WO2007146782A3 - Apparatus and method for controlling the temperature of a substrate in a high vacuum processing system - Google Patents

Apparatus and method for controlling the temperature of a substrate in a high vacuum processing system Download PDF

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Publication number
WO2007146782A3
WO2007146782A3 PCT/US2007/070728 US2007070728W WO2007146782A3 WO 2007146782 A3 WO2007146782 A3 WO 2007146782A3 US 2007070728 W US2007070728 W US 2007070728W WO 2007146782 A3 WO2007146782 A3 WO 2007146782A3
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
substrate
high vacuum
vacuum processing
controlling
Prior art date
Application number
PCT/US2007/070728
Other languages
French (fr)
Other versions
WO2007146782A2 (en
Inventor
Todd Arthur Luse
Roger Fremgen
William J Miller
Adrian Celaru
Original Assignee
Veeco Instr Inc
Todd Arthur Luse
Roger Fremgen
William J Miller
Adrian Celaru
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Veeco Instr Inc, Todd Arthur Luse, Roger Fremgen, William J Miller, Adrian Celaru filed Critical Veeco Instr Inc
Priority to JP2009514550A priority Critical patent/JP2009540580A/en
Publication of WO2007146782A2 publication Critical patent/WO2007146782A2/en
Publication of WO2007146782A3 publication Critical patent/WO2007146782A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Abstract

Apparatus and methods for improving the control of the temperature of a supported member, such as a substrate, in high vacuum processing systems, such as ion beam etch (IBE) systems. The apparatus includes thermoelectric devices (70) that transfer heat from a support member (42) supporting the supported member (20) to a liquid-cooled heat exchange member (44) to regulate the temperature of the support member (42). The method includes cooling the support member (42) with thermoelectric devices (70) that transfer the heat to the liquid-cooled heat exchange member (44).
PCT/US2007/070728 2006-06-09 2007-06-08 Apparatus and method for controlling the temperature of a substrate in a high vacuum processing system WO2007146782A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009514550A JP2009540580A (en) 2006-06-09 2007-06-08 Apparatus and method for controlling substrate temperature in a high vacuum generation system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/423,361 2006-06-09
US11/423,361 US20070283709A1 (en) 2006-06-09 2006-06-09 Apparatus and methods for managing the temperature of a substrate in a high vacuum processing system

Publications (2)

Publication Number Publication Date
WO2007146782A2 WO2007146782A2 (en) 2007-12-21
WO2007146782A3 true WO2007146782A3 (en) 2008-04-10

Family

ID=38820511

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/070728 WO2007146782A2 (en) 2006-06-09 2007-06-08 Apparatus and method for controlling the temperature of a substrate in a high vacuum processing system

Country Status (4)

Country Link
US (1) US20070283709A1 (en)
JP (1) JP2009540580A (en)
CN (1) CN101536148A (en)
WO (1) WO2007146782A2 (en)

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Also Published As

Publication number Publication date
WO2007146782A2 (en) 2007-12-21
JP2009540580A (en) 2009-11-19
CN101536148A (en) 2009-09-16
US20070283709A1 (en) 2007-12-13

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