JP5670351B2 - リソグラフィ機械装置のための準備ユニット - Google Patents

リソグラフィ機械装置のための準備ユニット Download PDF

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Publication number
JP5670351B2
JP5670351B2 JP2011550594A JP2011550594A JP5670351B2 JP 5670351 B2 JP5670351 B2 JP 5670351B2 JP 2011550594 A JP2011550594 A JP 2011550594A JP 2011550594 A JP2011550594 A JP 2011550594A JP 5670351 B2 JP5670351 B2 JP 5670351B2
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Prior art keywords
substrate
support structure
substrate support
liquid
clamped
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English (en)
Japanese (ja)
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JP2012518901A5 (enExample
JP2012518901A (ja
Inventor
デ・ヨング、ヘンドリク・ヤン
Original Assignee
マッパー・リソグラフィー・アイピー・ビー．ブイ．
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Priority claimed from GB0905789A external-priority patent/GB2469114A/en
Application filed by マッパー・リソグラフィー・アイピー・ビー．ブイ． filed Critical マッパー・リソグラフィー・アイピー・ビー．ブイ．
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Publication of JP2012518901A5 publication Critical patent/JP2012518901A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/0492—Storage devices mechanical with cars adapted to travel in storage aisles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electron Beam Exposure (AREA)
JP2011550594A 2009-02-22 2010-02-22 リソグラフィ機械装置のための準備ユニット Active JP5670351B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US15441109P 2009-02-22 2009-02-22
US15441509P 2009-02-22 2009-02-22
US61/154,411 2009-02-22
US61/154,415 2009-02-22
GB0905789.4 2009-04-03
GB0905789A GB2469114A (en) 2009-04-03 2009-04-03 Clamp preparation unit, unclamping unit, arrangement, method for clamping a substrate, and a method of unclamping a substrate
US30652110P 2010-02-21 2010-02-21
US61/306,521 2010-02-21
PCT/EP2010/052219 WO2010094802A1 (en) 2009-02-22 2010-02-22 Preparation unit for lithogrpahy machine

Publications (3)

Publication Number Publication Date
JP2012518901A JP2012518901A (ja) 2012-08-16
JP2012518901A5 JP2012518901A5 (enExample) 2013-04-11
JP5670351B2 true JP5670351B2 (ja) 2015-02-18

Family

ID=42211903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011550594A Active JP5670351B2 (ja) 2009-02-22 2010-02-22 リソグラフィ機械装置のための準備ユニット

Country Status (7)

Country Link
US (2) US8436324B2 (enExample)
EP (1) EP2399280B1 (enExample)
JP (1) JP5670351B2 (enExample)
KR (1) KR101586984B1 (enExample)
CN (1) CN102414782B (enExample)
TW (1) TW201106107A (enExample)
WO (1) WO2010094802A1 (enExample)

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US8705010B2 (en) 2007-07-13 2014-04-22 Mapper Lithography Ip B.V. Lithography system, method of clamping and wafer table
TWI450047B (zh) * 2007-07-13 2014-08-21 Mapper Lithography Ip Bv 微影系統、夾緊方法及晶圓台
US8436324B2 (en) * 2009-02-22 2013-05-07 Mapper Lithography Ip B.V. Preparation unit for lithography machine
GB2469112A (en) 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer
CN103370655B (zh) * 2010-12-14 2016-03-16 迈普尔平版印刷Ip有限公司 光刻系统和在该光刻系统中处理基板的方法
TWI514089B (zh) * 2011-04-28 2015-12-21 Mapper Lithography Ip Bv 在微影系統中用於轉移基板的設備
JP2013125791A (ja) * 2011-12-13 2013-06-24 Canon Inc 保持装置、描画装置、および、物品の製造方法
JP6219178B2 (ja) * 2014-01-20 2017-10-25 株式会社ディスコ プラズマエッチング装置
CN107111251B (zh) 2014-11-14 2020-10-20 Asml荷兰有限公司 用于在光刻系统中转移基材的加载锁定系统和方法
DE102016109510B4 (de) * 2016-05-24 2018-07-19 VON ARDENNE Asset GmbH & Co. KG Vakuumprozessieranlage und Verfahren zum schubweisen Einschleusen und Ausschleusen von Substraten
WO2019049588A1 (en) 2017-09-07 2019-03-14 Mapper Lithography Ip B.V. METHODS AND SYSTEMS FOR COATING A SUBSTRATE
CN110181428B (zh) * 2019-05-09 2024-04-26 武汉维尔笛工程技术有限公司 一种利用电磁力实现车门铰链压紧的装置
CN112325955A (zh) * 2020-11-11 2021-02-05 麦克传感器股份有限公司 多用途热导式流量开关及其制备方法

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JP5048352B2 (ja) * 2007-01-31 2012-10-17 東京エレクトロン株式会社 基板処理方法及び基板処理装置
TWI450047B (zh) * 2007-07-13 2014-08-21 Mapper Lithography Ip Bv 微影系統、夾緊方法及晶圓台
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GB2469112A (en) * 2009-04-03 2010-10-06 Mapper Lithography Ip Bv Wafer support using controlled capillary liquid layer to hold and release wafer

Also Published As

Publication number Publication date
CN102414782A (zh) 2012-04-11
WO2010094802A1 (en) 2010-08-26
US20130234040A1 (en) 2013-09-12
KR101586984B1 (ko) 2016-01-20
EP2399280A1 (en) 2011-12-28
TW201106107A (en) 2011-02-16
EP2399280B1 (en) 2020-01-15
CN102414782B (zh) 2014-11-05
US8436324B2 (en) 2013-05-07
JP2012518901A (ja) 2012-08-16
US9117631B2 (en) 2015-08-25
US20100238421A1 (en) 2010-09-23
KR20110132395A (ko) 2011-12-07

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