WO2014002609A1 - 重ね合わせ装置および重ね合わせ方法 - Google Patents
重ね合わせ装置および重ね合わせ方法 Download PDFInfo
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- WO2014002609A1 WO2014002609A1 PCT/JP2013/062572 JP2013062572W WO2014002609A1 WO 2014002609 A1 WO2014002609 A1 WO 2014002609A1 JP 2013062572 W JP2013062572 W JP 2013062572W WO 2014002609 A1 WO2014002609 A1 WO 2014002609A1
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T11/00—2D [Two Dimensional] image generation
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L2221/68331—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. die mounting substrate
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Definitions
- the present invention relates to a superposition apparatus and superposition method for superposing a substrate and a support.
- chips semiconductor silicon chips
- a semiconductor wafer (hereinafter referred to as a wafer) serving as a base of a chip is thinned by grinding, its strength is weakened, and the wafer is likely to be cracked or warped. Further, since it is difficult to automatically transport a wafer whose strength has been reduced by making it thin, it has to be transported manually, and the handling thereof is complicated.
- a wafer support system that maintains the strength of the wafer and prevents the occurrence of cracks and warpage of the wafer by bonding a plate made of glass or hard plastic, called a support plate, to the wafer to be ground. . Since the strength of the wafer can be maintained by the wafer support system, the transport of the thinned semiconductor wafer can be automated.
- the wafer and the support plate are bonded together using an adhesive tape, a thermoplastic resin, an adhesive, or the like. After thinning the wafer to which the support plate is attached, the support plate is peeled from the substrate before dicing the wafer.
- Patent Documents 1 and 2 describe a technique for bonding together.
- Japanese Patent Publication Japanese Unexamined Patent Application Publication No. 2008-182127 (published on August 7, 2008)” Japanese Patent Publication “JP 2012-059758 A” (published on September 17, 2012)
- the superposition apparatus matches the outer diameters of the wafer and the support plate.
- the support plate often varies in dimensions, and when the outer diameters of the wafer and the support plate are matched, the relative position between the wafer and the support plate may also vary due to this variation. . If variations occur in the relative positions of the wafer and the support plate, subsequent wafer processing is adversely affected.
- the present invention has been made in view of the above problems, and has as its main object to provide a technique for improving the alignment accuracy of a wafer and a support plate in an overlay apparatus.
- an overlaying apparatus includes an overlaying unit that overlays a substrate and a support that supports the substrate, an end surface of the substrate and the support before being superimposed.
- a center position detector configured to detect the center position, and a transport means for transporting the substrate and the support after detecting the center position from the holding unit to the stacking unit.
- the substrate and the support are overlapped so that the center positions of the substrate and the support detected by the center position detection unit overlap each other. It is characterized in that there.
- the superimposing method according to the present invention includes an imaging step of imaging the substrate held by the holding unit and an end surface of the support by a plurality of imaging units, and the plurality of images captured in the imaging step.
- the center position detection step of detecting the center position of each of the supports the transport step of transporting the substrate and the support body from which the center position has been detected from the holding portion to the overlap portion, and detection in the overlap portion
- an overlaying step of overlaying the substrate and the support so that the center positions of the substrate and the support overlap each other.
- the center position of the substrate and the support held by the holding unit is detected, the substrate and the support are transported from the holding unit to the overlapping unit, and then the detected substrate and support are detected at the overlapping unit.
- the substrate and the support are overlapped so that the center position of the body overlaps. Thereby, the accuracy of alignment between the wafer and the support plate can be improved.
- FIG. 1 It is a top view which shows typically the whole structure of the bonding system in one Embodiment. It is a top view which shows typically the structure of the holding
- (A) is a front view which shows typically the structure of the overlap part in one Embodiment
- (b) is the figure which simplified (a). It is a top view which shows typically the structure of the position adjustment means in one Embodiment. It is a top view which shows typically the structure of the latching member in one Embodiment. It is a figure which shows the structure of the bonding unit in one Embodiment. It is a figure explaining operation
- the superimposing apparatus includes a superimposing unit that superimposes a substrate and a support that supports the substrate, a plurality of imaging units that capture images of the substrate and the end surface of the support before being superimposed, A center configured to detect a center position of each of the substrate and the support from a plurality of images captured by the image capturing unit and a holding unit that holds the substrate and the support captured by the image capturing unit. A position detection unit, and a transport unit that transports the substrate and the support after detecting the center position from the holding unit to the stacking unit. In the stacking unit, the center position detection unit The substrate and the support are superposed such that the center positions of the substrate and the support detected by each other overlap.
