CN109478527B - 基片处理设备 - Google Patents

基片处理设备 Download PDF

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Publication number
CN109478527B
CN109478527B CN201780044348.2A CN201780044348A CN109478527B CN 109478527 B CN109478527 B CN 109478527B CN 201780044348 A CN201780044348 A CN 201780044348A CN 109478527 B CN109478527 B CN 109478527B
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CN
China
Prior art keywords
substrate
processing
wafer
moving path
processing units
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Active
Application number
CN201780044348.2A
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English (en)
Chinese (zh)
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CN109478527A (zh
Inventor
若林真士
近藤圭祐
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN109478527A publication Critical patent/CN109478527A/zh
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Publication of CN109478527B publication Critical patent/CN109478527B/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
CN201780044348.2A 2016-07-22 2017-06-21 基片处理设备 Active CN109478527B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016144764A JP6747136B2 (ja) 2016-07-22 2016-07-22 基板処理装置
JP2016-144764 2016-07-22
PCT/JP2017/022866 WO2018016257A1 (ja) 2016-07-22 2017-06-21 基板処理装置

Publications (2)

Publication Number Publication Date
CN109478527A CN109478527A (zh) 2019-03-15
CN109478527B true CN109478527B (zh) 2023-03-28

Family

ID=60992105

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780044348.2A Active CN109478527B (zh) 2016-07-22 2017-06-21 基片处理设备

Country Status (5)

Country Link
US (1) US10906756B2 (enExample)
JP (1) JP6747136B2 (enExample)
KR (1) KR102164404B1 (enExample)
CN (1) CN109478527B (enExample)
WO (1) WO2018016257A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6851288B2 (ja) * 2017-08-23 2021-03-31 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
US11380564B2 (en) * 2018-09-19 2022-07-05 Applied Materials, Inc. Processing system having a front opening unified pod (FOUP) load lock
JP7210960B2 (ja) * 2018-09-21 2023-01-24 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
WO2020100381A1 (ja) * 2018-11-14 2020-05-22 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
KR20210127738A (ko) * 2019-03-19 2021-10-22 가부시키가이샤 코쿠사이 엘렉트릭 반도체 장치의 제조 방법, 기판 처리 장치 및 프로그램
JP7363591B2 (ja) * 2020-03-05 2023-10-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US11705354B2 (en) * 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1120992A (zh) * 1994-06-24 1996-04-24 Lg半导体株式会社 自动基片装载装置
TW494523B (en) * 2000-04-05 2002-07-11 Tokyo Electron Ltd Processing device
JP2002334918A (ja) * 2001-03-09 2002-11-22 Tokyo Electron Ltd 処理装置
JP2008028035A (ja) * 2006-07-19 2008-02-07 Phyzchemix Corp 半導体製造装置
CN101330032A (zh) * 2008-07-22 2008-12-24 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体处理设备及其过渡腔室
CN102034726A (zh) * 2009-09-25 2011-04-27 东京毅力科创株式会社 处理模块、基片处理装置以及基片运送方法
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188229A (ja) 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
JP4389424B2 (ja) * 2001-12-25 2009-12-24 東京エレクトロン株式会社 被処理体の搬送機構及び処理システム
JP2004349503A (ja) 2003-05-22 2004-12-09 Tokyo Electron Ltd 被処理体の処理システム及び処理方法
WO2005123565A2 (en) * 2004-06-09 2005-12-29 Brooks Automation, Inc. Dual sacra arm
KR102060544B1 (ko) * 2010-11-10 2019-12-30 브룩스 오토메이션 인코퍼레이티드 이중 아암 로봇
JP6059156B2 (ja) * 2011-03-11 2017-01-11 ブルックス オートメーション インコーポレイテッド 基板処理ツール
US9293317B2 (en) * 2012-09-12 2016-03-22 Lam Research Corporation Method and system related to semiconductor processing equipment

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1120992A (zh) * 1994-06-24 1996-04-24 Lg半导体株式会社 自动基片装载装置
TW494523B (en) * 2000-04-05 2002-07-11 Tokyo Electron Ltd Processing device
JP2002334918A (ja) * 2001-03-09 2002-11-22 Tokyo Electron Ltd 処理装置
JP2008028035A (ja) * 2006-07-19 2008-02-07 Phyzchemix Corp 半導体製造装置
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
CN101330032A (zh) * 2008-07-22 2008-12-24 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体处理设备及其过渡腔室
CN102034726A (zh) * 2009-09-25 2011-04-27 东京毅力科创株式会社 处理模块、基片处理装置以及基片运送方法

Also Published As

Publication number Publication date
JP2018014469A (ja) 2018-01-25
CN109478527A (zh) 2019-03-15
WO2018016257A1 (ja) 2018-01-25
KR102164404B1 (ko) 2020-10-12
US10906756B2 (en) 2021-02-02
US20190152722A1 (en) 2019-05-23
KR20190020042A (ko) 2019-02-27
JP6747136B2 (ja) 2020-08-26

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