JP2014007299A5 - - Google Patents

Download PDF

Info

Publication number
JP2014007299A5
JP2014007299A5 JP2012142389A JP2012142389A JP2014007299A5 JP 2014007299 A5 JP2014007299 A5 JP 2014007299A5 JP 2012142389 A JP2012142389 A JP 2012142389A JP 2012142389 A JP2012142389 A JP 2012142389A JP 2014007299 A5 JP2014007299 A5 JP 2014007299A5
Authority
JP
Japan
Prior art keywords
substrate
support
imaging
unit
center position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012142389A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014007299A (ja
JP6001934B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2012142389A external-priority patent/JP6001934B2/ja
Priority to JP2012142389A priority Critical patent/JP6001934B2/ja
Priority to US14/409,137 priority patent/US9911637B2/en
Priority to KR1020157001241A priority patent/KR101677864B1/ko
Priority to PCT/JP2013/062572 priority patent/WO2014002609A1/ja
Priority to TW102117205A priority patent/TWI524463B/zh
Publication of JP2014007299A publication Critical patent/JP2014007299A/ja
Publication of JP2014007299A5 publication Critical patent/JP2014007299A5/ja
Publication of JP6001934B2 publication Critical patent/JP6001934B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012142389A 2012-06-25 2012-06-25 重ね合わせ装置および重ね合わせ方法 Active JP6001934B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012142389A JP6001934B2 (ja) 2012-06-25 2012-06-25 重ね合わせ装置および重ね合わせ方法
US14/409,137 US9911637B2 (en) 2012-06-25 2013-04-30 Overlapping device, and overlapping method
KR1020157001241A KR101677864B1 (ko) 2012-06-25 2013-04-30 중첩 장치 및 중첩 방법
PCT/JP2013/062572 WO2014002609A1 (ja) 2012-06-25 2013-04-30 重ね合わせ装置および重ね合わせ方法
TW102117205A TWI524463B (zh) 2012-06-25 2013-05-15 重疊裝置及重疊方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012142389A JP6001934B2 (ja) 2012-06-25 2012-06-25 重ね合わせ装置および重ね合わせ方法

Publications (3)

Publication Number Publication Date
JP2014007299A JP2014007299A (ja) 2014-01-16
JP2014007299A5 true JP2014007299A5 (enExample) 2016-03-10
JP6001934B2 JP6001934B2 (ja) 2016-10-05

Family

ID=49782783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012142389A Active JP6001934B2 (ja) 2012-06-25 2012-06-25 重ね合わせ装置および重ね合わせ方法

Country Status (5)

Country Link
US (1) US9911637B2 (enExample)
JP (1) JP6001934B2 (enExample)
KR (1) KR101677864B1 (enExample)
TW (1) TWI524463B (enExample)
WO (1) WO2014002609A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014098174A1 (ja) * 2012-12-21 2014-06-26 株式会社新川 フリップチップボンダ及びボンディングステージの平坦度並びに変形量補正方法
JP6412786B2 (ja) * 2014-12-03 2018-10-24 東京応化工業株式会社 搬送方法
US10825705B2 (en) * 2015-05-15 2020-11-03 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
JP6756600B2 (ja) * 2016-12-14 2020-09-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7291577B2 (ja) * 2019-08-28 2023-06-15 芝浦メカトロニクス株式会社 移送装置および実装装置
JP7580811B2 (ja) * 2022-03-29 2024-11-12 Ａｉメカテック株式会社 基板貼り合わせ装置及び基板貼り合わせ方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4535907B2 (ja) * 2005-03-03 2010-09-01 日東電工株式会社 判別機能付き位置決め装置
JP4781802B2 (ja) * 2005-12-06 2011-09-28 東京応化工業株式会社 サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法
JP4750724B2 (ja) 2007-01-25 2011-08-17 東京応化工業株式会社 重ね合わせユニット及び貼り合わせ装置
JP4744458B2 (ja) * 2007-01-31 2011-08-10 東京エレクトロン株式会社 基板位置決め装置および基板位置決め方法
TWI471971B (zh) 2007-10-30 2015-02-01 尼康股份有限公司 Substrate holding member, substrate bonding apparatus, laminated substrate manufacturing apparatus, substrate bonding method, laminated substrate manufacturing method, and laminated semiconductor device manufacturing method
US8060330B2 (en) 2008-12-12 2011-11-15 Lam Research Corporation Method and system for centering wafer on chuck
JP5477053B2 (ja) * 2010-03-02 2014-04-23 株式会社ニコン 重ね合わせ装置、ウェハホルダ、位置検出方法およびデバイスの製造方法
JP6014302B2 (ja) * 2010-09-06 2016-10-25 東京応化工業株式会社 貼り合わせ装置および貼り合わせ方法
JP2013033809A (ja) * 2011-08-01 2013-02-14 Tokyo Electron Ltd ウエハ搬送装置

Similar Documents

Publication Publication Date Title
JP2014007299A5 (enExample)
ES2644809T3 (es) Sistema de generación de gas inerte a bordo
JP2014057070A5 (enExample)
IL259285B1 (en) A system and method for detecting defects on objects in an image
ES2485617A1 (es) Sensor textil piezo-resistivo y sistema de detección del ritmo cardiaco y/o respiratorio
IL235833B (en) Metrology method and apparatus, substrate, lithographic system and device manufacturing method
JP2016001457A5 (ja) 電子機器及びその作製方法
CL2013003589A1 (es) Un metodo y sistema para cancelar la interferencia sinusoidal en un sistema procesador de señales.
JP2016524334A5 (enExample)
JP2015203652A5 (enExample)
JP2012084861A5 (ja) 成膜装置
JP2014237545A5 (enExample)
JP2013085715A5 (enExample)
TR201909178T4 (tr) Cihazın hareketini ve yönlendirmesini izlemek için cihaz ve yöntem.
EP2775264A3 (en) Time synchronized redundant sensors
JP2014501442A5 (enExample)
JP2018155531A5 (enExample)
JP2015073263A5 (enExample)
EP2722714A3 (en) Detection device, exposure apparatus and device manufacturing method using such an exposure apparatus
WO2014016720A3 (en) Dose deformation error calculation method and system
JP2010161740A5 (enExample)
JP2013035642A5 (enExample)
JP2013114605A5 (enExample)
SG11201404558UA (en) A device for imaging, recording and saving thermographic image, a system of three liquid crystal matrices used by this device and its application for the detection of thermal anomalies, and a method of diagnosing of these anomalies
JP2013026994A5 (enExample)