TWI287481B - Polyurethane urea polishing pad - Google Patents
Polyurethane urea polishing pad Download PDFInfo
- Publication number
- TWI287481B TWI287481B TW094133710A TW94133710A TWI287481B TW I287481 B TWI287481 B TW I287481B TW 094133710 A TW094133710 A TW 094133710A TW 94133710 A TW94133710 A TW 94133710A TW I287481 B TWI287481 B TW I287481B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- pad
- polishing
- partially
- polishing layer
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 186
- 229920003226 polyurethane urea Polymers 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 129
- 150000001412 amines Chemical class 0.000 claims abstract description 57
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 56
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 56
- 239000004604 Blowing Agent Substances 0.000 claims abstract description 38
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 33
- 229920001730 Moisture cure polyurethane Polymers 0.000 claims abstract description 20
- 238000004377 microelectronic Methods 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims abstract description 12
- -1 poly(cyanoisocyanate) Polymers 0.000 claims description 55
- 229920005862 polyol Polymers 0.000 claims description 45
- 150000003077 polyols Chemical class 0.000 claims description 43
- 239000000853 adhesive Substances 0.000 claims description 41
- 230000001070 adhesive effect Effects 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 36
- 239000000203 mixture Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 23
- 239000002245 particle Substances 0.000 claims description 19
- 239000004094 surface-active agent Substances 0.000 claims description 18
- 239000003054 catalyst Substances 0.000 claims description 17
- 125000003118 aryl group Chemical group 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 229920002635 polyurethane Polymers 0.000 claims description 15
- 239000004814 polyurethane Substances 0.000 claims description 15
- 229920000768 polyamine Polymers 0.000 claims description 14
- 239000011236 particulate material Substances 0.000 claims description 12
- 229920000728 polyester Polymers 0.000 claims description 12
- 125000005442 diisocyanate group Chemical group 0.000 claims description 10
- 229920000570 polyether Polymers 0.000 claims description 10
- 229920000642 polymer Polymers 0.000 claims description 10
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 9
- 238000011065 in-situ storage Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 8
- 239000004088 foaming agent Substances 0.000 claims description 8
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 7
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 7
- 239000002667 nucleating agent Substances 0.000 claims description 7
- 239000004417 polycarbonate Substances 0.000 claims description 7
- 229920000515 polycarbonate Polymers 0.000 claims description 7
- 229920001610 polycaprolactone Polymers 0.000 claims description 6
- 239000004632 polycaprolactone Substances 0.000 claims description 6
- 229920000098 polyolefin Polymers 0.000 claims description 6
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 5
- 125000002947 alkylene group Chemical group 0.000 claims description 5
- 239000004202 carbamide Substances 0.000 claims description 5
- 239000004615 ingredient Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 238000011049 filling Methods 0.000 claims description 4
- 238000005187 foaming Methods 0.000 claims description 4
- 229920005906 polyester polyol Polymers 0.000 claims description 4
- 229920006295 polythiol Polymers 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 239000011593 sulfur Substances 0.000 claims description 4
- 210000004209 hair Anatomy 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920001634 Copolyester Polymers 0.000 claims description 2
- 244000043261 Hevea brasiliensis Species 0.000 claims description 2
- 239000001569 carbon dioxide Substances 0.000 claims description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 2
- 229920003174 cellulose-based polymer Polymers 0.000 claims description 2
- 125000004494 ethyl ester group Chemical group 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 229920003052 natural elastomer Polymers 0.000 claims description 2
- 229920001194 natural rubber Polymers 0.000 claims description 2
- 229920003051 synthetic elastomer Polymers 0.000 claims description 2
- 239000005061 synthetic rubber Substances 0.000 claims description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 239000008187 granular material Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 229920002725 thermoplastic elastomer Polymers 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 9
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 230000003287 optical effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 78
- 239000003795 chemical substances by application Substances 0.000 description 26
- 238000001723 curing Methods 0.000 description 22
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 19
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 14
- 150000002009 diols Chemical class 0.000 description 14
- 239000007789 gas Substances 0.000 description 14
- 239000002002 slurry Substances 0.000 description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- 239000002253 acid Substances 0.000 description 12
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 12
- 239000012948 isocyanate Substances 0.000 description 10
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 9
- 125000001931 aliphatic group Chemical group 0.000 description 9
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 229920000573 polyethylene Polymers 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 6
- 239000012530 fluid Substances 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 150000004985 diamines Chemical class 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000006260 foam Substances 0.000 description 5
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 239000005060 rubber Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 4
- 229920005830 Polyurethane Foam Polymers 0.000 description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229920002098 polyfluorene Polymers 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- 239000011496 polyurethane foam Substances 0.000 description 4
- 229910052707 ruthenium Inorganic materials 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 4
- 239000000052 vinegar Substances 0.000 description 4
- 235000021419 vinegar Nutrition 0.000 description 4
- VIOMIGLBMQVNLY-UHFFFAOYSA-N 4-[(4-amino-2-chloro-3,5-diethylphenyl)methyl]-3-chloro-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C(=C(CC)C(N)=C(CC)C=2)Cl)=C1Cl VIOMIGLBMQVNLY-UHFFFAOYSA-N 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 239000004821 Contact adhesive Substances 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 150000002923 oximes Chemical class 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 229920001084 poly(chloroprene) Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000151 polyglycol Polymers 0.000 description 3
- 239000010695 polyglycol Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000011541 reaction mixture Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 229910003468 tantalcarbide Inorganic materials 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- AZYRZNIYJDKRHO-UHFFFAOYSA-N 1,3-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC(C(C)(C)N=C=O)=C1 AZYRZNIYJDKRHO-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 229920002359 Tetronic® Polymers 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
- 235000013877 carbamide Nutrition 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000012936 correction and preventive action Methods 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 150000002429 hydrazines Chemical class 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 2
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 2
- DGTNSSLYPYDJGL-UHFFFAOYSA-N phenyl isocyanate Chemical compound O=C=NC1=CC=CC=C1 DGTNSSLYPYDJGL-UHFFFAOYSA-N 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229920001281 polyalkylene Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 150000003141 primary amines Chemical class 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- RKBCYCFRFCNLTO-UHFFFAOYSA-N triisopropylamine Chemical compound CC(C)N(C(C)C)C(C)C RKBCYCFRFCNLTO-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- UJPMYEOUBPIPHQ-UHFFFAOYSA-N 1,1,1-trifluoroethane Chemical compound CC(F)(F)F UJPMYEOUBPIPHQ-UHFFFAOYSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- QXRRAZIZHCWBQY-UHFFFAOYSA-N 1,1-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1(CN=C=O)CCCCC1 QXRRAZIZHCWBQY-UHFFFAOYSA-N 0.000 description 1
