JP2014501442A5 - - Google Patents
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- Publication number
- JP2014501442A5 JP2014501442A5 JP2013543728A JP2013543728A JP2014501442A5 JP 2014501442 A5 JP2014501442 A5 JP 2014501442A5 JP 2013543728 A JP2013543728 A JP 2013543728A JP 2013543728 A JP2013543728 A JP 2013543728A JP 2014501442 A5 JP2014501442 A5 JP 2014501442A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- lithography system
- lithography
- unit
- vacuum chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001459 lithography Methods 0.000 claims 26
- 239000000758 substrate Substances 0.000 claims 18
- 238000002360 preparation method Methods 0.000 claims 6
- 238000007689 inspection Methods 0.000 claims 2
- 238000000059 patterning Methods 0.000 claims 2
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42274510P | 2010-12-14 | 2010-12-14 | |
| US61/422,745 | 2010-12-14 | ||
| US201161480163P | 2011-04-28 | 2011-04-28 | |
| US61/480,163 | 2011-04-28 | ||
| PCT/EP2011/072654 WO2012080278A1 (en) | 2010-12-14 | 2011-12-13 | Lithography system and method of processing substrates in such a lithography system |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014501442A JP2014501442A (ja) | 2014-01-20 |
| JP2014501442A5 true JP2014501442A5 (enExample) | 2015-02-05 |
| JP6158091B2 JP6158091B2 (ja) | 2017-07-05 |
Family
ID=45418651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013543728A Active JP6158091B2 (ja) | 2010-12-14 | 2011-12-13 | リソグラフィシステム及びこのようなリソグラフィシステムで基板を処理する方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8895943B2 (enExample) |
| EP (1) | EP2681624B1 (enExample) |
| JP (1) | JP6158091B2 (enExample) |
| KR (1) | KR101907433B1 (enExample) |
| CN (1) | CN103370655B (enExample) |
| RU (1) | RU2579533C2 (enExample) |
| TW (1) | TWI548950B (enExample) |
| WO (1) | WO2012080278A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI517196B (zh) * | 2010-11-13 | 2016-01-11 | 瑪波微影Ip公司 | 具有中間腔室的帶電粒子微影系統 |
| US10679883B2 (en) * | 2012-04-19 | 2020-06-09 | Intevac, Inc. | Wafer plate and mask arrangement for substrate fabrication |
| JP6049367B2 (ja) | 2012-09-13 | 2016-12-21 | 株式会社Screenセミコンダクターソリューションズ | 基板処理装置および基板処理システム |
| US8907280B1 (en) | 2012-09-19 | 2014-12-09 | Sandia Corporation | Fast electron microscopy via compressive sensing |
| NL2010624C2 (en) | 2013-04-08 | 2014-10-09 | Mapper Lithography Ip Bv | Cabinet for electronic equipment. |
| NL2013438B1 (en) * | 2013-09-07 | 2016-05-18 | Mapper Lithography Ip Bv | Target processing unit. |
| KR102401836B1 (ko) | 2014-05-07 | 2022-05-25 | 에이에스엠엘 네델란즈 비.브이. | 타겟 가공 기계용 봉입체 |
| CN107111251B (zh) * | 2014-11-14 | 2020-10-20 | Asml荷兰有限公司 | 用于在光刻系统中转移基材的加载锁定系统和方法 |
| JP2016207755A (ja) * | 2015-04-17 | 2016-12-08 | 株式会社ニコン | 露光システム及び交換方法 |
| NL2014864B1 (en) * | 2015-05-27 | 2017-01-31 | Suss Microtec Lithography Gmbh | Device for treating a disc-shaped substrate and support adapter. |
| MY190638A (en) * | 2015-10-01 | 2022-04-29 | Intevac Inc | Wafer plate and mask arrangement for substrate fabrication |
