JP2011040737A5 - - Google Patents
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- Publication number
- JP2011040737A5 JP2011040737A5 JP2010165580A JP2010165580A JP2011040737A5 JP 2011040737 A5 JP2011040737 A5 JP 2011040737A5 JP 2010165580 A JP2010165580 A JP 2010165580A JP 2010165580 A JP2010165580 A JP 2010165580A JP 2011040737 A5 JP2011040737 A5 JP 2011040737A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- polytetramethylene ether
- polyamine
- polypropylene glycol
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 26
- 238000005498 polishing Methods 0.000 claims description 20
- 229920000768 polyamine Polymers 0.000 claims description 16
- 229920001451 polypropylene glycol Polymers 0.000 claims description 16
- 229920000909 polytetrahydrofuran Polymers 0.000 claims description 15
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 8
- 229920000642 polymer Polymers 0.000 claims description 8
- 229920005862 polyol Polymers 0.000 claims description 8
- 150000003077 polyols Chemical class 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 4
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 125000005442 diisocyanate group Chemical group 0.000 claims 2
- 229920002959 polymer blend Polymers 0.000 claims 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/460,809 | 2009-07-24 | ||
| US12/460,809 US8697239B2 (en) | 2009-07-24 | 2009-07-24 | Multi-functional polishing pad |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011040737A JP2011040737A (ja) | 2011-02-24 |
| JP2011040737A5 true JP2011040737A5 (enExample) | 2013-07-11 |
| JP5991503B2 JP5991503B2 (ja) | 2016-09-14 |
Family
ID=43384152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010165580A Active JP5991503B2 (ja) | 2009-07-24 | 2010-07-23 | 多官能研磨パッド |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8697239B2 (enExample) |
| JP (1) | JP5991503B2 (enExample) |
| KR (1) | KR101630464B1 (enExample) |
| CN (1) | CN101961854A (enExample) |
| DE (1) | DE102010031850A1 (enExample) |
| FR (1) | FR2948308B1 (enExample) |
| TW (1) | TWI480123B (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102869758B (zh) * | 2010-04-21 | 2014-11-19 | 宝洁公司 | 液体清洁和/或净化组合物 |
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| JP5945874B2 (ja) | 2011-10-18 | 2016-07-05 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| KR102100654B1 (ko) | 2012-04-02 | 2020-04-14 | 토마스 웨스트 인코포레이티드 | 폴리머 연마패드의 원심주조를 위한 방법 및 시스템 및 상기 방법으로 만들어진 연마패드 |
| US10722997B2 (en) | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
| US10022842B2 (en) | 2012-04-02 | 2018-07-17 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
| US9144880B2 (en) * | 2012-11-01 | 2015-09-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad |
| US9233451B2 (en) * | 2013-05-31 | 2016-01-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad stack |
| US9238295B2 (en) * | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical window polishing pad |
| US9102034B2 (en) | 2013-08-30 | 2015-08-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of chemical mechanical polishing a substrate |
| US20150059254A1 (en) * | 2013-09-04 | 2015-03-05 | Dow Global Technologies Llc | Polyurethane polishing pad |
| US9463550B2 (en) * | 2014-02-19 | 2016-10-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
| SG11201606734RA (en) * | 2014-02-20 | 2016-09-29 | Thomas West Inc | Method and systems to control optical transmissivity of a polish pad material |
| US20150306731A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US9259821B2 (en) | 2014-06-25 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing layer formulation with conditioning tolerance |
| US20150375361A1 (en) | 2014-06-25 | 2015-12-31 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
| FR3035251A1 (fr) * | 2015-04-17 | 2016-10-21 | Stmicroelectronics (Grenoble 2) Sas | Procede et dispositif de generation d'une representation multi-resolutions d'une image et application a la detection d'objet |
| CN108136563A (zh) * | 2015-07-30 | 2018-06-08 | Jh罗得股份有限公司 | 聚合磨光材料、包含聚合磨光材料的介质和系统及其形成和使用方法 |
