JP2015109437A5 - - Google Patents
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- Publication number
- JP2015109437A5 JP2015109437A5 JP2014216232A JP2014216232A JP2015109437A5 JP 2015109437 A5 JP2015109437 A5 JP 2015109437A5 JP 2014216232 A JP2014216232 A JP 2014216232A JP 2014216232 A JP2014216232 A JP 2014216232A JP 2015109437 A5 JP2015109437 A5 JP 2015109437A5
- Authority
- JP
- Japan
- Prior art keywords
- curing agent
- molecular weight
- polishing
- isocyanate
- amine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003795 chemical substances by application Substances 0.000 claims 19
- 238000005498 polishing Methods 0.000 claims 13
- 229920005862 polyol Polymers 0.000 claims 13
- 150000003077 polyols Chemical class 0.000 claims 13
- 238000000034 method Methods 0.000 claims 9
- 239000012948 isocyanate Substances 0.000 claims 8
- 150000002513 isocyanates Chemical class 0.000 claims 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 7
- 150000001412 amines Chemical class 0.000 claims 7
- 229910052710 silicon Inorganic materials 0.000 claims 7
- 239000010703 silicon Substances 0.000 claims 7
- 235000012431 wafers Nutrition 0.000 claims 7
- 230000001588 bifunctional effect Effects 0.000 claims 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 3
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical group C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 claims 2
- 150000004985 diamines Chemical class 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 2
- 239000004848 polyfunctional curative Substances 0.000 claims 2
- VIOMIGLBMQVNLY-UHFFFAOYSA-N 4-[(4-amino-2-chloro-3,5-diethylphenyl)methyl]-3-chloro-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C(=C(CC)C(N)=C(CC)C=2)Cl)=C1Cl VIOMIGLBMQVNLY-UHFFFAOYSA-N 0.000 claims 1
- HOSGXJWQVBHGLT-UHFFFAOYSA-N 6-hydroxy-3,4-dihydro-1h-quinolin-2-one Chemical group N1C(=O)CCC2=CC(O)=CC=C21 HOSGXJWQVBHGLT-UHFFFAOYSA-N 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 150000002009 diols Chemical class 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/062,060 US8980749B1 (en) | 2013-10-24 | 2013-10-24 | Method for chemical mechanical polishing silicon wafers |
| US14/062,060 | 2013-10-24 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015109437A JP2015109437A (ja) | 2015-06-11 |
| JP2015109437A5 true JP2015109437A5 (enExample) | 2017-11-24 |
| JP6463618B2 JP6463618B2 (ja) | 2019-02-06 |
Family
ID=52632216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014216232A Active JP6463618B2 (ja) | 2013-10-24 | 2014-10-23 | シリコンウェーハを化学機械研磨する方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8980749B1 (enExample) |
| JP (1) | JP6463618B2 (enExample) |
| KR (1) | KR102359116B1 (enExample) |
| CN (1) | CN104551977B (enExample) |
| DE (1) | DE102014015664A1 (enExample) |
| MY (1) | MY172804A (enExample) |
| SG (1) | SG10201406877WA (enExample) |
| TW (1) | TWI621166B (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9216489B2 (en) * | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| US20150306731A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US9314897B2 (en) * | 2014-04-29 | 2016-04-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| US9259821B2 (en) * | 2014-06-25 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing layer formulation with conditioning tolerance |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| CN107078048B (zh) | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US9484212B1 (en) * | 2015-10-30 | 2016-11-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| JP6697931B2 (ja) * | 2016-04-01 | 2020-05-27 | 富士紡ホールディングス株式会社 | 研磨パッド、研磨パッドの製造方法及び研磨方法 |