- VNMOIBZLSJDQEO-UHFFFAOYSA-N 1,10-diisocyanatodecane Chemical compound O=C=NCCCCCCCCCCN=C=O VNMOIBZLSJDQEO-UHFFFAOYSA-N 0.000 description 1
- FAZUWMOGQKEUHE-UHFFFAOYSA-N 1,2-bis(2-isocyanatoethyl)benzene Chemical compound O=C=NCCC1=CC=CC=C1CCN=C=O FAZUWMOGQKEUHE-UHFFFAOYSA-N 0.000 description 1
- WZROIUBWZBSCSE-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)naphthalene Chemical compound C1=CC=CC2=C(CN=C=O)C(CN=C=O)=CC=C21 WZROIUBWZBSCSE-UHFFFAOYSA-N 0.000 description 1
- PAAZPARNPHGIKF-UHFFFAOYSA-N 1,2-dibromoethane Chemical compound BrCCBr PAAZPARNPHGIKF-UHFFFAOYSA-N 0.000 description 1
- XFNJYAKDBJUJAJ-UHFFFAOYSA-N 1,2-dibromopropane Chemical compound CC(Br)CBr XFNJYAKDBJUJAJ-UHFFFAOYSA-N 0.000 description 1
- LUYHWJKHJNFYGV-UHFFFAOYSA-N 1,2-diisocyanato-3-phenylbenzene Chemical compound O=C=NC1=CC=CC(C=2C=CC=CC=2)=C1N=C=O LUYHWJKHJNFYGV-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- ZIZJPRKHEXCVLL-UHFFFAOYSA-N 1,3-bis(6-isocyanatohexyl)-1,3-diazetidine-2,4-dione Chemical compound O=C=NCCCCCCN1C(=O)N(CCCCCCN=C=O)C1=O ZIZJPRKHEXCVLL-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- RNQWXOKSUCPOFS-UHFFFAOYSA-N 1,4-dioxan-2-ol Chemical compound OC1COCCO1 RNQWXOKSUCPOFS-UHFFFAOYSA-N 0.000 description 1
- RHNNQENFSNOGAM-UHFFFAOYSA-N 1,8-diisocyanato-4-(isocyanatomethyl)octane Chemical compound O=C=NCCCCC(CN=C=O)CCCN=C=O RHNNQENFSNOGAM-UHFFFAOYSA-N 0.000 description 1
- QUPKOUOXSNGVLB-UHFFFAOYSA-N 1,8-diisocyanatooctane Chemical compound O=C=NCCCCCCCCN=C=O QUPKOUOXSNGVLB-UHFFFAOYSA-N 0.000 description 1
- OBTNQJQVKQVMSI-UHFFFAOYSA-N 1-[2-(1-hydroxycyclohexyl)propan-2-yl]cyclohexan-1-ol Chemical compound C1CCCCC1(O)C(C)(C)C1(O)CCCCC1 OBTNQJQVKQVMSI-UHFFFAOYSA-N 0.000 description 1
- MPPPKRYCTPRNTB-UHFFFAOYSA-N 1-bromobutane Chemical compound CCCCBr MPPPKRYCTPRNTB-UHFFFAOYSA-N 0.000 description 1
- ZQXCQTAELHSNAT-UHFFFAOYSA-N 1-chloro-3-nitro-5-(trifluoromethyl)benzene Chemical compound [O-][N+](=O)C1=CC(Cl)=CC(C(F)(F)F)=C1 ZQXCQTAELHSNAT-UHFFFAOYSA-N 0.000 description 1
- KVPDWHPIRGLHFE-UHFFFAOYSA-N 1-ethylpiperidin-2-amine Chemical compound CCN1CCCCC1N KVPDWHPIRGLHFE-UHFFFAOYSA-N 0.000 description 1
- DTZHXCBUWSTOPO-UHFFFAOYSA-N 1-isocyanato-4-[(4-isocyanato-3-methylphenyl)methyl]-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(CC=2C=C(C)C(N=C=O)=CC=2)=C1 DTZHXCBUWSTOPO-UHFFFAOYSA-N 0.000 description 1
- XFEWMFDVBLLXFE-UHFFFAOYSA-N 1-isocyanatodecane Chemical compound CCCCCCCCCCN=C=O XFEWMFDVBLLXFE-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- MQXNNWDXHFBFEB-UHFFFAOYSA-N 2,2-bis(2-hydroxyphenyl)propane Chemical compound C=1C=CC=C(O)C=1C(C)(C)C1=CC=CC=C1O MQXNNWDXHFBFEB-UHFFFAOYSA-N 0.000 description 1
- HNRMPXKDFBEGFZ-UHFFFAOYSA-N 2,2-dimethylbutane Chemical class CCC(C)(C)C HNRMPXKDFBEGFZ-UHFFFAOYSA-N 0.000 description 1
- RULKYXXCCZZKDZ-UHFFFAOYSA-N 2,3,4,5-tetrachlorophenol Chemical compound OC1=CC(Cl)=C(Cl)C(Cl)=C1Cl RULKYXXCCZZKDZ-UHFFFAOYSA-N 0.000 description 1
- XVSJTVAPLGSCSK-UHFFFAOYSA-N 2,3,6-trimethylbenzenethiol Chemical compound CC1=CC=C(C)C(S)=C1C XVSJTVAPLGSCSK-UHFFFAOYSA-N 0.000 description 1
- ZVDSMYGTJDFNHN-UHFFFAOYSA-N 2,4,6-trimethylbenzene-1,3-diamine Chemical compound CC1=CC(C)=C(N)C(C)=C1N ZVDSMYGTJDFNHN-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- PKKDWPSOOQBWFB-UHFFFAOYSA-N 2,4-dichloro-6-[(3,5-dichloro-2-hydroxyphenyl)methyl]phenol Chemical compound OC1=C(Cl)C=C(Cl)C=C1CC1=CC(Cl)=CC(Cl)=C1O PKKDWPSOOQBWFB-UHFFFAOYSA-N 0.000 description 1
- HGXVKAPCSIXGAK-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine;4,6-diethyl-2-methylbenzene-1,3-diamine Chemical compound CCC1=CC(CC)=C(N)C(C)=C1N.CCC1=CC(C)=C(N)C(CC)=C1N HGXVKAPCSIXGAK-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- ATEBGNALLCMSGS-UHFFFAOYSA-N 2-chloro-1,1-difluoroethane Chemical compound FC(F)CCl ATEBGNALLCMSGS-UHFFFAOYSA-N 0.000 description 1
- WKYYYUWKFPFVEY-UHFFFAOYSA-N 2-ethylcyclohexan-1-one Chemical compound CCC1CCCCC1=O WKYYYUWKFPFVEY-UHFFFAOYSA-N 0.000 description 1
- GNDOBZLRZOCGAS-JTQLQIEISA-N 2-isocyanatoethyl (2s)-2,6-diisocyanatohexanoate Chemical compound O=C=NCCCC[C@H](N=C=O)C(=O)OCCN=C=O GNDOBZLRZOCGAS-JTQLQIEISA-N 0.000 description 1
- VXHRHHAEVWHZBK-UHFFFAOYSA-N 2-methyl-4,6-di(propan-2-yl)benzene-1,3-diamine Chemical compound CC(C)C1=CC(C(C)C)=C(N)C(C)=C1N VXHRHHAEVWHZBK-UHFFFAOYSA-N 0.000 description 1
- DDTKYVBFPULMGN-UHFFFAOYSA-N 2-methyl-6-propan-2-ylaniline Chemical compound CC(C)C1=CC=CC(C)=C1N DDTKYVBFPULMGN-UHFFFAOYSA-N 0.000 description 1
- DTBDAFLSBDGPEA-UHFFFAOYSA-N 3-Methylquinoline Natural products C1=CC=CC2=CC(C)=CN=C21 DTBDAFLSBDGPEA-UHFFFAOYSA-N 0.000 description 1
- PGSWEKYNAOWQDF-UHFFFAOYSA-N 3-methylcatechol Chemical compound CC1=CC=CC(O)=C1O PGSWEKYNAOWQDF-UHFFFAOYSA-N 0.000 description 1
- MWMODOXJCVGXML-UHFFFAOYSA-N 3-methylnonane-2,2-diol Chemical compound CCCCCCC(C)C(C)(O)O MWMODOXJCVGXML-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- QTNWDKOORXWKLY-UHFFFAOYSA-N 4,4-dipropylcyclohexan-1-ol Chemical compound CCCC1(CCC)CCC(O)CC1 QTNWDKOORXWKLY-UHFFFAOYSA-N 0.000 description 1
- RQEOBXYYEPMCPJ-UHFFFAOYSA-N 4,6-diethyl-2-methylbenzene-1,3-diamine Chemical compound CCC1=CC(CC)=C(N)C(C)=C1N RQEOBXYYEPMCPJ-UHFFFAOYSA-N 0.000 description 1
- NWIVYGKSHSJHEF-UHFFFAOYSA-N 4-[(4-amino-3,5-diethylphenyl)methyl]-2,6-diethylaniline Chemical compound CCC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(CC)C=2)=C1 NWIVYGKSHSJHEF-UHFFFAOYSA-N 0.000 description 1
- OMHOXRVODFQGCA-UHFFFAOYSA-N 4-[(4-amino-3,5-dimethylphenyl)methyl]-2,6-dimethylaniline Chemical compound CC1=C(N)C(C)=CC(CC=2C=C(C)C(N)=C(C)C=2)=C1 OMHOXRVODFQGCA-UHFFFAOYSA-N 0.000 description 1
- QJENIOQDYXRGLF-UHFFFAOYSA-N 4-[(4-amino-3-ethyl-5-methylphenyl)methyl]-2-ethyl-6-methylaniline Chemical compound CC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(C)C=2)=C1 QJENIOQDYXRGLF-UHFFFAOYSA-N 0.000 description 1
- KZTROCYBPMKGAW-UHFFFAOYSA-N 4-[[4-amino-3,5-di(propan-2-yl)phenyl]methyl]-2,6-di(propan-2-yl)aniline Chemical compound CC(C)C1=C(N)C(C(C)C)=CC(CC=2C=C(C(N)=C(C(C)C)C=2)C(C)C)=C1 KZTROCYBPMKGAW-UHFFFAOYSA-N 0.000 description 1
- AKZOLEPNYXGNEH-UHFFFAOYSA-N 4-methyl-2,6-di(propan-2-yl)benzene-1,3-diamine Chemical compound CC(C)C1=CC(C)=C(N)C(C(C)C)=C1N AKZOLEPNYXGNEH-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920002972 Acrylic fiber Polymers 0.000 description 1
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 241000894006 Bacteria Species 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- YDNKGFDKKRUKPY-JHOUSYSJSA-N C16 ceramide Natural products CCCCCCCCCCCCCCCC(=O)N[C@@H](CO)[C@H](O)C=CCCCCCCCCCCCCC YDNKGFDKKRUKPY-JHOUSYSJSA-N 0.000 description 1
- NSSUVSFTLQNMIR-UHFFFAOYSA-N CC1=C(C)C=CC=C1.N=C=O.N=C=O.N=C=O Chemical compound CC1=C(C)C=CC=C1.N=C=O.N=C=O.N=C=O NSSUVSFTLQNMIR-UHFFFAOYSA-N 0.000 description 1
- UMUMNISGPKEFJX-UHFFFAOYSA-N CCCCCCCCCCC1CCCCC1.N=C=O.N=C=O Chemical compound CCCCCCCCCCC1CCCCC1.N=C=O.N=C=O UMUMNISGPKEFJX-UHFFFAOYSA-N 0.000 description 1
- KSTCCNSXHIGYPJ-UHFFFAOYSA-N CN(CC1=CC=CC=C1)C.NN Chemical compound CN(CC1=CC=CC=C1)C.NN KSTCCNSXHIGYPJ-UHFFFAOYSA-N 0.000 description 1
- 229910021532 Calcite Inorganic materials 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 244000241257 Cucumis melo Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- HTIRHQRTDBPHNZ-UHFFFAOYSA-N Dibutyl sulfide Chemical compound CCCCSCCCC HTIRHQRTDBPHNZ-UHFFFAOYSA-N 0.000 description 1
- 239000004338 Dichlorodifluoromethane Substances 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 241000233866 Fungi Species 0.000 description 1
- 241000245772 Gasteria Species 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- OWIKHYCFFJSOEH-UHFFFAOYSA-N Isocyanic acid Chemical compound N=C=O OWIKHYCFFJSOEH-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- LKDRXBCSQODPBY-AMVSKUEXSA-N L-(-)-Sorbose Chemical compound OCC1(O)OC[C@H](O)[C@@H](O)[C@@H]1O LKDRXBCSQODPBY-AMVSKUEXSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 239000002879 Lewis base Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 241001112258 Moca Species 0.000 description 1
- 241001595898 Monophlebidae Species 0.000 description 1
- CRJGESKKUOMBCT-VQTJNVASSA-N N-acetylsphinganine Chemical compound CCCCCCCCCCCCCCC[C@@H](O)[C@H](CO)NC(C)=O CRJGESKKUOMBCT-VQTJNVASSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-O N-dimethylethanolamine Chemical compound C[NH+](C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-O 0.000 description 1
- ZMRNTPSLQDZXBU-UHFFFAOYSA-N N=C=O.N=C=O.C12=CC=CC=C2NC2=C1C=CC=C2CC Chemical compound N=C=O.N=C=O.C12=CC=CC=C2NC2=C1C=CC=C2CC ZMRNTPSLQDZXBU-UHFFFAOYSA-N 0.000 description 1
- BYKRKNWETSJWGI-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=C2C3=CC=C(Cl)C(Cl)=C3NC2=C1 Chemical compound N=C=O.N=C=O.C1=CC=C2C3=CC=C(Cl)C(Cl)=C3NC2=C1 BYKRKNWETSJWGI-UHFFFAOYSA-N 0.000 description 1
- OGTYCYGFMVPCCV-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=C2C3=CC=CC=C3NC2=C1 Chemical compound N=C=O.N=C=O.C1=CC=C2C3=CC=CC=C3NC2=C1 OGTYCYGFMVPCCV-UHFFFAOYSA-N 0.000 description 1
