JP2014097567A5 - - Google Patents
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- Publication number
- JP2014097567A5 JP2014097567A5 JP2013226447A JP2013226447A JP2014097567A5 JP 2014097567 A5 JP2014097567 A5 JP 2014097567A5 JP 2013226447 A JP2013226447 A JP 2013226447A JP 2013226447 A JP2013226447 A JP 2013226447A JP 2014097567 A5 JP2014097567 A5 JP 2014097567A5
- Authority
- JP
- Japan
- Prior art keywords
- curing agent
- molecular weight
- amine
- chemical mechanical
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003795 chemical substances by application Substances 0.000 claims 30
- 238000005498 polishing Methods 0.000 claims 25
- 229920005862 polyol Polymers 0.000 claims 19
- 150000003077 polyols Chemical class 0.000 claims 19
- 239000000758 substrate Substances 0.000 claims 12
- 239000000126 substance Substances 0.000 claims 11
- 150000001412 amines Chemical class 0.000 claims 10
- 239000012948 isocyanate Substances 0.000 claims 9
- 150000002513 isocyanates Chemical class 0.000 claims 9
- 230000001588 bifunctional effect Effects 0.000 claims 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 3
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 3
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical group C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 claims 2
- VIOMIGLBMQVNLY-UHFFFAOYSA-N 4-[(4-amino-2-chloro-3,5-diethylphenyl)methyl]-3-chloro-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C(=C(CC)C(N)=C(CC)C=2)Cl)=C1Cl VIOMIGLBMQVNLY-UHFFFAOYSA-N 0.000 claims 2
- 150000004985 diamines Chemical class 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 230000003750 conditioning effect Effects 0.000 claims 1
- 150000002009 diols Chemical class 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/666,514 US9144880B2 (en) | 2012-11-01 | 2012-11-01 | Soft and conditionable chemical mechanical polishing pad |
| US13/666,514 | 2012-11-01 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014097567A JP2014097567A (ja) | 2014-05-29 |
| JP2014097567A5 true JP2014097567A5 (enExample) | 2016-12-01 |
| JP6177665B2 JP6177665B2 (ja) | 2017-08-09 |
Family
ID=50483296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013226447A Active JP6177665B2 (ja) | 2012-11-01 | 2013-10-31 | 軟質かつコンディショニング可能なケミカルメカニカル研磨パッド |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9144880B2 (enExample) |
| JP (1) | JP6177665B2 (enExample) |
| KR (1) | KR102117902B1 (enExample) |
| CN (1) | CN103802018B (enExample) |
| DE (1) | DE102013018258A1 (enExample) |
| FR (1) | FR2997331B1 (enExample) |
| TW (1) | TWI597355B (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9238295B2 (en) * | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical window polishing pad |
| US8980749B1 (en) * | 2013-10-24 | 2015-03-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing silicon wafers |
| US9216489B2 (en) * | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| US20150306731A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US9333620B2 (en) * | 2014-04-29 | 2016-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with clear endpoint detection window |
| US9259821B2 (en) * | 2014-06-25 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing layer formulation with conditioning tolerance |
| US20150375361A1 (en) * | 2014-06-25 | 2015-12-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
| US9586304B2 (en) * | 2014-12-19 | 2017-03-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled-expansion CMP PAD casting method |
| US10092998B2 (en) * | 2015-06-26 | 2018-10-09 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making composite polishing layer for chemical mechanical polishing pad |
| US9776300B2 (en) * | 2015-06-26 | 2017-10-03 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Chemical mechanical polishing pad and method of making same |
| KR102640690B1 (ko) * | 2015-09-25 | 2024-02-23 | 씨엠씨 머티리얼즈 엘엘씨 | 높은 탄성률 비를 갖는 폴리우레탄 화학 기계적 연마 패드 |
| US9484212B1 (en) | 2015-10-30 | 2016-11-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
| US10208154B2 (en) * | 2016-11-30 | 2019-02-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Formulations for chemical mechanical polishing pads and CMP pads made therewith |
| US20180281149A1 (en) | 2017-03-31 | 2018-10-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| CN107553313B (zh) * | 2017-08-31 | 2019-12-31 | 湖北鼎龙控股股份有限公司 | 一种抛光垫、聚氨酯抛光层及其制备方法 |
| US11179822B2 (en) | 2017-08-31 | 2021-11-23 | Hubei Dinghui Microelectronics Materials Co., Ltd | Polyurethane polishing layer, polishing pad comprising polishing layer, method for preparing polishing layer and method for planarizing material |
| US10464187B2 (en) | 2017-12-01 | 2019-11-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives |
