WO2009057710A1 - 基板保持部材、基板接合装置、積層基板製造装置、基板接合方法、積層基板製造方法および積層型半導体装置製造方法 - Google Patents

基板保持部材、基板接合装置、積層基板製造装置、基板接合方法、積層基板製造方法および積層型半導体装置製造方法 Download PDF

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Publication number
WO2009057710A1
WO2009057710A1 PCT/JP2008/069793 JP2008069793W WO2009057710A1 WO 2009057710 A1 WO2009057710 A1 WO 2009057710A1 JP 2008069793 W JP2008069793 W JP 2008069793W WO 2009057710 A1 WO2009057710 A1 WO 2009057710A1
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WO
WIPO (PCT)
Prior art keywords
substrate
manufacturing multilayer
holding member
substrates
bonding
Prior art date
Application number
PCT/JP2008/069793
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English (en)
French (fr)
Inventor
Hidehiro Maeda
Satoshi Katagiri
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to KR1020107008583A priority Critical patent/KR101669045B1/ko
Priority to CN2008801144385A priority patent/CN101874288B/zh
Priority to JP2009539112A priority patent/JP5402640B2/ja
Publication of WO2009057710A1 publication Critical patent/WO2009057710A1/ja
Priority to US12/769,218 priority patent/US9015930B2/en
Priority to US13/761,348 priority patent/US10714351B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53196—Means to apply magnetic force directly to position or hold work part

Abstract

　永久磁石の吸引力により接合基板を挟む基板保持部材を用いて基板を接合する。 　位置合わせして積層された一対の基板を保持する基板保持部材であって、一対の基板の一方を保持する第１保持部材と、第１保持部材に連結された複数の被結合部材と、一方に対向させて一対の基板の他方を保持する第２保持部材と、被結合部材に作用する吸着力を有して、被結合部材の位置に対応して第２保持部材に連結された複数の結合部材と、吸着力を、一対の基板が位置合わせされるまで規制する吸着規制部とを備える。
PCT/JP2008/069793 2007-10-30 2008-10-30 基板保持部材、基板接合装置、積層基板製造装置、基板接合方法、積層基板製造方法および積層型半導体装置製造方法 WO2009057710A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020107008583A KR101669045B1 (ko) 2007-10-30 2008-10-30 기판 유지 부재, 기판 접합 장치, 적층 기판 제조 장치, 기판 접합 방법, 적층 기판 제조 방법 및 적층형 반도체 장치 제조 방법
CN2008801144385A CN101874288B (zh) 2007-10-30 2008-10-30 基板保持部件、基板接合装置、叠层基板制造装置、基板接合方法、叠层基板制造方法和叠层半导体装置制造方法
JP2009539112A JP5402640B2 (ja) 2007-10-30 2008-10-30 基板接合装置、基板接合方法、積層型半導体装置製造方法および基板保持部材
US12/769,218 US9015930B2 (en) 2007-10-30 2010-04-28 Substrate bonding apparatus
US13/761,348 US10714351B2 (en) 2007-10-30 2013-02-07 Multi-layered substrate manufacturing method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007281200 2007-10-30
JP2007-281200 2007-10-30
JP2008-199553 2008-08-01
JP2008-199554 2008-08-01
JP2008199553 2008-08-01
JP2008199554 2008-08-01

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/769,218 Continuation US9015930B2 (en) 2007-10-30 2010-04-28 Substrate bonding apparatus

Publications (1)

Publication Number Publication Date
WO2009057710A1 true WO2009057710A1 (ja) 2009-05-07

Family

ID=40591094

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069793 WO2009057710A1 (ja) 2007-10-30 2008-10-30 基板保持部材、基板接合装置、積層基板製造装置、基板接合方法、積層基板製造方法および積層型半導体装置製造方法

Country Status (6)

