JP2012518901A5 - - Google Patents

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Publication number
JP2012518901A5
JP2012518901A5 JP2011550594A JP2011550594A JP2012518901A5 JP 2012518901 A5 JP2012518901 A5 JP 2012518901A5 JP 2011550594 A JP2011550594 A JP 2011550594A JP 2011550594 A JP2011550594 A JP 2011550594A JP 2012518901 A5 JP2012518901 A5 JP 2012518901A5
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JP
Japan
Prior art keywords
substrate
support structure
substrate support
housing
clamped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011550594A
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English (en)
Japanese (ja)
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JP5670351B2 (ja
JP2012518901A (ja
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Publication date
Priority claimed from GB0905789A external-priority patent/GB2469114A/en
Application filed filed Critical
Priority claimed from PCT/EP2010/052219 external-priority patent/WO2010094802A1/en
Publication of JP2012518901A publication Critical patent/JP2012518901A/ja
Publication of JP2012518901A5 publication Critical patent/JP2012518901A5/ja
Application granted granted Critical
Publication of JP5670351B2 publication Critical patent/JP5670351B2/ja
Active legal-status Critical Current
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JP2011550594A 2009-02-22 2010-02-22 リソグラフィ機械装置のための準備ユニット Active JP5670351B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US15441109P 2009-02-22 2009-02-22
US15441509P 2009-02-22 2009-02-22
US61/154,411 2009-02-22
US61/154,415 2009-02-22
GB0905789.4 2009-04-03
GB0905789A GB2469114A (en) 2009-04-03 2009-04-03 Clamp preparation unit, unclamping unit, arrangement, method for clamping a substrate, and a method of unclamping a substrate
US30652110P 2010-02-21 2010-02-21
US61/306,521 2010-02-21
PCT/EP2010/052219 WO2010094802A1 (en) 2009-02-22 2010-02-22 Preparation unit for lithogrpahy machine

Publications (3)

Publication Number Publication Date
JP2012518901A JP2012518901A (ja) 2012-08-16
JP2012518901A5 true JP2012518901A5 (enExample) 2013-04-11
JP5670351B2 JP5670351B2 (ja) 2015-02-18

Family

ID=42211903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011550594A Active JP5670351B2 (ja) 2009-02-22 2010-02-22 リソグラフィ機械装置のための準備ユニット

Country Status (7)

Country Link
US (2) US8436324B2 (enExample)
EP (1) EP2399280B1 (enExample)
JP (1) JP5670351B2 (enExample)
KR (1) KR101586984B1 (enExample)
CN (1) CN102414782B (enExample)
TW (1) TW201106107A (enExample)
WO (1) WO2010094802A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8705010B2 (en) 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI450047B (zh) * 2007-07-13 2014-08-21 Mapper Lithography Ip Bv 微影系統、夾緊方法及晶圓台
US8436324B2 (en) * 2009-02-22 2013-05-07 Mapper Lithography Ip B.V. Preparation unit for lithography machine
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
CN103370655B (zh) * 2010-12-14 2016-03-16 迈普尔平版印刷Ip有限公司 光刻系统和在该光刻系统中处理基板的方法
TWI514089B (zh) * 2011-04-28 2015-12-21 Mapper Lithography Ip Bv 在微影系統中用於轉移基板的設備
JP2013125791A (ja) * 2011-12-13 2013-06-24 Canon Inc 保持装置、描画装置、および、物品の製造方法
JP6219178B2 (ja) * 2014-01-20 2017-10-25 株式会社ディスコ プラズマエッチング装置
CN107111251B (zh) 2014-11-14 2020-10-20 Asml荷兰有限公司 用于在光刻系统中转移基材的加载锁定系统和方法
DE102016109510B4 (de) * 2016-05-24 2018-07-19 VON ARDENNE Asset GmbH & Co. KG Vakuumprozessieranlage und Verfahren zum schubweisen Einschleusen und Ausschleusen von Substraten
WO2019049588A1 (en) 2017-09-07 2019-03-14 Mapper Lithography Ip B.V. METHODS AND SYSTEMS FOR COATING A SUBSTRATE
CN110181428B (zh) * 2019-05-09 2024-04-26 武汉维尔笛工程技术有限公司 一种利用电磁力实现车门铰链压紧的装置
CN112325955A (zh) * 2020-11-11 2021-02-05 麦克传感器股份有限公司 多用途热导式流量开关及其制备方法

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US8325321B2 (en) 2006-07-28 2012-12-04 Mapper Lithography Ip B.V. Lithography system, method of heat dissipation and frame
JP5384339B2 (ja) 2006-07-28 2014-01-08 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィ・システム、熱放散の方法、及びフレーム
JP5048352B2 (ja) * 2007-01-31 2012-10-17 東京エレクトロン株式会社 基板処理方法及び基板処理装置
TWI450047B (zh) * 2007-07-13 2014-08-21 Mapper Lithography Ip Bv 微影系統、夾緊方法及晶圓台
US8436324B2 (en) 2009-02-22 2013-05-07 Mapper Lithography Ip B.V. Preparation unit for lithography machine
GB2469112A (en) * 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer

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