CN103649837B - 在光刻系统中处理基板的方法 - Google Patents

在光刻系统中处理基板的方法 Download PDF

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Publication number
CN103649837B
CN103649837B CN201280032577.XA CN201280032577A CN103649837B CN 103649837 B CN103649837 B CN 103649837B CN 201280032577 A CN201280032577 A CN 201280032577A CN 103649837 B CN103649837 B CN 103649837B
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CN
China
Prior art keywords
substrate
unit
robot
transferring
nth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280032577.XA
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English (en)
Chinese (zh)
Other versions
CN103649837A (zh
Inventor
V.S.凯珀
E.斯洛特
M.N.J.范科温克
G.德博尔
H.J.德琼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
Original Assignee
Mapper Lithopraphy IP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mapper Lithopraphy IP BV filed Critical Mapper Lithopraphy IP BV
Priority to CN201710164697.XA priority Critical patent/CN106896650A/zh
Priority to CN201710164699.9A priority patent/CN106919006B/zh
Publication of CN103649837A publication Critical patent/CN103649837A/zh
Application granted granted Critical
Publication of CN103649837B publication Critical patent/CN103649837B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0474—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201280032577.XA 2011-04-28 2012-05-01 在光刻系统中处理基板的方法 Expired - Fee Related CN103649837B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201710164697.XA CN106896650A (zh) 2011-04-28 2012-05-01 将目标从基板转移系统转移至光刻系统的装置和方法
CN201710164699.9A CN106919006B (zh) 2011-04-28 2012-05-01 光刻系统、在光刻系统内转移基板的装置及方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161480163P 2011-04-28 2011-04-28
US61/480,163 2011-04-28
PCT/EP2012/057955 WO2012146788A1 (en) 2011-04-28 2012-05-01 Method of processing a substrate in a lithography system

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN201710164697.XA Division CN106896650A (zh) 2011-04-28 2012-05-01 将目标从基板转移系统转移至光刻系统的装置和方法
CN201710164699.9A Division CN106919006B (zh) 2011-04-28 2012-05-01 光刻系统、在光刻系统内转移基板的装置及方法

Publications (2)

Publication Number Publication Date
CN103649837A CN103649837A (zh) 2014-03-19
CN103649837B true CN103649837B (zh) 2017-04-12

Family

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Family Applications (3)

Application Number Title Priority Date Filing Date
CN201280032577.XA Expired - Fee Related CN103649837B (zh) 2011-04-28 2012-05-01 在光刻系统中处理基板的方法
CN201710164697.XA Pending CN106896650A (zh) 2011-04-28 2012-05-01 将目标从基板转移系统转移至光刻系统的装置和方法
CN201710164699.9A Expired - Fee Related CN106919006B (zh) 2011-04-28 2012-05-01 光刻系统、在光刻系统内转移基板的装置及方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201710164697.XA Pending CN106896650A (zh) 2011-04-28 2012-05-01 将目标从基板转移系统转移至光刻系统的装置和方法
CN201710164699.9A Expired - Fee Related CN106919006B (zh) 2011-04-28 2012-05-01 光刻系统、在光刻系统内转移基板的装置及方法

Country Status (7)

Country Link
US (4) US9176397B2 (enExample)
EP (1) EP2702452B1 (enExample)
JP (2) JP5787331B2 (enExample)
KR (4) KR20180031082A (enExample)
CN (3) CN103649837B (enExample)
TW (2) TWI486723B (enExample)
WO (2) WO2012146789A1 (enExample)

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KR101907433B1 (ko) * 2010-12-14 2018-10-12 마퍼 리쏘그라피 아이피 비.브이. 리소그라피 시스템 및 이러한 리소그라피 시스템에서 기판을 프로세싱하는 방법
JP6049367B2 (ja) 2012-09-13 2016-12-21 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理システム
NL2010624C2 (en) 2013-04-08 2014-10-09 Mapper Lithography Ip Bv Cabinet for electronic equipment.
CN106462084B (zh) * 2014-05-07 2018-10-19 迈普尔平版印刷Ip有限公司 用于目标处理机械的封闭件
KR101681185B1 (ko) * 2014-11-04 2016-12-02 세메스 주식회사 인터페이스 모듈 및 이를 포함하는 기판 처리 장치 및 방법
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JP5805851B2 (ja) 2015-11-10
US20130034421A1 (en) 2013-02-07
CN106919006B (zh) 2020-03-13
EP2702452B1 (en) 2016-08-03
CN106919006A (zh) 2017-07-04
KR20160047590A (ko) 2016-05-02
JP2014514769A (ja) 2014-06-19
USRE48903E1 (en) 2022-01-25
KR101607618B1 (ko) 2016-04-11
TW201250403A (en) 2012-12-16
US20160004173A1 (en) 2016-01-07
TWI514089B (zh) 2015-12-21
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US9575418B2 (en) 2017-02-21
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US8936994B2 (en) 2015-01-20
CN106896650A (zh) 2017-06-27
TWI486723B (zh) 2015-06-01
CN103649837A (zh) 2014-03-19
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US9176397B2 (en) 2015-11-03
US20130044305A1 (en) 2013-02-21
KR20140025495A (ko) 2014-03-04
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