WO2008081561A1 - 孔あきサポートプレート - Google Patents

孔あきサポートプレート Download PDF

Info

Publication number
WO2008081561A1
WO2008081561A1 PCT/JP2007/001295 JP2007001295W WO2008081561A1 WO 2008081561 A1 WO2008081561 A1 WO 2008081561A1 JP 2007001295 W JP2007001295 W JP 2007001295W WO 2008081561 A1 WO2008081561 A1 WO 2008081561A1
Authority
WO
WIPO (PCT)
Prior art keywords
support plate
perforated support
wafer
perforated
adhesive layer
Prior art date
Application number
PCT/JP2007/001295
Other languages
English (en)
French (fr)
Inventor
Akihiko Nakamura
Atsushi Miyanari
Yoshihiro Inao
Yasumasa Iwata
Original Assignee
Tokyo Ohka Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co., Ltd. filed Critical Tokyo Ohka Kogyo Co., Ltd.
Priority to US12/448,499 priority Critical patent/US20090288780A1/en
Publication of WO2008081561A1 publication Critical patent/WO2008081561A1/ja
Priority to US13/939,524 priority patent/US8882096B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1798—Surface bonding means and/or assemblymeans with work feeding or handling means with liquid adhesive or adhesive activator applying means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

　剛性を高めた孔あきサポートプレートを提供することを目的に、ウエハを接着層を挟んで面サポートするための孔あきサポートプレート（１）において撓み防止用の補強部（１４）を備えるようにする。
PCT/JP2007/001295 2006-12-28 2007-11-26 孔あきサポートプレート WO2008081561A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/448,499 US20090288780A1 (en) 2006-12-28 2007-11-26 Perforated support plate
US13/939,524 US8882096B2 (en) 2006-12-28 2013-07-11 Perforated support plate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-355508 2006-12-28
JP2006355508A JP4922752B2 (ja) 2006-12-28 2006-12-28 孔あきサポートプレート

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/448,499 A-371-Of-International US20090288780A1 (en) 2006-12-28 2007-11-26 Perforated support plate
US13/939,524 Division US8882096B2 (en) 2006-12-28 2013-07-11 Perforated support plate

Publications (1)

Publication Number Publication Date
WO2008081561A1 true WO2008081561A1 (ja) 2008-07-10

Family

ID=39588251

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/001295 WO2008081561A1 (ja) 2006-12-28 2007-11-26 孔あきサポートプレート

Country Status (4)

Country Link
US (2) US20090288780A1 (ja)
JP (1) JP4922752B2 (ja)
TW (1) TWI456686B (ja)
WO (1) WO2008081561A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100159191A1 (en) * 2008-12-19 2010-06-24 Hirofumi Imai Processed substrate and method for manufacturing same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5426855B2 (ja) * 2008-09-18 2014-02-26 東京応化工業株式会社 ガラス基板の製造方法
JP5695304B2 (ja) * 2009-06-09 2015-04-01 東京応化工業株式会社 サポートプレート及びその製造方法、基板処理方法
JP2016146429A (ja) * 2015-02-09 2016-08-12 トヨタ自動車株式会社 半導体装置の製造方法
CN107431034A (zh) 2015-03-11 2017-12-01 贝卡尔特公司 用于临时键合晶片的载体
WO2016142238A1 (en) 2015-03-11 2016-09-15 Nv Bekaert Sa Carrier for temporary bonded wafers
WO2016142240A1 (en) 2015-03-11 2016-09-15 Nv Bekaert Sa Carrier for temporary bonded wafers
WO2016142239A1 (en) 2015-03-11 2016-09-15 Nv Bekaert Sa Carrier for temporary bonded wafers
JP7184722B2 (ja) 2019-09-19 2022-12-06 株式会社東芝 支持基板、支持基板の剥離方法、及び、半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195878A (ja) * 1998-12-24 2000-07-14 Toshiba Corp ウェーハ搬送・固定治具及び半導体装置の製造方法
JP2004140227A (ja) * 2002-10-18 2004-05-13 Disco Abrasive Syst Ltd 半導体ウエーハ保護ユニット及び半導体ウエーハ処理方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5298337A (en) * 1989-07-05 1994-03-29 Alabama Cryogenic Engineering, Inc. Perforated plates for cryogenic regenerators and method of fabrication
JP2005191550A (ja) 2003-12-01 2005-07-14 Tokyo Ohka Kogyo Co Ltd 基板の貼り付け方法
JP2006135272A (ja) * 2003-12-01 2006-05-25 Tokyo Ohka Kogyo Co Ltd 基板のサポートプレート及びサポートプレートの剥離方法
US20060141412A1 (en) * 2004-12-27 2006-06-29 Masten James H Burner plate and burner assembly

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195878A (ja) * 1998-12-24 2000-07-14 Toshiba Corp ウェーハ搬送・固定治具及び半導体装置の製造方法
JP2004140227A (ja) * 2002-10-18 2004-05-13 Disco Abrasive Syst Ltd 半導体ウエーハ保護ユニット及び半導体ウエーハ処理方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100159191A1 (en) * 2008-12-19 2010-06-24 Hirofumi Imai Processed substrate and method for manufacturing same
US9017932B2 (en) 2008-12-19 2015-04-28 Tokyo Ohka Kogyo Co., Ltd. Processed substrate and method for manufacturing same

Also Published As

Publication number Publication date
JP4922752B2 (ja) 2012-04-25
US8882096B2 (en) 2014-11-11
TW200834807A (en) 2008-08-16
TWI456686B (zh) 2014-10-11
US20130333833A1 (en) 2013-12-19
JP2008166566A (ja) 2008-07-17
US20090288780A1 (en) 2009-11-26

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