CN103650116B - 衬底冷冻干燥装置和方法 - Google Patents

衬底冷冻干燥装置和方法 Download PDF

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Publication number
CN103650116B
CN103650116B CN201280026928.6A CN201280026928A CN103650116B CN 103650116 B CN103650116 B CN 103650116B CN 201280026928 A CN201280026928 A CN 201280026928A CN 103650116 B CN103650116 B CN 103650116B
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Prior art keywords
chamber
electrostatic chuck
drying
wet substrate
dry chemistry
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Chinese (zh)
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CN103650116A (zh
Inventor
史蒂芬·M·施瑞德
戴安·海姆斯
艾伦·M·舍普
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201280026928.6A 2011-05-31 2012-05-29 衬底冷冻干燥装置和方法 Active CN103650116B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161491727P 2011-05-31 2011-05-31
US61/491,727 2011-05-31
US13/273,090 US9673037B2 (en) 2011-05-31 2011-10-13 Substrate freeze dry apparatus and method
US13/273,090 2011-10-13
PCT/US2012/039855 WO2012166727A2 (en) 2011-05-31 2012-05-29 Substrate freeze dry apparatus and method

Publications (2)

Publication Number Publication Date
CN103650116A CN103650116A (zh) 2014-03-19
CN103650116B true CN103650116B (zh) 2017-05-03

Family

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CN201280026928.6A Active CN103650116B (zh) 2011-05-31 2012-05-29 衬底冷冻干燥装置和方法

Country Status (5)

Country Link
US (1) US9673037B2 (enExample)
JP (1) JP2014523636A (enExample)
CN (1) CN103650116B (enExample)
TW (1) TWI571948B (enExample)
WO (1) WO2012166727A2 (enExample)

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US9970708B2 (en) 2012-02-01 2018-05-15 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US12276454B2 (en) 2020-04-21 2025-04-15 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US9513053B2 (en) 2013-03-14 2016-12-06 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US12215925B2 (en) 2020-04-21 2025-02-04 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US10240867B2 (en) 2012-02-01 2019-03-26 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US9644891B2 (en) 2012-02-01 2017-05-09 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
WO2016105505A1 (en) 2014-12-23 2016-06-30 Revive Electronics, LLC Apparatuses and methods for controlling power to electronic devices
US10876792B2 (en) 2012-02-01 2020-12-29 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US10690413B2 (en) 2012-02-01 2020-06-23 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
EP2810004B1 (en) 2012-02-01 2018-11-14 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US11713924B2 (en) 2012-02-01 2023-08-01 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
US12281847B2 (en) 2020-04-21 2025-04-22 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
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CN108807670B (zh) * 2017-05-03 2020-04-28 京东方科技集团股份有限公司 一种薄膜的制备方法、阵列基板的制备方法及显示面板
JP6966899B2 (ja) 2017-08-31 2021-11-17 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置
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Also Published As

Publication number Publication date
JP2014523636A (ja) 2014-09-11
WO2012166727A2 (en) 2012-12-06
TWI571948B (zh) 2017-02-21
CN103650116A (zh) 2014-03-19
WO2012166727A3 (en) 2013-05-10
US9673037B2 (en) 2017-06-06
TW201308486A (zh) 2013-02-16
US20120304483A1 (en) 2012-12-06

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