JP2014233835A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2014233835A5 JP2014233835A5 JP2014112282A JP2014112282A JP2014233835A5 JP 2014233835 A5 JP2014233835 A5 JP 2014233835A5 JP 2014112282 A JP2014112282 A JP 2014112282A JP 2014112282 A JP2014112282 A JP 2014112282A JP 2014233835 A5 JP2014233835 A5 JP 2014233835A5
- Authority
- JP
- Japan
- Prior art keywords
- stack
- layer
- chemical mechanical
- hard layer
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 26
- 239000010410 layer Substances 0.000 claims 23
- 239000000126 substance Substances 0.000 claims 12
- 239000003795 chemical substances by application Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 7
- 229920005862 polyol Polymers 0.000 claims 5
- 150000003077 polyols Chemical class 0.000 claims 5
- 239000012790 adhesive layer Substances 0.000 claims 4
- 238000004026 adhesive bonding Methods 0.000 claims 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 3
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 claims 2
- VIOMIGLBMQVNLY-UHFFFAOYSA-N 4-[(4-amino-2-chloro-3,5-diethylphenyl)methyl]-3-chloro-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C(=C(CC)C(N)=C(CC)C=2)Cl)=C1Cl VIOMIGLBMQVNLY-UHFFFAOYSA-N 0.000 claims 2
- 239000004831 Hot glue Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 150000001412 amines Chemical class 0.000 claims 2
- 230000001588 bifunctional effect Effects 0.000 claims 2
- 239000012948 isocyanate Substances 0.000 claims 2
- 150000002513 isocyanates Chemical class 0.000 claims 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 2
- HOSGXJWQVBHGLT-UHFFFAOYSA-N 6-hydroxy-3,4-dihydro-1h-quinolin-2-one Chemical group N1C(=O)CCC2=CC(O)=CC=C21 HOSGXJWQVBHGLT-UHFFFAOYSA-N 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 230000003750 conditioning effect Effects 0.000 claims 1
- 150000004985 diamines Chemical class 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- -1 polyethylene terephthalate Polymers 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/906,825 US9238296B2 (en) | 2013-05-31 | 2013-05-31 | Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer |
| US13/906,825 | 2013-05-31 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014233835A JP2014233835A (ja) | 2014-12-15 |
| JP2014233835A5 true JP2014233835A5 (enExample) | 2017-06-29 |
| JP6367611B2 JP6367611B2 (ja) | 2018-08-01 |
Family
ID=51168262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014112282A Active JP6367611B2 (ja) | 2013-05-31 | 2014-05-30 | 軟質かつコンディショニング可能な研磨層を有する多層化学機械研磨パッドスタック |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9238296B2 (enExample) |
| JP (1) | JP6367611B2 (enExample) |
| KR (1) | KR102208278B1 (enExample) |
| CN (1) | CN104209874B (enExample) |
| DE (1) | DE102014007002A1 (enExample) |
| FR (1) | FR3006220B1 (enExample) |
| TW (1) | TWI560070B (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI556910B (zh) * | 2013-10-01 | 2016-11-11 | 三芳化學工業股份有限公司 | 複合硏磨墊及其製造方法 |
| US9259820B2 (en) * | 2014-03-28 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with polishing layer and window |
| US9216489B2 (en) * | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| US9238294B2 (en) * | 2014-06-18 | 2016-01-19 | Nexplanar Corporation | Polishing pad having porogens with liquid filler |
| USD785339S1 (en) * | 2014-10-23 | 2017-05-02 | Griot's Garage, Inc. | Hand applicator buffing pad |
| US20160144477A1 (en) * | 2014-11-21 | 2016-05-26 | Diane Scott | Coated compressive subpad for chemical mechanical polishing |