- DNNXXFFLRWCPBC-UHFFFAOYSA-N N=C=O.N=C=O.C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C1=CC=CC=C1 DNNXXFFLRWCPBC-UHFFFAOYSA-N 0.000 description 1
- WMTLVUCMBWBYSO-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 WMTLVUCMBWBYSO-UHFFFAOYSA-N 0.000 description 1
- KYIMHWNKQXQBDG-UHFFFAOYSA-N N=C=O.N=C=O.CCCCCC Chemical compound N=C=O.N=C=O.CCCCCC KYIMHWNKQXQBDG-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- LRNAHSCPGKWOIY-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=CC=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=CC=C1 LRNAHSCPGKWOIY-UHFFFAOYSA-N 0.000 description 1
- GNSXQXWHNBJDPE-UHFFFAOYSA-N N=C=O.N=C=O.OCCO Chemical compound N=C=O.N=C=O.OCCO GNSXQXWHNBJDPE-UHFFFAOYSA-N 0.000 description 1
- 241000772415 Neovison vison Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- OXQPIGGFIZXSKU-UHFFFAOYSA-N OC1CCC(CC1)C=1NC2=CC=CC=C2C=1 Chemical compound OC1CCC(CC1)C=1NC2=CC=CC=C2C=1 OXQPIGGFIZXSKU-UHFFFAOYSA-N 0.000 description 1
- GBBDVMJBRZSBRW-UHFFFAOYSA-N OC=O.CCOC(N)=O Chemical compound OC=O.CCOC(N)=O GBBDVMJBRZSBRW-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- 229910033181 TiB2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 1
- FKJBEXVZCLVUPI-UHFFFAOYSA-N [3-hydroxy-2-(2-sulfanylacetyl)oxypropyl] 2-sulfanylacetate Chemical compound SCC(=O)OC(CO)COC(=O)CS FKJBEXVZCLVUPI-UHFFFAOYSA-N 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- KEZVEHRXAWUQOX-UHFFFAOYSA-N [O-2].[Fr+].[Fr+] Chemical compound [O-2].[Fr+].[Fr+] KEZVEHRXAWUQOX-UHFFFAOYSA-N 0.000 description 1
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 210000001015 abdomen Anatomy 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- AVMNFQHJOOYCAP-UHFFFAOYSA-N acetic acid;propanoic acid Chemical compound CC(O)=O.CCC(O)=O AVMNFQHJOOYCAP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 230000029936 alkylation Effects 0.000 description 1
- 238000005804 alkylation reaction Methods 0.000 description 1
- 229940037003 alum Drugs 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- DZYFUUQMKQBVBY-UHFFFAOYSA-N bis(2-isocyanatoethyl) carbonate Chemical compound O=C=NCCOC(=O)OCCN=C=O DZYFUUQMKQBVBY-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical compound NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229940106189 ceramide Drugs 0.000 description 1
- ZVEQCJWYRWKARO-UHFFFAOYSA-N ceramide Natural products CCCCCCCCCCCCCCC(O)C(=O)NC(CO)C(O)C=CCCC=C(C)CCCCCCCCC ZVEQCJWYRWKARO-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- MBZFMVVPAZRBEN-UHFFFAOYSA-N cyclohexane ethanol Chemical compound CCO.CCO.C1CCCCC1 MBZFMVVPAZRBEN-UHFFFAOYSA-N 0.000 description 1
- FNTHQRXVZDCWSP-UHFFFAOYSA-N cyclohexane-1,1,2-triol Chemical compound OC1CCCCC1(O)O FNTHQRXVZDCWSP-UHFFFAOYSA-N 0.000 description 1
- PDXRQENMIVHKPI-UHFFFAOYSA-N cyclohexane-1,1-diol Chemical compound OC1(O)CCCCC1 PDXRQENMIVHKPI-UHFFFAOYSA-N 0.000 description 1
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 1
- 125000004210 cyclohexylmethyl group Chemical group [H]C([H])(*)C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- UYDJAHJCGZTTHB-UHFFFAOYSA-N cyclopentane-1,1-diol Chemical compound OC1(O)CCCC1 UYDJAHJCGZTTHB-UHFFFAOYSA-N 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000012973 diazabicyclooctane Substances 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 1
- 235000019404 dichlorodifluoromethane Nutrition 0.000 description 1
- UMNKXPULIDJLSU-UHFFFAOYSA-N dichlorofluoromethane Chemical compound FC(Cl)Cl UMNKXPULIDJLSU-UHFFFAOYSA-N 0.000 description 1
- 229940099364 dichlorofluoromethane Drugs 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- SDTDHTCWRNVNAJ-UHFFFAOYSA-L dimethyltin(2+);diacetate Chemical compound CC(=O)O[Sn](C)(C)OC(C)=O SDTDHTCWRNVNAJ-UHFFFAOYSA-L 0.000 description 1
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical class C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- ZMUCVNSKULGPQG-UHFFFAOYSA-N dodecanedioic acid;hexane-1,6-diamine Chemical compound NCCCCCCN.OC(=O)CCCCCCCCCCC(O)=O ZMUCVNSKULGPQG-UHFFFAOYSA-N 0.000 description 1
- YLGZRMLFAGSRHM-UHFFFAOYSA-N dodecanoic acid;tin Chemical compound [Sn].CCCCCCCCCCCC(O)=O YLGZRMLFAGSRHM-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- HGVSZIWPYBQNOR-UHFFFAOYSA-N ethane-1,2-diol;propane-1,3-diol Chemical compound OCCO.OCCCO HGVSZIWPYBQNOR-UHFFFAOYSA-N 0.000 description 1
- 125000005670 ethenylalkyl group Chemical group 0.000 description 1
- 238000007046 ethoxylation reaction Methods 0.000 description 1
- BFMKFCLXZSUVPI-UHFFFAOYSA-N ethyl but-3-enoate Chemical compound CCOC(=O)CC=C BFMKFCLXZSUVPI-UHFFFAOYSA-N 0.000 description 1
- 150000003947 ethylamines Chemical class 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 238000001640 fractional crystallisation Methods 0.000 description 1
- LNTHITQWFMADLM-UHFFFAOYSA-M gallate Chemical compound OC1=CC(C([O-])=O)=CC(O)=C1O LNTHITQWFMADLM-UHFFFAOYSA-M 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- WZWKEEOAUZXNJJ-UHFFFAOYSA-N isocyanato acetate Chemical compound CC(=O)ON=C=O WZWKEEOAUZXNJJ-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 229940102253 isopropanolamine Drugs 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002540 isothiocyanates Chemical class 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 150000007527 lewis bases Chemical class 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 150000004668 long chain fatty acids Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- PJUIMOJAAPLTRJ-UHFFFAOYSA-N monothioglycerol Chemical compound OCC(O)CS PJUIMOJAAPLTRJ-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- IHMIAJWIZXWVIN-UHFFFAOYSA-N n-ethyl-2,3,3-trimethylbutan-2-amine Chemical compound CCNC(C)(C)C(C)(C)C IHMIAJWIZXWVIN-UHFFFAOYSA-N 0.000 description 1
- VVGIYYKRAMHVLU-UHFFFAOYSA-N newbouldiamide Natural products CCCCCCCCCCCCCCCCCCCC(O)C(O)C(O)C(CO)NC(=O)CCCCCCCCCCCCCCCCC VVGIYYKRAMHVLU-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- CQRYARSYNCAZFO-UHFFFAOYSA-N o-hydroxybenzyl alcohol Natural products OCC1=CC=CC=C1O CQRYARSYNCAZFO-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- BVJSUAQZOZWCKN-UHFFFAOYSA-N p-hydroxybenzyl alcohol Chemical compound OCC1=CC=C(O)C=C1 BVJSUAQZOZWCKN-UHFFFAOYSA-N 0.000 description 1
- RUOPINZRYMFPBF-UHFFFAOYSA-N pentane-1,3-diol Chemical compound CCC(O)CCO RUOPINZRYMFPBF-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- PJGSXYOJTGTZAV-UHFFFAOYSA-N pinacolone Chemical compound CC(=O)C(C)(C)C PJGSXYOJTGTZAV-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- NFQPKQCSKRLPHP-UHFFFAOYSA-N propyl cyanate Chemical compound CCCOC#N NFQPKQCSKRLPHP-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 239000012970 tertiary amine catalyst Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 150000003573 thiols Chemical group 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005829 trimerization reaction Methods 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000002888 zwitterionic surfactant Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
- B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
- B32B5/20—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material foamed in situ
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/02—Organic
- B32B2266/0214—Materials belonging to B32B27/00
- B32B2266/0278—Polyurethane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/08—Closed cell foam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/554—Wear resistance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2432/00—Cleaning articles, e.g. mops, wipes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2475/00—Frictional elements
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polyurethanes Or Polyureas (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