- the superimposing method according to the present invention includes an imaging step of imaging the substrate held by the holding unit and an end surface of the support by a plurality of imaging units, and the plurality of images captured in the imaging step.
- the center position detection step of detecting the center position of each of the supports the transport step of transporting the substrate and the support body from which the center position has been detected from the holding portion to the overlap portion, and detection in the overlap portion
- an overlapping step of overlapping the substrate and the support so that the center positions of the substrate and the support overlap each other.
- the stacking apparatus forms a stacked body by stacking a substrate and a support supporting the substrate via an adhesive layer stacked on at least one of the substrate and the support. That is, the laminate is formed by laminating a substrate, an adhesive layer containing, for example, a thermoplastic resin, and a support plate (support) that supports the substrate in this order.
- the adhesive layer can be formed by applying an adhesive to any one of the substrate and the support plate, or by attaching an adhesive tape to which the adhesive is applied.
- substrate and a support plate can be bonded together by mounting (setting) the formed laminated body in the predetermined position of a sticking apparatus, for example with conveyance apparatuses, such as a robot arm, and applying a pressing force.
- the forming method and forming apparatus for forming the laminate that is, the method for forming the adhesive layer and the apparatus for forming the adhesive layer are not particularly limited, and various methods and apparatuses can be employed.
- the substrate is subjected to processes such as thinning, conveyance, and mounting while being supported (attached) to the support plate.
- the substrate is not limited to a wafer substrate, and may be any substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate that needs to be supported by a support plate.
- the support plate is a support that supports the substrate and is attached to the substrate through an adhesive layer. Therefore, the support plate only needs to have a strength necessary to prevent breakage or deformation of the substrate during a process such as thinning, transporting, and mounting of the substrate, and is desirably lighter. From the above viewpoint, the support plate is more preferably made of glass, silicon, acrylic resin, or the like.
- the adhesive constituting the adhesive layer may contain, for example, a thermoplastic resin whose thermal fluidity is improved by heating as an adhesive material.
- a thermoplastic resin whose thermal fluidity is improved by heating as an adhesive material.
- the thermoplastic resin include acrylic resins, styrene resins, maleimide resins, hydrocarbon resins, and elastomer resins.
- the method for forming the adhesive layer that is, the method for applying the adhesive to the substrate or the support plate, or the method for forming the adhesive tape by applying the adhesive to the substrate is not particularly limited.
- Examples of the method for applying the adhesive include a spin coating method, a dipping method, a roller blade method, a doctor blade method, a spray method, and a slit nozzle method.
- the thickness of the adhesive layer may be set as appropriate according to the type of substrate to be pasted and the type of support plate, the treatment applied to the substrate after pasting, etc., but is within the range of 10 to 150 ⁇ m. Is more preferable, and it is more preferably within a range of 15 to 100 ⁇ m.
- a solvent may be supplied to the adhesive layer to dissolve the adhesive layer.
- substrate and a support plate can be isolate
- the support plate has a through-hole penetrating in the thickness direction, it is more preferable because the solvent can be easily supplied to the adhesive layer through the through-hole.
- a layer other than the adhesive layer may be further formed between the substrate and the support plate as long as the attachment of the both is not hindered.
- a separation layer that is altered by irradiation with light may be formed between the support plate and the adhesive layer. Since the separation layer is formed, the substrate and the support plate can be easily separated by irradiating light after processes such as thinning, transporting, and mounting of the substrate.
- the superimposing apparatus according to the present invention can be incorporated into a bonding system for bonding the substrate 42 and the support plate 41 together.
- FIG. 1 is a configuration diagram showing a bonding system 1 in the present embodiment, and shows a schematic configuration when the bonding system 1 is viewed from directly above.
- the bonding system 1 includes a bonding unit 2, a holding unit 3, a first external transport unit 4, and a first external transport unit travel path 5.
- the laminating unit 2 includes an overlapping portion 6 that can be decompressed and a pasting portion 7 that can be decompressed.
- the holding unit 3 and the superimposing unit 6 constitute the superimposing device according to the present embodiment
- the pasting unit 7 constitutes the pasting device according to the present embodiment.
