JP6386306B2 - 貼り合わせ装置、及び積層体の作製装置 - Google Patents
貼り合わせ装置、及び積層体の作製装置 Download PDFInfo
- Publication number
- JP6386306B2 JP6386306B2 JP2014176873A JP2014176873A JP6386306B2 JP 6386306 B2 JP6386306 B2 JP 6386306B2 JP 2014176873 A JP2014176873 A JP 2014176873A JP 2014176873 A JP2014176873 A JP 2014176873A JP 6386306 B2 JP6386306 B2 JP 6386306B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- support
- light
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10431—Specific parts for the modulation of light incorporated into the laminated safety glass or glazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/105—Metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/0015—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid warp or curl
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
-
- H10W72/00—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/15—Combined or convertible surface bonding means and/or assembly means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1798—Surface bonding means and/or assemblymeans with work feeding or handling means with liquid adhesive or adhesive activator applying means
Landscapes
- Electroluminescent Light Sources (AREA)
- Liquid Crystal (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014176873A JP6386306B2 (ja) | 2013-09-06 | 2014-09-01 | 貼り合わせ装置、及び積層体の作製装置 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013184659 | 2013-09-06 | ||
| JP2013184659 | 2013-09-06 | ||
| JP2014029754 | 2014-02-19 | ||
| JP2014029754 | 2014-02-19 | ||
| JP2014176873A JP6386306B2 (ja) | 2013-09-06 | 2014-09-01 | 貼り合わせ装置、及び積層体の作製装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018149838A Division JP6621883B2 (ja) | 2013-09-06 | 2018-08-09 | 積層体の作製装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015173244A JP2015173244A (ja) | 2015-10-01 |
| JP2015173244A5 JP2015173244A5 (enExample) | 2017-10-12 |
| JP6386306B2 true JP6386306B2 (ja) | 2018-09-05 |
Family
ID=52624353
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014176873A Expired - Fee Related JP6386306B2 (ja) | 2013-09-06 | 2014-09-01 | 貼り合わせ装置、及び積層体の作製装置 |
| JP2018149838A Expired - Fee Related JP6621883B2 (ja) | 2013-09-06 | 2018-08-09 | 積層体の作製装置 |
| JP2019209393A Withdrawn JP2020050527A (ja) | 2013-09-06 | 2019-11-20 | 貼り合せ装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018149838A Expired - Fee Related JP6621883B2 (ja) | 2013-09-06 | 2018-08-09 | 積層体の作製装置 |
| JP2019209393A Withdrawn JP2020050527A (ja) | 2013-09-06 | 2019-11-20 | 貼り合せ装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US9925749B2 (enExample) |
| JP (3) | JP6386306B2 (enExample) |
| TW (1) | TWI641057B (enExample) |
| WO (1) | WO2015033944A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI671141B (zh) | 2013-08-30 | 2019-09-11 | 半導體能源研究所股份有限公司 | 支撐體供應裝置及供應支撐體的方法 |
| TWI618131B (zh) | 2013-08-30 | 2018-03-11 | 半導體能源研究所股份有限公司 | 剝離起點形成裝置及形成方法、疊層體製造裝置 |
| US9427949B2 (en) | 2013-12-03 | 2016-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and stack manufacturing apparatus |
| US9229481B2 (en) | 2013-12-20 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US9676175B2 (en) | 2014-06-20 | 2017-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus |
| CN115447223A (zh) * | 2014-12-26 | 2022-12-09 | Agc株式会社 | 玻璃层叠体、电子器件的制造方法、玻璃层叠体的制造方法、玻璃板包装体 |
| JP6815096B2 (ja) | 2015-05-27 | 2021-01-20 | 株式会社半導体エネルギー研究所 | 剥離装置 |
| US10804407B2 (en) | 2016-05-12 | 2020-10-13 | Semiconductor Energy Laboratory Co., Ltd. | Laser processing apparatus and stack processing apparatus |
| JP6448067B2 (ja) * | 2017-05-22 | 2019-01-09 | キヤノントッキ株式会社 | 基板載置方法、基板載置機構、成膜方法、成膜装置及び電子デバイスの製造方法 |
| CN109391873A (zh) * | 2017-08-10 | 2019-02-26 | 深圳清华大学研究院 | 石墨烯增强pet塑料声学振膜的扬声器信号调理系统 |
| KR102404905B1 (ko) | 2017-11-10 | 2022-06-07 | 삼성전자주식회사 | 디스플레이 장치 및 그 제조 방법 |
| CN108016656A (zh) * | 2017-12-15 | 2018-05-11 | 天津实德新型建材科技有限公司 | 一种型材保护膜黏贴压紧装置 |
| CN108284661B (zh) * | 2018-01-31 | 2019-12-31 | 武汉华星光电半导体显示技术有限公司 | 偏光片的剥离设备及其剥离方法 |