1287481 九、發明說明: 【發明所屬之技彳好領域】 發明領域 本發明關於一種用於改變一工作件之表面的物件。尤 5其,本發明係著重於一種具有一窗部的拋光墊。更特別地, 此拋光墊可包括聚氨酯脲材料,其中至少部分充填氣體之 胞室是實質上均一地分佈在整個材料及/或拋光墊中。此 聚氨酯脲材料可藉由組合聚異氰酸酯及〆或聚氨酯預聚 物;含羥基材料;含胺材料及發泡劑來製備。根據本發明 10之拋光墊可用於拋光物件,以及尤其可用於例如但不限制 於半導體晶圓之微電子元件及光學電子元件的化學機械抛 光或平坦化。拋光墊之窗部是至少部分透明的,且因此特 別有用與配備有通過磨板(through 一 the-platen)晶圓計量 學的拋光或平坦化工具一起作用。 15 【】 發明背景 例如微電子元件之物件的粗糙表面之拋光或平坦化成 實質平滑的表面,一般涉及使用一經控制及重覆的動作, 以利用一拋光之工作表面摩擦此粗糙表面。拋光流體可夾 20置於待拋光的此物件的此粗糙表面及此拋光墊的工作表面 之間。 電子元件的製造可包含在半導體基板上形成多數積體 電路。基板的組成玎包括石夕或坤化鎵。積體路一般可藉由 一糸列的方法步‘形成,其中例如導電性、絕緣性及半導 1287481 7Y材料之材料的圖案化層係形成在基板上。為了使每— 晶圓之積體電路密度達到最大化 ,理想的是在整個製造過 秋的不同卩昏 一 权肀,具有平坦之經拋光基板。因此,微電子 凡件的製造—奴、 、。一股涉及一拋光步驟以及通常可涉及多數拋光 5 步驟,盆可道從 、J导致一個以上之拋光墊的使用。 光v驟可包括在抛光流體存在下,使抛光塾及半導 體基板彼此靠抵地旋轉。拋光流體可為弱驗性且可任擇地 3有一研磨劑顆粒材料,例如但不限制於顆粒態氧化鈽、 顆粒態氧化銘,或顆粒態氧化石夕。拋光流體可促進被磨掉 1〇的材料自物件之粗糙表面移除及輸送離開。 例如孔洞體積及孔洞尺寸等拋光墊特性,可因拋光塾 不同而改變,以及在一特定拋光墊之整個操作壽命期間改 變。抛光墊之拋光特性上的改變可造成不當拋光及平坦化 的基板,其不適於製造半導體晶圓。因此,所欲為發展一 15種拋光墊,其在拋光及平坦化特性上,呈現降低之拋光墊 間差異。進一步所欲為發展一種拋光墊,其在該拋光塾的 整個操作壽命期間,呈現降低之拋光及平坦化特性的改變。 習知技術領域已知當晶圓固持於平坦化工具中並與拋 光塾接觸時,平坦化工具具有測量平坦化製程之進展的能 2〇力。在平坦化製程期間,測量平坦化一微電子元件的進展 可參考習知習知技術中的“原地計量學”。美國專利第 5, 964, 643號及第6, 159, 073號,以及歐洲專利第 1,108, 501號描述拋光或平坦化工具,以及原地計量學系 統。一般而言,原地計量學可包括導引一光束通過位在該 1287481 磨板之至)部分透明窗部,該光束可自該晶圓之表 可勺士出來’回到磨板的窗部’並進入一檢測器。抛光塾 少其對:!用於計量學系統的波長而言是至 5 的以及貫質上與該磨板的窗部對齊。 量與所欲為發展一種拋光塾,其包含可用於原地計 予以部區域。進—步所欲為在減墊的整個操作 ^間,窗部提供適當的透明性。 利用具有與抛光表面共平面之窗部的習知抛光塾的一 缺點可包括窗部部分的磨耗速率較拋光墊表面的磨耗速率 〇 f又。利用具有共平面窗部的習知拋光墊的另—缺點可包括 囪部的刮痕,該刮痕為該窗部在拋光或平坦化製程期間, 與漿液中研磨劑顆粒接觸的結果。被刮傷的窗部一般會降 低窗部的透明性且可降低計量學訊號的衰減。 【發明内容】 15 發明概要 本發明包括適合於拋光一電子基板之塾。此拋包括含 有聚氨酯脲拋光層。此拋光層可包括至少部分充填氣體之 胞室,至少一部分之該至少部分充填氣體的胞室可藉由原 地反應形成。拋光層具有形成於該層中的一開口。本發明 20之墊包括第二層,其中至少一部分之該第二層可包括一至 少部分透明的窗部。拋光層係至少部分連接至該第二層, 以及該拋光層中的開口係至少部分地與該第二層之該窗部 對齊。 本發明包括一種具有一窗部之抛光墊。此拋光墊可包 7 !28748l 括第-層及第二層。第二層可至少部分地連接至該第一層。 一連接至”-詞意指聯結在—起或直接放置的關係,或由 一或多種界於中間之材料所產生之間接放置的關係。第一 5 2可作為該墊之軸光層的玉作表面。該抛光層可至少部 5分地與待拋光之基板及拋光聚液接觸。在-非限制的具體 •中至少部分之該墊的第二層可包含一窗部,該窗部 對於拋光工具之計量學設備所使用之波長為至少部分透 • 月。在一非限制的具體例中,本發明之拋光墊可包括一次 1墊層,該次墊層係至少部分地連铎至該第二層。在一非限 10制的具體例中,胞室可實質均一分佈在整個材料及/或抛 光層中。 在替換的非限制之具體例中,本發明之聚氨酯脲可藉 由組合具有含經基材料之聚異氰酸酯、含胺材料及發泡劑 來製備;或藉由反應包含組合聚異氰酸酯及含羥基材料以 形成♦氨知預聚物之二成分組成物,並接著使預聚物與 % 含胺材料及發泡劑來製備;或藉由組合聚異氰酸酯及/或 聚氨酯脲預聚物,任擇之含羥基材料、含胺材料及發泡劑 來製備。1287481 IX. INSTRUCTIONS: [Technical Fields to Which the Invention pertains] Field of the Invention The present invention relates to an article for changing the surface of a work piece. In particular, the present invention focuses on a polishing pad having a window portion. More particularly, the polishing pad can comprise a polyurethaneurea material wherein at least a portion of the gas-filled cells are substantially uniformly distributed throughout the material and/or polishing pad. The polyurethaneurea material can be prepared by combining a polyisocyanate and a ruthenium or polyurethane prepolymer; a hydroxyl group-containing material; an amine-containing material and a foaming agent. The polishing pad according to the present invention 10 can be used for polishing articles, and is particularly useful for chemical mechanical polishing or planarization of, for example, but not limited to, microelectronic components and optical electronic components of semiconductor wafers. The window of the polishing pad is at least partially transparent and is therefore particularly useful in conjunction with polishing or planarization tools equipped with through-the-platen wafer metrology. BACKGROUND OF THE INVENTION Polishing or planarizing a rough surface of an article such as a microelectronic component into a substantially smooth surface generally involves the use of a controlled and repeated action to rub the roughened surface with a polished working surface. A polishing fluid clip 20 is placed between the rough surface of the article to be polished and the working surface of the polishing pad. Fabrication of electronic components can include forming a plurality of integrated circuits on a semiconductor substrate. The composition of the substrate includes Shi Xi or Kun. The integrated circuit can generally be formed by a method of forming a pattern in which a patterned layer of a material such as conductivity, insulating, and semi-conductive material 1287481 7Y is formed on the substrate. In order to maximize the integrated circuit density per wafer, it is desirable to have a flat polished substrate throughout the entire manufacturing process. Therefore, the manufacture of microelectronics - slaves, . One involves a polishing step and typically involves a majority of polishing steps, and the basin can lead to the use of more than one polishing pad. The light v may include rotating the polishing crucible and the semiconductor substrate against each other in the presence of a polishing fluid. The polishing fluid can be weakly and optionally 3 with an abrasive particulate material such as, but not limited to, particulate cerium oxide, particulate oxidation, or particulate oxidized oxide. The polishing fluid promotes the removal of material from the rough surface of the article and transport away. Polishing pad characteristics such as hole volume and hole size can vary from polishing to polishing and can change over the life of a particular polishing pad. Changes in the polishing characteristics of the polishing pad can result in improperly polished and planarized substrates that are not suitable for fabricating semiconductor wafers. Therefore, there is a desire to develop a polishing pad that exhibits reduced polishing pad differences in polishing and planarization characteristics. It is further desired to develop a polishing pad that exhibits reduced polishing and planarization characteristics throughout the operational life of the polishing crucible. It is known in the art that when a wafer is held in a planarizing tool and brought into contact with a polishing pad, the planarizing tool has the ability to measure the progress of the planarization process. The measurement of the progress of planarizing a microelectronic component during the planarization process can be referred to "in situ metrology" in the prior art. Polishing or planarizing tools, as well as in situ metrology systems, are described in U.S. Patent Nos. 5,964,643 and 6,159,073, and European Patent No. 1,108,501. In general, in situ metrology can include directing a beam of light through a portion of the transparent window located at the 1287481 plate, the beam can be ejected from the surface of the wafer to return to the window of the plate. 'And enter a detector. Polished 塾 Lesser: The wavelength used for the metrology system is up to 5 and is aligned with the window of the plate. Quantitative and desired to develop a polished enamel that contains areas that can be used in situ. The step is to provide proper transparency for the window during the entire operation of the pad. One disadvantage of conventional polishing crucibles having a window portion that is coplanar with the polishing surface can include a wear rate of the window portion that is greater than the wear rate of the polishing pad surface. Another disadvantage of utilizing conventional polishing pads having coplanar windows can include scratches in the bakes that are the result of contact of the window with abrasive particles in the slurry during the polishing or planarization process. The scratched window generally reduces the transparency of the window and reduces the attenuation of the metrology signal. SUMMARY OF THE INVENTION 15 SUMMARY OF THE INVENTION The present invention includes a crucible suitable for polishing an electronic substrate. This polishing includes a polishing layer containing a polyurethane urea. The polishing layer can include a cell that is at least partially filled with a gas, and at least a portion of the at least partially gas-filled cell can be formed by in situ reaction. The polishing layer has an opening formed in the layer. The pad of the present invention 20 includes a second layer, wherein at least a portion of the second layer can include a window portion that is at least partially transparent. A polishing layer is at least partially coupled to the second layer, and an opening in the polishing layer is at least partially aligned with the window portion of the second layer. The invention includes a polishing pad having a window portion. This polishing pad can cover 7 !28748l including the first layer and the second layer. The second layer can be at least partially connected to the first layer. A connection to a "-" means a relationship that is joined in a direct or direct placement, or a relationship that is created by one or more materials in the middle. The first 52 can be used as the jade of the pad. The polishing layer can be in contact with the substrate to be polished and the polishing liquid at least 5 minutes. In the non-limiting embodiment, at least part of the second layer of the pad can comprise a window portion, the window portion The wavelength of the polishing tool is at least partially transparent. In a non-limiting embodiment, the polishing pad of the present invention may comprise a primary pad, the secondary layer being at least partially connected to the The second layer. In a non-limiting 10 embodiment, the cells may be substantially uniformly distributed throughout the material and/or the polishing layer. In an alternative, non-limiting embodiment, the polyurethaneurea of the present invention may be combined Prepared with a polyisocyanate containing a base material, an amine-containing material, and a foaming agent; or by reacting a combination of a polyisocyanate and a hydroxyl-containing material to form a two-component composition of a known amino acid prepolymer, and then prepolymerizing And % amine-containing materials and Foaming agent was prepared; or by a combination of polyisocyanate and / or polyurethane urea prepolymer, the optional hydroxyl-containing materials, amine-containing material and a blowing agent is prepared.
