JP7113626B2 - 研磨パッド - Google Patents
研磨パッド Download PDFInfo
- Publication number
- JP7113626B2 JP7113626B2 JP2018003472A JP2018003472A JP7113626B2 JP 7113626 B2 JP7113626 B2 JP 7113626B2 JP 2018003472 A JP2018003472 A JP 2018003472A JP 2018003472 A JP2018003472 A JP 2018003472A JP 7113626 B2 JP7113626 B2 JP 7113626B2
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- JP
- Japan
- Prior art keywords
- polishing
- polished
- polishing pad
- contact portion
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
0<R1≦r/2
R1<R2≦3*r/4
0<R1≦R0/2
第一非接触部位121が同心円C1上に配置されるため、上述のように、研磨パッド1の半径R0が被研磨物2の半径rよりも大きく被研磨物の直径以下であり、且つ、研磨パッド1はその外周縁の一部が被研磨物2の外周縁の一部と重なった状態で、被研磨物2を研磨するとき、第一非接触部位121が被研磨物2を通過することになる。
R1<R2≦3*R0/4
第二非接触部位122が同心円C2上に配置されるため、上述のように、研磨パッド1の
半径R0が被研磨物2の半径rよりも大きく被研磨物2の直径以下であり、且つ、研磨パッド1はその外周縁の一部が被研磨物2の外周縁の一部と重なった状態で、被研磨物2を研磨するとき、被研磨物2の内側(例えば、被研磨物2における半径rの1/2以内に広がる領域)における研磨パッド1との摺動距離を低減することができる。
p=k*ρ(P)*V(P)*t
V2(R2,θ2)={ω2 2L2 2+2(ω2-ω1)ω1*L2*R2*cosθ2+(ω2-ω1)2*R2}1/2
Claims (2)
- 研磨スラリーが供給され回転しながら被研磨物を研磨可能な研磨パッドであって、
前記被研磨物を研磨可能な研磨面を有する研磨層を備え、
前記研磨面は、前記被研磨物を研磨する際に回転するときの回転中心を中心とし且つ所望の長さの半径を有する同心円上に配置される凹部及び前記研磨層を貫通した貫通孔の少なくとも一方を有する非接触部を有し、
前記研磨パッドは、円形状或いは略円形状であり、
前記非接触部は、径が5mm以上研磨パッドの直径の13%以下であり、
前記研磨パッドの半径の長さをR0としたとき、前記同心円の半径R1は以下の数式を満たし、
前記非接触部の中心は、R0/2を半径とする仮想円よりも径外側に配置されず、
少なくとも一つの前記非接触部は、R0/2を半径とする仮想円上に配置されている、ことを特徴とする研磨パッド。
0<R1≦R0/2 - 前記凹部及び前記研磨層を貫通した貫通孔の少なくとも一方は、互いに離間した状態で前記同心円上に複数配置される、請求項1に記載の研磨パッド。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018003472A JP7113626B2 (ja) | 2018-01-12 | 2018-01-12 | 研磨パッド |
PCT/JP2019/000668 WO2019139117A1 (ja) | 2018-01-12 | 2019-01-11 | 研磨パッド |
CN201980007751.7A CN111601681B (zh) | 2018-01-12 | 2019-01-11 | 研磨垫 |
US16/960,333 US20210053181A1 (en) | 2018-01-12 | 2019-01-11 | Polishing pad |
KR1020207018741A KR20200104867A (ko) | 2018-01-12 | 2019-01-11 | 연마 패드 |
DE112019000396.8T DE112019000396T5 (de) | 2018-01-12 | 2019-01-11 | Polierkissen |
TW108101172A TWI800589B (zh) | 2018-01-12 | 2019-01-11 | 研磨墊 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018003472A JP7113626B2 (ja) | 2018-01-12 | 2018-01-12 | 研磨パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019123031A JP2019123031A (ja) | 2019-07-25 |
JP7113626B2 true JP7113626B2 (ja) | 2022-08-05 |
Family
ID=67219738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018003472A Active JP7113626B2 (ja) | 2018-01-12 | 2018-01-12 | 研磨パッド |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210053181A1 (ja) |
JP (1) | JP7113626B2 (ja) |
KR (1) | KR20200104867A (ja) |
CN (1) | CN111601681B (ja) |
DE (1) | DE112019000396T5 (ja) |
