CN102414782B - 用于光刻机的准备单元 - Google Patents

用于光刻机的准备单元 Download PDF

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Publication number
CN102414782B
CN102414782B CN201080017967.0A CN201080017967A CN102414782B CN 102414782 B CN102414782 B CN 102414782B CN 201080017967 A CN201080017967 A CN 201080017967A CN 102414782 B CN102414782 B CN 102414782B
Authority
CN
China
Prior art keywords
substrate
support structure
substrate support
liquid
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201080017967.0A
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English (en)
Chinese (zh)
Other versions
CN102414782A (zh
Inventor
H.J.德琼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
Mapper Lithopraphy IP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0905789A external-priority patent/GB2469114A/en
Application filed by Mapper Lithopraphy IP BV filed Critical Mapper Lithopraphy IP BV
Publication of CN102414782A publication Critical patent/CN102414782A/zh
Application granted granted Critical
Publication of CN102414782B publication Critical patent/CN102414782B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/0492—Storage devices mechanical with cars adapted to travel in storage aisles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electron Beam Exposure (AREA)
CN201080017967.0A 2009-02-22 2010-02-22 用于光刻机的准备单元 Active CN102414782B (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US15441509P 2009-02-22 2009-02-22
US15441109P 2009-02-22 2009-02-22
US61/154,411 2009-02-22
US61/154,415 2009-02-22
GB0905789.4 2009-04-03
GB0905789A GB2469114A (en) 2009-04-03 2009-04-03 Clamp preparation unit, unclamping unit, arrangement, method for clamping a substrate, and a method of unclamping a substrate
US30652110P 2010-02-21 2010-02-21
US61/306,521 2010-02-21
PCT/EP2010/052219 WO2010094802A1 (en) 2009-02-22 2010-02-22 Preparation unit for lithogrpahy machine

Publications (2)

Publication Number Publication Date
CN102414782A CN102414782A (zh) 2012-04-11
CN102414782B true CN102414782B (zh) 2014-11-05

Family

ID=42211903

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080017967.0A Active CN102414782B (zh) 2009-02-22 2010-02-22 用于光刻机的准备单元

Country Status (7)

Country Link
US (2) US8436324B2 (enExample)
EP (1) EP2399280B1 (enExample)
JP (1) JP5670351B2 (enExample)
KR (1) KR101586984B1 (enExample)
CN (1) CN102414782B (enExample)
TW (1) TW201106107A (enExample)
WO (1) WO2010094802A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8705010B2 (en) 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI541615B (zh) * 2007-07-13 2016-07-11 瑪波微影Ｉｐ公司 在微影裝置中交換晶圓的方法
US8436324B2 (en) 2009-02-22 2013-05-07 Mapper Lithography Ip B.V. Preparation unit for lithography machine
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
EP2681624B1 (en) * 2010-12-14 2016-07-20 Mapper Lithography IP B.V. Lithography system and method of processing substrates in such a lithography system
US8936994B2 (en) 2011-04-28 2015-01-20 Mapper Lithography Ip B.V. Method of processing a substrate in a lithography system
JP2013125791A (ja) * 2011-12-13 2013-06-24 Canon Inc 保持装置、描画装置、および、物品の製造方法
JP6219178B2 (ja) * 2014-01-20 2017-10-25 株式会社ディスコ プラズマエッチング装置
CN107111251B (zh) 2014-11-14 2020-10-20 Asml荷兰有限公司 用于在光刻系统中转移基材的加载锁定系统和方法
DE102016109510B4 (de) * 2016-05-24 2018-07-19 VON ARDENNE Asset GmbH & Co. KG Vakuumprozessieranlage und Verfahren zum schubweisen Einschleusen und Ausschleusen von Substraten
WO2019049588A1 (en) 2017-09-07 2019-03-14 Mapper Lithography Ip B.V. METHODS AND SYSTEMS FOR COATING A SUBSTRATE
CN110181428B (zh) * 2019-05-09 2024-04-26 武汉维尔笛工程技术有限公司 一种利用电磁力实现车门铰链压紧的装置
CN112325955A (zh) * 2020-11-11 2021-02-05 麦克传感器股份有限公司 多用途热导式流量开关及其制备方法

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CN1689140A (zh) * 2002-08-31 2005-10-26 应用材料有限公司 向处理工具提供衬底的方法和设备
US20050259236A1 (en) * 2003-09-29 2005-11-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2009011574A1 (en) * 2007-07-13 2009-01-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table

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KR100655079B1 (ko) * 2005-11-11 2006-12-08 삼성전자주식회사 트랜스퍼 챔버와 프로세스 챔버 사이의 기밀유지장치
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JP5048352B2 (ja) * 2007-01-31 2012-10-17 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US8436324B2 (en) 2009-02-22 2013-05-07 Mapper Lithography Ip B.V. Preparation unit for lithography machine
GB2469112A (en) * 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002023597A2 (en) * 2000-09-15 2002-03-21 Applied Materials, Inc. Double dual slot load lock for process equipment
CN1689140A (zh) * 2002-08-31 2005-10-26 应用材料有限公司 向处理工具提供衬底的方法和设备
US20050259236A1 (en) * 2003-09-29 2005-11-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2009011574A1 (en) * 2007-07-13 2009-01-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table

Also Published As

Publication number Publication date
TW201106107A (en) 2011-02-16
WO2010094802A1 (en) 2010-08-26
EP2399280B1 (en) 2020-01-15
US20100238421A1 (en) 2010-09-23
KR20110132395A (ko) 2011-12-07
KR101586984B1 (ko) 2016-01-20
CN102414782A (zh) 2012-04-11
JP2012518901A (ja) 2012-08-16
JP5670351B2 (ja) 2015-02-18
EP2399280A1 (en) 2011-12-28
US8436324B2 (en) 2013-05-07
US9117631B2 (en) 2015-08-25
US20130234040A1 (en) 2013-09-12

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20190524

Address after: Holland Weide Eindhoven

Patentee after: ASML Holland Co., Ltd.

Address before: About Holland

Patentee before: Mapper Lithography IP B. V.

TR01 Transfer of patent right