t實施方式]I 20 較佳實施例之詳細說明 在一非限制的具體例中,胞室可實質均一地分佈在整 個材料及/或拋光墊内。在另一非限制的具體例中,聚氨 酉曰脲可藉由組合聚異氰酸酯、含羥基材料、含胺材料及發 /包劑來製備。在另一非限制的具體例中,聚氨酯脲可藉由 8 1287481 聚異氰酸酯官能性聚氨酯預聚物與聚胺及發泡劑的縮合聚 合作用來製備。在又一非限制的具體例中,聚氨酯脲可藉 由組合聚異氰酸酯及聚氨酯預聚物,任擇的含羥基材料、 含胺材料及發泡劑來形成。在一非限制的具體例中,至少 一部分之拋光墊可包含一窗部,其對於拋光工具之計量學 設備所使用之波長為至少部分透明。t. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a non-limiting embodiment, the cells may be substantially uniformly distributed throughout the material and/or polishing pad. In another non-limiting embodiment, the polyurethane carbamide can be prepared by combining a polyisocyanate, a hydroxyl-containing material, an amine-containing material, and a hair/bag. In another non-limiting embodiment, the polyurethaneurea can be prepared by condensation polymerization of 81287481 polyisocyanate functional polyurethane prepolymer with a polyamine and a blowing agent. In yet another non-limiting embodiment, the polyurethaneurea can be formed by combining a polyisocyanate and a polyurethane prepolymer, optionally a hydroxyl-containing material, an amine-containing material, and a blowing agent. In a non-limiting embodiment, at least a portion of the polishing pad can comprise a window portion that is at least partially transparent to the wavelength used by the metrology device of the polishing tool.
在替換的非限制的具體例中,聚異氰酸酯、含羥基材 料及含胺材料的量可經選擇,以致於(NC〇 + NCS) : (NH + 0H)的當量比可大於〇·95,或至少為1〇,或至少為 1〇 1· 05 ’或小於1· 3,或小於1· 2,或小於1· 1。 15 π ;衣爾本發明之聚氨酯脲的聚異氰酸酯是種類繁 多且廣泛變化。適當的聚異氰酸酯可包括但不限制於聚合 性及C2-C2Q線性、分支、環狀及芳族聚異氰酸酯。非限制的 例子可包括聚異氰酸醋,其具有選自於胺甲酸醋鍵聯 (-NH-C(0)-〇-)的主鏈鍵聯。 聚異氰酸醋的分子量可廣泛變化。在替換的非限制的 具體例中,數量平均分子量(Μη)可為至少刚克/莫 = 150克/莫耳,或小於15,_克,莫耳或小於_ 克/莫耳。數量平均分子量可使用已知方法來測量。 ^說财及切專利範财所記載之數量平均分子量的數 =错由使用聚笨乙稀標準品之凝膠滲透層析法(GPC)來 不限制於 適田之來異氰酸醋的非限制的例子可包括但 具有至少二異氰咖基的聚異氰酸醋。 20 1287481 異氰酸酯的非限制的例子可包括但不限制於脂族聚異 氰酸酯,環脂族聚異氰酸酯,其中一或多個異氰酸根基係 直接連接至環脂族環,環脂族聚異氰酸酯,其中一或多個 異氰酸根基未直接連接至環脂族環,芳族聚異氰酸酯,其 5中一或多個異氰酸根基係直接連接至芳族環,以及芳族聚 異氰酸酯,其中一或多個異氰酸根基未直接連接至芳族環。 在本發明之非限制的具體例中,聚異氰酸酯可包括但 不限制於脂族或環脂族二異氰酸酯、芳族二異氰酸酯、其 環狀一聚物及環狀三聚物,及其混合物。適當之聚異氰酸 1〇酯的非限制的例子可包括但不限制於Desm〇dur N 3300A(六 亞甲基二異氰酸酯三聚物),其在商業上可自Bayer取得; Desmodur N 3400 ( 60%六亞甲基二異氰酸酯二聚物及4〇 /6/、亞曱基一異策酸醋三聚物)。 在非限制的具體例中,聚異氰酸酯可包括二環己基甲 15烷二異氰酸酯及其異構物混合物。如同使用於本案說明及 申明專利範圍中者,“異構物混合物,,—詞意指聚異氛酸 酉曰之順順、反-反,及順_反異構物的混合物。使用於本發 明之異構物的非限制的例子可包括4, 4’ —亞曱基雙(環己基 異氰_)(在下文中稱為” PICM”(對異氛酸環己基甲 20烷))之反—反異構物、PICM之順-反異構物,PICM之順一 順異構物,及其混合物。 在一非限制的具體例中,使用於本發明之PICM可藉由 4知技術領域中已知的製程,光氣化4, 4,—亞甲基雙(環己 基月女)(PACM)來製備,此製程例如美國專利第2,料4, 〇〇7 1287481 號及第2, 680, 127號中所揭露者,此等專利文獻係併入本 案說明書中以供參考。ΡΑαΐ異構物混合物,在光氣化時, 在室溫下可產生液相、部分㈣,或固相的⑽。刪異 構物混合物可在水及例如甲醇及乙醇之醇類存在下,藉由 5二苯胺基甲院之氫化,以及/或藉由嶋異構物混合物之 分級結晶來獲得。 在非限制的具體例中,異構物混合物可含有1〇 一⑽ 百刀比之4, 4 -亞甲基雙(環己基異氰酸酉旨脚的反,反 異構物。 在非限制的具體例中,聚異氰酸酯可包括2, 4-甲笨 一異氰酸目曰、2,6-甲苯二異氰酸酯及此等異構物(” TDi”) 的混合物。 可使用於本發明之替換的非限制的具體例的其他脂族 及環脂族二異氰酸酯包括3_異氰酸 15環己基-異氛酸醋(”腹"),其在商業上可二 Chemical購得,以及間—四甲基二甲苯二異氰酸酯(1,3一 雙(1-異氰酸-1-甲基乙基)-笨),其在商業上可由Cytec Industries Inc·購得,商品名為TMXDIRTM (間)脂族異 氰酸酯。 20 如本案說明書及申請專利範圍中所使用者,脂族及環 脂族二異氰酸酯等詞語意指具有二個二異氰酸酯反應性端 基之6至100個連接成直鏈或成環的碳原子。在本發明之 非限制的具體例中,使用於本發明之脂族及環脂族二異氰 11 1287481 酸酯可包括TMXDI及化學式R-(NC0)2的化合物,其中R代 表脂族基團或環脂族基團。 適當的聚異氰酸酯之其他非限制的例子可包括但不限 制於脂族聚異氰酸酯;乙烯化不飽和聚異氰酸酯;脂環族 5 聚異氰酸酯;芳族聚異氰酸酯,其中異氰酸酯基未直接結 合至芳族環,例如α,α’ -二甲苯二異氰酸酯;芳族聚異氰 酸酯,其中異氰酸酯基直接結合至芳族環,例如苯二異氰 酸酯;聚異氰酸酯之i化、烷基化、烷氧基化、硝化、經 碳二亞胺改質、經脲改質及經縮二脲改質的衍生物;以及 ίο 聚異氰酸酯之二聚化及三聚化產物。 脂族聚異氰酸酯之其他非限制的例子可包括乙二醇二 異氰酸酯、三亞甲基二異氰酸酯、四亞曱基二異氰酸酯、 六亞甲基二異氰酸酯、八亞甲基二異氰酸酯、九亞甲基二 異氰酸酯、2,2’ -二甲基戊烷二異氰酸酯,2,2,4-三甲基 15 己烷二異氰酸酯、十亞甲基二異氰酸酯、2, 4, 4,-三曱基六 亞甲基二異氰酸酯、1,6, 11-十一烷三異氰酸酯、1,3, 6-六 亞曱基三異氰酸酯、1,8-二異氰酸根-4-(異氰酸甲酯基)辛 烷、2, 5, 7-二甲基-1,8-二異氰酸根-5-(異氰酸曱酯基)辛 烷、雙(異氰酸乙酯基)-碳酸酯、雙(異氰酸乙酯基)醚、2-20 異氰酸丙酯基-2, 6-二異氰酸根合己酸酯、離胺酸二異氰酸 甲酯以及離胺酸三異氰酸曱酯。 乙烯化不飽和聚異氰酸酯的例子可包括但不限制於丁 烯二異氰酸酯及1,3-丁二烯-1,4-二異氰酸酯。脂環族聚異 氰酸酯可包括但不限制於異氟爾酮二異氰酸酯、環己烷二 12 1287481 異氮酸酿、曱基環己烷二異氰酸酯、雙(異氰酸甲酯基)環 己烧雙(異氣酸環己醋基)曱烧、雙(異氰酸環己酉旨 基)—2, 2-丙烷、雙(異氰酸環己酯基卜丨,2—乙烷、2_異氰酸 甲醋基一3—(3—異氰酸丙酯基)-5-異氰酸甲酯基-二環 5 [2·2· 1卜庚烷、2-異氰酸甲酯基-3-(3-異氰酸丙酯基)-6- 異氮酸甲酿基—二環[2· 2· 1]一庚烷、2-異氰酸甲酯基-2-(3-異氰酸丙酯基)—5-異氰酸曱酯基-二環[2. 2. 1]_庚烷、2-異 氮酸曱S旨基—2一(3-異氰酸丙酯基)-6-異氰酸曱酯基-二環 [2·2·1]-庚烷、2-異氰酸甲酯基—3-(3-異氰酸丙酯 1〇基)一6一(2-異氰酸乙酯基)一二環[2· 2· 庚烷、2一異氰酸曱 酯基-2-(3~異氰酸丙酯基)_5—(2—異氰酸乙酯基)_二環 [2· 2. 1]-庚烷及2—異氰酸甲酯基—2_(3—異氰酸丙酯 基)—6—(2-異氰酸乙酯基)—二環[2· 2· J]-庚烷。 芳族聚異氰酸酯的例子中,其中未直接結合至芳族環 15之異氰酸酯基者,包括但不限制於雙(異氰酸乙酯基)苯、 α,α,α ,α -四甲基二甲苯二異氰酸酯、込3一雙〇一異氰 酸根-1-甲基乙基)苯、雙(異氰酸丁酯基)苯、雙(異氰酸甲 酯基)萘、雙(異氰酸甲酯基)二苯醚、雙(異氰酸乙酯基)鄰 苯一甲酸醋、莱基三異氰酸醋及2, 5-二(異氰酸甲醋基)吱 2〇喃。具有直接結合至芳族環之異氰酸酯基的芳族聚異氰酸 酯包括但不限制於伸苯基二異氰酸酯、乙基伸苯基二異氰 酸S旨、異丙基伸苯基二異氰酸g旨、二甲基伸苯基二異氛酸 酯、二乙基伸苯基二異氰酸酯、二異丙基伸苯基二異氰酸 酉曰、二甲基苯三異氰酸酯、苯三異氰酸酯、萘二異氰酸酯、 13 1287481 甲基伸萘基二異氰酸酯、聯苯基二異氰酸酯、鄰-曱苯胺二 異氰酸酯、鄰-亞甲苯基二異氰酸酯、鄰-甲苯二異氰酸酯、 4, 4’ -二苯基甲烷二異氰酸酯、雙(3-甲基-4-異氰酸苯酯 基)甲烷、雙(異氰酸苯酯基)乙烯、3,3’ -二曱氧基-聯苯 5 基-4, 4’ -二異氰酸酯、三苯基甲烷三異氰酸酯、聚合性 4, 4’ -二苯基甲烷二異氰酸酯、伸萘基三異氰酸酯、二苯 基甲烷-2, 4, 4’ -三異氰酸酯、4-甲基二苯基甲烷 -3,5,2’,4’,6’ -五異氰酸酯、二苯醚二異氰酸酯、雙(異 氰酸苯酯醚)乙二醇、雙(異氰酸苯酯醚)-1,3-丙二醇、苯 10 酮二異氰酸酯、咔唑二異氰酸酯、乙基咔唑二異氰酸酯及 二氯咔唑二異氰酸酯。 在本發明之替換的非限制的具體例中,聚異硫氰酸酯 或聚異氰酸酯及聚異硫氰酸酯的組合可用於取代聚異氰酸 酯。在此等替換的非限制的具體例中,異硫氰酸酯可具有 15 至少二異硫氰酸酯基。 在本發明之非限制的具體例中,使用於本發明之聚異 氰酸酯可包括聚氨酯預聚物。 在非限制的具體例中,聚異氰酸酯可與含羥基材料反 應以形成聚氨酯預聚物,以及該預聚物可與含胺材料及發 20 泡劑反應,以產生本發明之聚氨酯脲。在另一非限制的具 體例中,聚異氰酸酯及聚氨酯預聚物可與含羥基材料、含 胺材料及發泡劑反應。在另一非限制的具體例中,聚異氰 酸酯及聚氨酯預聚物可與含胺材料及發泡劑反應。 含羥基材料可改變且為習知技術領域中已知者。非限 14 1287481 制的例子可包括但不限制於多元醇;含硫材料,例如但不 限制於羥基官能性聚硫化物,以及含邠材料,例如但不限 制於多硫醇;以及兼倶羥基及硫醇官能基的材料。 使用於本發明之含羥基材料可包括習知技術領域中已 5知的廣泛不同的材料。非限制的例子可包括但不限制於聚 峻夕元醇、聚酯多元醇、聚己内酯多元醇、聚碳酸酯多元 醇,及其混合物。 聚醚多元醇及其製備方法對熟習該項技術者而言為已 知。各種不同形式及分子量之聚醚多元醇在商業上可自許 10多不同的製造商購得。聚醚多元醇之非限制的例子可包括 但不限制於聚氧伸烷基多元醇,以及聚烷氧基化多元醇。 聚氧伸烷基多元醇可根據已知方法製備。在一非限制的具 體例中’聚氧伸烧基多元醇可藉由利用多經基的起始劑或 多經基的起始劑的混合物之酸催化或鹼催化之加成作用, 15縮合伸烧基氧化物或伸烷基氧化物的混合物來製備,該多 .基的起始劑或多羥基的起始劑的混合物例如但不限制於 乙二醇、丙二醇、丙三醇及山梨糖醇。伸烷基氧化物之非 限制的例子可包括環氧乙烷、環氧丙烷、環氧丁烷、氧雜 環己烷、例如但不限制於氧化苯乙烯的伸芳烷基氧化物, 20以及環氧乙烷及環氧丙烷的混合物。在其他非限制的具體 例中,聚氧伸烷基多元醇可利用無規的或逐步的氧烷基化 作用,由伸烷基氧化物來製備。此類聚氧伸烷基多元醇之 非限制的例子包括聚氧乙烯,例如但不限制於聚乙二醇; 聚氧丙稀,例如但不限制於聚丙二醇。 15 1287481 在一非限制的具體例中,聚烧氧基化多元醇可由下述 通式代表: 5In an alternative non-limiting embodiment, the amount of polyisocyanate, hydroxyl-containing material, and amine-containing material may be selected such that the equivalent ratio of (NC〇+ NCS) :(NH + 0H) may be greater than 〇·95, or At least 1〇, or at least 1〇1· 05 ' or less than 1.3, or less than 1.2, or less than 1.1. 