TW (1) | TWI800589B (ja) |
WO (1) | WO2019139117A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1012657S1 (en) * | 2021-09-13 | 2024-01-30 | Mirka Ltd | Sanding disk |
CN114178003B (zh) * | 2021-11-08 | 2023-04-07 | 北京天地融创科技股份有限公司 | 卧式细磨机 |
Citations (12)
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JP2002324769A (ja) | 2001-04-25 | 2002-11-08 | Jsr Corp | 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 |
JP2003260657A (ja) | 2002-03-04 | 2003-09-16 | Rodel Nitta Co | 研磨布 |
JP2003300149A (ja) | 2002-02-07 | 2003-10-21 | Sony Corp | 研磨パッド、研磨装置および研磨方法 |
JP2004082270A (ja) | 2002-08-27 | 2004-03-18 | Fujitsu Ltd | 研磨パッド及びこの研磨パッドを用いた研磨装置、研磨方法 |
JP2005500174A (ja) | 2001-08-16 | 2005-01-06 | エスケーシー カンパニー,リミテッド | 孔および/またはグルーブを有する化学的機械的研磨パッド |
JP2006289539A (ja) | 2005-04-08 | 2006-10-26 | Mitsubishi Materials Techno Corp | 研磨機及び被研磨体の研磨方法 |
JP2006527483A (ja) | 2003-06-06 | 2006-11-30 | アプライド マテリアルズ インコーポレイテッド | 電気化学機械的研磨用の導電性研磨機器 |
JP2007290114A (ja) | 2006-03-27 | 2007-11-08 | Toshiba Corp | 研磨パッド、研磨方法及び研磨装置 |
US20080125019A1 (en) | 2006-11-28 | 2008-05-29 | Semiconductor Manufacturing | Polishing Pad and a Chemical-Mechanical Polishing Method |
JP2008221389A (ja) | 2007-03-12 | 2008-09-25 | Jsr Corp | 化学機械研磨パッドおよび化学機械研磨方法 |
JP2012151501A (ja) | 2000-08-31 | 2012-08-09 | Ebara Corp | 化学的機械研磨(cmp)ヘッド、装置及び方法 |
JP2013151058A (ja) | 2013-02-25 | 2013-08-08 | Nitta Haas Inc | 研磨パッド |
Family Cites Families (15)
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JPH1158218A (ja) * | 1997-08-12 | 1999-03-02 | Nikon Corp | 研磨パッド及び研磨装置 |
JPH11347935A (ja) | 1998-06-10 | 1999-12-21 | Ebara Corp | 研磨装置 |
TWI221105B (en) * | 2002-05-13 | 2004-09-21 | Jsr Corp | Polishing pad for semiconductor wafer, polishing laminate comprising the same for semiconductor wafer, and method for polishing semiconductor wafer |
US7442116B2 (en) * | 2003-11-04 | 2008-10-28 | Jsr Corporation | Chemical mechanical polishing pad |
EP1983558A4 (en) * | 2006-02-06 | 2011-08-10 | Toray Industries | ABRASIVE SKATE AND ABRASIVE DEVICE |
TW200736001A (en) * | 2006-03-27 | 2007-10-01 | Toshiba Kk | Polishing pad, method of polishing and polishing apparatus |
JP2008087082A (ja) * | 2006-09-29 | 2008-04-17 | Three M Innovative Properties Co | 吸塵用研磨具 |
JP2008258574A (ja) * | 2007-03-14 | 2008-10-23 | Jsr Corp | 化学機械研磨パッドおよび化学機械研磨方法 |
CN101497182B (zh) * | 2008-01-31 | 2013-05-08 | 智胜科技股份有限公司 | 研磨垫及其制造方法 |
WO2013002744A1 (en) * | 2011-06-30 | 2013-01-03 | Hoya Glass Disk (Thailand) Ltd. | Device and method for removing substrates for information recording medium |
