TW201106107A - Preparation unit for lithography machine - Google Patents

Preparation unit for lithography machine Download PDF

Info

Publication number
TW201106107A
TW201106107A TW099105117A TW99105117A TW201106107A TW 201106107 A TW201106107 A TW 201106107A TW 099105117 A TW099105117 A TW 099105117A TW 99105117 A TW99105117 A TW 99105117A TW 201106107 A TW201106107 A TW 201106107A
Authority
TW
Taiwan
Prior art keywords
substrate
support structure
liquid
substrate support
gas
Prior art date
Application number
TW099105117A
Other languages
English (en)
Chinese (zh)
Inventor
Jong Hendrik Jan De
Original Assignee
Mapper Lithography Ip Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0905789A external-priority patent/GB2469114A/en
Application filed by Mapper Lithography Ip Bv filed Critical Mapper Lithography Ip Bv
Publication of TW201106107A publication Critical patent/TW201106107A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/0492—Storage devices mechanical with cars adapted to travel in storage aisles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electron Beam Exposure (AREA)
TW099105117A 2009-02-22 2010-02-22 Preparation unit for lithography machine TW201106107A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15441109P 2009-02-22 2009-02-22
US15441509P 2009-02-22 2009-02-22
GB0905789A GB2469114A (en) 2009-04-03 2009-04-03 Clamp preparation unit, unclamping unit, arrangement, method for clamping a substrate, and a method of unclamping a substrate

Publications (1)

Publication Number Publication Date
TW201106107A true TW201106107A (en) 2011-02-16

Family

ID=42211903

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099105117A TW201106107A (en) 2009-02-22 2010-02-22 Preparation unit for lithography machine

Country Status (7)

Country Link
US (2) US8436324B2 (enExample)
EP (1) EP2399280B1 (enExample)
JP (1) JP5670351B2 (enExample)
KR (1) KR101586984B1 (enExample)
CN (1) CN102414782B (enExample)
TW (1) TW201106107A (enExample)
WO (1) WO2010094802A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548950B (zh) * 2010-12-14 2016-09-11 瑪波微影Ｉｐ公司 微影系統及在該微影系統內處理基板之方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8705010B2 (en) 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI450047B (zh) * 2007-07-13 2014-08-21 Mapper Lithography Ip Bv 微影系統、夾緊方法及晶圓台
US8436324B2 (en) * 2009-02-22 2013-05-07 Mapper Lithography Ip B.V. Preparation unit for lithography machine
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
TWI514089B (zh) * 2011-04-28 2015-12-21 Mapper Lithography Ip Bv 在微影系統中用於轉移基板的設備
JP2013125791A (ja) * 2011-12-13 2013-06-24 Canon Inc 保持装置、描画装置、および、物品の製造方法
JP6219178B2 (ja) * 2014-01-20 2017-10-25 株式会社ディスコ プラズマエッチング装置
CN107111251B (zh) 2014-11-14 2020-10-20 Asml荷兰有限公司 用于在光刻系统中转移基材的加载锁定系统和方法
DE102016109510B4 (de) * 2016-05-24 2018-07-19 VON ARDENNE Asset GmbH & Co. KG Vakuumprozessieranlage und Verfahren zum schubweisen Einschleusen und Ausschleusen von Substraten
WO2019049588A1 (en) 2017-09-07 2019-03-14 Mapper Lithography Ip B.V. METHODS AND SYSTEMS FOR COATING A SUBSTRATE
CN110181428B (zh) * 2019-05-09 2024-04-26 武汉维尔笛工程技术有限公司 一种利用电磁力实现车门铰链压紧的装置
CN112325955A (zh) * 2020-11-11 2021-02-05 麦克传感器股份有限公司 多用途热导式流量开关及其制备方法

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JP5384339B2 (ja) 2006-07-28 2014-01-08 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィ・システム、熱放散の方法、及びフレーム
JP5048352B2 (ja) * 2007-01-31 2012-10-17 東京エレクトロン株式会社 基板処理方法及び基板処理装置
TWI450047B (zh) * 2007-07-13 2014-08-21 Mapper Lithography Ip Bv 微影系統、夾緊方法及晶圓台
US8436324B2 (en) 2009-02-22 2013-05-07 Mapper Lithography Ip B.V. Preparation unit for lithography machine
GB2469112A (en) * 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548950B (zh) * 2010-12-14 2016-09-11 瑪波微影Ｉｐ公司 微影系統及在該微影系統內處理基板之方法

Also Published As

Publication number Publication date
CN102414782A (zh) 2012-04-11
WO2010094802A1 (en) 2010-08-26
US20130234040A1 (en) 2013-09-12
KR101586984B1 (ko) 2016-01-20
EP2399280A1 (en) 2011-12-28
JP5670351B2 (ja) 2015-02-18
EP2399280B1 (en) 2020-01-15
CN102414782B (zh) 2014-11-05
US8436324B2 (en) 2013-05-07
JP2012518901A (ja) 2012-08-16
US9117631B2 (en) 2015-08-25
US20100238421A1 (en) 2010-09-23
KR20110132395A (ko) 2011-12-07

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