| WO2019226958A1 (en) | 2018-05-24 | 2019-11-28 | The Research Foundation For The State University Of New York | Capacitive sensor |
| TWI673171B (zh) * | 2018-08-20 | 2019-10-01 | 萬達光電科技股份有限公司 | 治具及全貼合設備 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52107028A (en) | 1975-09-10 | 1977-09-08 | Dainippon Toryo Co Ltd | Container for transferring paint |
| JPH0697016A (ja) | 1992-09-11 | 1994-04-08 | Fuji Xerox Co Ltd | 基板貼付装置 |
| JPH0878366A (ja) | 1994-09-02 | 1996-03-22 | Takatori Corp | 半導体ウエハへのテープ貼付装置 |
| JP4619462B2 (ja) | 1996-08-27 | 2011-01-26 | セイコーエプソン株式会社 | 薄膜素子の転写方法 |
| CN1143394C (zh) | 1996-08-27 | 2004-03-24 | 精工爱普生株式会社 | 剥离方法、溥膜器件的转移方法和薄膜器件 |
| US6127199A (en) | 1996-11-12 | 2000-10-03 | Seiko Epson Corporation | Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device |
| US5944947A (en) * | 1998-01-21 | 1999-08-31 | Jesam Industries Incorporated | Apparatus and method for fabricating laminated structures |
| JP2001042351A (ja) | 1999-07-30 | 2001-02-16 | Minolta Co Ltd | 液晶表示素子の製造方法 |
| EP1072931A3 (en) | 1999-07-27 | 2002-02-13 | Minolta Co., Ltd. | Liquid crystal display and method of producing a liquid crystal display |
| JP2002341323A (ja) | 2001-05-18 | 2002-11-27 | Minolta Co Ltd | 曲面型表示パネルの製造方法 |
| JP4027740B2 (ja) | 2001-07-16 | 2007-12-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TW564471B (en) | 2001-07-16 | 2003-12-01 | Semiconductor Energy Lab | Semiconductor device and peeling off method and method of manufacturing semiconductor device |
| JP2003109773A (ja) | 2001-07-27 | 2003-04-11 | Semiconductor Energy Lab Co Ltd | 発光装置、半導体装置およびそれらの作製方法 |
| AU2003275614A1 (en) | 2002-10-30 | 2004-05-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| US7554121B2 (en) | 2003-12-26 | 2009-06-30 | Semiconductor Energy Laboratory Co., Ltd. | Organic semiconductor device |
| US8040469B2 (en) | 2004-09-10 | 2011-10-18 | Semiconductor Energy Laboratory Co., Ltd. | Display device, method for manufacturing the same and apparatus for manufacturing the same |
| JP4612453B2 (ja) * | 2005-03-30 | 2011-01-12 | 株式会社タカトリ | ウエハへのテープ貼付方法と貼付装置 |
| JP4712886B2 (ja) | 2009-09-03 | 2011-06-29 | 株式会社Fuk | 板状部材貼り合せ装置 |
| JPWO2012067164A1 (ja) * | 2010-11-17 | 2014-05-12 | 旭硝子株式会社 | 透明保護板、フラットパネルディスプレイ、およびフラットパネルディスプレイの製造方法 |
| JP2012110870A (ja) * | 2010-11-26 | 2012-06-14 | Shibaura Mechatronics Corp | 接着剤供給装置及び接着剤供給方法 |
| US9722212B2 (en) | 2011-02-14 | 2017-08-01 | Semiconductor Energy Laboratory Co., Ltd. | Lighting device, light-emitting device, and manufacturing method and manufacturing apparatus thereof |
| KR101888158B1 (ko) | 2011-12-02 | 2018-08-14 | 엘지디스플레이 주식회사 | 평판표시소자의 박형 유리기판의 합착라인 및 합착방법 |
| JP5311527B1 (ja) * | 2013-04-04 | 2013-10-09 | 株式会社Fuk | 貼付装置 |
| TWI671141B (zh) | 2013-08-30 | 2019-09-11 | 半導體能源研究所股份有限公司 | 支撐體供應裝置及供應支撐體的方法 |
| TWI618131B (zh) | 2013-08-30 | 2018-03-11 | 半導體能源研究所股份有限公司 | 剝離起點形成裝置及形成方法、疊層體製造裝置 |
| CN105493631B (zh) | 2013-08-30 | 2017-11-24 | 株式会社半导体能源研究所 | 叠层体的加工装置及加工方法 |
-
2014
- 2014-08-26 US US14/468,818 patent/US9925749B2/en active Active
- 2014-08-27 WO PCT/JP2014/073117 patent/WO2015033944A1/en not_active Ceased
- 2014-09-01 JP JP2014176873A patent/JP6386306B2/ja not_active Expired - Fee Related
- 2014-09-04 TW TW103130575A patent/TWI641057B/zh not_active IP Right Cessation
-
2017
- 2017-11-06 US US15/804,319 patent/US10583641B2/en not_active Expired - Fee Related
-
2018
- 2018-08-09 JP JP2018149838A patent/JP6621883B2/ja not_active Expired - Fee Related
-
2019
- 2019-11-20 JP JP2019209393A patent/JP2020050527A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US20180072033A1 (en) | 2018-03-15 |
| JP2020050527A (ja) | 2020-04-02 |
| US10583641B2 (en) | 2020-03-10 |
| WO2015033944A1 (en) | 2015-03-12 |
| JP6621883B2 (ja) | 2019-12-18 |
| TW201523745A (zh) | 2015-06-16 |
| TWI641057B (zh) | 2018-11-11 |
| US9925749B2 (en) | 2018-03-27 |
| US20150068683A1 (en) | 2015-03-12 |
| JP2018201034A (ja) | 2018-12-20 |
| JP2015173244A (ja) | 2015-10-01 |
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