JP2017041523A5 - - Google Patents

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Publication number
JP2017041523A5
JP2017041523A5 JP2015161760A JP2015161760A JP2017041523A5 JP 2017041523 A5 JP2017041523 A5 JP 2017041523A5 JP 2015161760 A JP2015161760 A JP 2015161760A JP 2015161760 A JP2015161760 A JP 2015161760A JP 2017041523 A5 JP2017041523 A5 JP 2017041523A5
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JP
Japan
Prior art keywords
substrate
unit
processing
environment
rotation direction
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JP2015161760A
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English (en)
Japanese (ja)
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JP2017041523A (ja
JP6598242B2 (ja
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Priority claimed from JP2015161760A external-priority patent/JP6598242B2/ja
Priority to JP2015161760A priority Critical patent/JP6598242B2/ja
Priority to TW105126420A priority patent/TWI631620B/zh
Priority to KR1020160104851A priority patent/KR101846696B1/ko
Priority to US15/239,871 priority patent/US20170053779A1/en
Priority to CN201610696908.XA priority patent/CN106469667B/zh
Publication of JP2017041523A publication Critical patent/JP2017041523A/ja
Publication of JP2017041523A5 publication Critical patent/JP2017041523A5/ja
Publication of JP6598242B2 publication Critical patent/JP6598242B2/ja
Application granted granted Critical
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JP2015161760A 2015-08-19 2015-08-19 基板処理装置、および基板処理方法 Active JP6598242B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015161760A JP6598242B2 (ja) 2015-08-19 2015-08-19 基板処理装置、および基板処理方法
TW105126420A TWI631620B (zh) 2015-08-19 2016-08-18 基板處理裝置及基板處理方法
KR1020160104851A KR101846696B1 (ko) 2015-08-19 2016-08-18 기판 처리 장치 및 기판 처리 방법
US15/239,871 US20170053779A1 (en) 2015-08-19 2016-08-18 Substrate processing apparatus and substrate processing method
CN201610696908.XA CN106469667B (zh) 2015-08-19 2016-08-19 基板处理装置及基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015161760A JP6598242B2 (ja) 2015-08-19 2015-08-19 基板処理装置、および基板処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019101529A Division JP6788072B2 (ja) 2019-05-30 2019-05-30 基板処理装置、および基板処理方法

Publications (3)

Publication Number Publication Date
JP2017041523A JP2017041523A (ja) 2017-02-23
JP2017041523A5 true JP2017041523A5 (enExample) 2019-01-31
JP6598242B2 JP6598242B2 (ja) 2019-10-30

Family

ID=58158333

Family Applications (1)

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JP2015161760A Active JP6598242B2 (ja) 2015-08-19 2015-08-19 基板処理装置、および基板処理方法

Country Status (5)

Country Link
US (1) US20170053779A1 (enExample)
JP (1) JP6598242B2 (enExample)
KR (1) KR101846696B1 (enExample)
CN (1) CN106469667B (enExample)
TW (1) TWI631620B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10449641B2 (en) * 2016-02-18 2019-10-22 Panasonic Intellectual Property Management Co., Ltd. System for manufacturing assembly board and method for installing undersupporting device of the system
CN114743921B (zh) * 2017-03-23 2025-06-03 圆益Ips股份有限公司 基板支承架及设置有此支承架的基板处理装置
JP6974126B2 (ja) * 2017-11-13 2021-12-01 東京エレクトロン株式会社 基板処理装置、基板処理方法、及び記憶媒体
WO2021044623A1 (ja) * 2019-09-06 2021-03-11 キヤノンアネルバ株式会社 ロードロック装置
JP7337868B2 (ja) * 2021-03-23 2023-09-04 芝浦メカトロニクス株式会社 プラズマ処理装置、およびプラズマ処理方法
WO2023164228A1 (en) * 2022-02-28 2023-08-31 Applied Materials, Inc. Crossflow deposition with substrate rotation for enhanced deposition uniformity

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275511A (ja) * 1991-03-01 1993-10-22 Tokyo Electron Ltd 被処理体の移載システム及び処理装置
JPH0569162U (ja) * 1992-02-28 1993-09-17 セイコー電子工業株式会社 バッファ付クラスタ形薄膜処理装置
US6688375B1 (en) * 1997-10-14 2004-02-10 Applied Materials, Inc. Vacuum processing system having improved substrate heating and cooling
JP4056141B2 (ja) * 1998-08-07 2008-03-05 松下電器産業株式会社 基板搬送装置
JP2002164407A (ja) * 2000-11-27 2002-06-07 Japan Steel Works Ltd:The レーザアニール処理装置及び方法
US6896513B2 (en) 2002-09-12 2005-05-24 Applied Materials, Inc. Large area substrate processing system
JP2005183458A (ja) * 2003-12-16 2005-07-07 Matsushita Electric Ind Co Ltd 半導体装置の製造方法及びその製造装置
JP4900904B2 (ja) * 2006-02-28 2012-03-21 東京エレクトロン株式会社 基板処理装置、基板処理条件変更方法及び記憶媒体
JP4896899B2 (ja) 2007-01-31 2012-03-14 東京エレクトロン株式会社 基板処理装置およびパーティクル付着防止方法
KR100965413B1 (ko) * 2008-04-18 2010-06-25 엘아이지에이디피 주식회사 기판 처리용 클러스터 장치 및 클러스터 장치의 기판 처리방법
KR101331507B1 (ko) * 2010-08-09 2013-11-20 엘지디스플레이 주식회사 기판 세정/건조 장치와 이를 포함하는 기판 처리 장치, 그의 기판 세정/건조 방법, 및 디스플레이 패널의 제조 방법
JP2012227370A (ja) * 2011-04-20 2012-11-15 Hitachi Kokusai Electric Inc 基板処理装置
JP6012995B2 (ja) 2012-03-27 2016-10-25 芝浦メカトロニクス株式会社 プラズマ処理装置およびプラズマ処理方法
US20150034699A1 (en) * 2013-08-01 2015-02-05 Semigear Inc Reflow treating unit & substrate treating apparatus

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