FR2901499B1 - Feutre de polissage mecano-chimique - Google Patents

Feutre de polissage mecano-chimique

Info

Publication number
FR2901499B1
FR2901499B1 FR0755268A FR0755268A FR2901499B1 FR 2901499 B1 FR2901499 B1 FR 2901499B1 FR 0755268 A FR0755268 A FR 0755268A FR 0755268 A FR0755268 A FR 0755268A FR 2901499 B1 FR2901499 B1 FR 2901499B1
Authority
FR
France
Prior art keywords
polishing
polymer
asperities
phase
polymer matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0755268A
Other languages
English (en)
French (fr)
Other versions
FR2901499A1 (fr
Inventor
Mary Jo Kulp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR2901499A1 publication Critical patent/FR2901499A1/fr
Application granted granted Critical
Publication of FR2901499B1 publication Critical patent/FR2901499B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
FR0755268A 2006-05-25 2007-05-25 Feutre de polissage mecano-chimique Expired - Fee Related FR2901499B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/442,077 US7445847B2 (en) 2006-05-25 2006-05-25 Chemical mechanical polishing pad

Publications (2)

Publication Number Publication Date
FR2901499A1 FR2901499A1 (fr) 2007-11-30
FR2901499B1 true FR2901499B1 (fr) 2010-09-03

Family

ID=38622487

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0755268A Expired - Fee Related FR2901499B1 (fr) 2006-05-25 2007-05-25 Feutre de polissage mecano-chimique

Country Status (7)

Country Link
US (1) US7445847B2 (enExample)
JP (1) JP5346446B2 (enExample)
KR (1) KR101360622B1 (enExample)
CN (1) CN100540225C (enExample)
DE (1) DE102007024459A1 (enExample)
FR (1) FR2901499B1 (enExample)
TW (1) TWI418443B (enExample)

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CN101724167B (zh) * 2005-07-15 2013-06-26 东洋橡胶工业株式会社 层叠片及其制造方法
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
MY144784A (en) * 2006-09-08 2011-11-15 Toyo Tire & Rubber Co Method for manufacturing a polishing pad
KR100832106B1 (ko) * 2006-12-05 2008-05-27 삼성전자주식회사 반도체 소자의 제조방법
CN102152232B (zh) 2007-01-15 2013-06-26 东洋橡胶工业株式会社 研磨垫及其制造方法
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
US20100035529A1 (en) * 2008-08-05 2010-02-11 Mary Jo Kulp Chemical mechanical polishing pad
JP5846714B2 (ja) * 2009-04-06 2016-01-20 ニッタ・ハース株式会社 研磨パッド
US8697239B2 (en) * 2009-07-24 2014-04-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-functional polishing pad
US8551201B2 (en) * 2009-08-07 2013-10-08 Praxair S.T. Technology, Inc. Polyurethane composition for CMP pads and method of manufacturing same
TWI431080B (zh) 2009-10-13 2014-03-21 Ｌｇ化學公司 化學機械拋光之漿料組成物及拋光方法
JP5606083B2 (ja) * 2010-01-29 2014-10-15 日本発條株式会社 独泡ウレタンシート及びその製造方法
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
EP2511236B1 (en) 2011-04-14 2015-07-01 Rohm and Haas Company Improved quality multi-spectral zinc sulfide
JP5710353B2 (ja) * 2011-04-15 2015-04-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
EP2634158B1 (en) 2011-05-24 2016-08-10 Rohm and Haas Company Improved quality multi-spectral zinc sulfide
JP5373171B1 (ja) * 2012-10-20 2013-12-18 株式会社ナノテム 砥石およびそれを用いた研削・研磨装置
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
JP6004966B2 (ja) * 2013-02-22 2016-10-12 株式会社クラレ 研磨パッドおよび研磨方法
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
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US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
SG10202002601QA (en) 2014-10-17 2020-05-28 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN107107307B (zh) * 2015-03-30 2020-06-26 霓达杜邦股份有限公司 研磨垫
US9457449B1 (en) 2015-06-26 2016-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with composite polishing layer
US9630293B2 (en) 2015-06-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad composite polishing layer formulation
US9539694B1 (en) 2015-06-26 2017-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composite polishing layer chemical mechanical polishing pad
CN108136563A (zh) * 2015-07-30 2018-06-08 Jh罗得股份有限公司 聚合磨光材料、包含聚合磨光材料的介质和系统及其形成和使用方法
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US9484212B1 (en) * 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10086494B2 (en) 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
JP6389497B2 (ja) * 2016-11-09 2018-09-12 株式会社Kri 可撓性を有する透明耐熱フィルム
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US10391606B2 (en) 2017-06-06 2019-08-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US10464187B2 (en) 2017-12-01 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP7587455B2 (ja) * 2021-03-30 2024-11-20 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP7733464B2 (ja) * 2021-03-30 2025-09-03 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
WO2023034573A1 (en) 2021-09-02 2023-03-09 Cmc Materials, Inc. Textured cmp pad comprising polymer particles
US11897082B2 (en) * 2021-09-11 2024-02-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Heterogeneous fluoropolymer mixture polishing pad
US12544958B2 (en) * 2022-06-02 2026-02-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of making low specific gravity polishing pads
US12528152B2 (en) 2022-06-02 2026-01-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having ultra expanded polymer microspheres
CN118238064A (zh) * 2022-12-22 2024-06-25 罗门哈斯电子材料Cmp控股股份有限公司 含有氟化聚合物和多模态凹槽图案的化学机械抛光垫
CN117020933B (zh) * 2023-08-10 2025-10-31 安徽禾臣新材料有限公司 一种半导体抛光用白垫及其生产工艺
US12610793B2 (en) * 2023-09-21 2026-04-21 Macronix International Co., Ltd. Method of manufacturing memory device
CN119458143B (zh) * 2024-10-11 2025-11-14 广东粤港澳大湾区黄埔材料研究院 一种用于SiC晶圆的粗抛垫及其制备方法

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Also Published As

Publication number Publication date
KR20070114019A (ko) 2007-11-29
FR2901499A1 (fr) 2007-11-30
US20070275226A1 (en) 2007-11-29
DE102007024459A1 (de) 2007-11-29
KR101360622B1 (ko) 2014-02-07
US7445847B2 (en) 2008-11-04
CN101077570A (zh) 2007-11-28
TW200806431A (en) 2008-02-01
CN100540225C (zh) 2009-09-16
JP5346446B2 (ja) 2013-11-20
JP2007313641A (ja) 2007-12-06
TWI418443B (zh) 2013-12-11

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