RU2579533C2 - Литографическая система и способ обработки подложек в такой литографической системе - Google Patents

Литографическая система и способ обработки подложек в такой литографической системе Download PDF

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Publication number
RU2579533C2
RU2579533C2 RU2013132215/28A RU2013132215A RU2579533C2 RU 2579533 C2 RU2579533 C2 RU 2579533C2 RU 2013132215/28 A RU2013132215/28 A RU 2013132215/28A RU 2013132215 A RU2013132215 A RU 2013132215A RU 2579533 C2 RU2579533 C2 RU 2579533C2
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RU
Russia
Prior art keywords
substrate
lithographic
lithographic system
substrates
vacuum chamber
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RU2013132215/28A
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English (en)
Russian (ru)
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RU2013132215A (ru
Inventor
БУР Гвидо ДЕ
ЙОНГ Хендрик Ян ДЕ
Винцент Сильвстер КЭЙПЕР
Эрвин СЛОТ
Original Assignee
МЭППЕР ЛИТОГРАФИ АйПи Б. В.
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Publication of RU2013132215A publication Critical patent/RU2013132215A/ru
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/16—Vessels; Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31774—Multi-beam

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
RU2013132215/28A 2010-12-14 2011-12-13 Литографическая система и способ обработки подложек в такой литографической системе RU2579533C2 (ru)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US42274510P 2010-12-14 2010-12-14
US61/422,745 2010-12-14
US201161480163P 2011-04-28 2011-04-28
US61/480,163 2011-04-28
PCT/EP2011/072654 WO2012080278A1 (en) 2010-12-14 2011-12-13 Lithography system and method of processing substrates in such a lithography system

Publications (2)

Publication Number Publication Date
RU2013132215A RU2013132215A (ru) 2015-01-20
RU2579533C2 true RU2579533C2 (ru) 2016-04-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
RU2013132215/28A RU2579533C2 (ru) 2010-12-14 2011-12-13 Литографическая система и способ обработки подложек в такой литографической системе

Country Status (8)

Country Link
US (1) US8895943B2 (enExample)
EP (1) EP2681624B1 (enExample)
JP (1) JP6158091B2 (enExample)
KR (1) KR101907433B1 (enExample)
CN (1) CN103370655B (enExample)
RU (1) RU2579533C2 (enExample)
TW (1) TWI548950B (enExample)
WO (1) WO2012080278A1 (enExample)

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CN107111251B (zh) * 2014-11-14 2020-10-20 Asml荷兰有限公司 用于在光刻系统中转移基材的加载锁定系统和方法
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Also Published As

Publication number Publication date
KR20130131398A (ko) 2013-12-03
WO2012080278A1 (en) 2012-06-21
KR101907433B1 (ko) 2018-10-12
US20120175527A1 (en) 2012-07-12
CN103370655A (zh) 2013-10-23
TW201241575A (en) 2012-10-16
RU2013132215A (ru) 2015-01-20
JP2014501442A (ja) 2014-01-20
EP2681624B1 (en) 2016-07-20
EP2681624A1 (en) 2014-01-08
TWI548950B (zh) 2016-09-11
JP6158091B2 (ja) 2017-07-05
US8895943B2 (en) 2014-11-25
CN103370655B (zh) 2016-03-16

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