- 1 further includes a FOUP opener 50 provided in the bonding system 1, a spinner 52 that applies an adhesive layer to the substrate 42, a bake plate 51 that cures the applied adhesive layer, a second external transport unit 54, and A pass line 53 for transferring the substrate 42 to the first external transfer means 4 is shown.
- the external transport means 4 has a configuration that can carry the support plate 41, the substrate 42, and the laminated body 40, and can exchange the support plate 41, the substrate 42, and the laminated body 40 with the bonding unit 2. It has a configuration.
- the external transport unit 4 moves on the external transport unit travel path 5.
- the external conveying means 4 and the external conveying means traveling path 5 that bear such a function can be prepared by a conventionally known technique.
- FIG. 2 is a diagram illustrating a schematic configuration of the holding unit 3.
- the holding unit 3 includes imaging units (first imaging unit and second imaging unit) 17 a and 17 b and a center position detection unit 19, and the substrate 42 or the support before being superimposed.
- the plate 41 is held (note that FIG. 2 shows the case where the support plate 41 is held).
- the imaging units 17a and 17b respectively capture areas 18a and 18b including different end surfaces (first end surface and second end surface) of the substrate 42 or the support plate 41 held by the holding unit 3. .
- the regions 18a and 18b are preferably set, for example, approximately on a diagonal line of the substrate 42 or the support plate 41 held by the holding unit 3.
- the imaging units 17a and 17b can be, for example, CCD cameras.
- the center position detection unit 19 detects the center position of the substrate 42 or the support plate 41 held by the holding unit 3 based on a plurality of images taken by the imaging units 17a and 17b.
- the center position detector 19 only needs to calculate a virtual circle based on the image of the end face of the disk and detect the center position.
- the technique for detecting the center position based on the image of the end face is not particularly limited as long as known image processing is used.
- FIG. 3A is a diagram illustrating a schematic configuration of the overlapping unit 6, and FIG. 3B is a simplified diagram of FIG.
- the overlapping portion 6 includes an elevating stage (supporting means) 21, a position adjusting part (position adjusting means) 22, a latching member 23, a temporary fixing part (temporary fixing means) 24, A heater 25 and a pressing part 26 are provided.
- the position adjusting unit 22 and the latching member 23 are moved in the horizontal direction, and the elevating stage 21 and the temporary fixing unit 24 are moved in the vertical direction. It has become.
- the support plate 41 and the substrate 42 are separately carried into the overlapping portion 6.
- the elevating stage 21 is a member that holds the support plate 41 or the substrate 42 or the stacked body 40 in which the support plate 41 or the substrate 42 is stacked from the bottom surface. It can be a chuck that holds by suction. The elevating stage 21 can be moved up and down in the vertical direction, whereby the support plate 41, the substrate 42 and the stacked body 40 to be held can be moved up and down in the vertical direction.
- the mounting surface 21a such as the support plate 41 in the elevating stage 21 is preferably formed of a resin such as polytetrafluoroethylene or PEEK so as not to wrinkle the mounted object. Moreover, it is preferable to form a groove in the mounting surface 21a. By forming a groove in the mounting surface 21a, when the inside of the overlapping portion 6 is decompressed, gas remains between the support plate 41, the substrate 42, the stacked body 40, and the mounting surface 21a. Can be prevented.
- the position adjusting unit 22 is a member that adjusts the position in the horizontal direction of the support plate 41 and the substrate 42 to be aligned for alignment.
- the position adjustment unit 22 is based on the center positions of the support plate 41 and the substrate 42 detected by the center position detection unit 19 so that the center positions of the support plate 41 and the substrate 42 overlap each other.
- the position in one in-plane direction is adjusted.
- the center positions of the support plate 41 and the substrate 42 may be adjusted so as to overlap a predetermined center axis O.
- the position adjustment unit 42 determines the position of at least one of the substrate 42 and the support plate 41 in the in-plane direction so that the center positions of the substrate 42 and the support plate 41 detected by the center position detection unit 19 overlap each other. adjust. Thereby, in the superposition part 6, the center position of the board
- the position adjusting unit 22 is pressed by the pressing units 26a to 26d and abuts against the support plate 41 or the substrate 42, whereby the support plate 41 and the substrate 42 are positioned in the horizontal direction.
- the pressing portions 26a to 26d can be configured by, for example, a stepping motor, an air cylinder, or the like.
- the position where the position adjusting unit 22 abuts on the support plate 41 or the substrate 42 is two steps in one example. Thereby, for example, the substrate 42 having two types of sizes can be processed.
