TWI800589B - 研磨墊 - Google Patents
研磨墊 Download PDFInfo
- Publication number
- TWI800589B TWI800589B TW108101172A TW108101172A TWI800589B TW I800589 B TWI800589 B TW I800589B TW 108101172 A TW108101172 A TW 108101172A TW 108101172 A TW108101172 A TW 108101172A TW I800589 B TWI800589 B TW I800589B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing pad
- polishing
- pad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-003472 | 2018-01-12 | ||
JP2018003472A JP7113626B2 (ja) | 2018-01-12 | 2018-01-12 | 研磨パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201940285A TW201940285A (zh) | 2019-10-16 |
TWI800589B true TWI800589B (zh) | 2023-05-01 |
Family
ID=67219738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108101172A TWI800589B (zh) | 2018-01-12 | 2019-01-11 | 研磨墊 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210053181A1 (zh) |
JP (1) | JP7113626B2 (zh) |
KR (1) | KR20200104867A (zh) |
CN (1) | CN111601681B (zh) |
DE (1) | DE112019000396T5 (zh) |
TW (1) | TWI800589B (zh) |
WO (1) | WO2019139117A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1012657S1 (en) * | 2021-09-13 | 2024-01-30 | Mirka Ltd | Sanding disk |
CN114178003B (zh) * | 2021-11-08 | 2023-04-07 | 北京天地融创科技股份有限公司 | 卧式细磨机 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI221105B (en) * | 2002-05-13 | 2004-09-21 | Jsr Corp | Polishing pad for semiconductor wafer, polishing laminate comprising the same for semiconductor wafer, and method for polishing semiconductor wafer |
EP1529598A1 (en) * | 2003-11-04 | 2005-05-11 | JSR Corporation | Chemical mechanical polishing pad |
JP2006289539A (ja) * | 2005-04-08 | 2006-10-26 | Mitsubishi Materials Techno Corp | 研磨機及び被研磨体の研磨方法 |
JP2008221389A (ja) * | 2007-03-12 | 2008-09-25 | Jsr Corp | 化学機械研磨パッドおよび化学機械研磨方法 |
WO2008114805A1 (ja) * | 2007-03-14 | 2008-09-25 | Jsr Corporation | 化学機械研磨パッドおよび化学機械研磨方法 |
JP2013151058A (ja) * | 2013-02-25 | 2013-08-08 | Nitta Haas Inc | 研磨パッド |
TW201535496A (zh) * | 2013-10-24 | 2015-09-16 | 羅門哈斯電子材料Cmp控股公司 | 化學機械硏磨矽晶圓之方法 |
JP5936921B2 (ja) * | 2012-05-31 | 2016-06-22 | 富士紡ホールディングス株式会社 | 研磨パッド |
US9440326B2 (en) * | 2012-07-23 | 2016-09-13 | Jh Rhodes Company, Inc. | Non-planar glass polishing pad and method of manufacture |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1158218A (ja) * | 1997-08-12 | 1999-03-02 | Nikon Corp | 研磨パッド及び研磨装置 |
JPH11347935A (ja) | 1998-06-10 | 1999-12-21 | Ebara Corp | 研磨装置 |
TWI246448B (en) | 2000-08-31 | 2006-01-01 | Multi Planar Technologies Inc | Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby |
JP3826728B2 (ja) | 2001-04-25 | 2006-09-27 | Jsr株式会社 | 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 |
KR100646702B1 (ko) | 2001-08-16 | 2006-11-17 | 에스케이씨 주식회사 | 홀 및/또는 그루브로 형성된 화학적 기계적 연마패드 |
JP3843933B2 (ja) | 2002-02-07 | 2006-11-08 | ソニー株式会社 | 研磨パッド、研磨装置および研磨方法 |
JP4103106B2 (ja) | 2002-03-04 | 2008-06-18 | ニッタ・ハース株式会社 | 研磨布 |