| EP3667696A1 (en) * | 2018-12-14 | 2020-06-17 | ASML Netherlands B.V. | Stage apparatus suitable for electron beam inspection apparatus |
| EP4117017A1 (en) * | 2021-07-05 | 2023-01-11 | ASML Netherlands B.V. | Charged particle detector |
| EP4202970A1 (en) * | 2021-12-24 | 2023-06-28 | ASML Netherlands B.V. | Alignment determination method and computer program |
Family Cites Families (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3157308A (en) | 1961-09-05 | 1964-11-17 | Clark Mfg Co J L | Canister type container and method of making the same |
| US3159408A (en) | 1961-10-05 | 1964-12-01 | Grace W R & Co | Chuck |
| US4524308A (en) | 1984-06-01 | 1985-06-18 | Sony Corporation | Circuits for accomplishing electron beam convergence in color cathode ray tubes |
| WO1994025880A1 (en) | 1993-04-30 | 1994-11-10 | Board Of Regents, The University Of Texas System | Megavoltage scanning imager and method for its use |
| EP0766405A1 (en) | 1995-09-29 | 1997-04-02 | STMicroelectronics S.r.l. | Successive approximation register without redundancy |
| JP3460909B2 (ja) * | 1996-06-26 | 2003-10-27 | 大日本スクリーン製造株式会社 | 基板処理システム |
| JP2000252188A (ja) * | 1999-02-26 | 2000-09-14 | Nikon Corp | 露光装置及びリソグラフィシステム、並びにデバイス |
| JP2000311850A (ja) * | 1999-02-26 | 2000-11-07 | Nikon Corp | 露光装置及びリソグラフィシステム、並びにデバイス製造方法及びデバイス |
| JP2000269299A (ja) | 1999-03-18 | 2000-09-29 | Kokusai Electric Co Ltd | 半導体製造装置 |
| JP2001160534A (ja) * | 1999-09-22 | 2001-06-12 | Nikon Corp | 安全システム及び露光装置 |
| JP2001203167A (ja) * | 2000-01-20 | 2001-07-27 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
| US6261853B1 (en) * | 2000-02-07 | 2001-07-17 | Therma-Wave, Inc. | Method and apparatus for preparing semiconductor wafers for measurement |
| US6519045B2 (en) * | 2001-01-31 | 2003-02-11 | Rudolph Technologies, Inc. | Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment |
| US6669783B2 (en) * | 2001-06-28 | 2003-12-30 | Lam Research Corporation | High temperature electrostatic chuck |
| JP2003142393A (ja) * | 2001-11-07 | 2003-05-16 | Tokyo Seimitsu Co Ltd | 電子ビーム露光装置 |
| EP1554634B1 (en) | 2002-10-25 | 2011-12-21 | Mapper Lithography Ip B.V. | Lithography system |
| CN101414125B (zh) | 2002-10-30 | 2012-02-22 | 迈普尔平版印刷Ip有限公司 | 电子束曝光系统 |
| EP2503587A3 (en) | 2003-03-10 | 2017-08-23 | Mapper Lithography Ip B.V. | Apparatus for generating a plurality of beamlets |
| SG115632A1 (en) * | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate |
| JP2004311890A (ja) * | 2003-04-10 | 2004-11-04 | Sumitomo Heavy Ind Ltd | 移動体のガイド機構 |
| JP3977767B2 (ja) | 2003-04-10 | 2007-09-19 | 住友重機械工業株式会社 | 基板処理装置 |
| ATE524822T1 (de) | 2003-05-28 | 2011-09-15 | Mapper Lithography Ip Bv | Belichtungsverfahren für strahlen aus geladenen teilchen |
| JP2005016255A (ja) * | 2003-06-27 | 2005-01-20 | Sumitomo Heavy Ind Ltd | 扉ロック装置、及び扉システム |
| WO2005010618A2 (en) | 2003-07-30 | 2005-02-03 | Mapper Lithography Ip B.V. | Modulator circuitry |
| US20070269297A1 (en) * | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
