TWI800589B - 研磨墊 - Google Patents

研磨墊 Download PDF

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Publication number
TWI800589B
TWI800589B TW108101172A TW108101172A TWI800589B TW I800589 B TWI800589 B TW I800589B TW 108101172 A TW108101172 A TW 108101172A TW 108101172 A TW108101172 A TW 108101172A TW I800589 B TWI800589 B TW I800589B
Authority
TW
Taiwan
Prior art keywords
polishing pad
polishing
pad
Prior art date
Application number
TW108101172A
Other languages
English (en)
Other versions
TW201940285A (zh
Inventor
尾関晃
Original Assignee
日商霓塔杜邦股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商霓塔杜邦股份有限公司 filed Critical 日商霓塔杜邦股份有限公司
Publication of TW201940285A publication Critical patent/TW201940285A/zh
Application granted granted Critical
Publication of TWI800589B publication Critical patent/TWI800589B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW108101172A 2018-01-12 2019-01-11 研磨墊 TWI800589B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-003472 2018-01-12
JP2018003472A JP7113626B2 (ja) 2018-01-12 2018-01-12 研磨パッド

Publications (2)

Publication Number Publication Date
TW201940285A TW201940285A (zh) 2019-10-16
TWI800589B true TWI800589B (zh) 2023-05-01

Family

ID=67219738

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108101172A TWI800589B (zh) 2018-01-12 2019-01-11 研磨墊

Country Status (7)

Country Link
US (1) US20210053181A1 (zh)
JP (1) JP7113626B2 (zh)
KR (1) KR20200104867A (zh)
CN (1) CN111601681B (zh)
DE (1) DE112019000396T5 (zh)
TW (1) TWI800589B (zh)
WO (1) WO2019139117A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1012657S1 (en) * 2021-09-13 2024-01-30 Mirka Ltd Sanding disk
CN114178003B (zh) * 2021-11-08 2023-04-07 北京天地融创科技股份有限公司 卧式细磨机

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI221105B (en) * 2002-05-13 2004-09-21 Jsr Corp Polishing pad for semiconductor wafer, polishing laminate comprising the same for semiconductor wafer, and method for polishing semiconductor wafer
EP1529598A1 (en) * 2003-11-04 2005-05-11 JSR Corporation Chemical mechanical polishing pad
JP2006289539A (ja) * 2005-04-08 2006-10-26 Mitsubishi Materials Techno Corp 研磨機及び被研磨体の研磨方法
JP2008221389A (ja) * 2007-03-12 2008-09-25 Jsr Corp 化学機械研磨パッドおよび化学機械研磨方法
WO2008114805A1 (ja) * 2007-03-14 2008-09-25 Jsr Corporation 化学機械研磨パッドおよび化学機械研磨方法
JP2013151058A (ja) * 2013-02-25 2013-08-08 Nitta Haas Inc 研磨パッド
TW201535496A (zh) * 2013-10-24 2015-09-16 羅門哈斯電子材料Ｃｍｐ控股公司 化學機械硏磨矽晶圓之方法
JP5936921B2 (ja) * 2012-05-31 2016-06-22 富士紡ホールディングス株式会社 研磨パッド
US9440326B2 (en) * 2012-07-23 2016-09-13 Jh Rhodes Company, Inc. Non-planar glass polishing pad and method of manufacture

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1158218A (ja) * 1997-08-12 1999-03-02 Nikon Corp 研磨パッド及び研磨装置
JPH11347935A (ja) 1998-06-10 1999-12-21 Ebara Corp 研磨装置
TWI246448B (en) 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
JP3826728B2 (ja) 2001-04-25 2006-09-27 Ｊｓｒ株式会社 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
KR100646702B1 (ko) 2001-08-16 2006-11-17 에스케이씨 주식회사 홀 및/또는 그루브로 형성된 화학적 기계적 연마패드
JP3843933B2 (ja) 2002-02-07 2006-11-08 ソニー株式会社 研磨パッド、研磨装置および研磨方法
JP4103106B2 (ja) 2002-03-04 2008-06-18 ニッタ・ハース株式会社 研磨布
JP2004082270A (ja) 2002-08-27 2004-03-18 Fujitsu Ltd 研磨パッド及びこの研磨パッドを用いた研磨装置、研磨方法
KR20070104686A (ko) 2003-06-06 2007-10-26 어플라이드 머티어리얼스, 인코포레이티드 전기화학적 기계적 폴리싱을 위한 전도성 폴리싱 아티클
TW200736001A (en) * 2006-03-27 2007-10-01 Toshiba Kk Polishing pad, method of polishing and polishing apparatus
JP2007290114A (ja) 2006-03-27 2007-11-08 Toshiba Corp 研磨パッド、研磨方法及び研磨装置
CN100537149C (zh) 2006-11-28 2009-09-09 中芯国际集成电路制造(上海)有限公司 抛光垫以及化学机械抛光方法
CN101497182B (zh) * 2008-01-31 2013-05-08 智胜科技股份有限公司 研磨垫及其制造方法
WO2013002744A1 (en) * 2011-06-30 2013-01-03 Hoya Glass Disk (Thailand) Ltd. Device and method for removing substrates for information recording medium
CN203282330U (zh) * 2013-05-14 2013-11-13 中芯国际集成电路制造(北京)有限公司 化学机械研磨装置
CN204295485U (zh) * 2014-12-04 2015-04-29 朱晓飞 化学机械研磨垫

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI221105B (en) * 2002-05-13 2004-09-21 Jsr Corp Polishing pad for semiconductor wafer, polishing laminate comprising the same for semiconductor wafer, and method for polishing semiconductor wafer
EP1529598A1 (en) * 2003-11-04 2005-05-11 JSR Corporation Chemical mechanical polishing pad
JP2006289539A (ja) * 2005-04-08 2006-10-26 Mitsubishi Materials Techno Corp 研磨機及び被研磨体の研磨方法
JP2008221389A (ja) * 2007-03-12 2008-09-25 Jsr Corp 化学機械研磨パッドおよび化学機械研磨方法
WO2008114805A1 (ja) * 2007-03-14 2008-09-25 Jsr Corporation 化学機械研磨パッドおよび化学機械研磨方法
JP5936921B2 (ja) * 2012-05-31 2016-06-22 富士紡ホールディングス株式会社 研磨パッド
US9440326B2 (en) * 2012-07-23 2016-09-13 Jh Rhodes Company, Inc. Non-planar glass polishing pad and method of manufacture
JP2013151058A (ja) * 2013-02-25 2013-08-08 Nitta Haas Inc 研磨パッド
TW201535496A (zh) * 2013-10-24 2015-09-16 羅門哈斯電子材料Ｃｍｐ控股公司 化學機械硏磨矽晶圓之方法

Also Published As

Publication number Publication date
CN111601681A (zh) 2020-08-28
KR20200104867A (ko) 2020-09-04
WO2019139117A1 (ja) 2019-07-18
TW201940285A (zh) 2019-10-16
US20210053181A1 (en) 2021-02-25
CN111601681B (zh) 2023-05-12
DE112019000396T5 (de) 2020-09-24
JP7113626B2 (ja) 2022-08-05
JP2019123031A (ja) 2019-07-25

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