15 π; The polyisocyanate of the polyurethaneurea of the present invention is a wide variety and widely varied. Suitable polyisocyanates may include, but are not limited to, polymerizable and C2-C2Q linear, branched, cyclic, and aromatic polyisocyanates. Non-limiting examples may include polyisocyanuric acid having a backbone linkage selected from the group consisting of urethane linkages (-NH-C(0)-oxime-). The molecular weight of polyisocyanuric acid can vary widely. In a non-limiting, specific example of substitution, the number average molecular weight (?n) may be at least gram/mo = 150 g/mole, or less than 15, gram, mole or less than gram per mole. The number average molecular weight can be measured using known methods. ^The number of the average molecular weight recorded in the patent and the patent patents = wrong by the gel permeation chromatography (GPC) using the polystyrene standard is not limited to the non-isocyanic acid of the field Examples of the restrictions may include polyisocyanuric acid having at least diisocyanate. 20 1287481 Non-limiting examples of isocyanates may include, but are not limited to, aliphatic polyisocyanates, cycloaliphatic polyisocyanates in which one or more isocyanato groups are attached directly to a cycloaliphatic ring, a cycloaliphatic polyisocyanate, wherein One or more isocyanato groups are not directly bonded to a cycloaliphatic ring, an aromatic polyisocyanate, wherein one or more isocyanato groups in 5 are directly bonded to an aromatic ring, and an aromatic polyisocyanate, one of which A plurality of isocyanato groups are not directly attached to the aromatic ring. In a non-limiting embodiment of the invention, the polyisocyanate may include, but is not limited to, an aliphatic or cycloaliphatic diisocyanate, an aromatic diisocyanate, a cyclic monomer thereof, and a cyclic trimer, and mixtures thereof. Non-limiting examples of suitable poly-p-isocyanate may include, but are not limited to, Desm〇dur N 3300A (hexamethylene diisocyanate trimer), which is commercially available from Bayer; Desmodur N 3400 ( 60% hexamethylene diisocyanate dimer and 4〇/6/, fluorenylene-iso-fat vinegar terpolymer). In a non-limiting embodiment, the polyisocyanate may comprise dicyclohexylmethane diisocyanate and a mixture of isomers thereof. As used in the description of this case and in the scope of the patent, "isomer mixture," means a mixture of cis-trans, anti-trans, and cis-trans isomers of polyisocyanate. Non-limiting examples of the isomers of the invention may include the inverse of 4,4'-fluorenylene bis(cyclohexylisocyano-) (hereinafter referred to as "PICM" (for cyclohexylmethyl 20-alkane) - anti-isomers, cis-trans isomers of PICM, cis-isomers of PICM, and mixtures thereof. In a non-limiting embodiment, the PICMs used in the present invention can be used in the art of 4 A known process, phosgenation of 4, 4, methylene bis(cyclohexyl virgin) (PACM) is prepared, for example, U.S. Patent No. 2, material 4, 〇〇7 1287481 and 2, 680. , the disclosure of which is hereby incorporated by reference herein in its entirety in its entirety in its entirety in the entire disclosure in the the the the the the the the the the the the the the (10) The mixture of the isomers can be hydrogenated by a 5-diphenylamine group in the presence of water and an alcohol such as methanol and ethanol. And/or obtained by fractional crystallization of a mixture of hydrazines. In a non-limiting embodiment, the mixture of isomers may contain 1 〇 (10) hundred knives of 4,4-methylene bis(cyclohexyliso) In the non-limiting embodiment, the polyisocyanate may include 2,4-methylisocyanurate, 2,6-toluene diisocyanate, and the like. Mixture of ("TDi"). Other aliphatic and cycloaliphatic diisocyanates which may be used in the non-limiting specific examples of the present invention include 3-isocyanate 15-cyclohexyl-isoacetoic acid vinegar ("belly" ;), which is commercially available commercially, and m-tetramethylxylene diisocyanate (1,3-bis(1-isocyanate-1-methylethyl)-stupid), which is commercially available The above is commercially available from Cytec Industries Inc. under the trade name TMXDIRTM aliphatic isocyanate. 20 As used in the specification and claims, the terms aliphatic and cycloaliphatic diisocyanate mean two diisocyanates. 6 to 100 of the reactive end groups are bonded to a linear or cyclic carbon atom. In the present invention In a non-limiting specific example, the aliphatic and cycloaliphatic diisocyanate 11 1287481 acid esters useful in the present invention may include TMXDI and a compound of the formula R-(NC0)2 wherein R represents an aliphatic group or a cycloaliphatic Other non-limiting examples of suitable polyisocyanates may include, but are not limited to, aliphatic polyisocyanates; ethylenically unsaturated polyisocyanates; cycloaliphatic 5 polyisocyanates; aromatic polyisocyanates in which isocyanate groups are not directly bonded. To an aromatic ring, such as α,α'-xylene diisocyanate; an aromatic polyisocyanate in which an isocyanate group is directly bonded to an aromatic ring, such as phenyl diisocyanate; polyisocyanate i, alkylation, alkoxylation , nitrification, modification by carbodiimide, modification by urea and modification by biuret; and dimerization and trimerization of ίο polyisocyanate. Other non-limiting examples of aliphatic polyisocyanates may include ethylene glycol diisocyanate, trimethylene diisocyanate, tetradecyl diisocyanate, hexamethylene diisocyanate, octamethylene diisocyanate, nonamethylene di Isocyanate, 2,2'-dimethylpentane diisocyanate, 2,2,4-trimethyl 15 hexane diisocyanate, decamethylene diisocyanate, 2, 4, 4,-trimethyl hexamethylene Diisocyanate, 1,6,11-undecane triisocyanate, 1,3,6-hexadecylene triisocyanate, 1,8-diisocyanato-4-(isocyanatomethyl)octane , 2, 5, 7-Dimethyl-1,8-diisocyanato-5-(decyl isocyanate) octane, bis(isocyanatoethyl)-carbonate, bis(isocyanide) Acid ethyl ester)ether, 2-20 isocyanate-2,6-diisocyanatohexanoate, methyl cis-aminoisocyanate and decyl isocyanate. Examples of the ethylenically unsaturated polyisocyanate may include, but are not limited to, butadiene diisocyanate and 1,3-butadiene-1,4-diisocyanate. The alicyclic polyisocyanate may include, but is not limited to, isophorone diisocyanate, cyclohexane di 12 1287481 isochloric acid, decyl cyclohexane diisocyanate, bis(isocyanatomethyl) cyclohexane (isohalic acid cyclohexyl vinegar) bismuth, bis(isocyanatocyclohexanyl)-2, 2-propane, bis(cyclohexyl isocyanate, 2-ethane, 2-iso Methyl cyanate-3-(3-isocyanate)-5-isocyanatomethyl-bicyclo 5 [2·2·1 heptane, 2-isocyanatomethyl group- 3-(3-Isocyanate)-6-isoxanoate-dicyclo[2·2·1]-heptane, 2-isocyanatomethyl-2-(3-iso) Propyl cyanate) 5-isocyanate-dicyclo[2.2.1]-heptane, 2-isoxanosium sulfonate S- 2-(3-isocyanatopropyl) - 6-Iso isocyanyl-bicyclo[2·2·1]-heptane, 2-isocyanatomethyl 3-(3-isocyanatopropyl) (2-isocyanatoethyl)-bicyclo[2·2·heptane, 