JP2014523636A5 - - Google Patents
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- JP2014523636A5 JP2014523636A5 JP2014513642A JP2014513642A JP2014523636A5 JP 2014523636 A5 JP2014523636 A5 JP 2014523636A5 JP 2014513642 A JP2014513642 A JP 2014513642A JP 2014513642 A JP2014513642 A JP 2014513642A JP 2014523636 A5 JP2014523636 A5 JP 2014523636A5
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- electrostatic chuck
- substrate
- dry chemical
- providing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 30
- 239000000126 substance Substances 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000012298 atmosphere Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 10
- 239000013043 chemical agent Substances 0.000 claims description 8
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 238000007710 freezing Methods 0.000 claims description 4
- 230000008014 freezing Effects 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 4
- KTUQUZJOVNIKNZ-UHFFFAOYSA-N butan-1-ol;hydrate Chemical compound O.CCCCO KTUQUZJOVNIKNZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000004320 controlled atmosphere Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004108 freeze drying Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161491727P | 2011-05-31 | 2011-05-31 | |
| US61/491,727 | 2011-05-31 | ||
| US13/273,090 US9673037B2 (en) | 2011-05-31 | 2011-10-13 | Substrate freeze dry apparatus and method |
| US13/273,090 | 2011-10-13 | ||
| PCT/US2012/039855 WO2012166727A2 (en) | 2011-05-31 | 2012-05-29 | Substrate freeze dry apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014523636A JP2014523636A (ja) | 2014-09-11 |
| JP2014523636A5 true JP2014523636A5 (enExample) | 2015-07-09 |
Family
ID=47260252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014513642A Withdrawn JP2014523636A (ja) | 2011-05-31 | 2012-05-29 | 基板凍結乾燥装置及び方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9673037B2 (enExample) |
| JP (1) | JP2014523636A (enExample) |
| CN (1) | CN103650116B (enExample) |
| TW (1) | TWI571948B (enExample) |
| WO (1) | WO2012166727A2 (enExample) |
Families Citing this family (46)
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| EP1870649A1 (en) * | 2006-06-20 | 2007-12-26 | Octapharma AG | Lyophilisation targetting defined residual moisture by limited desorption energy levels |
| JP5622675B2 (ja) * | 2011-07-05 | 2014-11-12 | 株式会社東芝 | 基板処理方法及び基板処理装置 |
| US10069443B2 (en) * | 2011-12-20 | 2018-09-04 | Tokyo Electron Limited | Dechuck control method and plasma processing apparatus |
| US10690413B2 (en) | 2012-02-01 | 2020-06-23 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US12281847B2 (en) | 2020-04-21 | 2025-04-22 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US12276454B2 (en) | 2020-04-21 | 2025-04-15 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US11713924B2 (en) | 2012-02-01 | 2023-08-01 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10876792B2 (en) | 2012-02-01 | 2020-12-29 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US9970708B2 (en) | 2012-02-01 | 2018-05-15 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US10240867B2 (en) | 2012-02-01 | 2019-03-26 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US9644891B2 (en) | 2012-02-01 | 2017-05-09 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US9513053B2 (en) | 2013-03-14 | 2016-12-06 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US12215925B2 (en) | 2020-04-21 | 2025-02-04 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| US8991067B2 (en) | 2012-02-01 | 2015-03-31 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
| JP5859888B2 (ja) * | 2012-03-26 | 2016-02-16 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| US8898928B2 (en) * | 2012-10-11 | 2014-12-02 | Lam Research Corporation | Delamination drying apparatus and method |
| US9488565B2 (en) | 2012-11-14 | 2016-11-08 | Revive Electronics, LLC | Method and apparatus for detecting moisture in portable electronic devices |
