JP2012164716A5 - - Google Patents

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Publication number
JP2012164716A5
JP2012164716A5 JP2011022050A JP2011022050A JP2012164716A5 JP 2012164716 A5 JP2012164716 A5 JP 2012164716A5 JP 2011022050 A JP2011022050 A JP 2011022050A JP 2011022050 A JP2011022050 A JP 2011022050A JP 2012164716 A5 JP2012164716 A5 JP 2012164716A5
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JP
Japan
Prior art keywords
substrate
arms
chamber
processing
substrates
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JP2011022050A
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English (en)
Japanese (ja)
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JP5728770B2 (ja
JP2012164716A (ja
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Priority claimed from JP2011022050A external-priority patent/JP5728770B2/ja
Publication of JP2012164716A publication Critical patent/JP2012164716A/ja
Publication of JP2012164716A5 publication Critical patent/JP2012164716A5/ja
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Publication of JP5728770B2 publication Critical patent/JP5728770B2/ja
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JP2011022050A 2011-02-03 2011-02-03 基板処理装置、基板処理方法、ならびに、プログラム Active JP5728770B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011022050A JP5728770B2 (ja) 2011-02-03 2011-02-03 基板処理装置、基板処理方法、ならびに、プログラム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011022050A JP5728770B2 (ja) 2011-02-03 2011-02-03 基板処理装置、基板処理方法、ならびに、プログラム

Publications (3)

Publication Number Publication Date
JP2012164716A JP2012164716A (ja) 2012-08-30
JP2012164716A5 true JP2012164716A5 (enExample) 2014-10-16
JP5728770B2 JP5728770B2 (ja) 2015-06-03

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ID=46843851

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JP2011022050A Active JP5728770B2 (ja) 2011-02-03 2011-02-03 基板処理装置、基板処理方法、ならびに、プログラム

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JP (1) JP5728770B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6559543B2 (ja) * 2015-11-09 2019-08-14 サムコ株式会社 基板処理装置
JP2017183665A (ja) * 2016-03-31 2017-10-05 芝浦メカトロニクス株式会社 基板搬送装置、基板処理装置及び基板処理方法
US20180061696A1 (en) * 2016-08-23 2018-03-01 Applied Materials, Inc. Edge ring or process kit for semiconductor process module
KR102164067B1 (ko) * 2017-09-29 2020-10-12 시바우라 메카트로닉스 가부시끼가이샤 기판 처리 장치 및 기판 처리 방법
JP7320369B2 (ja) * 2019-04-17 2023-08-03 株式会社アルバック 基板処理装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0634783B1 (en) * 1993-07-16 1997-08-06 Semiconductor Systems, Inc. Thermal process module for substrate coat/develop system

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