2-isocyanatosyl-2-(3~isocyanatopropyl)_5-(2-isocyanate Ethyl))bicyclo[2·2]-heptane and 2-isocyanatomethyl- 2_(3-isocyanate Ethyl) 6-(2-isocyanatoethyl)-bicyclo[2·2·J]-heptane. In the case of an aromatic polyisocyanate, an isocyanate group which is not directly bonded to the aromatic ring 15 Including but not limited to bis(isocyanatoethyl)benzene, α,α,α,α-tetramethylxylene diisocyanate, 込3-biguanide-isocyanato-1-methylethyl Benzene, bis(isobutyloctylate)benzene, bis(isocyanatomethyl)naphthalene, bis(isocyanatomethyl)diphenyl ether, bis(isocyanatoethyl) phthalate Formic acid vinegar, lysine triisocyanate and 2, 5-di(isocyanatoacetate) oxime. The aromatic polyisocyanate having an isocyanate group directly bonded to the aromatic ring includes, but is not limited to, phenyl diisocyanate, ethyl phenyl diisocyanate, isopropyl phenyl diisocyanate, and Methyl phenyl diisocyanate, diethylphenyl diisocyanate, diisopropyl phenyl diisocyanate, dimethyl benzene triisocyanate, benzene triisocyanate, naphthalene diisocyanate, 13 1287481 Exo-naphthyl diisocyanate, biphenyl diisocyanate, o-nonanilide diisocyanate, o-tolyl diisocyanate, o-toluene diisocyanate, 4, 4'-diphenylmethane diisocyanate, bis (3- Methyl 4-isocyanatophenyl)methane, bis(phenylisocyanate)ethylene, 3,3'-dimethoxy-biphenyl-5-yl-4,4'-diisocyanate, triphenyl Methane triisocyanate, polymerizable 4,4'-diphenylmethane diisocyanate, naphthyltriisocyanate, diphenylmethane-2,4,4'-triisocyanate, 4-methyldiphenylmethane-3 ,5,2',4',6'-penta-isocyanate, diphenyl ether diisocyanate, double (different Acid phenyl ester ether) glycol, bis (phenyl isocyanate ether) -1,3-propanediol, 10 one benzene diisocyanate, carbazole diisocyanate, ethylcarbazole diisocyanate and dichloro-carbazole diisocyanate. In an alternative, non-limiting embodiment of the invention, a polyisothiocyanate or a combination of a polyisocyanate and a polyisothiocyanate can be used in place of the polyisocyanate. In such non-limiting, specific examples, the isothiocyanate may have 15 at least diisothiocyanate groups. In a non-limiting embodiment of the invention, the polyisocyanate used in the present invention may comprise a polyurethane prepolymer. In a non-limiting embodiment, the polyisocyanate can be reacted with a hydroxyl-containing material to form a polyurethane prepolymer, and the prepolymer can be reacted with an amine-containing material and a foaming agent to produce the polyurethaneurea of the present invention. In another non-limiting embodiment, the polyisocyanate and polyurethane prepolymer can be reacted with a hydroxyl-containing material, an amine-containing material, and a blowing agent. In another non-limiting embodiment, the polyisocyanate and polyurethane prepolymer can be reacted with an amine-containing material and a blowing agent. Hydroxyl-containing materials can vary and are known in the art. Examples of non-limiting 14 1287481 may include, but are not limited to, polyols; sulfur-containing materials such as, but not limited to, hydroxy-functional polysulfides, and ruthenium-containing materials such as, but not limited to, polythiols; A material of a thiol functional group. The hydroxyl-containing materials used in the present invention may include a wide variety of materials which are known in the prior art. Non-limiting examples can include, but are not limited to, polyglycols, polyester polyols, polycaprolactone polyols, polycarbonate polyols, and mixtures thereof. Polyether polyols and methods for their preparation are known to those skilled in the art. Polyether polyols of various forms and molecular weights are commercially available from more than 10 different manufacturers. Non-limiting examples of polyether polyols can include, but are not limited to, polyoxyalkylene polyols, as well as polyalkoxylated polyols. Polyoxyalkylene polyols can be prepared according to known methods. In a non-limiting embodiment, the polyoxyalkylene-based polyol can be subjected to an acid-catalyzed or base-catalyzed addition using a mixture of a polyhydric radical initiator or a polyhydric radical initiator, 15 condensation. Preparing a mixture of a base oxide or an alkyl oxide, such as, but not limited to, ethylene glycol, propylene glycol, glycerol, and sorbose. alcohol. Non-limiting examples of alkylene oxides can include ethylene oxide, propylene oxide, butylene oxide, oxane, extended aralkyl oxides such as, but not limited to, styrene oxide, 20 a mixture of ethylene oxide and propylene oxide. In other non-limiting examples, polyoxyalkylene polyols can be prepared from alkylene oxides by random or stepwise oxyalkylation. Non-limiting examples of such polyoxyalkylene polyols include polyoxyethylene such as, but not limited to, polyethylene glycol; polyoxypropylene, such as but not limited to polypropylene glycol. 15 1287481 In a non-limiting embodiment, the poly(O)lated polyhydric alcohol can be represented by the following formula:
10 1510 15
Rl R2 其中m及n各自可為-正整數’之總和為5至7〇; 減R2各自為氫、甲基或乙基;以及A為二價連接基例 如直鏈或分支之雜基’其可含有丨i 8個碳原子,伸苯 基,以及d C9經絲取代之伸苯基。所選擇之瓜及n的 值,可與所卿之二價連縣組合,決定&_分子量。 聚烧氧基化多元醇可藉由習知技術領域中已知的方法 來製備。在-非限制的具體例中,例如4 4, _異亞丙基二紛之多讀,可與例如但不限制於環氧乙燒、環氧丙烧及 環氧丁烧含有環氧烧之材料反應,以形成具有經基官=性之-般稱為乙氧基化、丙氧基化或丁氧基化之多满。適用於製備聚院氧基化多元醇之多元醇的非限制的例子可包括描f於美國專利第6,187,444 B1號,第1()欄,第㈣ 行之多元醇,該專利文獻的揭露内容係併入本案說明金中 以供參考。 … 曰丁 20 如同使用於本案說明書及申請專利範圍中者,“聚鍵 多凡醇” 係_ 詞可包括一般已知的聚(氧四亞甲基)二醇,其 之=由在例如但秘制於三氟化蝴、氣化锡(ιν)及績酿氣 在—易均催化劑存在下之四氫。夫喃的聚合作用來製備。 非限制的具體例中,聚醚多元醇可包括τ㈣让抓广 16 1287481 其在商業上可購自於DuPon。亦*包括藉由例如但不限制於 環氧乙烷、環氧丙烷、氧雜環丁烷及四氫呋喃之環狀越, 與例如但不限制於乙二醇、丨,^丁二醇、1,4-丁二醇、二 甘醇、一縮二丙二醇'1,2-丙二酵及1,3-丙二醇之月曰族二 5醇之共聚合作用所製備之聚醚。亦可使用聚醚多元醇的可 相容混合物。如同在本案說明書中所使用者, <相各 一詞意指多元醇係彼此互溶,以致能形成單一相。 習知技術領域中已知的廣泛不同的聚酯多元酵可使用 於本發明。適當的聚酯多元醇吁包括但不限制於聚酯二 ίο醇。使用於本發明之聚酯二醇可包括具有4至1〇個铁原子 之一或多種二羧酸,與具有2至10個碳原子之,或多種氐 分子量二醇的酯化產物,該二羧酸例如但不限制於己二 酸、琥珀酸或癸二酸,該二醇例如但不限制於乙二醇、丙 二醇、二甘醇、1,4-丁二醇、新戊二醇、1,6-己二酵及1,1〇〜 15癸二醇。