- the retaining member 23 holds the aligned support plate 41 (or the substrate 42 when the substrate 42 is first aligned) until it is overlapped without changing its horizontal position. It is a member.
- FIG. 5 is a view of the latch member 23 as seen from the upper surface side.
- the latch member 23 supports the support plate 41 stably by supporting a part of the peripheral edge portion of the support plate 41 from below.
- the latch member 23 is movable in the horizontal direction.
- FIG. 5 shows a state in which the latch member 23 is in the “insertion position”.
- the width d 3 of overlap between the respective members and the support plate 41 for supporting the support plate 41 of the latch member 23 include, but are not limited to, inward from the peripheral edge of the support plate 41 It can be about 1 to 5 mm. It is preferably 5 mm.
- the size of the hook member 23 is, for example, the width d 4 may be 5 mm, but is not limited thereto.
- the material of the retaining member 23 is not particularly limited, and for example, a material obtained by chamfering stainless steel (SUS) and coating with resin with polytetrafluoroethylene or the like can be used.
- the temporary fixing portion 24 presses a part of the support plate 41 overlapped with the substrate 42 toward the substrate 42 and heats the substrate 42.
- This is a member for temporarily fixing the support plate 41. That is, a part of the adhesive layer sandwiched between the support plate 41 and the substrate 42 is softened by pressing and heating a part of the region. Thereafter, the support plate 41 and the substrate 42 can be temporarily fixed by re-cooling.
- the support plate 41 and the substrate 42 can be temporarily fixed. Therefore, when the stacked laminate 40 is transported to the attaching unit 7, the substrate 42 and the support plate 41 are used. It is possible to successfully prevent a deviation from occurring in the relative position with respect to.
- the temporary fixing portion 24 is paired with the elevating stage 21 so as to be sandwiched between the support plate 41 and the substrate 42, and the area of the contact surface 24a of the temporary fixing portion 24 with respect to the support plate 41 is not particularly limited. What is necessary is just to set suitably in view of the intensity
- region on the support plate 41 which the contact surface 24a contacts is the center part of the support plate 41. FIG. Thereby, the support plate 41 and the board
- the temporary fixing part 24 includes a heater (heating means) 25 for heating the contact surface 24a.
- the material of the temporary fixing part 24 is not particularly limited, but can be made of aluminum or the like having good thermal conductivity.
- the temporary fixing portion 24 is driven by, for example, a stepping motor, and the pressing force to the support plate 41 can be controlled by the torque applied to the stepping motor.
- the temporary fixing portion 24 is provided vertically above the hooking member 23 and is configured to be movable up and down.
- the temporary fixing portion 24 is referred to as a “standby position” that the temporary fixing portion 24 is not moved downward and is therefore not in contact with the support plate 41 held by the latching member 23. It is said that.
- the temporary fixing portion 24 indicates that the temporary fixing portion 24 moves downward and, as a result, is in a position where the surface of the support plate 41 held by the hooking member 23 is pressed. Is at the “joining position”.
- the temporary fixing portion 24 is provided so as to come into contact with the central portion of the surface of the support plate 41 when the temporary fixing portion 24 is in the joining position.
- the affixing unit 7 has an affixing unit that affixes the substrate 42 and the support plate 41 that have been aligned and aligned.
- the bonding means a configuration is possible in which the substrate 42 and the support plate 41 are bonded together by thermocompression bonding via an adhesive layer.
- the overlapping portion 6 and the pasting portion 7 can have a structure in which a wall that partitions the inside of one processing chamber into two processing chambers is provided.
- the overlapping portion 6 and the pasting portion 7 may have a structure in which the overlapping portion 6 and the pasting portion 7 are in contact with each other without a gap on each side surface.
- a gate 8 for delivering the laminate 40 between the overlapping portion 6 and the pasting portion 7 is provided. The gate 8 is controlled to be opened and closed by a shutter.
- the overlapping portion 6 is provided with an openable / closable delivery window 9 for delivering the support plate 41, the substrate 42 and the laminated body 40 between the bonding unit 2 and the external transport means 4.
- Each of the overlapping portion 6 and the pasting portion 7 is provided with a known pressure reducing means (not shown), and the internal pressure state of each chamber can be controlled independently.
- the substrate 42 and the support plate 41 can be bonded together via an adhesive layer in a reduced pressure atmosphere.
- the adhesive layer can enter the recess in a state where no air is present in the recess of the uneven pattern on the surface of the substrate 42. It is possible to prevent the generation of bubbles between the substrate 42 more reliably.
