JP2005136400A5 - - Google Patents
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- Publication number
- JP2005136400A5 JP2005136400A5 JP2004295816A JP2004295816A JP2005136400A5 JP 2005136400 A5 JP2005136400 A5 JP 2005136400A5 JP 2004295816 A JP2004295816 A JP 2004295816A JP 2004295816 A JP2004295816 A JP 2004295816A JP 2005136400 A5 JP2005136400 A5 JP 2005136400A5
- Authority
- JP
- Japan
- Prior art keywords
- rad
- sec
- polishing pad
- semiconductor substrate
- porosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000002861 polymer material Substances 0.000 claims description 6
- 239000007795 chemical reaction product Substances 0.000 claims description 5
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 229920000909 polytetrahydrofuran Polymers 0.000 claims 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68215803A | 2003-10-09 | 2003-10-09 | |
| US10/682,158 | 2003-10-09 | ||
| US10/937,914 | 2004-09-10 | ||
| US10/937,914 US7074115B2 (en) | 2003-10-09 | 2004-09-10 | Polishing pad |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005136400A JP2005136400A (ja) | 2005-05-26 |
| JP2005136400A5 true JP2005136400A5 (enExample) | 2011-03-31 |
| JP4722446B2 JP4722446B2 (ja) | 2011-07-13 |
Family
ID=34316904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004295816A Expired - Lifetime JP4722446B2 (ja) | 2003-10-09 | 2004-10-08 | 研磨パッド |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1522385B1 (enExample) |
| JP (1) | JP4722446B2 (enExample) |
| KR (1) | KR101092944B1 (enExample) |
| CN (1) | CN100353502C (enExample) |
| DE (1) | DE602004010871T2 (enExample) |
| SG (1) | SG111222A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7074115B2 (en) | 2003-10-09 | 2006-07-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad |
| US20050171224A1 (en) * | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
| WO2006026343A1 (en) * | 2004-08-25 | 2006-03-09 | J.H. Rhodes, Inc. | Polishing pad and methods of improving pad removal rates and planarization |
| JP4757562B2 (ja) * | 2005-08-04 | 2011-08-24 | 東洋ゴム工業株式会社 | Ｃｕ膜研磨用研磨パッド |
| US7445847B2 (en) * | 2006-05-25 | 2008-11-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US7169030B1 (en) * | 2006-05-25 | 2007-01-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US7569268B2 (en) * | 2007-01-29 | 2009-08-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US8303375B2 (en) * | 2009-01-12 | 2012-11-06 | Novaplanar Technology, Inc. | Polishing pads for chemical mechanical planarization and/or other polishing methods |
| KR101352235B1 (ko) * | 2009-05-27 | 2014-01-15 | 로저스코포레이션 | 연마 패드, 이를 위한 폴리우레탄층, 및 규소 웨이퍼의 연마 방법 |
| US20150059254A1 (en) * | 2013-09-04 | 2015-03-05 | Dow Global Technologies Llc | Polyurethane polishing pad |
| US9463550B2 (en) | 2014-02-19 | 2016-10-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
| US9731398B2 (en) * | 2014-08-22 | 2017-08-15 | Rohm And Haas Electronic Materials Cmp Holding, Inc. | Polyurethane polishing pad |
| US10688621B2 (en) * | 2016-08-04 | 2020-06-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Low-defect-porous polishing pad |
| US20180345449A1 (en) * | 2017-06-06 | 2018-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
| JP6968651B2 (ja) | 2017-10-12 | 2021-11-17 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| CN108047420B (zh) * | 2017-11-28 | 2021-01-12 | 湖北鼎龙控股股份有限公司 | 一种聚氨酯抛光层及其制备方法 |
| JP7141230B2 (ja) | 2018-03-30 | 2022-09-22 | 富士紡ホールディングス株式会社 | 研磨パッド及びその製造方法 |
| CN112512747B (zh) | 2018-09-28 | 2024-04-05 | 富士纺控股株式会社 | 研磨垫及研磨加工物的制造方法 |
| KR102423956B1 (ko) * | 2020-09-07 | 2022-07-21 | 에스케이씨솔믹스 주식회사 | 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법 |
| KR102811921B1 (ko) | 2020-09-30 | 2025-05-22 | 후지보 홀딩스 가부시키가이샤 | 연마 패드 및 연마 가공물의 제조 방법 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI228522B (en) * | 1999-06-04 | 2005-03-01 | Fuji Spinning Co Ltd | Urethane molded products for polishing pad and method for making same |
| JP2000344902A (ja) * | 1999-06-04 | 2000-12-12 | Fuji Spinning Co Ltd | 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物 |
| EP1284842B1 (en) * | 2000-05-27 | 2005-10-19 | Rohm and Haas Electronic Materials CMP Holdings, Inc. | Polishing pads for chemical mechanical planarization |
| US6454634B1 (en) * | 2000-05-27 | 2002-09-24 | Rodel Holdings Inc. | Polishing pads for chemical mechanical planarization |
| JP2002124491A (ja) | 2000-08-10 | 2002-04-26 | Toray Ind Inc | 研磨パッド |
| JP2002192457A (ja) * | 2000-12-26 | 2002-07-10 | Toyo Tire & Rubber Co Ltd | 研磨材組成物及び研磨シート |
| JP4409758B2 (ja) * | 2000-12-26 | 2010-02-03 | 東洋ゴム工業株式会社 | 研磨シートの製造方法 |
| JP3359629B1 (ja) * | 2001-04-09 | 2002-12-24 | 東洋紡績株式会社 | ポリウレタン組成物からなる研磨パッド |
| US7378454B2 (en) * | 2001-04-09 | 2008-05-27 | Toyo Tire & Rubber Co., Ltd. | Polyurethane composition and polishing pad |
| JP2004083722A (ja) * | 2002-08-26 | 2004-03-18 | Jsr Corp | 研磨パッド用組成物及びこれを用いた研磨パッド |
-
2004
- 2004-10-04 SG SG200405774A patent/SG111222A1/en unknown
- 2004-10-06 DE DE602004010871T patent/DE602004010871T2/de not_active Expired - Lifetime
- 2004-10-06 EP EP04256170A patent/EP1522385B1/en not_active Expired - Lifetime
- 2004-10-07 KR KR1020040080039A patent/KR101092944B1/ko not_active Expired - Lifetime
- 2004-10-08 JP JP2004295816A patent/JP4722446B2/ja not_active Expired - Lifetime
- 2004-10-08 CN CNB200410010483XA patent/CN100353502C/zh not_active Ceased
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