JP2018014469A5 - - Google Patents

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Publication number
JP2018014469A5
JP2018014469A5 JP2016144764A JP2016144764A JP2018014469A5 JP 2018014469 A5 JP2018014469 A5 JP 2018014469A5 JP 2016144764 A JP2016144764 A JP 2016144764A JP 2016144764 A JP2016144764 A JP 2016144764A JP 2018014469 A5 JP2018014469 A5 JP 2018014469A5
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JP
Japan
Prior art keywords
moving body
mounting table
mounting
substrate
stages
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JP2016144764A
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English (en)
Japanese (ja)
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JP6747136B2 (ja
JP2018014469A (ja
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Priority claimed from JP2016144764A external-priority patent/JP6747136B2/ja
Priority to JP2016144764A priority Critical patent/JP6747136B2/ja
Application filed filed Critical
Priority to KR1020197001350A priority patent/KR102164404B1/ko
Priority to PCT/JP2017/022866 priority patent/WO2018016257A1/ja
Priority to CN201780044348.2A priority patent/CN109478527B/zh
Publication of JP2018014469A publication Critical patent/JP2018014469A/ja
Priority to US16/252,978 priority patent/US10906756B2/en
Publication of JP2018014469A5 publication Critical patent/JP2018014469A5/ja
Publication of JP6747136B2 publication Critical patent/JP6747136B2/ja
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JP2016144764A 2016-07-22 2016-07-22 基板処理装置 Active JP6747136B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016144764A JP6747136B2 (ja) 2016-07-22 2016-07-22 基板処理装置
KR1020197001350A KR102164404B1 (ko) 2016-07-22 2017-06-21 기판 처리 장치
PCT/JP2017/022866 WO2018016257A1 (ja) 2016-07-22 2017-06-21 基板処理装置
CN201780044348.2A CN109478527B (zh) 2016-07-22 2017-06-21 基片处理设备
US16/252,978 US10906756B2 (en) 2016-07-22 2019-01-21 Substrate processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016144764A JP6747136B2 (ja) 2016-07-22 2016-07-22 基板処理装置

Publications (3)

Publication Number Publication Date
JP2018014469A JP2018014469A (ja) 2018-01-25
JP2018014469A5 true JP2018014469A5 (enExample) 2019-11-07
JP6747136B2 JP6747136B2 (ja) 2020-08-26

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ID=60992105

Family Applications (1)

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JP2016144764A Active JP6747136B2 (ja) 2016-07-22 2016-07-22 基板処理装置

Country Status (5)

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US (1) US10906756B2 (enExample)
JP (1) JP6747136B2 (enExample)
KR (1) KR102164404B1 (enExample)
CN (1) CN109478527B (enExample)
WO (1) WO2018016257A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6851288B2 (ja) * 2017-08-23 2021-03-31 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
US11380564B2 (en) 2018-09-19 2022-07-05 Applied Materials, Inc. Processing system having a front opening unified pod (FOUP) load lock
JP7210960B2 (ja) * 2018-09-21 2023-01-24 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
CN112956010B (zh) * 2018-11-14 2024-07-23 东京毅力科创株式会社 基板处理装置和基板输送方法
CN113597666B (zh) * 2019-03-19 2024-10-25 株式会社国际电气 半导体装置的制造方法、基板处理装置和存储介质
JP7363591B2 (ja) * 2020-03-05 2023-10-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US11705354B2 (en) * 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0147403B1 (ko) * 1994-06-24 1998-11-02 문정환 칩자동 로딩장치
WO2001075965A1 (fr) * 2000-04-05 2001-10-11 Tokyo Electron Limited Dispositif de traitement
JP4114737B2 (ja) * 2001-03-09 2008-07-09 東京エレクトロン株式会社 処理装置
JP2003188229A (ja) 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
JP4389424B2 (ja) * 2001-12-25 2009-12-24 東京エレクトロン株式会社 被処理体の搬送機構及び処理システム
JP2004349503A (ja) 2003-05-22 2004-12-09 Tokyo Electron Ltd 被処理体の処理システム及び処理方法
JP5264171B2 (ja) * 2004-06-09 2013-08-14 ブルックス オートメーション インコーポレイテッド 基板搬送装置
JP2008028035A (ja) * 2006-07-19 2008-02-07 Phyzchemix Corp 半導体製造装置
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
CN101330032B (zh) * 2008-07-22 2012-01-11 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体处理设备及其过渡腔室
JP2011071293A (ja) * 2009-09-25 2011-04-07 Tokyo Electron Ltd プロセスモジュール、基板処理装置、および基板搬送方法
US9623555B2 (en) * 2010-11-10 2017-04-18 Brooks Automation, Inc. Dual arm robot
KR102392186B1 (ko) * 2011-03-11 2022-04-28 브룩스 오토메이션 인코퍼레이티드 기판 처리 툴
US9293317B2 (en) * 2012-09-12 2016-03-22 Lam Research Corporation Method and system related to semiconductor processing equipment

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