- the gate 8 can move the aligned laminated body 40 from the overlapping portion 6 to the attaching portion 7 in a state where the shutter is opened. It is formed so that it can be moved to the overlapping portion 6.
- the laminated body 40 before joining can be moved from the overlapping portion 6 to the pasting portion 7 under reduced pressure. Yes.
- the bonding unit 2 is further provided with an internal conveying means (10 in FIG. 6) for delivering the laminated body 40 between the overlapping portion 6 and the bonding portion 7 via the gate 8.
- FIG. 6 is a configuration diagram of the internal configuration of the bonding unit 2 including the internal conveyance means 10 as viewed from above.
- the internal conveyance means 10 is the structure which can move the laminated body 40 between the superimposition part 6 and the sticking part 7, there is no restriction
- the internal transfer means 10 includes an internal transfer arm 11 and an arm pivot shaft 12.
- the internal conveyance means 10 is a mechanism for moving the multilayer body 40 by rotation about the arm turning shaft 12 of the internal conveyance arm 11 that can support the multilayer body 40 from the lower surface.
- two internal conveyance means 10 having a common pivot axis for rotation are provided.
- the arm turning shaft 12 is provided on the overlapping portion 6 side, but may be configured on the sticking portion 7 side.
- the arm pivot shaft 12 is formed on the side close to the side surface on which the delivery window 9 is formed from the viewpoint that the delivery stroke between the overlapping portion 6 and the external conveying means 4 can be shortened. It is preferable.
- the two-dot chain line indicated by “B” represents the standby position of the internal transfer arm 11
- the two-dot chain line indicated by “C” indicates the position (the sticking part) of the internal transfer arm 11 at the sticking part 7. (Delivery position).
- the rotation speed of the internal transfer arm 11 can be set according to the situation. Therefore, when the internal transfer arm 11 holds the stacked body 40, the internal transfer arm 11 can be rotated at a low speed, and when the stacked body 40 is not held, the internal transfer arm 11 rotates at a high speed. Can be made. In addition, acceleration / deceleration can be controlled so that the turning up and stopping of the internal transfer arm 11 is smooth.
- the gate 8 has an opening with a width that allows the rotating internal transfer arm 11 to pass through the gate 8 and carry the laminated body 40 to the pasting portion delivery position C when the shutter is opened. It has become.
- Conventionally known means can be used to open and close the gate 8, and for example, a gate valve structure can be applied.
- FIG. 7 is a diagram for explaining the operation of the superposition apparatus according to the present embodiment, based on the internal state of the superposition unit 6.
- FIG. 3B illustration of the members for holding or controlling the position adjusting unit 22, the hooking member 23, and the temporary fixing unit 24 is omitted.
- the center position detection unit 19 detects the center position of the support plate 41. Specifically, first, the imaging units 17a and 17b image the end surface of the support plate 41 held by the holding unit 3 (imaging process). Then, the center position detection unit 19 detects the center position of the support plate 41 held by the holding unit 3 based on the plurality of images captured by the imaging units 17a and 17b (center position detection step).
- the support plate 41 is carried into the overlapping portion 6 through the delivery window 9 and placed on the elevating stage 21 using the external conveying means 4 (conveying step, see FIG. 7A). At this time, it is preferable that the latching member 23 is in the removal position and the temporary fixing portion 24 is in the standby position.
- the center position detection unit 19 detects the center position of the substrate 42. Specifically, first, the imaging units 17a and 17b image the end face of the substrate 42 held by the holding unit 3 (imaging process). Then, the center position detection unit 19 detects the center position of the substrate 42 held by the holding unit 3 based on the plurality of images captured by the imaging units 17a and 17b (center position detection step).
- the substrate 42 is carried into the overlapping portion 6 through the delivery window 9 and placed on the elevating stage 21 using the external conveying means 4 (conveying step, see FIG. 7D). After loading the substrate 42 into the superposition unit 6 and closing the transfer window 9, decompression of the superposition unit 6 is started.
- the superposition part 6 may be depressurized so that the depressurization state of the superposition part 6 and the depressurization state of the sticking part 7 at the time when the temporary fixing is finished are substantially the same. Preferably, it is 10 Pa or less.
- the elevating stage 21 on which the aligned substrate 42 is placed is raised to a position where it is overlapped with the support plate 41.
- the temporary fixing part 24 is moved onto the support plate 41.
