CN103370655B - 光刻系统和在该光刻系统中处理基板的方法 - Google Patents

光刻系统和在该光刻系统中处理基板的方法 Download PDF

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Publication number
CN103370655B
CN103370655B CN201180067573.0A CN201180067573A CN103370655B CN 103370655 B CN103370655 B CN 103370655B CN 201180067573 A CN201180067573 A CN 201180067573A CN 103370655 B CN103370655 B CN 103370655B
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CN
China
Prior art keywords
substrate
lithography
lithography system
unit
vacuum chamber
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CN201180067573.0A
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English (en)
Chinese (zh)
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CN103370655A (zh
Inventor
G.德波尔
H.J.德琼
V.S.凯珀
E.斯洛特
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ASML Netherlands BV
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Mapper Lithopraphy IP BV
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/16—Vessels; Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31774—Multi-beam

Landscapes

  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201180067573.0A 2010-12-14 2011-12-13 光刻系统和在该光刻系统中处理基板的方法 Active CN103370655B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US42274510P 2010-12-14 2010-12-14
US61/422,745 2010-12-14
US201161480163P 2011-04-28 2011-04-28
US61/480,163 2011-04-28
PCT/EP2011/072654 WO2012080278A1 (en) 2010-12-14 2011-12-13 Lithography system and method of processing substrates in such a lithography system

Publications (2)

Publication Number Publication Date
CN103370655A CN103370655A (zh) 2013-10-23
CN103370655B true CN103370655B (zh) 2016-03-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180067573.0A Active CN103370655B (zh) 2010-12-14 2011-12-13 光刻系统和在该光刻系统中处理基板的方法

Country Status (8)

Country Link
US (1) US8895943B2 (enExample)
EP (1) EP2681624B1 (enExample)
JP (1) JP6158091B2 (enExample)
KR (1) KR101907433B1 (enExample)
CN (1) CN103370655B (enExample)
RU (1) RU2579533C2 (enExample)
TW (1) TWI548950B (enExample)
WO (1) WO2012080278A1 (enExample)

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Also Published As

Publication number Publication date
EP2681624B1 (en) 2016-07-20
TW201241575A (en) 2012-10-16
JP2014501442A (ja) 2014-01-20
JP6158091B2 (ja) 2017-07-05
RU2579533C2 (ru) 2016-04-10
KR101907433B1 (ko) 2018-10-12
WO2012080278A1 (en) 2012-06-21
US20120175527A1 (en) 2012-07-12
RU2013132215A (ru) 2015-01-20
TWI548950B (zh) 2016-09-11
EP2681624A1 (en) 2014-01-08
CN103370655A (zh) 2013-10-23
KR20130131398A (ko) 2013-12-03
US8895943B2 (en) 2014-11-25

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Effective date of registration: 20190430

Address after: Holland Weide Eindhoven

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Patentee before: Mapper Lithography IP B. V.

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