| US9481070B2 (en) * | 2014-12-19 | 2016-11-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High-stability polyurethane polishing pad |
| KR102640690B1 (ko) * | 2015-09-25 | 2024-02-23 | 씨엠씨 머티리얼즈 엘엘씨 | 높은 탄성률 비를 갖는 폴리우레탄 화학 기계적 연마 패드 |
| US9484212B1 (en) * | 2015-10-30 | 2016-11-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
| US20180085888A1 (en) * | 2016-09-29 | 2018-03-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads having a consistent pad surface microtexture |
| CN108453970A (zh) * | 2018-03-27 | 2018-08-28 | 成都时代立夫科技有限公司 | 一种化学机械抛光垫的制造方法及其产品和模具 |
| KR102526513B1 (ko) * | 2021-05-26 | 2023-04-26 | 에스케이엔펄스 주식회사 | 연마패드 접착필름, 이를 포함하는 연마패드 적층체 및 웨이퍼의 연마방법 |
| KR102572960B1 (ko) * | 2021-06-10 | 2023-09-01 | 에프엔에스테크 주식회사 | 복수의 패턴 구조체를 포함하는 연마 패드 |
| CN116890492A (zh) * | 2023-07-10 | 2023-10-17 | 安徽禾臣新材料有限公司 | 一种防褶皱断裂的复合型阻尼布及其生产工艺 |
| CN119795025B (zh) * | 2024-10-31 | 2025-11-04 | 比亚迪股份有限公司 | 复合抛光层、抛光垫及其制备方法 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5257478A (en) | 1990-03-22 | 1993-11-02 | Rodel, Inc. | Apparatus for interlayer planarization of semiconductor material |
| US5212910A (en) | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
| US5287663A (en) | 1992-01-21 | 1994-02-22 | National Semiconductor Corporation | Polishing pad and method for polishing semiconductor wafers |
| US5245790A (en) * | 1992-02-14 | 1993-09-21 | Lsi Logic Corporation | Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers |
| US6069080A (en) | 1992-08-19 | 2000-05-30 | Rodel Holdings, Inc. | Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
| MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US5489233A (en) | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
| JPH08216033A (ja) * | 1995-02-16 | 1996-08-27 | Fuji Photo Film Co Ltd | 研磨テープ |
| EP0779655A3 (en) | 1995-12-14 | 1997-07-16 | International Business Machines Corporation | A method of chemically-mechanically polishing an electronic component |
| US5692950A (en) | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| IT1302496B1 (it) * | 1998-09-14 | 2000-09-05 | Sixton Holding Sa | Schiuma poliuretanica rigida. |
| US6095902A (en) * | 1998-09-23 | 2000-08-01 | Rodel Holdings, Inc. | Polyether-polyester polyurethane polishing pads and related methods |
| US6524164B1 (en) | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
| JP3925041B2 (ja) | 2000-05-31 | 2007-06-06 | Ｊｓｒ株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| JP3826702B2 (ja) | 2000-10-24 | 2006-09-27 | Ｊｓｒ株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| KR100877390B1 (ko) | 2001-11-13 | 2009-01-07 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
| JP4039214B2 (ja) | 2002-11-05 | 2008-01-30 | Ｊｓｒ株式会社 | 研磨パッド |
| US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US20040192178A1 (en) | 2003-03-28 | 2004-09-30 | Barak Yardeni | Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads |
| US20040224622A1 (en) | 2003-04-15 | 2004-11-11 | Jsr Corporation | Polishing pad and production method thereof |
| US7101275B2 (en) | 2003-09-26 | 2006-09-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Resilient polishing pad for chemical mechanical polishing |
| US8066552B2 (en) | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
| US7074115B2 (en) | 2003-10-09 | 2006-07-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
| US20050171224A1 (en) * | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
| US7132033B2 (en) | 2004-02-27 | 2006-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a layered polishing pad |
| JP4475404B2 (ja) | 2004-10-14 | 2010-06-09 | Ｊｓｒ株式会社 | 研磨パッド |