- connects the surface of the support plate 41, and it will be in the state which pressed the surface of the support plate 41 (superimposition process, (f) reference of FIG. 7).
- the contact surface 24 a is heated by the heater 25.
- the adhesive layer between the substrate 42 and the support plate 41 is thermally fluidized and temporarily fixed.
- the temperature of the contact surface 24a becomes the temperature more than the glass transition point (Tg) of the thermoplastic resin which is an adhesive material of a contact bonding layer, for example, temperature more than a glass transition point (Tg) It is more preferable to heat until.
- Tg glass transition point
- the thermal fluidity of the adhesive layer is improved and the adhesive layer is easily deformed.
- the temperature of the contact surface 24a is preferably 23 to 300 ° C.
- the heating time, that is, the pressing time is preferably 3 to 300 seconds. Preferably, it is 5 to 180 seconds.
- Laminate 40 conveyance The shutter of the gate 8 is opened, and the internal conveyance means 10 is moved to the overlapping portion 6 to hold the stacked body 40 (see FIG. 8B). And the internal conveyance means 10 conveys the laminated body 40 to the sticking part 7 (refer FIG.8 (b)).
- the substrate 42 and the support plate 41 can be superimposed so that the center positions of the substrate 42 and the support plate 41 detected by the center position detection unit 19 overlap each other. it can.
- the relative position between the substrate 42 and the support plate 41 varies, unlike when the outer diameters of the substrate 42 and the support plate 41 are matched. This can be prevented.
- a deviation of about 100 ⁇ m has been generated, but when this embodiment is used, it can be suppressed to about 50 ⁇ m.
- the present invention can improve the accuracy of bonding the substrate and the support plate in a vacuum, and thus can be widely used in the field of manufacturing industrial products.
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Abstract
Description
上記重ね合わせ装置は、基板と、上記基板を支持する支持体とを、上記基板および上記支持体の少なくとも何れかに積層された接着層を介して重ね合わせることによって積層体を形成する。すなわち、積層体は、基板と、例えば熱可塑性樹脂を含む接着層と、上記基板を支持するサポートプレート(支持体)とがこの順に積層されて形成されている。接着層は、基板およびサポートプレートの何れか一方に接着剤が塗布されることによって、または、接着剤が塗布されてなる接着テープを貼着することによって形成され得る。そして、形成した積層体を、例えば、ロボットアーム等の搬送装置によって、貼付装置の所定位置に載置(セット)し、押圧力を掛けることにより、基板とサポートプレートとを貼り合わせることができる。
本発明に係る重ね合わせ装置は、一実施形態において、基板42とサポートプレート41とを貼り合わせる貼り合わせシステムに組み込むことができる。