JP5936921B2 (ja) * | 2012-05-31 | 2016-06-22 | 富士紡ホールディングス株式会社 | 研磨パッド |
US9440326B2 (en) * | 2012-07-23 | 2016-09-13 | Jh Rhodes Company, Inc. | Non-planar glass polishing pad and method of manufacture |
CN203282330U (zh) * | 2013-05-14 | 2013-11-13 | 中芯国际集成电路制造(北京)有限公司 | 化学机械研磨装置 |
US8980749B1 (en) * | 2013-10-24 | 2015-03-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing silicon wafers |
CN204295485U (zh) * | 2014-12-04 | 2015-04-29 | 朱晓飞 | 化学机械研磨垫 |
-
2018
- 2018-01-12 JP JP2018003472A patent/JP7113626B2/ja active Active
-
2019
- 2019-01-11 KR KR1020207018741A patent/KR20200104867A/ko not_active Application Discontinuation
- 2019-01-11 DE DE112019000396.8T patent/DE112019000396T5/de active Pending
- 2019-01-11 TW TW108101172A patent/TWI800589B/zh active
- 2019-01-11 US US16/960,333 patent/US20210053181A1/en active Pending
- 2019-01-11 WO PCT/JP2019/000668 patent/WO2019139117A1/ja active Application Filing
- 2019-01-11 CN CN201980007751.7A patent/CN111601681B/zh active Active
Patent Citations (12)
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JP2012151501A (ja) | 2000-08-31 | 2012-08-09 | Ebara Corp | 化学的機械研磨(cmp)ヘッド、装置及び方法 |
JP2002324769A (ja) | 2001-04-25 | 2002-11-08 | Jsr Corp | 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 |
JP2005500174A (ja) | 2001-08-16 | 2005-01-06 | エスケーシー カンパニー,リミテッド | 孔および/またはグルーブを有する化学的機械的研磨パッド |
JP2003300149A (ja) | 2002-02-07 | 2003-10-21 | Sony Corp | 研磨パッド、研磨装置および研磨方法 |
JP2003260657A (ja) | 2002-03-04 | 2003-09-16 | Rodel Nitta Co | 研磨布 |
JP2004082270A (ja) | 2002-08-27 | 2004-03-18 | Fujitsu Ltd | 研磨パッド及びこの研磨パッドを用いた研磨装置、研磨方法 |
JP2006527483A (ja) | 2003-06-06 | 2006-11-30 | アプライド マテリアルズ インコーポレイテッド | 電気化学機械的研磨用の導電性研磨機器 |
JP2006289539A (ja) | 2005-04-08 | 2006-10-26 | Mitsubishi Materials Techno Corp | 研磨機及び被研磨体の研磨方法 |
JP2007290114A (ja) | 2006-03-27 | 2007-11-08 | Toshiba Corp | 研磨パッド、研磨方法及び研磨装置 |
US20080125019A1 (en) | 2006-11-28 | 2008-05-29 | Semiconductor Manufacturing | Polishing Pad and a Chemical-Mechanical Polishing Method |
JP2008221389A (ja) | 2007-03-12 | 2008-09-25 | Jsr Corp | 化学機械研磨パッドおよび化学機械研磨方法 |
JP2013151058A (ja) | 2013-02-25 | 2013-08-08 | Nitta Haas Inc | 研磨パッド |
Also Published As
Publication number | Publication date |
---|---|
JP2019123031A (ja) | 2019-07-25 |
CN111601681B (zh) | 2023-05-12 |
DE112019000396T5 (de) | 2020-09-24 |
TWI800589B (zh) | 2023-05-01 |
WO2019139117A1 (ja) | 2019-07-18 |
CN111601681A (zh) | 2020-08-28 |
US20210053181A1 (en) | 2021-02-25 |
TW201940285A (zh) | 2019-10-16 |
KR20200104867A (ko) | 2020-09-04 |
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