JP5787331B2 - リソグラフィシステムにおいて基板を搬送するための装置 - Google Patents

リソグラフィシステムにおいて基板を搬送するための装置 Download PDF

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Publication number
JP5787331B2
JP5787331B2 JP2014506912A JP2014506912A JP5787331B2 JP 5787331 B2 JP5787331 B2 JP 5787331B2 JP 2014506912 A JP2014506912 A JP 2014506912A JP 2014506912 A JP2014506912 A JP 2014506912A JP 5787331 B2 JP5787331 B2 JP 5787331B2
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substrate
support structure
fingers
substrate support
load lock
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JP2014514769A (ja
JP2014514769A5 (enExample
Inventor
クイパー、ビンセント・シルベスター
スロット、アーウィン
ファン・ケルビンック、マルセル・ニコラース・ヤコブス
デ・ボア、ギード
デ・ヨン、ヘンドリク・ヤン
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マッパー・リソグラフィー・アイピー・ビー．ブイ．
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2014506912A 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を搬送するための装置 Active JP5787331B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161480163P 2011-04-28 2011-04-28
US61/480,163 2011-04-28
PCT/EP2012/057959 WO2012146789A1 (en) 2011-04-28 2012-05-01 Apparatus for transferring a substrate in a lithography system

Publications (3)

Publication Number Publication Date
JP2014514769A JP2014514769A (ja) 2014-06-19
JP2014514769A5 JP2014514769A5 (enExample) 2015-06-25
JP5787331B2 true JP5787331B2 (ja) 2015-09-30

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014506912A Active JP5787331B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を搬送するための装置
JP2014506911A Expired - Fee Related JP5805851B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を処理する方法

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JP2014506911A Expired - Fee Related JP5805851B2 (ja) 2011-04-28 2012-05-01 リソグラフィシステムにおいて基板を処理する方法

Country Status (7)

Country Link
US (4) US8936994B2 (enExample)
EP (1) EP2702452B1 (enExample)
JP (2) JP5787331B2 (enExample)
KR (4) KR101892460B1 (enExample)
CN (3) CN106896650A (enExample)
TW (2) TWI514089B (enExample)
WO (2) WO2012146789A1 (enExample)

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Publication number Publication date
US20160004173A1 (en) 2016-01-07
CN106896650A (zh) 2017-06-27
CN106919006B (zh) 2020-03-13
KR101607618B1 (ko) 2016-04-11
TW201250403A (en) 2012-12-16
JP2014513429A (ja) 2014-05-29
KR20180031082A (ko) 2018-03-27
US20130044305A1 (en) 2013-02-21
TWI486723B (zh) 2015-06-01
TW201250402A (en) 2012-12-16
JP2014514769A (ja) 2014-06-19
CN106919006A (zh) 2017-07-04
EP2702452A1 (en) 2014-03-05
USRE48903E1 (en) 2022-01-25
US9176397B2 (en) 2015-11-03
KR20140041501A (ko) 2014-04-04
EP2702452B1 (en) 2016-08-03
CN103649837B (zh) 2017-04-12
KR20140025495A (ko) 2014-03-04
WO2012146789A1 (en) 2012-11-01
CN103649837A (zh) 2014-03-19
TWI514089B (zh) 2015-12-21
KR101614475B1 (ko) 2016-04-21
JP5805851B2 (ja) 2015-11-10
WO2012146788A1 (en) 2012-11-01
US20130034421A1 (en) 2013-02-07
KR101892460B1 (ko) 2018-08-28
KR20160047590A (ko) 2016-05-02
US9575418B2 (en) 2017-02-21
US8936994B2 (en) 2015-01-20

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