図2は、保持部3の概略の構成を示す図である。図2に示すように、保持部3は、撮像部(第一の撮像手段、第二の撮像手段)17a、17bおよび中心位置検出部19を備えており、重ね合わされる前の基板42またはサポートプレート41を保持するようになっている(なお、図2ではサポートプレート41を保持している場合について示す。)。
図3の(a)は、重ね合わせ部6の概略の構成を示す図であり、図3の(b)は、図3の(a)を簡略化した図である。図3の(a)に示すように、重ね合わせ部6は、昇降ステージ(支持手段)21、位置調整部(位置調整手段)22、掛止部材23、仮止め部(仮止め手段)24、ヒータ25および押圧部26を備えている。図3の(b)に示すように、位置調整部22および掛止部材23は、水平方向に移動するようになっており、昇降ステージ21および仮止め部24は、鉛直方向に移動するようになっている。重ね合わせ部6には、サポートプレート41および基板42が別々に搬入される。
貼付部7は、位置合わせを行って重ね合わされた基板42とサポートプレート41とを貼り合わせる貼り合わせ手段を有している。貼り合わせ手段としては、基板42とサポートプレート41とを接着剤層を介して熱圧着により貼り合わせる構成が可能である。例えば、貼付部7内部の上下にプレスプレートを設け、この上下のプレスプレート間に、接合前の積層体40を挟み込めるようにする構成が可能である。
重ね合わせ部6および貼付部7は、一つの処理室の内部を二つの処理室に仕切る壁を設けた構造とすることができる。このほかにも重ね合わせ部6および貼付部7は、重ね合わせ部6と貼付部7とがそれぞれの側面において隙間なく互いに接している構造であってもよい。重ね合わせ部6および貼付部7の境界には、重ね合わせ部6および貼付部7間で積層体40の受け渡しを行うためのゲート8が設けられている。ゲート8はシャッターによって開閉が制御されている。また、重ね合わせ部6には、貼り合わせユニット2と外部搬送手段4との間でサポートプレート41、基板42および積層体40の受け渡しを行うための開閉可能な受け渡し窓9が設けられている。重ね合わせ部6および貼付部7にはそれぞれ、公知の減圧手段が設けられており(図示せず)、各室の内部圧の状態を独立に制御することができる。
続いて、本実施形態に係る重ね合わせ装置(保持部3および重ね合わせ部6)の概略動作(本実施形態に係る重ね合わせ方法)について説明する。
外部搬送手段4を用いて、サポートプレート41を保持部3に搬入する。そして、中心位置検出部19が、サポートプレート41の中心位置を検出する。詳細には、まず、撮像部17aおよび17bが、保持部3に保持されたサポートプレート41の端面を撮像する(撮像工程)。そして、中心位置検出部19が、撮像部17aおよび17bが撮像した複数の画像に基づいて、保持部3に保持されたサポートプレート41の中心位置を検出する(中心位置検出工程)。
外部搬送手段4を用いて、サポートプレート41を、受け渡し窓9を介して重ね合わせ部6内部に搬入し、昇降ステージ21上に載置する(搬送工程、図7の(a)参照)。なお、この時点において、掛止部材23は抜き位置にしておき、仮止め部24は待機位置にしておくことが好ましい。
次に、サポートプレート41を載せた昇降ステージ21を、位置調整部22が存在する位置まで移動させる。そして、位置調整部22によって、(1)において検出したサポートプレート41の中心位置が、予め定められた中心軸に重なるように、サポートプレート41の水平方向における位置を調整する(重ね合わせ工程、図7(b)参照)。
サポートプレート41の位置合わせが終了した後、サポートプレート41を載せた昇降ステージ21を、掛止部材23を挿入する位置まで上昇させる。そして、掛止部材23を挿入位置に移動させる(図7の(c)参照)。これにより、位置合わせを終えたサポートプレート41の水平方向の位置を変えずに掛止部材23によって保持させて、昇降ステージ21を再び下降させることができるようになる。
外部搬送手段4を用いて、基板42を保持部3に搬入する。そして、中心位置検出部19が、基板42の中心位置を検出する。詳細には、まず、撮像部17aおよび17bが、保持部3に保持された基板42の端面を撮像する(撮像工程)。そして、中心位置検出部19が、撮像部17aおよび17bが撮像した複数の画像に基づいて、保持部3に保持された基板42の中心位置を検出する(中心位置検出工程)。
外部搬送手段4を用いて、基板42を、受け渡し窓9を介して重ね合わせ部6内部に搬入し、昇降ステージ21上に配置させる(搬送工程、図7の(d)参照)。基板42を重ね合わせ部6内に搬入し終えて、受け渡し窓9を閉じた後に、重ね合わせ部6の減圧を開始する。重ね合わせ部6の減圧は、仮止めが終了した時点における重ね合わせ部6の減圧状態および貼付部7の減圧状態が、互いにほぼ同じ状態になるように行えばよい。好適には、10Pa以下である。
次に、基板42を載せた昇降ステージ21を、位置調整部22が存在する位置まで移動させる。そして、位置調整部22によって、(5)において検出した基板42の中心位置が、予め定められた中心軸に重なるように、基板42の水平方向における位置を調整する(重ね合わせ工程、図7の(e)参照)。
位置合わせを終えた基板42を載せた昇降ステージ21を、サポートプレート41と重ねる位置まで上昇させる。昇降ステージ21が当該位置に到達した後、仮止め部24をサポートプレート41上に移動させる。これにより、仮止め部24の接触面24aがサポートプレート41の表面に接して、サポートプレート41の表面を押圧した状態になる(重ね合わせ工程、図7の(f)参照)。同時に、ヒータ25によって、接触面24aを加熱しておく。これによって、基板42とサポートプレート41との間の接着層を熱流動させ、仮止めする。