Country Link
US (2) US9015930B2 (ja)
JP (2) JP5402640B2 (ja)
KR (1) KR101669045B1 (ja)
CN (2) CN103258771A (ja)
TW (1) TWI471971B (ja)
WO (1) WO2009057710A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010267821A (ja) * 2009-05-14 2010-11-25 Nikon Corp ホルダユニット、基板貼り合わせ装置および静電装置
WO2011010452A1 (ja) * 2009-07-21 2011-01-27 株式会社ニコン 基板ホルダシステム、基板接合装置およびデバイスの製造方法
WO2011010460A1 (ja) * 2009-07-21 2011-01-27 株式会社ニコン 基板処理システム、基板ホルダ、基板ホルダ対、基板接合装置およびデバイスの製造方法
WO2011052627A1 (ja) * 2009-10-28 2011-05-05 三菱重工業株式会社 接合装置制御装置および多層接合方法
JP2011096949A (ja) * 2009-10-30 2011-05-12 Nikon Corp 加熱装置および積層電子デバイス装置の製造方法
WO2011074274A1 (ja) * 2009-12-18 2011-06-23 株式会社ニコン 基板ホルダ対、デバイスの製造方法、分離装置、基板の分離方法、基板ホルダおよび基板位置合わせ装置
JP2012079818A (ja) * 2010-09-30 2012-04-19 Nikon Corp 基板貼り合せ装置、加熱装置、積層半導体装置の製造方法及び積層半導体装置
JP2012089537A (ja) * 2010-10-15 2012-05-10 Nikon Corp ステージ装置、基板貼り合せ装置、積層半導体装置の製造方法及び積層半導体装置
WO2014002609A1 (ja) * 2012-06-25 2014-01-03 東京応化工業株式会社 重ね合わせ装置および重ね合わせ方法
KR20190018627A (ko) * 2016-06-16 2019-02-25 가부시키가이샤 니콘 적층 장치 및 적층 방법