| JP6526575B2 (ja) | 2013-02-07 | 2019-06-05 | エーエスエムエル ホールディング エヌ.ブイ. | リソグラフィ装置及び方法 |
| JP6106501B2 (ja) * | 2013-04-12 | 2017-04-05 | 東京エレクトロン株式会社 | 収納容器内の雰囲気管理方法 |
| US9666427B2 (en) * | 2013-06-21 | 2017-05-30 | Lam Research Corporation | Method of collapse-free drying of high aspect ratio structures |
| US20150060013A1 (en) * | 2013-09-05 | 2015-03-05 | Applied Materials, Inc. | Tunable temperature controlled electrostatic chuck assembly |
| JP6259299B2 (ja) * | 2014-01-30 | 2018-01-10 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
| JP2016025233A (ja) * | 2014-07-22 | 2016-02-08 | 株式会社東芝 | 基板処理装置、及び基板処理方法 |
| CA3009047A1 (en) | 2014-12-23 | 2016-06-30 | Revive Electronics, LLC | Apparatuses and methods for controlling power to electronic devices |
| US10192751B2 (en) * | 2015-10-15 | 2019-01-29 | Lam Research Corporation | Systems and methods for ultrahigh selective nitride etch |
| WO2017075554A1 (en) * | 2015-10-29 | 2017-05-04 | Golfetto Michael | Methods freeze drying and composite materials |
| CN105467682A (zh) * | 2016-01-15 | 2016-04-06 | 京东方科技集团股份有限公司 | 膜层结构、其制作方法、显示基板、背光源及显示装置 |
| KR102008566B1 (ko) * | 2016-05-24 | 2019-08-07 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
| EP3340280A1 (en) * | 2016-12-26 | 2018-06-27 | SCREEN Holdings Co., Ltd. | Substrate treating apparatus and substrate treating method |
| JP7001423B2 (ja) * | 2016-12-26 | 2022-01-19 | 株式会社Screenホールディングス | 基板処理装置及び基板処理方法 |
| CN108807670B (zh) * | 2017-05-03 | 2020-04-28 | 京东方科技集团股份有限公司 | 一种薄膜的制备方法、阵列基板的制备方法及显示面板 |
| JP6966899B2 (ja) * | 2017-08-31 | 2021-11-17 | 株式会社Screenホールディングス | 基板乾燥方法および基板処理装置 |
| JP7010629B2 (ja) * | 2017-08-31 | 2022-01-26 | 株式会社Screenホールディングス | 基板乾燥方法および基板処理装置 |
| US11302525B2 (en) * | 2017-09-22 | 2022-04-12 | SCREEN Holdings Co., Ltd. | Substrate processing method and substrate processing apparatus |
| JP6954793B2 (ja) * | 2017-09-25 | 2021-10-27 | 株式会社Screenホールディングス | 基板処理方法、基板処理液及び基板処理装置 |
| US11149345B2 (en) * | 2017-12-11 | 2021-10-19 | Applied Materials, Inc. | Cryogenically cooled rotatable electrostatic chuck |
| US10957530B2 (en) * | 2017-12-19 | 2021-03-23 | Micron Technology, Inc. | Freezing a sacrificial material in forming a semiconductor |
| US10811267B2 (en) * | 2017-12-21 | 2020-10-20 | Micron Technology, Inc. | Methods of processing semiconductor device structures and related systems |
| US10497559B2 (en) * | 2018-03-28 | 2019-12-03 | Taiwan Semiconductor Manufacturing Company Ltd. | Method for dehydrating semiconductor structure and dehydrating method of the same |
| JP7336306B2 (ja) * | 2018-10-23 | 2023-08-31 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法および記憶媒体 |
| JP7233294B2 (ja) * | 2019-04-25 | 2023-03-06 | 株式会社Screenホールディングス | 基板処理方法、半導体製造方法、および、基板処理装置 |
| US11508569B2 (en) | 2019-08-21 | 2022-11-22 | Fujifilm Electronic Materials U.S.A., Inc. | Surface treatment compositions and methods |
| US11871667B2 (en) | 2020-09-17 | 2024-01-09 | Applied Materials, Inc. | Methods and apparatus for warpage correction |
| CN113758157A (zh) * | 2021-08-02 | 2021-12-07 | 南京研沃生物科技有限公司 | 一种微波真空冷冻干燥机及其介质分离处理方法 |
| CN116092915B (zh) * | 2021-11-08 | 2025-08-15 | 长鑫存储技术有限公司 | 一种衬底的清洁方法以及用于清洁衬底的系统 |
| US11859153B2 (en) | 2021-11-08 | 2024-01-02 | Changxin Memory Technologies, Inc. | Method for cleaning substrate and system for cleaning substrate |
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| KR101108337B1 (ko) * | 2009-12-31 | 2012-01-25 | 주식회사 디엠에스 | 2단의 냉매 유로를 포함하는 정전척의 온도제어장치 |
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-
2011
- 2011-10-13 US US13/273,090 patent/US9673037B2/en not_active Expired - Fee Related
-
2012
- 2012-05-29 WO PCT/US2012/039855 patent/WO2012166727A2/en not_active Ceased
- 2012-05-29 JP JP2014513642A patent/JP2014523636A/ja not_active Withdrawn
- 2012-05-29 TW TW101119160A patent/TWI571948B/zh active
- 2012-05-29 CN CN201280026928.6A patent/CN103650116B/zh active Active
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