| CN109015342B (zh) * | 2018-03-06 | 2020-08-25 | 湖北鼎汇微电子材料有限公司 | 一种化学机械抛光垫及其平坦化基材的方法 |
| TWI735101B (zh) * | 2018-12-26 | 2021-08-01 | 南韓商Ｓｋｃ索密思股份有限公司 | 用於研磨墊之組成物、研磨墊及用於製備其之方法 |
| US20210069860A1 (en) * | 2019-09-11 | 2021-03-11 | Applied Materials, Inc. | Compositions and Methods of Additive Manufacturing of Polishing Pads |
| US12006442B2 (en) | 2019-09-11 | 2024-06-11 | Applied Materials, Inc. | Additive manufacturing of polishing pads |
| EP3967452A1 (en) * | 2020-09-07 | 2022-03-16 | SKC Solmics Co., Ltd. | Polishing pad and method of fabricating semiconductor device using the same |
| CN113146488B (zh) * | 2021-05-18 | 2022-06-17 | 广东伟艺抛磨材料有限公司 | 一种水磨环保抛光轮及其制造方法 |
| KR102561824B1 (ko) * | 2021-06-02 | 2023-07-31 | 에스케이엔펄스 주식회사 | 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
| US20230390889A1 (en) * | 2022-06-02 | 2023-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cmp pad having polishing layer of low specific gravity |
| CN115431175B (zh) * | 2022-09-16 | 2024-03-22 | 湖北鼎汇微电子材料有限公司 | 一种自修整抛光垫及其制备方法和应用 |
| CN119734199A (zh) * | 2024-09-13 | 2025-04-01 | 湖北鼎汇微电子材料有限公司 | 抛光层，抛光垫及抛光方法 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5245790A (en) * | 1992-02-14 | 1993-09-21 | Lsi Logic Corporation | Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers |
| MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US6117000A (en) * | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
| JP3925041B2 (ja) | 2000-05-31 | 2007-06-06 | Ｊｓｒ株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| JP3826702B2 (ja) | 2000-10-24 | 2006-09-27 | Ｊｓｒ株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| KR100877390B1 (ko) | 2001-11-13 | 2009-01-07 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
| JP4039214B2 (ja) | 2002-11-05 | 2008-01-30 | Ｊｓｒ株式会社 | 研磨パッド |
| JP2005029617A (ja) * | 2003-07-08 | 2005-02-03 | Bridgestone Corp | 難燃性微細セル軟質ポリウレタンフォーム |
| US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US20040224622A1 (en) | 2003-04-15 | 2004-11-11 | Jsr Corporation | Polishing pad and production method thereof |
| US6943202B2 (en) * | 2003-07-29 | 2005-09-13 | Crompton Corporation | Radiation-curable polyurethane |
| US7074115B2 (en) | 2003-10-09 | 2006-07-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
| US20050171224A1 (en) * | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
| JP4475404B2 (ja) | 2004-10-14 | 2010-06-09 | Ｊｓｒ株式会社 | 研磨パッド |
| SG162794A1 (en) | 2005-07-15 | 2010-07-29 | Toyo Tire & Rubber Co | Layered sheets and processes for producing the same |
| WO2008029538A1 (en) | 2006-09-08 | 2008-03-13 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8257153B2 (en) * | 2007-01-15 | 2012-09-04 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and a method for manufacturing the same |
| JP4261586B2 (ja) * | 2007-01-15 | 2009-04-30 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
| US7569268B2 (en) * | 2007-01-29 | 2009-08-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| TWI444248B (zh) * | 2007-08-15 | 2014-07-11 | 羅門哈斯電子材料Ｃｍｐ控股公司 | 化學機械研磨方法 |
| US20090062414A1 (en) | 2007-08-28 | 2009-03-05 | David Picheng Huang | System and method for producing damping polyurethane CMP pads |
| US8052507B2 (en) | 2007-11-20 | 2011-11-08 | Praxair Technology, Inc. | Damping polyurethane CMP pads with microfillers |
| JP4593643B2 (ja) | 2008-03-12 | 2010-12-08 | 東洋ゴム工業株式会社 | 研磨パッド |
| WO2009131106A1 (ja) | 2008-04-25 | 2009-10-29 | トーヨーポリマー株式会社 | ポリウレタン発泡体及び研磨パッド |
| US20100035529A1 (en) * | 2008-08-05 | 2010-02-11 | Mary Jo Kulp | Chemical mechanical polishing pad |
| US8118644B2 (en) * | 2008-10-16 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having integral identification feature |
| JP5393434B2 (ja) | 2008-12-26 | 2014-01-22 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
| JP5276502B2 (ja) * | 2009-04-03 | 2013-08-28 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
| US8697239B2 (en) * | 2009-07-24 | 2014-04-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multi-functional polishing pad |
| US8551201B2 (en) | 2009-08-07 | 2013-10-08 | Praxair S.T. Technology, Inc. | Polyurethane composition for CMP pads and method of manufacturing same |
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
-
2012
- 2012-11-01 US US13/666,514 patent/US9144880B2/en active Active
-
2013
- 2013-10-30 DE DE102013018258.1A patent/DE102013018258A1/de active Pending
- 2013-10-31 JP JP2013226447A patent/JP6177665B2/ja active Active
- 2013-10-31 FR FR1360736A patent/FR2997331B1/fr active Active
- 2013-10-31 TW TW102139493A patent/TWI597355B/zh active
- 2013-11-01 CN CN201310757251.XA patent/CN103802018B/zh active Active
- 2013-11-01 KR KR1020130131973A patent/KR102117902B1/ko active Active
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