JP2007313641A5 - - Google Patents

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Publication number
JP2007313641A5
JP2007313641A5 JP2007138566A JP2007138566A JP2007313641A5 JP 2007313641 A5 JP2007313641 A5 JP 2007313641A5 JP 2007138566 A JP2007138566 A JP 2007138566A JP 2007138566 A JP2007138566 A JP 2007138566A JP 2007313641 A5 JP2007313641 A5 JP 2007313641A5
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JP
Japan
Prior art keywords
polymer
polishing
polymer matrix
asperity
polishing pad
Prior art date
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Application number
JP2007138566A
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English (en)
Japanese (ja)
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JP2007313641A (ja
JP5346446B2 (ja
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Publication date
Priority claimed from US11/442,077 external-priority patent/US7445847B2/en
Application filed filed Critical
Publication of JP2007313641A publication Critical patent/JP2007313641A/ja
Publication of JP2007313641A5 publication Critical patent/JP2007313641A5/ja
Application granted granted Critical
Publication of JP5346446B2 publication Critical patent/JP5346446B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007138566A 2006-05-25 2007-05-25 ケミカルメカニカル研磨パッド Active JP5346446B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/442,077 2006-05-25
US11/442,077 US7445847B2 (en) 2006-05-25 2006-05-25 Chemical mechanical polishing pad

Publications (3)

Publication Number Publication Date
JP2007313641A JP2007313641A (ja) 2007-12-06
JP2007313641A5 true JP2007313641A5 (enExample) 2010-07-01
JP5346446B2 JP5346446B2 (ja) 2013-11-20

Family

ID=38622487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007138566A Active JP5346446B2 (ja) 2006-05-25 2007-05-25 ケミカルメカニカル研磨パッド

Country Status (7)

Country Link
US (1) US7445847B2 (enExample)
JP (1) JP5346446B2 (enExample)
KR (1) KR101360622B1 (enExample)
CN (1) CN100540225C (enExample)
DE (1) DE102007024459A1 (enExample)
FR (1) FR2901499B1 (enExample)
TW (1) TWI418443B (enExample)

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CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
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US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
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US9630293B2 (en) 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation
US9539694B1 (en) 2015-06-26 2017-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composite polishing layer chemical mechanical polishing pad
US9457449B1 (en) 2015-06-26 2016-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with composite polishing layer
US10092991B2 (en) * 2015-07-30 2018-10-09 Jh Rhodes Company, Inc. Polymeric lapping materials, media and systems including polymeric lapping material, and methods of forming and using same
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10086494B2 (en) 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
JP6389497B2 (ja) * 2016-11-09 2018-09-12 株式会社Kri 可撓性を有する透明耐熱フィルム
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US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
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US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP7733464B2 (ja) * 2021-03-30 2025-09-03 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
CN117999150A (zh) 2021-09-02 2024-05-07 Cmc材料有限责任公司 包含聚合物颗粒的纹理化cmp垫
US11897082B2 (en) * 2021-09-11 2024-02-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Heterogeneous fluoropolymer mixture polishing pad
US20230390970A1 (en) * 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making low specific gravity polishing pads
CN117020933B (zh) * 2023-08-10 2025-10-31 安徽禾臣新材料有限公司 一种半导体抛光用白垫及其生产工艺
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