KR102164404B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR102164404B1
KR102164404B1 KR1020197001350A KR20197001350A KR102164404B1 KR 102164404 B1 KR102164404 B1 KR 102164404B1 KR 1020197001350 A KR1020197001350 A KR 1020197001350A KR 20197001350 A KR20197001350 A KR 20197001350A KR 102164404 B1 KR102164404 B1 KR 102164404B1
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South Korea
Prior art keywords
substrate
processing
transfer mechanism
transfer
loading
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KR1020197001350A
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English (en)
Korean (ko)
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KR20190020042A (ko
Inventor
신지 와카바야시
게이스케 곤도
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20190020042A publication Critical patent/KR20190020042A/ko
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    • H01L21/6773—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H01L21/67742—
    • H01L21/67757—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3312—Vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
KR1020197001350A 2016-07-22 2017-06-21 기판 처리 장치 Active KR102164404B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016144764A JP6747136B2 (ja) 2016-07-22 2016-07-22 基板処理装置
JPJP-P-2016-144764 2016-07-22
PCT/JP2017/022866 WO2018016257A1 (ja) 2016-07-22 2017-06-21 基板処理装置

Publications (2)

Publication Number Publication Date
KR20190020042A KR20190020042A (ko) 2019-02-27
KR102164404B1 true KR102164404B1 (ko) 2020-10-12

Family

ID=60992105

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197001350A Active KR102164404B1 (ko) 2016-07-22 2017-06-21 기판 처리 장치

Country Status (5)

Country Link
US (1) US10906756B2 (enExample)
JP (1) JP6747136B2 (enExample)
KR (1) KR102164404B1 (enExample)
CN (1) CN109478527B (enExample)
WO (1) WO2018016257A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6851288B2 (ja) * 2017-08-23 2021-03-31 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
US11380564B2 (en) * 2018-09-19 2022-07-05 Applied Materials, Inc. Processing system having a front opening unified pod (FOUP) load lock
JP7210960B2 (ja) * 2018-09-21 2023-01-24 東京エレクトロン株式会社 真空処理装置及び基板搬送方法
WO2020100381A1 (ja) * 2018-11-14 2020-05-22 東京エレクトロン株式会社 基板処理装置及び基板搬送方法
KR20210127738A (ko) * 2019-03-19 2021-10-22 가부시키가이샤 코쿠사이 엘렉트릭 반도체 장치의 제조 방법, 기판 처리 장치 및 프로그램
JP7363591B2 (ja) * 2020-03-05 2023-10-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US11705354B2 (en) * 2020-07-10 2023-07-18 Applied Materials, Inc. Substrate handling systems
KR102638655B1 (ko) * 2023-08-07 2024-02-20 에이피티씨 주식회사 멀티 층 efem을 포함하는 기판 이송 장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028035A (ja) * 2006-07-19 2008-02-07 Phyzchemix Corp 半導体製造装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0147403B1 (ko) * 1994-06-24 1998-11-02 문정환 칩자동 로딩장치
KR20020088419A (ko) * 2000-04-05 2002-11-27 동경 엘렉트론 주식회사 처리 장치
JP4114737B2 (ja) * 2001-03-09 2008-07-09 東京エレクトロン株式会社 処理装置
JP2003188229A (ja) 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
JP4389424B2 (ja) * 2001-12-25 2009-12-24 東京エレクトロン株式会社 被処理体の搬送機構及び処理システム
JP2004349503A (ja) 2003-05-22 2004-12-09 Tokyo Electron Ltd 被処理体の処理システム及び処理方法
WO2005123565A2 (en) * 2004-06-09 2005-12-29 Brooks Automation, Inc. Dual sacra arm
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
CN101330032B (zh) * 2008-07-22 2012-01-11 北京北方微电子基地设备工艺研究中心有限责任公司 等离子体处理设备及其过渡腔室
JP2011071293A (ja) * 2009-09-25 2011-04-07 Tokyo Electron Ltd プロセスモジュール、基板処理装置、および基板搬送方法
KR102060544B1 (ko) * 2010-11-10 2019-12-30 브룩스 오토메이션 인코퍼레이티드 이중 아암 로봇
JP6059156B2 (ja) * 2011-03-11 2017-01-11 ブルックス オートメーション インコーポレイテッド 基板処理ツール
US9293317B2 (en) * 2012-09-12 2016-03-22 Lam Research Corporation Method and system related to semiconductor processing equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008028035A (ja) * 2006-07-19 2008-02-07 Phyzchemix Corp 半導体製造装置

Also Published As

Publication number Publication date
CN109478527B (zh) 2023-03-28
JP2018014469A (ja) 2018-01-25
CN109478527A (zh) 2019-03-15
WO2018016257A1 (ja) 2018-01-25
US10906756B2 (en) 2021-02-02
US20190152722A1 (en) 2019-05-23
KR20190020042A (ko) 2019-02-27
JP6747136B2 (ja) 2020-08-26

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