JP2014233833A5 - - Google Patents
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- Publication number
- JP2014233833A5 JP2014233833A5 JP2014112280A JP2014112280A JP2014233833A5 JP 2014233833 A5 JP2014233833 A5 JP 2014233833A5 JP 2014112280 A JP2014112280 A JP 2014112280A JP 2014112280 A JP2014112280 A JP 2014112280A JP 2014233833 A5 JP2014233833 A5 JP 2014233833A5
- Authority
- JP
- Japan
- Prior art keywords
- chemical mechanical
- polishing pad
- curing agent
- mechanical polishing
- pad stack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 30
- 239000003795 chemical substances by application Substances 0.000 claims 16
- 239000000126 substance Substances 0.000 claims 16
- 238000001514 detection method Methods 0.000 claims 6
- 229920005862 polyol Polymers 0.000 claims 6
- 150000003077 polyols Chemical class 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive effect Effects 0.000 claims 5
- 239000012948 isocyanate Substances 0.000 claims 5
- 150000002513 isocyanates Chemical class 0.000 claims 5
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 claims 4
- VIOMIGLBMQVNLY-UHFFFAOYSA-N 4-[(4-amino-2-chloro-3,5-diethylphenyl)methyl]-3-chloro-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C(=C(CC)C(N)=C(CC)C=2)Cl)=C1Cl VIOMIGLBMQVNLY-UHFFFAOYSA-N 0.000 claims 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 4
- 239000004831 Hot glue Substances 0.000 claims 3
- 150000001412 amines Chemical class 0.000 claims 3
- 230000001588 bifunctional effect Effects 0.000 claims 3
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 3
- HOSGXJWQVBHGLT-UHFFFAOYSA-N 6-hydroxy-3,4-dihydro-1h-quinolin-2-one Chemical group N1C(=O)CCC2=CC(O)=CC=C21 HOSGXJWQVBHGLT-UHFFFAOYSA-N 0.000 claims 2
- 150000004985 diamines Chemical class 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims 2
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 claims 2
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 239000012943 hotmelt Substances 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- -1 polyethylene terephthalate Polymers 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/906,715 | 2013-05-31 | ||
| US13/906,715 US9233451B2 (en) | 2013-05-31 | 2013-05-31 | Soft and conditionable chemical mechanical polishing pad stack |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014233833A JP2014233833A (ja) | 2014-12-15 |
| JP2014233833A5 true JP2014233833A5 (enExample) | 2017-06-29 |
| JP6334266B2 JP6334266B2 (ja) | 2018-05-30 |
Family
ID=51168260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014112280A Active JP6334266B2 (ja) | 2013-05-31 | 2014-05-30 | 軟質かつコンディショニング可能な化学機械研磨パッドスタック |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9233451B2 (enExample) |
| JP (1) | JP6334266B2 (enExample) |
| KR (1) | KR102191947B1 (enExample) |
| CN (1) | CN104209854B (enExample) |
| DE (1) | DE102014007024A1 (enExample) |
| FR (1) | FR3006218B1 (enExample) |
| TW (1) | TWI574793B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9238296B2 (en) * | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer |
| US9259820B2 (en) * | 2014-03-28 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with polishing layer and window |
| US9216489B2 (en) * | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| US10092998B2 (en) * | 2015-06-26 | 2018-10-09 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making composite polishing layer for chemical mechanical polishing pad |
| US9484212B1 (en) * | 2015-10-30 | 2016-11-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
| US20180345449A1 (en) * | 2017-06-06 | 2018-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
| US10464187B2 (en) * | 2017-12-01 | 2019-11-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives |
| EP3967452A1 (en) * | 2020-09-07 | 2022-03-16 | SKC Solmics Co., Ltd. | Polishing pad and method of fabricating semiconductor device using the same |
| EP4267342A4 (en) | 2020-12-22 | 2024-10-30 | CMC Materials LLC | Chemical-mechanical polishing subpad having porogens with polymeric shells |
| CN112757153B (zh) * | 2021-03-09 | 2022-07-12 | 万华化学集团电子材料有限公司 | 一种多结构体化学机械抛光垫、制造方法及其应用 |
| KR102594068B1 (ko) * | 2021-10-12 | 2023-10-24 | 에스케이엔펄스 주식회사 | 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
| CN116985031B (zh) * | 2023-03-27 | 2025-11-04 | 万华化学集团电子材料有限公司 | 一种化学机械抛光垫、制备方法及其应用 |
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| MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
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| JPH08216033A (ja) * | 1995-02-16 | 1996-08-27 | Fuji Photo Film Co Ltd | 研磨テープ |
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| US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US20040192178A1 (en) | 2003-03-28 | 2004-09-30 | Barak Yardeni | Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads |
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| US7101275B2 (en) | 2003-09-26 | 2006-09-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Resilient polishing pad for chemical mechanical polishing |
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| US7074115B2 (en) | 2003-10-09 | 2006-07-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
| US6984163B2 (en) * | 2003-11-25 | 2006-01-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with high optical transmission window |
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| SG162794A1 (en) | 2005-07-15 | 2010-07-29 | Toyo Tire & Rubber Co | Layered sheets and processes for producing the same |
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| US20090062414A1 (en) | 2007-08-28 | 2009-03-05 | David Picheng Huang | System and method for producing damping polyurethane CMP pads |
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| JP5393434B2 (ja) | 2008-12-26 | 2014-01-22 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
| KR101186531B1 (ko) * | 2009-03-24 | 2012-10-08 | 차윤종 | 폴리우레탄 다공질체의 제조방법과 그 제조방법에 따른 폴리우레탄 다공질체 및 폴리우레탄 다공질체를 구비한 연마패드 |
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| JP5184448B2 (ja) * | 2009-06-23 | 2013-04-17 | 富士紡ホールディングス株式会社 | 研磨パッド、その製造方法および研磨加工方法 |
| US8697239B2 (en) * | 2009-07-24 | 2014-04-15 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multi-functional polishing pad |
| US8551201B2 (en) | 2009-08-07 | 2013-10-08 | Praxair S.T. Technology, Inc. | Polyurethane composition for CMP pads and method of manufacturing same |
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| JP2012214778A (ja) * | 2011-03-30 | 2012-11-08 | Asahi Glass Co Ltd | 軟質ポリウレタンフォームの製造方法およびシート |
| JP5858576B2 (ja) * | 2011-04-21 | 2016-02-10 | 東洋ゴム工業株式会社 | 積層研磨パッド用ホットメルト接着剤シート、及び積層研磨パッド用接着剤層付き支持層 |
| US8512427B2 (en) * | 2011-09-29 | 2013-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Acrylate polyurethane chemical mechanical polishing layer |
-
2013
- 2013-05-31 US US13/906,715 patent/US9233451B2/en active Active
-
2014
- 2014-05-13 DE DE102014007024.7A patent/DE102014007024A1/de not_active Withdrawn
- 2014-05-28 KR KR1020140064220A patent/KR102191947B1/ko active Active
- 2014-05-30 CN CN201410238719.9A patent/CN104209854B/zh active Active
- 2014-05-30 FR FR1454941A patent/FR3006218B1/fr not_active Expired - Fee Related
- 2014-05-30 JP JP2014112280A patent/JP6334266B2/ja active Active
- 2014-05-30 TW TW103118949A patent/TWI574793B/zh active
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