JP2015047691A5 - - Google Patents
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- Publication number
- JP2015047691A5 JP2015047691A5 JP2014174664A JP2014174664A JP2015047691A5 JP 2015047691 A5 JP2015047691 A5 JP 2015047691A5 JP 2014174664 A JP2014174664 A JP 2014174664A JP 2014174664 A JP2014174664 A JP 2014174664A JP 2015047691 A5 JP2015047691 A5 JP 2015047691A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- polishing
- chemical mechanical
- pad according
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005498 polishing Methods 0.000 claims 23
- 239000010410 layer Substances 0.000 claims 18
- 239000000126 substance Substances 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 7
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 238000001514 detection method Methods 0.000 claims 3
- 239000012948 isocyanate Substances 0.000 claims 3
- 150000002513 isocyanates Chemical class 0.000 claims 3
- 229920005862 polyol Polymers 0.000 claims 3
- 150000003077 polyols Chemical class 0.000 claims 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000008367 deionised water Substances 0.000 claims 2
- 229910021641 deionized water Inorganic materials 0.000 claims 2
- 230000001747 exhibiting effect Effects 0.000 claims 2
- 230000005484 gravity Effects 0.000 claims 2
- 230000007062 hydrolysis Effects 0.000 claims 2
- 238000006460 hydrolysis reaction Methods 0.000 claims 2
- 238000007654 immersion Methods 0.000 claims 2
- 229920000570 polyether Polymers 0.000 claims 2
- 229920002635 polyurethane Polymers 0.000 claims 2
- 239000004814 polyurethane Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 229920002799 BoPET Polymers 0.000 claims 1
- 239000004831 Hot glue Substances 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 230000001588 bifunctional effect Effects 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 230000003750 conditioning effect Effects 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 230000002085 persistent effect Effects 0.000 claims 1
- 238000007517 polishing process Methods 0.000 claims 1
- 229920001451 polypropylene glycol Polymers 0.000 claims 1
- 150000003141 primary amines Chemical class 0.000 claims 1
- 150000003335 secondary amines Chemical class 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical group CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims 1
- 239000011800 void material Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/014,468 US20150065013A1 (en) | 2013-08-30 | 2013-08-30 | Chemical mechanical polishing pad |
| US14/014,468 | 2013-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015047691A JP2015047691A (ja) | 2015-03-16 |
| JP2015047691A5 true JP2015047691A5 (enExample) | 2017-09-28 |
Family
ID=52470533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014174664A Withdrawn JP2015047691A (ja) | 2013-08-30 | 2014-08-29 | 化学機械研磨パッド |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20150065013A1 (enExample) |
| JP (1) | JP2015047691A (enExample) |
| KR (1) | KR20150026903A (enExample) |
| CN (1) | CN104416452B (enExample) |
| DE (1) | DE102014012353A1 (enExample) |
| FR (1) | FR3009988A1 (enExample) |
| TW (1) | TW201522406A (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9421666B2 (en) * | 2013-11-04 | 2016-08-23 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having abrasives therein |
| US9216489B2 (en) * | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| US20150306731A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US9314897B2 (en) * | 2014-04-29 | 2016-04-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| TWI626117B (zh) * | 2017-01-19 | 2018-06-11 | 智勝科技股份有限公司 | 研磨墊及研磨方法 |
| KR101835090B1 (ko) * | 2017-05-29 | 2018-03-06 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이를 사용하여 반도체 소자를 제조하는 방법 |
| KR101945878B1 (ko) | 2017-07-11 | 2019-02-11 | 에스케이씨 주식회사 | 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드 |
| US10464187B2 (en) * | 2017-12-01 | 2019-11-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives |
| TWI833018B (zh) * | 2019-05-07 | 2024-02-21 | 美商Ｃｍｃ材料有限責任公司 | 經基於槽生產之化學機械平坦化墊 |
| KR102345784B1 (ko) * | 2019-07-10 | 2022-01-03 | 에프엔에스테크 주식회사 | 웨이퍼 후면 연마용 고경도 연마패드 |
| KR102526513B1 (ko) * | 2021-05-26 | 2023-04-26 | 에스케이엔펄스 주식회사 | 연마패드 접착필름, 이를 포함하는 연마패드 적층체 및 웨이퍼의 연마방법 |
| CN115502881B (zh) * | 2021-06-23 | 2024-09-27 | 均豪精密工业股份有限公司 | 研磨装置 |
| KR102594068B1 (ko) * | 2021-10-12 | 2023-10-24 | 에스케이엔펄스 주식회사 | 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
| KR20240162499A (ko) * | 2022-03-29 | 2024-11-15 | 후지보 홀딩스 가부시키가이샤 | 연마 패드, 연마 패드의 제조 방법, 및 광학 재료 또는 반도체 재료의 표면을 연마하는 방법 |
| US12544958B2 (en) * | 2022-06-02 | 2026-02-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making low specific gravity polishing pads |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7101275B2 (en) * | 2003-09-26 | 2006-09-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Resilient polishing pad for chemical mechanical polishing |
| US20050171224A1 (en) * | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
| US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US7569268B2 (en) * | 2007-01-29 | 2009-08-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
| US8512427B2 (en) * | 2011-09-29 | 2013-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Acrylate polyurethane chemical mechanical polishing layer |
-
2013
- 2013-08-30 US US14/014,468 patent/US20150065013A1/en not_active Abandoned
-
2014
- 2014-08-18 TW TW103128258A patent/TW201522406A/zh unknown
- 2014-08-20 DE DE102014012353.7A patent/DE102014012353A1/de not_active Withdrawn
- 2014-08-27 KR KR20140112165A patent/KR20150026903A/ko not_active Withdrawn
- 2014-08-29 FR FR1458104A patent/FR3009988A1/fr not_active Withdrawn
- 2014-08-29 JP JP2014174664A patent/JP2015047691A/ja not_active Withdrawn
- 2014-08-29 CN CN201410437889.XA patent/CN104416452B/zh not_active Expired - Fee Related
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