JP2007313641A5 - - Google Patents

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Publication number
JP2007313641A5
JP2007313641A5 JP2007138566A JP2007138566A JP2007313641A5 JP 2007313641 A5 JP2007313641 A5 JP 2007313641A5 JP 2007138566 A JP2007138566 A JP 2007138566A JP 2007138566 A JP2007138566 A JP 2007138566A JP 2007313641 A5 JP2007313641 A5 JP 2007313641A5
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JP
Japan
Prior art keywords
polymer
polishing
polymer matrix
asperity
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007138566A
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English (en)
Japanese (ja)
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JP5346446B2 (ja
JP2007313641A (ja
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Publication date
Priority claimed from US11/442,077 external-priority patent/US7445847B2/en
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Publication of JP2007313641A publication Critical patent/JP2007313641A/ja
Publication of JP2007313641A5 publication Critical patent/JP2007313641A5/ja
Application granted granted Critical
Publication of JP5346446B2 publication Critical patent/JP5346446B2/ja
Active legal-status Critical Current
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JP2007138566A 2006-05-25 2007-05-25 ケミカルメカニカル研磨パッド Active JP5346446B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/442,077 US7445847B2 (en) 2006-05-25 2006-05-25 Chemical mechanical polishing pad
US11/442,077 2006-05-25

Publications (3)

Publication Number Publication Date
JP2007313641A JP2007313641A (ja) 2007-12-06
JP2007313641A5 true JP2007313641A5 (enExample) 2010-07-01
JP5346446B2 JP5346446B2 (ja) 2013-11-20

Family

ID=38622487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007138566A Active JP5346446B2 (ja) 2006-05-25 2007-05-25 ケミカルメカニカル研磨パッド

Country Status (7)

Country Link
US (1) US7445847B2 (enExample)
JP (1) JP5346446B2 (enExample)
KR (1) KR101360622B1 (enExample)
CN (1) CN100540225C (enExample)
DE (1) DE102007024459A1 (enExample)
FR (1) FR2901499B1 (enExample)
TW (1) TWI418443B (enExample)

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CN108136563A (zh) * 2015-07-30 2018-06-08 Jh罗得股份有限公司 聚合磨光材料、包含聚合磨光材料的介质和系统及其形成和使用方法
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
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JP6389497B2 (ja) * 2016-11-09 2018-09-12 株式会社Kri 可撓性を有する透明耐熱フィルム
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JP7587455B2 (ja) * 2021-03-30 2024-11-20 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
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US11897082B2 (en) * 2021-09-11 2024-02-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Heterogeneous fluoropolymer mixture polishing pad
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CN117020933B (zh) * 2023-08-10 2025-10-31 安徽禾臣新材料有限公司 一种半导体抛光用白垫及其生产工艺
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