JP2015047691A5 - - Google Patents
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- Publication number
- JP2015047691A5 JP2015047691A5 JP2014174664A JP2014174664A JP2015047691A5 JP 2015047691 A5 JP2015047691 A5 JP 2015047691A5 JP 2014174664 A JP2014174664 A JP 2014174664A JP 2014174664 A JP2014174664 A JP 2014174664A JP 2015047691 A5 JP2015047691 A5 JP 2015047691A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- polishing
- chemical mechanical
- pad according
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005498 polishing Methods 0.000 claims 23
- 239000010410 layer Substances 0.000 claims 18
- 239000000126 substance Substances 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 7
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 238000001514 detection method Methods 0.000 claims 3
- 239000012948 isocyanate Substances 0.000 claims 3
- 150000002513 isocyanates Chemical class 0.000 claims 3
- 229920005862 polyol Polymers 0.000 claims 3
- 150000003077 polyols Chemical class 0.000 claims 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000008367 deionised water Substances 0.000 claims 2
- 229910021641 deionized water Inorganic materials 0.000 claims 2
- 230000001747 exhibiting effect Effects 0.000 claims 2
- 230000005484 gravity Effects 0.000 claims 2
- 230000007062 hydrolysis Effects 0.000 claims 2
- 238000006460 hydrolysis reaction Methods 0.000 claims 2
- 238000007654 immersion Methods 0.000 claims 2
- 229920000570 polyether Polymers 0.000 claims 2
- 229920002635 polyurethane Polymers 0.000 claims 2
- 239000004814 polyurethane Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 229920002799 BoPET Polymers 0.000 claims 1
- 239000004831 Hot glue Substances 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 230000001588 bifunctional effect Effects 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 230000003750 conditioning effect Effects 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 230000002085 persistent effect Effects 0.000 claims 1
- 238000007517 polishing process Methods 0.000 claims 1
- 229920001451 polypropylene glycol Polymers 0.000 claims 1
- 150000003141 primary amines Chemical class 0.000 claims 1
- 150000003335 secondary amines Chemical class 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical group CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims 1
- 239000011800 void material Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/014,468 | 2013-08-30 | ||
| US14/014,468 US20150065013A1 (en) | 2013-08-30 | 2013-08-30 | Chemical mechanical polishing pad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015047691A JP2015047691A (ja) | 2015-03-16 |
| JP2015047691A5 true JP2015047691A5 (enExample) | 2017-09-28 |
Family
ID=52470533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014174664A Withdrawn JP2015047691A (ja) | 2013-08-30 | 2014-08-29 | 化学機械研磨パッド |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20150065013A1 (enExample) |
| JP (1) | JP2015047691A (enExample) |
| KR (1) | KR20150026903A (enExample) |
| CN (1) | CN104416452B (enExample) |
| DE (1) | DE102014012353A1 (enExample) |
| FR (1) | FR3009988A1 (enExample) |
| TW (1) | TW201522406A (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9421666B2 (en) * | 2013-11-04 | 2016-08-23 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having abrasives therein |
| US9216489B2 (en) * | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| US20150306731A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US9314897B2 (en) * | 2014-04-29 | 2016-04-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
| TWI626117B (zh) * | 2017-01-19 | 2018-06-11 | 智勝科技股份有限公司 | 研磨墊及研磨方法 |
| KR101835090B1 (ko) * | 2017-05-29 | 2018-03-06 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이를 사용하여 반도체 소자를 제조하는 방법 |
| KR101945878B1 (ko) | 2017-07-11 | 2019-02-11 | 에스케이씨 주식회사 | 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드 |
| US10464187B2 (en) * | 2017-12-01 | 2019-11-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives |
| CN114126803B (zh) * | 2019-05-07 | 2024-07-16 | Cmc材料有限责任公司 | 具有固定沟槽体积的化学机械平坦化垫 |
| KR102345784B1 (ko) * | 2019-07-10 | 2022-01-03 | 에프엔에스테크 주식회사 | 웨이퍼 후면 연마용 고경도 연마패드 |
| KR102526513B1 (ko) * | 2021-05-26 | 2023-04-26 | 에스케이엔펄스 주식회사 | 연마패드 접착필름, 이를 포함하는 연마패드 적층체 및 웨이퍼의 연마방법 |
| CN115502881B (zh) * | 2021-06-23 | 2024-09-27 | 均豪精密工业股份有限公司 | 研磨装置 |
| CN118891132A (zh) * | 2022-03-29 | 2024-11-01 | 富士纺控股股份有限公司 | 研磨垫、研磨垫的制造方法和对光学材料或半导体材料的表面进行研磨的方法 |
| US20230390970A1 (en) * | 2022-06-02 | 2023-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of making low specific gravity polishing pads |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7101275B2 (en) * | 2003-09-26 | 2006-09-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Resilient polishing pad for chemical mechanical polishing |
| US20050171224A1 (en) | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
| US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US7569268B2 (en) * | 2007-01-29 | 2009-08-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
| US8512427B2 (en) * | 2011-09-29 | 2013-08-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Acrylate polyurethane chemical mechanical polishing layer |
-
2013
- 2013-08-30 US US14/014,468 patent/US20150065013A1/en not_active Abandoned
-
2014
- 2014-08-18 TW TW103128258A patent/TW201522406A/zh unknown
- 2014-08-20 DE DE102014012353.7A patent/DE102014012353A1/de not_active Withdrawn
- 2014-08-27 KR KR20140112165A patent/KR20150026903A/ko not_active Withdrawn
- 2014-08-29 JP JP2014174664A patent/JP2015047691A/ja not_active Withdrawn
- 2014-08-29 FR FR1458104A patent/FR3009988A1/fr not_active Withdrawn
- 2014-08-29 CN CN201410437889.XA patent/CN104416452B/zh not_active Expired - Fee Related
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