JPS649624A - Method of drying semiconductor device - Google Patents
Method of drying semiconductor deviceInfo
- Publication number
- JPS649624A JPS649624A JP16583387A JP16583387A JPS649624A JP S649624 A JPS649624 A JP S649624A JP 16583387 A JP16583387 A JP 16583387A JP 16583387 A JP16583387 A JP 16583387A JP S649624 A JPS649624 A JP S649624A
- Authority
- JP
- Japan
- Prior art keywords
- water
- semiconductor device
- liquid
- droplets
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
PURPOSE:To make it possible to dry quickly without enriching and concentrating impurities in liquid and in the surface of a semiconductor device to a concentration which poses problems in manufacturing and operation of the semiconductor device, by replacing water droplets, which are attached to the semiconductor device after washing with water, by liquid whose vapor pressure is higher than water, and freezing and drying the droplets in vacuum. CONSTITUTION:A semiconductor device 11 after washing with water is placed beneath nozzles 14. Liquid, e.g., 2-propanol or acetone, whose compatibility with water is high and vapor pressure is higher than that of water, is atomized through the nozzles 14. Water droplets, which are attached to the semiconductor device 11, are replaced. The semiconductor device 21, to which the droplets of the substituted liquid are attached, is moved to a stage 22 and cooled. Thus the attached liquid droplets are frozen. Then, a valve 27 is opend, and a gas in a chamber 23 is exhausted through an exhaust port 25. The inside is made to be a vacuum state, and the semiconductor device 21 is dried. At this time, the frozen liquid droplets are sublimated like the liquid droplets 4a-4c. Therefore, the impurities in the attached liquid are sublimated or remain at planar positions like arrows 5a-5c. The impurities are not enriched and concentrated to a concentration, which poses problems in manufacturing and operation of the semiconductor device. Since the water is replaced by, e.g., 2-propanol or acetone, whose vapor pressure, is higher than that of water, the device can be dried 3-4 times faster than the case, in which water is frozen and dried.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16583387A JPS649624A (en) | 1987-07-02 | 1987-07-02 | Method of drying semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16583387A JPS649624A (en) | 1987-07-02 | 1987-07-02 | Method of drying semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS649624A true JPS649624A (en) | 1989-01-12 |
Family
ID=15819867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16583387A Pending JPS649624A (en) | 1987-07-02 | 1987-07-02 | Method of drying semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS649624A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04174268A (en) * | 1990-11-02 | 1992-06-22 | Hitachi Nakaseiki Ltd | Vacuum freezing drier |
JPH0611874A (en) * | 1993-03-17 | 1994-01-21 | Canon Inc | Electrophotographic image forming member |
US5348615A (en) * | 1992-10-21 | 1994-09-20 | Advanced Micro Devices, Inc. | Selective planarization method using regelation |
JP2007165528A (en) * | 2005-12-13 | 2007-06-28 | Dainippon Screen Mfg Co Ltd | Substrate processing device and substrate processing method |
JP2014523636A (en) * | 2011-05-31 | 2014-09-11 | ラム リサーチ コーポレーション | Substrate freeze-drying apparatus and method |
WO2022230669A1 (en) * | 2021-04-28 | 2022-11-03 | 株式会社Screenホールディングス | Substrate processing method and substrate processing device |
-
1987
- 1987-07-02 JP JP16583387A patent/JPS649624A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04174268A (en) * | 1990-11-02 | 1992-06-22 | Hitachi Nakaseiki Ltd | Vacuum freezing drier |
US5348615A (en) * | 1992-10-21 | 1994-09-20 | Advanced Micro Devices, Inc. | Selective planarization method using regelation |
JPH0611874A (en) * | 1993-03-17 | 1994-01-21 | Canon Inc | Electrophotographic image forming member |
JP2007165528A (en) * | 2005-12-13 | 2007-06-28 | Dainippon Screen Mfg Co Ltd | Substrate processing device and substrate processing method |
JP2014523636A (en) * | 2011-05-31 | 2014-09-11 | ラム リサーチ コーポレーション | Substrate freeze-drying apparatus and method |
WO2022230669A1 (en) * | 2021-04-28 | 2022-11-03 | 株式会社Screenホールディングス | Substrate processing method and substrate processing device |
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