zh) 2007-07-13 2014-08-21 瑪波微影Ｉｐ公司 微影系統、夾緊方法及晶圓台
US8705010B2 (en) * 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
US20090110532A1 (en) * 2007-10-29 2009-04-30 Sokudo Co., Ltd. Method and apparatus for providing wafer centering on a track lithography tool
CN102017052B (zh) 2008-02-26 2013-09-04 迈普尔平版印刷Ip有限公司 投影透镜装置
NL1036673A1 (nl) 2008-04-09 2009-10-12 Asml Holding Nv Robot Position Calibration Tool (RPCT).
US8757026B2 (en) 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
KR20110030466A (ko) 2008-05-23 2011-03-23 마퍼 리쏘그라피 아이피 비.브이. 이미징 시스템
WO2009147202A1 (en) 2008-06-04 2009-12-10 Mapper Lithography Ip B.V. Writing strategy
CN102232237B (zh) 2008-10-01 2014-09-24 迈普尔平版印刷Ip有限公司 静电透镜构件
JP5548430B2 (ja) 2008-11-26 2014-07-16 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP5000627B2 (ja) * 2008-11-27 2012-08-15 東京エレクトロン株式会社 基板処理システム
WO2010094800A1 (en) * 2009-02-22 2010-08-26 Mapper Lithography Ip B.V. Substrate support structure, clamp preparation unit, and lithography system
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
JP5249098B2 (ja) * 2009-03-17 2013-07-31 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP6510423B2 (ja) 2013-01-22 2019-05-08 ブルックス オートメーション インコーポレイテッド 基板搬送部
US10168208B2 (en) 2015-04-03 2019-01-01 Hitachi High-Technologies Corporation Light amount detection device, immune analyzing apparatus and charged particle beam apparatus that each use the light amount detection device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7129502B2 (en) * 2003-03-10 2006-10-31 Mapper Lithography Ip B.V. Apparatus for generating a plurality of beamlets
TW200426531A (en) * 2003-03-11 2004-12-01 Asml Netherlands Bv Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate.
US7084414B2 (en) * 2003-05-28 2006-08-01 Mapper Lithography Ip B.V. Charged particle beamlet exposure system
TW200952022A (en) * 2008-02-26 2009-12-16 Mapper Lithography Ip Bv Projection lens arrangement
TW201003711A (en) * 2008-04-15 2010-01-16 Mapper Lithography Ip Bv Projection lens arrangement
WO2010094802A1 (en) * 2009-02-22 2010-08-26 Mapper Lithography Ip B.V. Preparation unit for lithogrpahy machine

Also Published As

Publication number Publication date
WO2012146789A1 (en) 2012-11-01
KR101892460B1 (ko) 2018-08-28
EP2702452A1 (en) 2014-03-05
KR20180031082A (ko) 2018-03-27
JP5805851B2 (ja) 2015-11-10
US20130034421A1 (en) 2013-02-07
CN106919006B (zh) 2020-03-13
EP2702452B1 (en) 2016-08-03
CN106919006A (zh) 2017-07-04
KR20160047590A (ko) 2016-05-02
JP2014514769A (ja) 2014-06-19
USRE48903E1 (en) 2022-01-25
KR101607618B1 (ko) 2016-04-11
TW201250403A (en) 2012-12-16
US20160004173A1 (en) 2016-01-07
TWI514089B (zh) 2015-12-21
KR101614475B1 (ko) 2016-04-21
CN103649837B (zh) 2017-04-12
US9575418B2 (en) 2017-02-21
JP5787331B2 (ja) 2015-09-30
US8936994B2 (en) 2015-01-20
CN106896650A (zh) 2017-06-27
CN103649837A (zh) 2014-03-19
TW201250402A (en) 2012-12-16
US9176397B2 (en) 2015-11-03
US20130044305A1 (en) 2013-02-21
KR20140025495A (ko) 2014-03-04
KR20140041501A (ko) 2014-04-04
JP2014513429A (ja) 2014-05-29
WO2012146788A1 (en) 2012-11-01

Similar Documents

Publication Publication Date Title
TWI486723B (zh) 在微影系統中處理基板的方法
TWI548950B (zh) 微影系統及在該微影系統內處理基板之方法
KR100736300B1 (ko) 웨이퍼 취급 시스템 및 리소그래피 패터닝에 사용되는 방법
US9443699B2 (en) Multi-beam tool for cutting patterns
TW201324592A (zh) 高產量離子植入機

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees