JP6158091B2 - リソグラフィシステム及びこのようなリソグラフィシステムで基板を処理する方法 - Google Patents

リソグラフィシステム及びこのようなリソグラフィシステムで基板を処理する方法 Download PDF

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Publication number
JP6158091B2
JP6158091B2 JP2013543728A JP2013543728A JP6158091B2 JP 6158091 B2 JP6158091 B2 JP 6158091B2 JP 2013543728 A JP2013543728 A JP 2013543728A JP 2013543728 A JP2013543728 A JP 2013543728A JP 6158091 B2 JP6158091 B2 JP 6158091B2
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substrate
lithography system
lithography
unit
door
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Japanese (ja)
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JP2014501442A (ja
JP2014501442A5 (enExample
Inventor
デ・ボエル、ギド
デ・ジョン、ヘンドリク・ヤン
クイパー、ビンセント・シルベスター
スロット、アーウィン
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マッパー・リソグラフィー・アイピー・ビー．ブイ．
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/16—Vessels; Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31774—Multi-beam

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2013543728A 2010-12-14 2011-12-13 リソグラフィシステム及びこのようなリソグラフィシステムで基板を処理する方法 Active JP6158091B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US42274510P 2010-12-14 2010-12-14
US61/422,745 2010-12-14
US201161480163P 2011-04-28 2011-04-28
US61/480,163 2011-04-28
PCT/EP2011/072654 WO2012080278A1 (en) 2010-12-14 2011-12-13 Lithography system and method of processing substrates in such a lithography system

Publications (3)

Publication Number Publication Date
JP2014501442A JP2014501442A (ja) 2014-01-20
JP2014501442A5 JP2014501442A5 (enExample) 2015-02-05
JP6158091B2 true JP6158091B2 (ja) 2017-07-05

Family

ID=45418651

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013543728A Active JP6158091B2 (ja) 2010-12-14 2011-12-13 リソグラフィシステム及びこのようなリソグラフィシステムで基板を処理する方法

Country Status (8)

Country Link
US (1) US8895943B2 (enExample)
EP (1) EP2681624B1 (enExample)
JP (1) JP6158091B2 (enExample)
KR (1) KR101907433B1 (enExample)
CN (1) CN103370655B (enExample)
RU (1) RU2579533C2 (enExample)
TW (1) TWI548950B (enExample)
WO (1) WO2012080278A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI517196B (zh) * 2010-11-13 2016-01-11 瑪波微影Ｉｐ公司 具有中間腔室的帶電粒子微影系統
US10679883B2 (en) * 2012-04-19 2020-06-09 Intevac, Inc. Wafer plate and mask arrangement for substrate fabrication
JP6049367B2 (ja) 2012-09-13 2016-12-21 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理システム
US8907280B1 (en) 2012-09-19 2014-12-09 Sandia Corporation Fast electron microscopy via compressive sensing
NL2010624C2 (en) 2013-04-08 2014-10-09 Mapper Lithography Ip Bv Cabinet for electronic equipment.
NL2013438B1 (en) * 2013-09-07 2016-05-18 Mapper Lithography Ip Bv Target processing unit.
KR102401836B1 (ko) 2014-05-07 2022-05-25 에이에스엠엘 네델란즈 비.브이. 타겟 가공 기계용 봉입체
CN107111251B (zh) * 2014-11-14 2020-10-20 Asml荷兰有限公司 用于在光刻系统中转移基材的加载锁定系统和方法
JP2016207755A (ja) * 2015-04-17 2016-12-08 株式会社ニコン 露光システム及び交換方法
NL2014864B1 (en) * 2015-05-27 2017-01-31 Suss Microtec Lithography Gmbh Device for treating a disc-shaped substrate and support adapter.
MY190638A (en) * 2015-10-01 2022-04-29 Intevac Inc Wafer plate and mask arrangement for substrate fabrication
EP3667696A1 (en) * 2018-12-14 2020-06-17 ASML Netherlands B.V. Stage apparatus suitable for electron beam inspection apparatus
EP4117017A1 (en) * 2021-07-05 2023-01-11 ASML Netherlands B.V. Charged particle detector
EP4202970A1 (en) * 2021-12-24 2023-06-28 ASML Netherlands B.V. Alignment determination method and computer program

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157308A (en) 1961-09-05 1964-11-17 Clark Mfg Co J L Canister type container and method of making the same
US3159408A (en) 1961-10-05 1964-12-01 Grace W R & Co Chuck
US4524308A (en) 1984-06-01 1985-06-18 Sony Corporation Circuits for accomplishing electron beam convergence in color cathode ray tubes
WO1994025880A1 (en) 1993-04-30 1994-11-10 Board Of Regents, The University Of Texas System Megavoltage scanning imager and method for its use
EP0766405A1 (en) 1995-09-29 1997-04-02 STMicroelectronics S.r.l. Successive approximation register without redundancy
JP3460909B2 (ja) * 1996-06-26 2003-10-27 大日本スクリーン製造株式会社 基板処理システム
JP2000252188A (ja) * 1999-02-26 2000-09-14 Nikon Corp 露光装置及びリソグラフィシステム、並びにデバイス
JP2000311850A (ja) * 1999-02-26 2000-11-07 Nikon Corp 露光装置及びリソグラフィシステム、並びにデバイス製造方法及びデバイス
JP2000269299A (ja) 1999-03-18 2000-09-29 Kokusai Electric Co Ltd 半導体製造装置
JP2001160534A (ja) * 1999-09-22 2001-06-12 Nikon Corp 安全システム及び露光装置
JP2001203167A (ja) * 2000-01-20 2001-07-27 Hitachi Kokusai Electric Inc 半導体製造装置
US6261853B1 (en) * 2000-02-07 2001-07-17 Therma-Wave, Inc. Method and apparatus for preparing semiconductor wafers for measurement
US6519045B2 (en) * 2001-01-31 2003-02-11 Rudolph Technologies, Inc. Method and apparatus for measuring very thin dielectric film thickness and creating a stable measurement environment
US6669783B2 (en) * 2001-06-28 2003-12-30 Lam Research Corporation High temperature electrostatic chuck
JP2003142393A (ja) * 2001-11-07 2003-05-16 Tokyo Seimitsu Co Ltd 電子ビーム露光装置
EP1554634B1 (en) 2002-10-25 2011-12-21 Mapper Lithography Ip B.V. Lithography system
CN101414125B (zh) 2002-10-30 2012-02-22 迈普尔平版印刷Ip有限公司 电子束曝光系统
EP2503587A3 (en) 2003-03-10 2017-08-23 Mapper Lithography Ip B.V. Apparatus for generating a plurality of beamlets
SG115632A1 (en) * 2003-03-11 2005-10-28 Asml Netherlands Bv Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
JP2004311890A (ja) * 2003-04-10 2004-11-04 Sumitomo Heavy Ind Ltd 移動体のガイド機構
JP3977767B2 (ja) 2003-04-10 2007-09-19 住友重機械工業株式会社 基板処理装置
ATE524822T1 (de) 2003-05-28 2011-09-15 Mapper Lithography Ip Bv Belichtungsverfahren für strahlen aus geladenen teilchen
JP2005016255A (ja) * 2003-06-27 2005-01-20 Sumitomo Heavy Ind Ltd 扉ロック装置、及び扉システム
WO2005010618A2 (en) 2003-07-30 2005-02-03 Mapper Lithography Ip B.V. Modulator circuitry
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US7564552B2 (en) * 2004-05-14 2009-07-21 Kla-Tencor Technologies Corp. Systems and methods for measurement of a specimen with vacuum ultraviolet light
US9111972B2 (en) * 2004-07-13 2015-08-18 Hitachi Kokusai Electric Inc. Substrate processing apparatus and manufacturing method for a semiconductor device
JP4926433B2 (ja) * 2004-12-06 2012-05-09 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
RU2305918C2 (ru) * 2005-04-19 2007-09-10 Закрытое акционерное общество "Элма-Фотма" Способ получения фотошаблонных заготовок
US7709815B2 (en) 2005-09-16 2010-05-04 Mapper Lithography Ip B.V. Lithography system and projection method
US20070235665A1 (en) * 2006-03-30 2007-10-11 Applied Materials, Inc. Charged particle beam system and method for manufacturing and inspecting LCD devices
US20080225261A1 (en) * 2007-03-13 2008-09-18 Noriyuki Hirayanagi Exposure apparatus and device manufacturing method
US8277165B2 (en) * 2007-09-22 2012-10-02 Dynamic Micro System Semiconductor Equipment GmbH Transfer mechanism with multiple wafer handling capability
NL1036164A1 (nl) * 2007-11-15 2009-05-18 Asml Netherlands Bv Substrate processing apparatus and device manufacturing method.
US8757026B2 (en) * 2008-04-15 2014-06-24 Dynamic Micro Systems, Semiconductor Equipment Gmbh Clean transfer robot
JP2010157639A (ja) * 2008-12-27 2010-07-15 Canon Inc 露光装置およびデバイス製造方法
JP2010165948A (ja) * 2009-01-16 2010-07-29 Nikon Corp チャンバ装置、基板処理装置、露光装置、デバイス製造方法、及びメンテナンス方法
KR101025288B1 (ko) * 2009-02-12 2011-03-29 국민대학교산학협력단 전자빔 리소그래피 장치의 나노 스테이지
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
US8436324B2 (en) * 2009-02-22 2013-05-07 Mapper Lithography Ip B.V. Preparation unit for lithography machine
WO2010094804A1 (en) * 2009-02-22 2010-08-26 Mapper Lithography Ip B.V. Lithography machine and substrate handling arrangement
US9696633B2 (en) * 2010-04-12 2017-07-04 Asml Netherlands B.V. Substrate handling apparatus and lithographic apparatus
EP2699966B1 (en) * 2011-04-22 2021-04-07 ASML Netherlands B.V. Network architecture and protocol for cluster of lithography machines
TWI514089B (zh) * 2011-04-28 2015-12-21 Mapper Lithography Ip Bv 在微影系統中用於轉移基板的設備
CN107407595B (zh) 2015-04-03 2018-09-07 株式会社日立高新技术 光量检测装置、利用其的免疫分析装置及电荷粒子束装置

Also Published As

Publication number Publication date
KR20130131398A (ko) 2013-12-03
WO2012080278A1 (en) 2012-06-21
KR101907433B1 (ko) 2018-10-12
US20120175527A1 (en) 2012-07-12
CN103370655A (zh) 2013-10-23
TW201241575A (en) 2012-10-16
RU2013132215A (ru) 2015-01-20
JP2014501442A (ja) 2014-01-20
EP2681624B1 (en) 2016-07-20
EP2681624A1 (en) 2014-01-08
TWI548950B (zh) 2016-09-11
US8895943B2 (en) 2014-11-25
RU2579533C2 (ru) 2016-04-10
CN103370655B (zh) 2016-03-16

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