サポートプレート41と基板42とを重ね合わせた後、仮止め部24を待機位置に戻す。次いで、サポートプレート41と基板42とを重ね合わせた積層体40を載せた昇降ステージ21を下降させる。以上により、重ね合わせが終了する(図7の(h)参照)。
ゲート8のシャッターを開いて、内部搬送手段10を、重ね合わせ部6に移動させ、積層体40を保持させる(図8の(b)参照)。そして、内部搬送手段10が、積層体40を貼付部7に搬送する(図8の(b)参照)。
2 貼り合わせユニット
3 保持部
4 外部搬送手段(搬送手段)
5 外部搬送手段走行路
6 重ね合わせ部(第1の処理室)
7 貼付部(第2の処理室)
8 ゲート
9 受け渡し窓
10 内部搬送手段
11 内部搬送アーム
12 アーム旋回軸
17a、17b 撮像部(第一の撮像手段、第二の撮像手段)
18a、18b 撮像領域
19 中心位置検出部
21 昇降ステージ(支持手段)
22 位置調整部(位置調節手段)
23 掛止部材
24 仮止め部(仮止め手段)
25 ヒータ(加熱手段)
26 押圧部
40 積層体
41 サポートプレート(支持体)
42 基板
50 FOUPオープナー
51 ベークプレート
52 スピンナー
53 パスライン
54 第2外部搬送手段
Claims (6)
- 基板と当該基板を支持する支持体とを重ね合わせる重ね合わせ部と、
重ね合わされる前の上記基板および上記支持体の端面を撮像する複数の撮像手段と、
上記撮像手段によって撮像される上記基板および上記支持体を保持する保持部と、
上記撮像手段が撮像した複数の画像から、上記基板および上記支持体のそれぞれの中心位置を検出するようになっている中心位置検出部と、
中心位置を検出した後の上記基板および上記支持体を上記保持部から上記重ね合わせ部へ搬送する搬送手段と、を備えており、
上記重ね合わせ部では、上記中心位置検出部が検出した上記基板および上記支持体の互いの中心位置が重なるように、上記基板および上記支持体を重ね合わせるようになっていることを特徴とする重ね合わせ装置。 - 上記重ね合わせ部は、上記基板および上記支持体の互いの中心位置が重なるように、上記基板および上記支持体の少なくとも一方の面内方向の位置を調整する位置調整手段を備えていることを特徴とする請求項1に記載の重ね合わせ装置。
- 上記撮像手段は、上記基板および上記支持体における第一の端面を撮像する第一の撮像手段と、上記基板および上記支持体における第一の端面とは異なる位置の第二の端面を撮像する第二の撮像手段とを備えていることを特徴とする請求項1または2に記載の重ね合わせ装置。
- 上記基板および上記支持体の少なくとも何れかには、接着層が積層されており、
上記重ね合わせ部は、上記基板と上記支持体とを、上記接着層を介して重ね合わせるようになっていることを特徴とする請求項1~3の何れか一項に記載の重ね合わせ装置。 - 上記重ね合わせ部は、中心位置を検出した後の上記基板および上記支持体のうちの一方を支持する支持手段と、中心位置を検出した後の上記基板および上記支持体のうちの他方を掛止する掛止部材とを備えており、上記支持体に支持された上記基板および上記支持体のうちの一方に、掛止部材に掛止された上記基板および上記支持体のうちの他方を、上記基板および上記支持体の互いの中心位置が重なるように重ね合わせるようになっていることを特徴とする請求項1~4の何れか一項に記載の重ね合わせ装置。
- 複数の撮像手段によって、保持部に保持された基板および支持体の端面を撮像する撮像工程と、
上記撮像工程において撮像した複数の画像から、上記基板および上記支持体のそれぞれの中心位置を検出する中心位置検出工程と、
中心位置を検出した上記基板および上記支持体を上記保持部から重ね合わせ部へ搬送する搬送工程と、
上記重ね合わせ部において、検出した上記基板および上記支持体の互いの中心位置が重なるように、上記基板および上記支持体を重ね合わせる重ね合わせ工程と、を包含することを特徴とする重ね合わせ方法。
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- 2013-04-30 WO PCT/JP2013/062572 patent/WO2014002609A1/ja active Application Filing
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- 2013-04-30 US US14/409,137 patent/US9911637B2/en active Active
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JP6001934B2 (ja) | 2016-10-05 |
US20150194329A1 (en) | 2015-07-09 |
KR20150034179A (ko) | 2015-04-02 |
TW201413863A (zh) | 2014-04-01 |
TWI524463B (zh) | 2016-03-01 |
KR101677864B1 (ko) | 2016-11-18 |
US9911637B2 (en) | 2018-03-06 |
JP2014007299A (ja) | 2014-01-16 |
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