| US7564552B2 (en) * | 2004-05-14 | 2009-07-21 | Kla-Tencor Technologies Corp. | Systems and methods for measurement of a specimen with vacuum ultraviolet light |
| US9111972B2 (en) * | 2004-07-13 | 2015-08-18 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and manufacturing method for a semiconductor device |
| JP4926433B2 (ja) * | 2004-12-06 | 2012-05-09 | 株式会社Sokudo | 基板処理装置および基板処理方法 |
| RU2305918C2 (ru) * | 2005-04-19 | 2007-09-10 | Закрытое акционерное общество "Элма-Фотма" | Способ получения фотошаблонных заготовок |
| US7709815B2 (en) | 2005-09-16 | 2010-05-04 | Mapper Lithography Ip B.V. | Lithography system and projection method |
| US20070235665A1 (en) * | 2006-03-30 | 2007-10-11 | Applied Materials, Inc. | Charged particle beam system and method for manufacturing and inspecting LCD devices |
| US20080225261A1 (en) * | 2007-03-13 | 2008-09-18 | Noriyuki Hirayanagi | Exposure apparatus and device manufacturing method |
| US8277165B2 (en) * | 2007-09-22 | 2012-10-02 | Dynamic Micro System Semiconductor Equipment GmbH | Transfer mechanism with multiple wafer handling capability |
| NL1036164A1 (nl) * | 2007-11-15 | 2009-05-18 | Asml Netherlands Bv | Substrate processing apparatus and device manufacturing method. |
| US8757026B2 (en) * | 2008-04-15 | 2014-06-24 | Dynamic Micro Systems, Semiconductor Equipment Gmbh | Clean transfer robot |
| JP2010157639A (ja) * | 2008-12-27 | 2010-07-15 | Canon Inc | 露光装置およびデバイス製造方法 |
| JP2010165948A (ja) * | 2009-01-16 | 2010-07-29 | Nikon Corp | チャンバ装置、基板処理装置、露光装置、デバイス製造方法、及びメンテナンス方法 |
| KR101025288B1 (ko) * | 2009-02-12 | 2011-03-29 | 국민대학교산학협력단 | 전자빔 리소그래피 장치의 나노 스테이지 |
| GB2469112A (en) | 2009-04-03 | 2010-10-06 | Mapper Lithography Ip Bv | Wafer support using controlled capillary liquid layer to hold and release wafer |
| US8436324B2 (en) * | 2009-02-22 | 2013-05-07 | Mapper Lithography Ip B.V. | Preparation unit for lithography machine |
| WO2010094804A1 (en) * | 2009-02-22 | 2010-08-26 | Mapper Lithography Ip B.V. | Lithography machine and substrate handling arrangement |
| US9696633B2 (en) * | 2010-04-12 | 2017-07-04 | Asml Netherlands B.V. | Substrate handling apparatus and lithographic apparatus |
| EP2699966B1 (en) * | 2011-04-22 | 2021-04-07 | ASML Netherlands B.V. | Network architecture and protocol for cluster of lithography machines |
| TWI514089B (zh) * | 2011-04-28 | 2015-12-21 | Mapper Lithography Ip Bv | 在微影系統中用於轉移基板的設備 |
| CN107407595B (zh) | 2015-04-03 | 2018-09-07 | 株式会社日立高新技术 | 光量检测装置、利用其的免疫分析装置及电荷粒子束装置 |
-
2011
- 2011-12-13 CN CN201180067573.0A patent/CN103370655B/zh active Active
- 2011-12-13 KR KR1020137018345A patent/KR101907433B1/ko active Active
- 2011-12-13 JP JP2013543728A patent/JP6158091B2/ja active Active
- 2011-12-13 EP EP11802033.8A patent/EP2681624B1/en active Active
- 2011-12-13 WO PCT/EP2011/072654 patent/WO2012080278A1/en not_active Ceased
- 2011-12-13 US US13/323,950 patent/US8895943B2/en active Active
- 2011-12-13 RU RU2013132215/28A patent/RU2579533C2/ru active
- 2011-12-14 TW TW100146173A patent/TWI548950B/zh active
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