JP2015173244A5 - - Google Patents

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Publication number
JP2015173244A5
JP2015173244A5 JP2014176873A JP2014176873A JP2015173244A5 JP 2015173244 A5 JP2015173244 A5 JP 2015173244A5 JP 2014176873 A JP2014176873 A JP 2014176873A JP 2014176873 A JP2014176873 A JP 2014176873A JP 2015173244 A5 JP2015173244 A5 JP 2015173244A5
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JP
Japan
Prior art keywords
fixing
adhesive layer
bonding apparatus
sheet
laminating
Prior art date
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Application number
JP2014176873A
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English (en)
Japanese (ja)
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JP6386306B2 (ja
JP2015173244A (ja
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Priority to JP2014176873A priority Critical patent/JP6386306B2/ja
Priority claimed from JP2014176873A external-priority patent/JP6386306B2/ja
Publication of JP2015173244A publication Critical patent/JP2015173244A/ja
Publication of JP2015173244A5 publication Critical patent/JP2015173244A5/ja
Application granted granted Critical
Publication of JP6386306B2 publication Critical patent/JP6386306B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014176873A 2013-09-06 2014-09-01 貼り合わせ装置、及び積層体の作製装置 Expired - Fee Related JP6386306B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014176873A JP6386306B2 (ja) 2013-09-06 2014-09-01 貼り合わせ装置、及び積層体の作製装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013184659 2013-09-06
JP2013184659 2013-09-06
JP2014029754 2014-02-19
JP2014029754 2014-02-19
JP2014176873A JP6386306B2 (ja) 2013-09-06 2014-09-01 貼り合わせ装置、及び積層体の作製装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018149838A Division JP6621883B2 (ja) 2013-09-06 2018-08-09 積層体の作製装置

Publications (3)

Publication Number Publication Date
JP2015173244A JP2015173244A (ja) 2015-10-01
JP2015173244A5 true JP2015173244A5 (enExample) 2017-10-12
JP6386306B2 JP6386306B2 (ja) 2018-09-05

Family

ID=52624353

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2014176873A Expired - Fee Related JP6386306B2 (ja) 2013-09-06 2014-09-01 貼り合わせ装置、及び積層体の作製装置
JP2018149838A Expired - Fee Related JP6621883B2 (ja) 2013-09-06 2018-08-09 積層体の作製装置
JP2019209393A Withdrawn JP2020050527A (ja) 2013-09-06 2019-11-20 貼り合せ装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2018149838A Expired - Fee Related JP6621883B2 (ja) 2013-09-06 2018-08-09 積層体の作製装置
JP2019209393A Withdrawn JP2020050527A (ja) 2013-09-06 2019-11-20 貼り合せ装置

Country Status (4)

Country Link
US (2) US9925749B2 (enExample)
JP (3) JP6386306B2 (enExample)
TW (1) TWI641057B (enExample)
WO (1) WO2015033944A1 (enExample)

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TWI671141B (zh) 2013-08-30 2019-09-11 半導體能源研究所股份有限公司 支撐體供應裝置及供應支撐體的方法
TWI618131B (zh) 2013-08-30 2018-03-11 半導體能源研究所股份有限公司 剝離起點形成裝置及形成方法、疊層體製造裝置
US9427949B2 (en) 2013-12-03 2016-08-30 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus and stack manufacturing apparatus
US9229481B2 (en) 2013-12-20 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9676175B2 (en) 2014-06-20 2017-06-13 Semiconductor Energy Laboratory Co., Ltd. Peeling apparatus
CN115447223A (zh) * 2014-12-26 2022-12-09 Ａｇｃ株式会社 玻璃层叠体、电子器件的制造方法、玻璃层叠体的制造方法、玻璃板包装体
JP6815096B2 (ja) 2015-05-27 2021-01-20 株式会社半導体エネルギー研究所 剥離装置
US10804407B2 (en) 2016-05-12 2020-10-13 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus and stack processing apparatus
JP6448067B2 (ja) * 2017-05-22 2019-01-09 キヤノントッキ株式会社 基板載置方法、基板載置機構、成膜方法、成膜装置及び電子デバイスの製造方法
CN109391873A (zh) * 2017-08-10 2019-02-26 深圳清华大学研究院 石墨烯增强pet塑料声学振膜的扬声器信号调理系统
KR102404905B1 (ko) 2017-11-10 2022-06-07 삼성전자주식회사 디스플레이 장치 및 그 제조 방법
CN108016656A (zh) * 2017-12-15 2018-05-11 天津实德新型建材科技有限公司 一种型材保护膜黏贴压紧装置
CN108284661B (zh) * 2018-01-31 2019-12-31 武汉华星光电半导体显示技术有限公司 偏光片的剥离设备及其剥离方法
WO2019226958A1 (en) 2018-05-24 2019-11-28 The Research Foundation For The State University Of New York Capacitive sensor
TWI673171B (zh) * 2018-08-20 2019-10-01 萬達光電科技股份有限公司 治具及全貼合設備

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JP4619462B2 (ja) 1996-08-27 2011-01-26 セイコーエプソン株式会社 薄膜素子の転写方法
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JP5311527B1 (ja) * 2013-04-04 2013-10-09 株式会社Ｆｕｋ 貼付装置
TWI671141B (zh) 2013-08-30 2019-09-11 半導體能源研究所股份有限公司 支撐體供應裝置及供應支撐體的方法
TWI618131B (zh) 2013-08-30 2018-03-11 半導體能源研究所股份有限公司 剝離起點形成裝置及形成方法、疊層體製造裝置
CN105493631B (zh) 2013-08-30 2017-11-24 株式会社半导体能源研究所 叠层体的加工装置及加工方法

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