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012160628A (ja) * 2011-02-02 2012-08-23 Sony Corp 基板の接合方法及び基板接合装置
JP6112016B2 (ja) * 2011-12-14 2017-04-12 株式会社ニコン 基板ホルダ及び基板貼り合わせ装置
US20130199831A1 (en) * 2012-02-06 2013-08-08 Christopher Morris Electromagnetic field assisted self-assembly with formation of electrical contacts
US9604319B2 (en) 2013-08-13 2017-03-28 The Boeing Company Method for processing curved sheets using magnetic clamping members
JP5538613B1 (ja) * 2013-11-13 2014-07-02 東京エレクトロン株式会社 接合装置及び接合システム
DE102014008030A1 (de) * 2014-05-28 2015-12-03 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Verfahren zur Herstellung einer elektrostatischen Haltevorrichtung
DE102014008031B4 (de) 2014-05-28 2020-06-25 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co. Elektrostatische Haltevorrichtung mit einer Keramik-Elektrode und Verfahren zur Herstellung einer solchen Haltevorrichtung
DE102014007903A1 (de) 2014-05-28 2015-12-03 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co. Elektrostatische Haltevorrichtung mit Noppen-Elektroden und Verfahren zu deren Herstellung
DE102014008029B4 (de) 2014-05-28 2023-05-17 Asml Netherlands B.V. Elektrostatische Haltevorrichtung mit einer Elektroden-Trägerscheibe und Verfahren zur Herstellung der Haltevorrichtung
JP6596288B2 (ja) * 2014-11-25 2019-10-23 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
JP6345605B2 (ja) * 2015-01-16 2018-06-20 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
US10847571B2 (en) 2015-01-23 2020-11-24 Vuereal Inc. Micro device integration into system substrate
US10700120B2 (en) 2015-01-23 2020-06-30 Vuereal Inc. Micro device integration into system substrate
CN107851586B (zh) 2015-01-23 2021-07-06 维耶尔公司 到受体衬底的选择性微型器件转移
US11183401B2 (en) * 2015-05-15 2021-11-23 Suss Microtec Lithography Gmbh System and related techniques for handling aligned substrate pairs
US10192771B2 (en) * 2015-09-29 2019-01-29 SCREEN Holdings Co., Ltd. Substrate holding/rotating device, substrate processing apparatus including the same, and substrate processing method
US20170215280A1 (en) * 2016-01-21 2017-07-27 Vuereal Inc. Selective transfer of micro devices
US10126278B2 (en) * 2016-03-04 2018-11-13 Ldetek Inc. Thermal stress resistant micro-plasma emission detector unit
CN106842640A (zh) * 2016-12-12 2017-06-13 合肥瑞硕科技有限公司 一种真空贴合治具
KR102434438B1 (ko) * 2017-09-07 2022-08-19 삼성전자주식회사 스택 보우트 장치
WO2019144228A1 (en) 2018-01-23 2019-08-01 Ldetek Inc. Valve assembly for a gas chromatograph
US10755955B2 (en) * 2018-02-12 2020-08-25 Applied Materials, Inc. Substrate transfer mechanism to reduce back-side substrate contact
KR102471274B1 (ko) 2018-02-13 2022-11-28 삼성전자주식회사 리플로우를 위한 스택 툴 및 이를 포함하는 리플로우 장치
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EP3709342A1 (en) * 2019-03-12 2020-09-16 Infineon Technologies AG Arrangement and method for joining at least two joining members using a foil on a carrier element interposed between the upper one of the joining members and a pressure exerting part
JP6817648B1 (ja) * 2019-09-20 2021-01-20 上野精機株式会社 電子部品の処理装置
JP2023502250A (ja) * 2019-11-26 2023-01-23 ラム リサーチ コーポレーション 基板処理ツール用のキャリアリングから台座へのキネマティックマウント