JP2004082270A (ja) | 2002-08-27 | 2004-03-18 | Fujitsu Ltd | 研磨パッド及びこの研磨パッドを用いた研磨装置、研磨方法 |
KR20070104686A (ko) | 2003-06-06 | 2007-10-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 전기화학적 기계적 폴리싱을 위한 전도성 폴리싱 아티클 |
TW200736001A (en) * | 2006-03-27 | 2007-10-01 | Toshiba Kk | Polishing pad, method of polishing and polishing apparatus |
JP2007290114A (ja) | 2006-03-27 | 2007-11-08 | Toshiba Corp | 研磨パッド、研磨方法及び研磨装置 |
CN100537149C (zh) | 2006-11-28 | 2009-09-09 | 中芯国际集成电路制造(上海)有限公司 | 抛光垫以及化学机械抛光方法 |
CN101497182B (zh) * | 2008-01-31 | 2013-05-08 | 智胜科技股份有限公司 | 研磨垫及其制造方法 |
WO2013002744A1 (en) * | 2011-06-30 | 2013-01-03 | Hoya Glass Disk (Thailand) Ltd. | Device and method for removing substrates for information recording medium |
CN203282330U (zh) * | 2013-05-14 | 2013-11-13 | 中芯国际集成电路制造(北京)有限公司 | 化学机械研磨装置 |
CN204295485U (zh) * | 2014-12-04 | 2015-04-29 | 朱晓飞 | 化学机械研磨垫 |
-
2018
- 2018-01-12 JP JP2018003472A patent/JP7113626B2/ja active Active
-
2019
- 2019-01-11 US US16/960,333 patent/US20210053181A1/en active Pending
- 2019-01-11 TW TW108101172A patent/TWI800589B/zh active
- 2019-01-11 DE DE112019000396.8T patent/DE112019000396T5/de active Pending
- 2019-01-11 CN CN201980007751.7A patent/CN111601681B/zh active Active
- 2019-01-11 WO PCT/JP2019/000668 patent/WO2019139117A1/ja active Application Filing
- 2019-01-11 KR KR1020207018741A patent/KR20200104867A/ko not_active Application Discontinuation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI221105B (en) * | 2002-05-13 | 2004-09-21 | Jsr Corp | Polishing pad for semiconductor wafer, polishing laminate comprising the same for semiconductor wafer, and method for polishing semiconductor wafer |
EP1529598A1 (en) * | 2003-11-04 | 2005-05-11 | JSR Corporation | Chemical mechanical polishing pad |
JP2006289539A (ja) * | 2005-04-08 | 2006-10-26 | Mitsubishi Materials Techno Corp | 研磨機及び被研磨体の研磨方法 |
JP2008221389A (ja) * | 2007-03-12 | 2008-09-25 | Jsr Corp | 化学機械研磨パッドおよび化学機械研磨方法 |
WO2008114805A1 (ja) * | 2007-03-14 | 2008-09-25 | Jsr Corporation | 化学機械研磨パッドおよび化学機械研磨方法 |
JP5936921B2 (ja) * | 2012-05-31 | 2016-06-22 | 富士紡ホールディングス株式会社 | 研磨パッド |
US9440326B2 (en) * | 2012-07-23 | 2016-09-13 | Jh Rhodes Company, Inc. | Non-planar glass polishing pad and method of manufacture |
JP2013151058A (ja) * | 2013-02-25 | 2013-08-08 | Nitta Haas Inc | 研磨パッド |
TW201535496A (zh) * | 2013-10-24 | 2015-09-16 | 羅門哈斯電子材料Cmp控股公司 | 化學機械硏磨矽晶圓之方法 |
Also Published As
Publication number | Publication date |
---|---|
CN111601681A (zh) | 2020-08-28 |
KR20200104867A (ko) | 2020-09-04 |
WO2019139117A1 (ja) | 2019-07-18 |
TW201940285A (zh) | 2019-10-16 |
US20210053181A1 (en) | 2021-02-25 |
CN111601681B (zh) | 2023-05-12 |
DE112019000396T5 (de) | 2020-09-24 |
JP7113626B2 (ja) | 2022-08-05 |
JP2019123031A (ja) | 2019-07-25 |
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