| US20180281149A1 (en) | 2017-03-31 | 2018-10-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| JP7113626B2 (ja) * | 2018-01-12 | 2022-08-05 | ニッタ・デュポン株式会社 | 研磨パッド |
| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
| CN110528287B (zh) * | 2019-08-08 | 2022-03-08 | 安徽安利材料科技股份有限公司 | 一种毛刷式高耐用化学机械抛光聚氨酯材料及其制备方法 |
| CN110977756B (zh) * | 2019-12-27 | 2021-09-07 | 万华化学集团电子材料有限公司 | 一种化学机械抛光垫的抛光层及其应用 |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN113214741B (zh) * | 2021-04-24 | 2022-03-11 | 深圳市撒比斯科技有限公司 | 一种高稳定的cmp抛光液 |
| CN118456278B (zh) * | 2024-07-10 | 2024-12-03 | 万华化学集团电子材料有限公司 | 终点检测窗口、化学机械抛光垫及其应用 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283515A (ja) | 1992-03-31 | 1993-10-29 | Nec Kansai Ltd | 半導体装置製造方法 |
| JP3055471B2 (ja) | 1996-10-03 | 2000-06-26 | 日本電気株式会社 | 半導体基板の製造方法及びその製造装置 |
| JPH11277408A (ja) | 1998-01-29 | 1999-10-12 | Shin Etsu Handotai Co Ltd | 半導体ウエーハの鏡面研磨用研磨布、鏡面研磨方法ならびに鏡面研磨装置 |
| GB2334205B (en) | 1998-02-12 | 2001-11-28 | Shinetsu Handotai Kk | Polishing method for semiconductor wafer and polishing pad used therein |
| DE60038948D1 (de) | 1999-08-31 | 2008-07-03 | Shinetsu Handotai Kk | Verfahren und vorrichtung zum polieren von halbleiterscheiben |
| US6189546B1 (en) | 1999-12-29 | 2001-02-20 | Memc Electronic Materials, Inc. | Polishing process for manufacturing dopant-striation-free polished silicon wafers |
| JP2002292556A (ja) | 2001-03-29 | 2002-10-08 | Sumitomo Osaka Cement Co Ltd | シリコンウエハ鏡面研磨用スラリー、砥石、パッド及び研磨液、並びにこれらを用いたシリコンウエハの鏡面研磨方法 |
| JP2003037089A (ja) * | 2001-07-26 | 2003-02-07 | Shin Etsu Handotai Co Ltd | ウェーハの研磨方法 |
| US6783436B1 (en) | 2003-04-29 | 2004-08-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with optimized grooves and method of forming same |
| US20050171224A1 (en) * | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
| KR100709392B1 (ko) * | 2005-07-20 | 2007-04-20 | 에스케이씨 주식회사 | 액상의 비닐계 모노머가 상호침투 가교된 형태를 갖는폴리우레탄 연마 패드 |
| JP5019417B2 (ja) * | 2006-06-22 | 2012-09-05 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法及び研磨パッド |
| US7371160B1 (en) * | 2006-12-21 | 2008-05-13 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Elastomer-modified chemical mechanical polishing pad |
| JP4986129B2 (ja) * | 2007-01-15 | 2012-07-25 | 東洋ゴム工業株式会社 | 研磨パッド |
| US8257153B2 (en) * | 2007-01-15 | 2012-09-04 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and a method for manufacturing the same |
| JP5297096B2 (ja) | 2007-10-03 | 2013-09-25 | 富士紡ホールディングス株式会社 | 研磨布 |
| JP5484145B2 (ja) * | 2010-03-24 | 2014-05-07 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5534907B2 (ja) * | 2010-03-31 | 2014-07-02 | 富士紡ホールディングス株式会社 | 研磨パッドおよび研磨パッドの製造方法 |
| CN102310366B (zh) * | 2010-07-08 | 2014-03-05 | 罗门哈斯电子材料Cmp控股股份有限公司 | 具有低缺陷整体窗的化学机械抛光垫 |
| US20120264303A1 (en) | 2011-04-15 | 2012-10-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing slurry, system and method |
| JPWO2013011921A1 (ja) * | 2011-07-15 | 2015-02-23 | 東レ株式会社 | 研磨パッド |
| US9144880B2 (en) * | 2012-11-01 | 2015-09-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad |
-
2013
- 2013-10-24 US US14/062,060 patent/US8980749B1/en active Active
-
2014
- 2014-10-23 MY MYPI2014703142A patent/MY172804A/en unknown
- 2014-10-23 JP JP2014216232A patent/JP6463618B2/ja active Active
- 2014-10-23 DE DE201410015664 patent/DE102014015664A1/de not_active Withdrawn
- 2014-10-23 SG SG10201406877WA patent/SG10201406877WA/en unknown
- 2014-10-24 KR KR1020140145146A patent/KR102359116B1/ko active Active
- 2014-10-24 TW TW103136757A patent/TWI621166B/zh active
- 2014-10-24 CN CN201410578822.8A patent/CN104551977B/zh active Active
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