FR2901499B1 - Feutre de polissage mecano-chimique - Google Patents

Feutre de polissage mecano-chimique

Info

Publication number
FR2901499B1
FR2901499B1 FR0755268A FR0755268A FR2901499B1 FR 2901499 B1 FR2901499 B1 FR 2901499B1 FR 0755268 A FR0755268 A FR 0755268A FR 0755268 A FR0755268 A FR 0755268A FR 2901499 B1 FR2901499 B1 FR 2901499B1
Authority
FR
France
Prior art keywords
polymeric
asperities
polymer matrix
polish
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0755268A
Other languages
English (en)
French (fr)
Other versions
FR2901499A1 (fr
Inventor
Mary Jo Kulp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR2901499A1 publication Critical patent/FR2901499A1/fr
Application granted granted Critical
Publication of FR2901499B1 publication Critical patent/FR2901499B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
FR0755268A 2006-05-25 2007-05-25 Feutre de polissage mecano-chimique Expired - Fee Related FR2901499B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/442,077 US7445847B2 (en) 2006-05-25 2006-05-25 Chemical mechanical polishing pad

Publications (2)

Publication Number Publication Date
FR2901499A1 FR2901499A1 (fr) 2007-11-30
FR2901499B1 true FR2901499B1 (fr) 2010-09-03

Family

ID=38622487

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0755268A Expired - Fee Related FR2901499B1 (fr) 2006-05-25 2007-05-25 Feutre de polissage mecano-chimique

Country Status (7)

Country Link
US (1) US7445847B2 (enExample)
JP (1) JP5346446B2 (enExample)
KR (1) KR101360622B1 (enExample)
CN (1) CN100540225C (enExample)
DE (1) DE102007024459A1 (enExample)
FR (1) FR2901499B1 (enExample)
TW (1) TWI418443B (enExample)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG162794A1 (en) * 2005-07-15 2010-07-29 Toyo Tire & Rubber Co Layered sheets and processes for producing the same
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
US20100009611A1 (en) * 2006-09-08 2010-01-14 Toyo Tire & Rubber Co., Ltd. Method for manufacturing a polishing pad
KR100832106B1 (ko) * 2006-12-05 2008-05-27 삼성전자주식회사 반도체 소자의 제조방법
US8257153B2 (en) 2007-01-15 2012-09-04 Toyo Tire & Rubber Co., Ltd. Polishing pad and a method for manufacturing the same
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
US20100035529A1 (en) * 2008-08-05 2010-02-11 Mary Jo Kulp Chemical mechanical polishing pad
JP5846714B2 (ja) * 2009-04-06 2016-01-20 ニッタ・ハース株式会社 研磨パッド
US8697239B2 (en) * 2009-07-24 2014-04-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-functional polishing pad
US8551201B2 (en) * 2009-08-07 2013-10-08 Praxair S.T. Technology, Inc. Polyurethane composition for CMP pads and method of manufacturing same
WO2011049318A2 (ko) * 2009-10-13 2011-04-28 주식회사 엘지화학 Cmp용 슬러리 조성물 및 연마방법
JP5606083B2 (ja) * 2010-01-29 2014-10-15 日本発條株式会社 独泡ウレタンシート及びその製造方法
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
EP2511236B1 (en) 2011-04-14 2015-07-01 Rohm and Haas Company Improved quality multi-spectral zinc sulfide
JP5710353B2 (ja) * 2011-04-15 2015-04-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
EP2634157B1 (en) 2011-05-24 2016-08-10 Rohm and Haas Company Improved quality multi-spectral zinc sulfide
JP5373171B1 (ja) * 2012-10-20 2013-12-18 株式会社ナノテム 砥石およびそれを用いた研削・研磨装置
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
JP6004966B2 (ja) * 2013-02-22 2016-10-12 株式会社クラレ 研磨パッドおよび研磨方法
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9649741B2 (en) * 2014-07-07 2017-05-16 Jh Rhodes Company, Inc. Polishing material for polishing hard surfaces, media including the material, and methods of forming and using same
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
SG11201707842PA (en) * 2015-03-30 2017-10-30 Nitta Haas Inc Polishing pad
US9630293B2 (en) 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation
US9539694B1 (en) 2015-06-26 2017-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composite polishing layer chemical mechanical polishing pad
US9457449B1 (en) 2015-06-26 2016-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with composite polishing layer
US10092991B2 (en) * 2015-07-30 2018-10-09 Jh Rhodes Company, Inc. Polymeric lapping materials, media and systems including polymeric lapping material, and methods of forming and using same
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10086494B2 (en) 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
JP6389497B2 (ja) * 2016-11-09 2018-09-12 株式会社Kri 可撓性を有する透明耐熱フィルム
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US10391606B2 (en) 2017-06-06 2019-08-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US10464187B2 (en) 2017-12-01 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP7733464B2 (ja) * 2021-03-30 2025-09-03 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
CN117999150A (zh) 2021-09-02 2024-05-07 Cmc材料有限责任公司 包含聚合物颗粒的纹理化cmp垫
US11897082B2 (en) * 2021-09-11 2024-02-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Heterogeneous fluoropolymer mixture polishing pad
US20230390970A1 (en) * 2022-06-02 2023-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making low specific gravity polishing pads
CN117020933B (zh) * 2023-08-10 2025-10-31 安徽禾臣新材料有限公司 一种半导体抛光用白垫及其生产工艺
CN119458143B (zh) * 2024-10-11 2025-11-14 广东粤港澳大湾区黄埔材料研究院 一种用于SiC晶圆的粗抛垫及其制备方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3577386A (en) * 1968-10-07 1971-05-04 Minnesota Mining & Mfg Product and process
JPS63283857A (ja) * 1987-05-15 1988-11-21 Asahi Chem Ind Co Ltd 研磨布
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5814409A (en) 1994-05-10 1998-09-29 Asahi Kasei Kogyo Kabushiki Kaisha Expanded fluorine type resin products and a preparation process thereof
US6648733B2 (en) * 1997-04-04 2003-11-18 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6022268A (en) 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
WO1998045087A1 (en) * 1997-04-04 1998-10-15 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto
US6682402B1 (en) 1997-04-04 2004-01-27 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US7718102B2 (en) 1998-06-02 2010-05-18 Praxair S.T. Technology, Inc. Froth and method of producing froth
US6514301B1 (en) 1998-06-02 2003-02-04 Peripheral Products Inc. Foam semiconductor polishing belts and pads
US6022903A (en) 1998-07-09 2000-02-08 Arco Chemical Technology L.P. Permanent gas blown microcellular polyurethane elastomers
US6095902A (en) * 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods
US6267644B1 (en) 1998-11-06 2001-07-31 Beaver Creek Concepts Inc Fixed abrasive finishing element having aids finishing method
US6860802B1 (en) 2000-05-27 2005-03-01 Rohm And Haas Electric Materials Cmp Holdings, Inc. Polishing pads for chemical mechanical planarization
US6454634B1 (en) 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
JP2002151447A (ja) * 2000-11-13 2002-05-24 Asahi Kasei Corp 研磨パッド
CN1318469C (zh) * 2002-11-18 2007-05-30 东省A&T株式会社 具有微孔的聚氨酯泡沫的制备方法和由此获得的抛光垫
JP2004303280A (ja) 2003-03-28 2004-10-28 Hoya Corp 情報記録媒体用ガラス基板の製造方法
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
SG111222A1 (en) * 2003-10-09 2005-05-30 Rohm & Haas Elect Mat Polishing pad
US20050171224A1 (en) 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
JP4783553B2 (ja) * 2004-02-18 2011-09-28 三井化学ポリウレタン株式会社 ポリウレタン水性分散系の製造方法
US7169030B1 (en) * 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad

