KR101586984B1 - 리소그래피 머신을 위한 준비 유닛 - Google Patents

리소그래피 머신을 위한 준비 유닛 Download PDF

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KR101586984B1
KR101586984B1 KR1020117022203A KR20117022203A KR101586984B1 KR 101586984 B1 KR101586984 B1 KR 101586984B1 KR 1020117022203 A KR1020117022203 A KR 1020117022203A KR 20117022203 A KR20117022203 A KR 20117022203A KR 101586984 B1 KR101586984 B1 KR 101586984B1
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South Korea
Prior art keywords
substrate
support structure
substrate support
liquid
gas
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English (en)
Korean (ko)
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KR20110132395A (ko
Inventor
헨드릭 잔 데 종
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마퍼 리쏘그라피 아이피 비.브이.
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Priority claimed from GB0905789A external-priority patent/GB2469114A/en
Application filed by 마퍼 리쏘그라피 아이피 비.브이. filed Critical 마퍼 리쏘그라피 아이피 비.브이.
Publication of KR20110132395A publication Critical patent/KR20110132395A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/0492—Storage devices mechanical with cars adapted to travel in storage aisles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electron Beam Exposure (AREA)
KR1020117022203A 2009-02-22 2010-02-22 리소그래피 머신을 위한 준비 유닛 Active KR101586984B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US15441109P 2009-02-22 2009-02-22
US15441509P 2009-02-22 2009-02-22
US61/154,411 2009-02-22
US61/154,415 2009-02-22
GB0905789A GB2469114A (en) 2009-04-03 2009-04-03 Clamp preparation unit, unclamping unit, arrangement, method for clamping a substrate, and a method of unclamping a substrate
GB0905789.4 2009-04-03
US30652110P 2010-02-21 2010-02-21
US61/306,521 2010-02-21

Publications (2)

Publication Number Publication Date
KR20110132395A KR20110132395A (ko) 2011-12-07
KR101586984B1 true KR101586984B1 (ko) 2016-01-20

Family

ID=42211903

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117022203A Active KR101586984B1 (ko) 2009-02-22 2010-02-22 리소그래피 머신을 위한 준비 유닛

Country Status (7)

Country Link
US (2) US8436324B2 (enExample)
EP (1) EP2399280B1 (enExample)
JP (1) JP5670351B2 (enExample)
KR (1) KR101586984B1 (enExample)
CN (1) CN102414782B (enExample)
TW (1) TW201106107A (enExample)
WO (1) WO2010094802A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI541615B (zh) * 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 在微影裝置中交換晶圓的方法
US8705010B2 (en) * 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
KR101586984B1 (ko) * 2009-02-22 2016-01-20 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 머신을 위한 준비 유닛
JP6158091B2 (ja) * 2010-12-14 2017-07-05 マッパー・リソグラフィー・アイピー・ビー．ブイ． リソグラフィシステム及びこのようなリソグラフィシステムで基板を処理する方法
TWI514089B (zh) 2011-04-28 2015-12-21 Mapper Lithography Ip Bv 在微影系統中用於轉移基板的設備
JP2013125791A (ja) * 2011-12-13 2013-06-24 Canon Inc 保持装置、描画装置、および、物品の製造方法
JP6219178B2 (ja) * 2014-01-20 2017-10-25 株式会社ディスコ プラズマエッチング装置
KR20170084240A (ko) 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
DE102016109510B4 (de) * 2016-05-24 2018-07-19 VON ARDENNE Asset GmbH & Co. KG Vakuumprozessieranlage und Verfahren zum schubweisen Einschleusen und Ausschleusen von Substraten
WO2019049588A1 (en) 2017-09-07 2019-03-14 Mapper Lithography Ip B.V. METHODS AND SYSTEMS FOR COATING A SUBSTRATE
CN110181428B (zh) * 2019-05-09 2024-04-26 武汉维尔笛工程技术有限公司 一种利用电磁力实现车门铰链压紧的装置
CN112325955A (zh) * 2020-11-11 2021-02-05 麦克传感器股份有限公司 多用途热导式流量开关及其制备方法

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US20050259236A1 (en) 2003-09-29 2005-11-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20070114440A1 (en) 2005-11-11 2007-05-24 Kyoung-Seok Yang Multi-chambered substrate processing equipment having sealing structure between chambers thereof, and method of assembling such equipment

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TWI541615B (zh) * 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 在微影裝置中交換晶圓的方法
GB2469112A (en) * 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
KR101586984B1 (ko) 2009-02-22 2016-01-20 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 머신을 위한 준비 유닛

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030138704A1 (en) 2002-01-23 2003-07-24 Ping Mei Optical-mechanical feature fabrication during manufacture of semiconductors and other micro-devices and nano-devices that include micron and sub-micron features
US20050259236A1 (en) 2003-09-29 2005-11-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20070114440A1 (en) 2005-11-11 2007-05-24 Kyoung-Seok Yang Multi-chambered substrate processing equipment having sealing structure between chambers thereof, and method of assembling such equipment

Also Published As

Publication number Publication date
CN102414782B (zh) 2014-11-05
CN102414782A (zh) 2012-04-11
US20100238421A1 (en) 2010-09-23
EP2399280A1 (en) 2011-12-28
KR20110132395A (ko) 2011-12-07
EP2399280B1 (en) 2020-01-15
JP5670351B2 (ja) 2015-02-18
US20130234040A1 (en) 2013-09-12
WO2010094802A1 (en) 2010-08-26
JP2012518901A (ja) 2012-08-16
US9117631B2 (en) 2015-08-25
US8436324B2 (en) 2013-05-07
TW201106107A (en) 2011-02-16

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