| JP2017185563A (ja) * | 2016-04-01 | 2017-10-12 | 富士紡ホールディングス株式会社 | 研磨パッド |
| CN107646138B (zh) * | 2016-04-06 | 2020-11-06 | Kpx化工有限公司 | 研磨垫制造方法 |
| KR102518352B1 (ko) * | 2016-04-11 | 2023-04-05 | 삼성에스디아이 주식회사 | 이차 전지 |
| US10086494B2 (en) | 2016-09-13 | 2018-10-02 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High planarization efficiency chemical mechanical polishing pads and methods of making |
| US20180281149A1 (en) | 2017-03-31 | 2018-10-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US20180345449A1 (en) * | 2017-06-06 | 2018-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
| US10391606B2 (en) | 2017-06-06 | 2019-08-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
| CN108562470B (zh) * | 2018-04-09 | 2020-04-28 | 大连理工大学 | 一种钨镍铁合金金相制备方法 |
| KR102058877B1 (ko) * | 2018-04-20 | 2019-12-24 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
| US11717932B2 (en) * | 2018-12-14 | 2023-08-08 | Xia Tai Xin Semiconductor (Qing Dao) Ltd. | Polyurethane polishing pad and composition for manufacturing the same |
| US12122013B2 (en) * | 2019-10-23 | 2024-10-22 | Sk Enpulse Co., Ltd. | Composition for polishing pad and polishing pad |
| JP7733464B2 (ja) * | 2021-03-30 | 2025-09-03 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨パッドの製造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3980606A (en) * | 1975-02-24 | 1976-09-14 | The Firestone Tire & Rubber Company | Polyurethane elastomers having prolonged flex life and tires made therefrom |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US5648447A (en) * | 1995-12-22 | 1997-07-15 | Arco Chemical Technology, L.P. | Elastomeric polyurethanes with improved properties based on crystallizable polyols in combination with low monol polyoxpropylene polyols |
| JP3571334B2 (ja) * | 2002-05-20 | 2004-09-29 | 東洋紡績株式会社 | 研磨パッド |
| TW200530378A (en) * | 2003-03-11 | 2005-09-16 | Toyo Tire & Rubber Co | Polishing pad and semiconductor device manufacturing method |
| JP4849587B2 (ja) * | 2003-03-11 | 2012-01-11 | 東洋ゴム工業株式会社 | 研磨パッドおよび半導体デバイスの製造方法 |
| US6998166B2 (en) * | 2003-06-17 | 2006-02-14 | Cabot Microelectronics Corporation | Polishing pad with oriented pore structure |
| US7175915B2 (en) * | 2004-04-13 | 2007-02-13 | Universal Photonics | Method of producing polyurethane pads produced therewith |
| US7329174B2 (en) * | 2004-05-20 | 2008-02-12 | Jsr Corporation | Method of manufacturing chemical mechanical polishing pad |
| JP4475404B2 (ja) * | 2004-10-14 | 2010-06-09 | Ｊｓｒ株式会社 | 研磨パッド |
| US20060135724A1 (en) * | 2004-12-20 | 2006-06-22 | Lawrey Bruce D | Spandex having low heat-set temperature and materials for their production |
| TWI282344B (en) * | 2004-12-28 | 2007-06-11 | Ind Tech Res Inst | Elastomeric articles including aqueous aromatic polyurethane and method of fabricating the same |
| TWI372108B (en) * | 2005-04-06 | 2012-09-11 | Rohm & Haas Elect Mat | Method for forming a porous reaction injection molded chemical mechanical polishing pad |
| US7169030B1 (en) * | 2006-05-25 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US7445847B2 (en) * | 2006-05-25 | 2008-11-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US7371160B1 (en) * | 2006-12-21 | 2008-05-13 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Elastomer-modified chemical mechanical polishing pad |
| JP5044763B2 (ja) * | 2007-08-01 | 2012-10-10 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP2009090397A (ja) * | 2007-10-05 | 2009-04-30 | Nitta Haas Inc | 研磨パッド |
-
2009
- 2009-07-24 US US12/460,809 patent/US8697239B2/en active Active
-
2010
- 2010-07-15 TW TW099123239A patent/TWI480123B/zh active
- 2010-07-22 DE DE102010031850A patent/DE102010031850A1/de active Pending
- 2010-07-23 KR KR1020100071273A patent/KR101630464B1/ko active Active
- 2010-07-23 CN CN2010102407758A patent/CN101961854A/zh active Pending
- 2010-07-23 JP JP2010165580A patent/JP5991503B2/ja active Active
- 2010-07-26 FR FR1056116A patent/FR2948308B1/fr active Active
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