| SG162794A1 (en) | 2005-07-15 | 2010-07-29 | Toyo Tire & Rubber Co | Layered sheets and processes for producing the same |
| KR100709392B1 (ko) * | 2005-07-20 | 2007-04-20 | 에스케이씨 주식회사 | 액상의 비닐계 모노머가 상호침투 가교된 형태를 갖는폴리우레탄 연마 패드 |
| WO2008029538A1 (en) | 2006-09-08 | 2008-03-13 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| US8257153B2 (en) * | 2007-01-15 | 2012-09-04 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and a method for manufacturing the same |
| US20090062414A1 (en) | 2007-08-28 | 2009-03-05 | David Picheng Huang | System and method for producing damping polyurethane CMP pads |
| US8052507B2 (en) | 2007-11-20 | 2011-11-08 | Praxair Technology, Inc. | Damping polyurethane CMP pads with microfillers |
| JP4593643B2 (ja) | 2008-03-12 | 2010-12-08 | 東洋ゴム工業株式会社 | 研磨パッド |
| WO2009131106A1 (ja) | 2008-04-25 | 2009-10-29 | トーヨーポリマー株式会社 | ポリウレタン発泡体及び研磨パッド |
| JP5393434B2 (ja) | 2008-12-26 | 2014-01-22 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
| TWM367052U (en) * | 2009-04-24 | 2009-10-21 | Bestac Advanced Material Co Ltd | Polishing pad and polishing device |
| US8157614B2 (en) | 2009-04-30 | 2012-04-17 | Applied Materials, Inc. | Method of making and apparatus having windowless polishing pad and protected fiber |
| US8551201B2 (en) | 2009-08-07 | 2013-10-08 | Praxair S.T. Technology, Inc. | Polyurethane composition for CMP pads and method of manufacturing same |
| US9156124B2 (en) * | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| JP5687118B2 (ja) * | 2011-04-15 | 2015-03-18 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| US8512427B2 (en) * | 2011-09-29 | 2013-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Acrylate polyurethane chemical mechanical polishing layer |
| JP2013082035A (ja) * | 2011-10-11 | 2013-05-09 | Toyo Tire & Rubber Co Ltd | 積層研磨パッド及びその製造方法 |
| US9233451B2 (en) * | 2013-05-31 | 2016-01-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad stack |
-
2013
- 2013-05-31 US US13/906,825 patent/US9238296B2/en active Active
-
2014
- 2014-05-13 DE DE102014007002.6A patent/DE102014007002A1/de active Pending
- 2014-05-28 KR KR1020140064225A patent/KR102208278B1/ko active Active
- 2014-05-30 FR FR1454945A patent/FR3006220B1/fr active Active
- 2014-05-30 CN CN201410238701.9A patent/CN104209874B/zh active Active
- 2014-05-30 JP JP2014112282A patent/JP6367611B2/ja active Active
- 2014-05-30 TW TW103118946A patent/TWI560070B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014233835A5 (enExample) | ||
| JP2014233833A5 (enExample) | ||
| JP2014233834A5 (enExample) | ||
| JP2014097567A5 (enExample) | ||
| JP2015109437A5 (enExample) | ||
| CN103492124B (zh) | 层叠研磨垫用热熔粘接剂片、及带有层叠研磨垫用粘接剂层的支持层 | |
| JP2015047691A5 (enExample) | ||
| JP5021669B2 (ja) | 研磨パッド用クッションおよびそれを用いた研磨パッド | |
| JP5193595B2 (ja) | 高分子材料、それから得られる発泡体及びこれらを用いた研磨パッド | |
| JP6518680B2 (ja) | 研磨層用非多孔性成形体，研磨パッド及び研磨方法 | |
| JP3788729B2 (ja) | 研磨パッド | |
| US9227296B2 (en) | Polishing pad | |
| JP2015189003A5 (enExample) | ||
| JP5985287B2 (ja) | 積層研磨パッド及びその製造方法 | |
| KR101633766B1 (ko) | 적층 연마 패드 및 그 제조 방법 | |
| KR101641152B1 (ko) | 적층 연마 패드의 제조 방법 | |
| TW200908119A (en) | Polishing pad for metallic film and polishing method of metallic film using the same | |
| JP2013082035A (ja) | 積層研磨パッド及びその製造方法 | |
| CN101130232A (zh) | 研磨垫及其制造方法 | |
| JP6584261B2 (ja) | 被研磨物保持材及び被研磨物保持具 | |
| JP2012004335A5 (enExample) | ||
| WO2020255744A1 (ja) | 研磨パッド、研磨パッドの製造方法及び研磨方法 | |
| JP2017052078A5 (enExample) | ||
| KR102538440B1 (ko) | 연마 시스템, 연마 패드 및 반도체 소자의 제조방법 | |
| JP7513397B2 (ja) | 研磨パッド |