CN111312606B (zh) * 2019-11-29 2023-06-02 尚越光电科技股份有限公司 一种安全可靠的柔性cigs太阳能组件耐高压测试设备
JP7370920B2 (ja) * 2020-03-31 2023-10-30 住友重機械工業株式会社 ステージ装置
TWI809408B (zh) * 2021-06-01 2023-07-21 國立屏東科技大學 加熱輔助覆晶接合裝置
US20230280218A1 (en) * 2022-03-01 2023-09-07 Asmpt Singapore Pte. Ltd. Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0996822A (ja) * 1995-09-29 1997-04-08 Toshiba Corp 基板接合装置
JPH11271782A (ja) * 1998-03-18 1999-10-08 Seiko Epson Corp 基板接合装置、基板接合方法、および液晶装置の製造方法
JP2003332403A (ja) * 2002-05-10 2003-11-21 Seiko Epson Corp 基板保持装置、基板貼り合わせ装置、電気光学装置の製造方法、及び電子機器
JP2004337928A (ja) * 2003-05-15 2004-12-02 Ayumi Kogyo Kk 基板接合装置および基板接合方法
JP2005339706A (ja) * 2004-05-28 2005-12-08 Tsubaki Seiko:Kk 基板接合装置、基板接合方法および記録ディスク製造方法
JP2007005335A (ja) * 2005-06-21 2007-01-11 Matsushita Electric Ind Co Ltd 基板接合方法および基板接合装置
JP2007005577A (ja) * 2005-06-24 2007-01-11 Matsushita Electric Ind Co Ltd 押圧装置および押圧方法
JP2007088241A (ja) * 2005-09-22 2007-04-05 Matsushita Electric Ind Co Ltd 押圧装置および押圧方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2899130B2 (ja) * 1991-05-09 1999-06-02 日立テクノエンジニアリング株式会社 高真空ホットプレス
US5370301A (en) * 1994-01-04 1994-12-06 Texas Instruments Incorporated Apparatus and method for flip-chip bonding
JPH1140224A (ja) * 1997-07-11 1999-02-12 Jsr Corp 異方導電性シート
US6274508B1 (en) * 1999-02-05 2001-08-14 Alien Technology Corporation Apparatuses and methods used in forming assemblies
US6299713B1 (en) * 1999-07-15 2001-10-09 L. M. Bejtlich And Associates, Llc Optical radiation conducting zones and associated bonding and alignment systems
US6465084B1 (en) * 2001-04-12 2002-10-15 International Business Machines Corporation Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
AU2002351291A1 (en) * 2001-12-06 2003-06-23 Nanostream, Inc. Adhesiveless microfluidic device fabrication
US7244326B2 (en) * 2003-05-16 2007-07-17 Alien Technology Corporation Transfer assembly for manufacturing electronic devices
US6892769B2 (en) * 2003-06-30 2005-05-17 Lg.Philips Lcd Co., Ltd. Substrate bonding apparatus for liquid crystal display device panel
JP4626160B2 (ja) * 2004-03-04 2011-02-02 株式会社ニコン ウェハ重ね合わせ方法及びウェハ重ね合わせ装置
JP2006332563A (ja) 2005-05-30 2006-12-07 Nikon Corp ウェハ搬送装置、ウェハ積層体搬送装置及び積層型半導体装置製造方法
JP4852891B2 (ja) * 2005-05-31 2012-01-11 株式会社ニコン ウェハホルダ、ウェハ積層方法及び積層型半導体装置製造方法
US20070055621A1 (en) * 2005-09-01 2007-03-08 First Advantage Corporation Automated method and system for predicting and/or verifying income
US7926176B2 (en) * 2005-10-19 2011-04-19 General Electric Company Methods for magnetically directed self assembly
WO2007062268A2 (en) * 2005-11-28 2007-05-31 University Of Florida Research Foundation, Inc. Method and structure for magnetically-directed, self-assembly of three-dimensional structures
JP5098165B2 (ja) 2005-12-08 2012-12-12 株式会社ニコン ウェハの接合方法、接合装置及び積層型半導体装置の製造方法
CN1996550A (zh) * 2005-12-28 2007-07-11 上海广电Nec液晶显示器有限公司 基板贴合方法
JP2007194532A (ja) * 2006-01-23 2007-08-02 Toray Ind Inc 光透過性電磁波シールドシートの製造方法、および光透過性電磁波シールドシート
TWI383936B (zh) 2006-02-01 2013-02-01 Olympus Corp 基板交換裝置、基板處理裝置及基板檢查裝置
BRPI0811452A2 (pt) * 2007-05-04 2014-10-21 Envirotech Pumpsystems Inc Carcaça de mancal de duas peças para uma bomba centrífuga.
KR20090057809A (ko) * 2007-12-03 2009-06-08 주식회사 에이디피엔지니어링 기판합착장치