Also Published As

Publication number Publication date
US20070275226A1 (en) 2007-11-29
JP2007313641A (ja) 2007-12-06
KR20070114019A (ko) 2007-11-29
KR101360622B1 (ko) 2014-02-07
DE102007024459A1 (de) 2007-11-29
TW200806431A (en) 2008-02-01
FR2901499A1 (fr) 2007-11-30
US7445847B2 (en) 2008-11-04
CN101077570A (zh) 2007-11-28
JP5346446B2 (ja) 2013-11-20
CN100540225C (zh) 2009-09-16
TWI418443B (zh) 2013-12-11

Similar Documents

Publication Publication Date Title
FR2901499B1 (fr) Feutre de polissage mecano-chimique
WO2006081286A8 (en) Multi-layer polishing pad for low-pressure polishing
AU2002342090A1 (en) Fluorochemical urethane composition for treatment of fibrous substrates
MY150866A (en) Compositions and methods for polishing silicon nitride materials
MA32144B1 (fr) Article réfléchissant
TW200745220A (en) Copolymers comprising polyamide blocks and polyethers blocks having improved optical and/or mechanical properties
DE602004027901D1 (de) Belegte metalloxidteilchen für cmp
CN103032566A (zh) 带有dlc 涂层的滑动件
TW200639019A (en) Customized polishing pads for CMP and methods of fabrication and use thereof
TW200714213A (en) Stretch cloth
WO2006073435A3 (en) Multi-layered superhard nanocomposite coatings
WO2009115192A3 (en) Ni-p layer system and process for its preparation
MX2011009118A (es) Pelicula repelente al agua y componente para vehiculo que incluye la pelicula.
MX2018011871A (es) Lamina de acero, lamina de acero recubierta, metodo para producir lamina de acero laminada en caliente, metodo para producir lamina de acero laminada en frio de dureza completa, metodo para producir lamina tratada termicamente, metodo para producir lamina de acero y metodo para producir lamina de acero recubierta.
TW200603946A (en) Polishing pad for electrochemical mechanical polishing
ATE557192T1 (de) Sphärisches gleitlager mit metall-auf-metall kontaktoberflächen
KR20130091777A (ko) 저비용 다이아몬드 코팅을 갖는 저마찰 밀봉 링
MX2008001495A (es) Raspatubo resistente a la abrasion y materiales y metodos para hacer el mismo.
WO2002094985A3 (en) Beta-secretase substrates and uses thereof
WO2008081561A1 (ja) 孔あきサポートプレート
SE0300073D0 (sv) Surface modified preciptation hardened stainless steel
CN109137728A (zh) 双斜面桥梁伸缩装置
SMP201000056B (it) Elemento per il rivestimento di una superficie e relativo rivestimento, metodo per la realizzazione di un elemento per il rivestimento di una superficie e relativa macchina
SE9903600D0 (sv) Seal rings with improved friction and wear properties
DE102004016092A1 (de) Bremsscheibe für ein Fahrzeug

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 14

PLFP Fee payment

Year of fee payment: 15

PLFP Fee payment

Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17

ST Notification of lapse

Effective date: 20250105