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0996822A (ja) * 1995-09-29 1997-04-08 Toshiba Corp 基板接合装置
JPH11271782A (ja) * 1998-03-18 1999-10-08 Seiko Epson Corp 基板接合装置、基板接合方法、および液晶装置の製造方法
JP2003332403A (ja) * 2002-05-10 2003-11-21 Seiko Epson Corp 基板保持装置、基板貼り合わせ装置、電気光学装置の製造方法、及び電子機器
JP2004337928A (ja) * 2003-05-15 2004-12-02 Ayumi Kogyo Kk 基板接合装置および基板接合方法
JP2005339706A (ja) * 2004-05-28 2005-12-08 Tsubaki Seiko:Kk 基板接合装置、基板接合方法および記録ディスク製造方法
JP2007005335A (ja) * 2005-06-21 2007-01-11 Matsushita Electric Ind Co Ltd 基板接合方法および基板接合装置
JP2007005577A (ja) * 2005-06-24 2007-01-11 Matsushita Electric Ind Co Ltd 押圧装置および押圧方法
JP2007088241A (ja) * 2005-09-22 2007-04-05 Matsushita Electric Ind Co Ltd 押圧装置および押圧方法

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010267821A (ja) * 2009-05-14 2010-11-25 Nikon Corp ホルダユニット、基板貼り合わせ装置および静電装置
JPWO2011010452A1 (ja) * 2009-07-21 2012-12-27 株式会社ニコン 基板ホルダシステム、基板ホルダ、固定機構、基板接合装置およびデバイスの製造方法
CN102576689A (zh) * 2009-07-21 2012-07-11 株式会社尼康 基板处理系统、基板支架、基板支架对、基板接合装置及器件的制造方法
JP5810914B2 (ja) * 2009-07-21 2015-11-11 株式会社ニコン 基板ホルダシステム、基板ホルダ、基板接合装置およびデバイス製造方法
EP2458628A4 (en) * 2009-07-21 2016-12-21 Nikon Corp SUBSTRATE MOUNTING SYSTEM, SUBSTRATE CONNECTING DEVICE AND METHOD FOR MANUFACTURING THIS DEVICE
US9054140B2 (en) 2009-07-21 2015-06-09 Nikon Corporation Substrate holder system, substrate holder, fastening mechanism, substrate bonding apparatus and method for manufacturing devices
KR101746241B1 (ko) * 2009-07-21 2017-06-12 가부시키가이샤 니콘 기판처리 시스템, 기판홀더, 기판홀더쌍, 기판접합장치 및 디바이스의 제조방법
WO2011010460A1 (ja) * 2009-07-21 2011-01-27 株式会社ニコン 基板処理システム、基板ホルダ、基板ホルダ対、基板接合装置およびデバイスの製造方法
WO2011010452A1 (ja) * 2009-07-21 2011-01-27 株式会社ニコン 基板ホルダシステム、基板接合装置およびデバイスの製造方法
EP2458629A4 (en) * 2009-07-21 2017-04-12 Nikon Corporation Substrate processing system, substrate holder, substrate holder pair, substrate joining apparatus and device manufacturing method
CN102498559A (zh) * 2009-07-21 2012-06-13 株式会社尼康 基板保持架系统、基板接合装置以及器件的制造方法
CN102414784A (zh) * 2009-10-28 2012-04-11 三菱重工业株式会社 接合装置控制装置及多层接合方法
JP2011096781A (ja) * 2009-10-28 2011-05-12 Mitsubishi Heavy Ind Ltd 接合装置制御装置および多層接合方法
WO2011052627A1 (ja) * 2009-10-28 2011-05-05 三菱重工業株式会社 接合装置制御装置および多層接合方法
US9064910B2 (en) 2009-10-28 2015-06-23 Mitsubishi Heavy Industries, Ltd. Bonding unit control unit and multi-layer bonding method
JP2011096949A (ja) * 2009-10-30 2011-05-12 Nikon Corp 加熱装置および積層電子デバイス装置の製造方法
EP2515322A4 (en) * 2009-12-18 2017-03-01 Nikon Corporation Pair of substrate holders, method for manufacturing device, separation device, method for separating substrates, substrate holder, and device for positioning substrate
US20130008581A1 (en) * 2009-12-18 2013-01-10 Yuki Daisuke Pair of substrate holders, substrate holder, substrate bonding apparatus and method for manufacturing device
WO2011074274A1 (ja) * 2009-12-18 2011-06-23 株式会社ニコン 基板ホルダ対、デバイスの製造方法、分離装置、基板の分離方法、基板ホルダおよび基板位置合わせ装置
KR101860956B1 (ko) 2009-12-18 2018-05-24 가부시키가이샤 니콘 기판홀더쌍, 디바이스의 제조방법, 분리장치, 기판의 분리방법, 기판홀더 및 기판 위치맞춤 장치
JP2012079818A (ja) * 2010-09-30 2012-04-19 Nikon Corp 基板貼り合せ装置、加熱装置、積層半導体装置の製造方法及び積層半導体装置
JP2012089537A (ja) * 2010-10-15 2012-05-10 Nikon Corp ステージ装置、基板貼り合せ装置、積層半導体装置の製造方法及び積層半導体装置
KR20150034179A (ko) * 2012-06-25 2015-04-02 도오꾜오까고오교 가부시끼가이샤 중첩 장치 및 중첩 방법
WO2014002609A1 (ja) * 2012-06-25 2014-01-03 東京応化工業株式会社 重ね合わせ装置および重ね合わせ方法
KR101677864B1 (ko) 2012-06-25 2016-11-18 도오꾜오까고오교 가부시끼가이샤 중첩 장치 및 중첩 방법
US9911637B2 (en) 2012-06-25 2018-03-06 Tokyo Ohka Kogyo Co., Ltd. Overlapping device, and overlapping method
KR20190018627A (ko) * 2016-06-16 2019-02-25 가부시키가이샤 니콘 적층 장치 및 적층 방법
KR102478498B1 (ko) 2016-06-16 2022-12-19 가부시키가이샤 니콘 적층 장치 및 적층 방법

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