用於製造聚酯多元醇的酯化製程係描述於例如Ι)·Μ· Young,F. Hostettler等人發表的文獻,“聚酯s fr〇mRl R2 wherein each of m and n may be a positive integer '5 to 7 〇; minus R2 is each hydrogen, methyl or ethyl; and A is a divalent linking group such as a straight or branched hetero group' It may contain 8 carbon atoms of 丨i, a phenyl group, and a phenyl group substituted by d C9. The value of the selected melon and n can be combined with the two-valent county of Qing Dynasty to determine the & The polyalkylenoxylated polyols can be prepared by methods known in the art. In a non-limiting specific example, for example, 4 4, _ isopropylidene can be read with, for example, but not limited to, ethylene bromide, propylene bromide, and butyl bromide. The material reacts to form a sufficiency called ethoxylation, propoxylation or butoxylation. Non-limiting examples of polyols suitable for use in the preparation of polyethoxylated polyols may include polyols described in U.S. Patent No. 6,187,444 B1, column 1, column (d), disclosure of the patent document. The content is incorporated into the description of the case for reference. ... Kenting 20 As used in the present specification and the scope of the patent application, the term "poly-polyol" may include the generally known poly(oxytetramethylene) glycol, which is, for example, but The secret is tetrahydrogen in the presence of a catalyst such as trifluoride, vaporized tin (ιν) and calcite. The polymerization of Furan is prepared. In a non-limiting specific example, the polyether polyol can include τ(iv) for the capture of 16 1287481 which is commercially available from DuPon. Also * includes, for example, but not limited to, a ring of ethylene oxide, propylene oxide, oxetane, and tetrahydrofuran, with, for example, but not limited to, ethylene glycol, hydrazine, butanediol, 1, A polyether prepared by copolymerization of 4-butanediol, diethylene glycol, dipropylene glycol '1,2-propanediethanol, and 1,3-propanediol. A compatible mixture of polyether polyols can also be used. As used in the specification of the present specification, the term "phase" means that the polyols are mutually soluble so as to form a single phase. A wide variety of polyester polyesters known in the art of the prior art can be used in the present invention. Suitable polyester polyols include, but are not limited to, polyester diols. The polyester diol used in the present invention may include an esterification product having one or more dicarboxylic acids of 4 to 1 iron atoms, and a diol having 2 to 10 carbon atoms or a plurality of ruthenium molecular weights, the second The carboxylic acid is, for example but not limited to, adipic acid, succinic acid or sebacic acid, such as but not limited to ethylene glycol, propylene glycol, diethylene glycol, 1,4-butanediol, neopentyl glycol, 1 , 6-hexane diprotein and 1,1 〇 ~ 15 癸 diol. The esterification process for the manufacture of polyester polyols is described, for example, in the literature published by F. Hostettler et al., "Polyester s fr〇m
Lactone” ,Union Carbide F-40,第 147 頁。 在一非限制的具體例中,使用於本發明之多元醇可包 2〇 =聚己内酯多元醇。適當之聚己内酯多元醇是可變化且在 〇 =知技術領域中為已知。在非限制的具體例中,聚己内醋 多元醇可藉由在例如但不限制於水或如本案說明書所述之 低衫量二醇之二官能性活性氫化合物的存在下,縮合己 内®曰來製備。適當之聚己内醋多元醇的非限制的例子可包 括商業上可購得的㈣,所指名者如可自solvaychemical 17 1287481 購得之CAPA系列,其包括但不限制於CAPA 2047A,以及可 購自Dow Chem i ca 1之TONETM,其例如但不限制於TONE 0 2 01。 使用於本發明之聚碳酸酯多元醇是可變化且在習知技 術領域中為已知。適當之聚碳酸醋多元醇可包括該等商業 5 上可購得者(例如但不限制於可購自Enichem S.p.A.的 RavecarbTM 107)。在一非限制的具體例中,聚碳酸酯多元 醇可藉由使例如下文中所描述之二醇之有機二醇,及與聚 氨酯或聚氨酯脲之二醇成分的組合,與二烷基碳酸酯反應 來製造,該二烷基碳酸例如描述於美國專利第4,160, 853 10 號中者。在一非限制的具體例中,多元醇可包括聚六甲基 碳酸酯,例如 HO-(CH2)6-[〇-C(〇)-0-(CH2)6]n-〇H,其中 n 為 整數4至24,或4至1〇,或5至7。 15 20 仕一并丨叹刺的具體例中,二醇材料可包含低分子量多 元醇’例如具有數量平均分子量小於5⑽克/莫耳之多元 醇’及其可相容的混合物。如同在本案說明書中所使用者, ‘可相容:詞意指二醇係彼此互溶’以致能形成單一 旦此等夕讀的非限制的例子可包括但不限制於低分子 量的二醇及三醇。在其他非限制的具體例中,所選擇之三 =的量可達避免聚氨料聚氨崎之高度交聯的量。衫 :的非限制的具體例中,有機二醇可含有2至16個碳原 或2至6個奴原子,或2至1〇個碳原子。此等二醇的 非限制的例子可包括作 1〜不限制於乙二醇、丙二醇、二甘醇、 一縮三乙二醇、三縮四醇、— 一 一- 蝻一丙二醇、二縮三丙 …、1,— 丁二醇、1,3—丁二醇及 U一丁二醇,2,2,4—三 18 1287481Lactone", Union Carbide F-40, page 147. In a non-limiting embodiment, the polyol used in the present invention may comprise a polycaprolactone polyol. Suitable polycaprolactone polyols are It can be varied and is known in the art of 〇 = know. In a non-limiting embodiment, the polycaprolactone polyol can be obtained by, for example, but not limited to, water or a low-bulb diol as described in the present specification. Non-limiting examples of suitable polycaprolactone polyols may be included in the presence of a difunctional active hydrogen compound. Commercially available (4), such as those available from solvaychemical 17 1287481 The purchased CAPA series includes, but is not limited to, CAPA 2047A, and TONETM, available from Dow Chem i ca 1, which is for example but not limited to TONE 0 2 01. The polycarbonate polyol used in the present invention is It can be varied and is known in the art. Suitable polycarbonate polyols can include those commercially available (e.g., but not limited to, RavecarbTM 107 available from Enichem SpA). Specific examples of restrictions, polycarbonate The alcohol can be produced by reacting an organic diol such as a diol described hereinafter with a diol component of a polyurethane or a polyurethane urea, which is described, for example, in the reaction with a dialkyl carbonate. U.S. Patent No. 4,160,853, the disclosure of which is incorporated herein by reference in its entirety, in its entirety, in its entirety, in the non-limiting embodiment, the polyol may include polyhexamethyl carbonate, such as HO-(CH2)6-[〇-C(〇)-0-( CH2)6]n-〇H, wherein n is an integer of 4 to 24, or 4 to 1 〇, or 5 to 7. 15 20 In a specific example of a sigh, the diol material may comprise a low molecular weight polyol 'For example, a polyol having a number average molecular weight of less than 5 (10) g/mol and its compatible mixture. As used in the specification of the present specification, 'compatible: the word means that the diols are mutually soluble' so as to form Non-limiting examples of such readings may include, but are not limited to, low molecular weight diols and triols. In other non-limiting specific examples, the selected three = amount can be used to avoid polyammonia The amount of high cross-linking of Saki. In the non-limiting specific example of the shirt: the organic diol may contain 2 to 16 carbon atoms or 2 6 slave atoms, or 2 to 1 carbon atoms. Non-limiting examples of such diols may include 1 to no limitation to ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, tricondensate Tetrahydrin, - one-one - propylene glycol, tripropylene ..., 1, - butanediol, 1,3-butanediol and U-butylene glycol, 2, 2, 4 - 3 18 1287481
It1’3—戊二醇、2-甲基~1,3-戊二醇戊二醇、2,4一 ^及戊二醇、2’5~己二醇及1,6-己二醇、2,4_庚 :醇、2-乙基#己二醇、2 2二甲基 辛二醇、1 9-+ - * :—醇、丨,10—癸二醇、1,4-環己二醇、1,4- 二一Ψ醇、1,2〜雙(經乙基環己燒、丙三醇、四經甲基 谨Γ季戊四醇、三經甲基乙烧及三經甲基丙烧;及其異 構物。 10 15 20 、纟非限制的具體例巾,含祕材料可具有至少 '耳之刀子1,或至少1000克/莫耳,或至少2000 、耳在替換的非限制的具體例中,含雜材料可具 有小於10,000克/1且夕奴〇丁 .莫耳之數置平均分子量,或小於15, 0〇〇 見/莫耳,或小於20 ηηη * ..^ ,000克/莫耳,或小於32, 000克/ 旲耳。 可勺^ _限制的具體例巾,使用於本發明之含羥基材料 可包括由至少一例如ρ _说 酯。 一1之低分子量二羧酸所製造的三 物^山#限制的具體例中,含經基材料可包含喪段聚A 物,該嵌段聚合物包括JS Κσ 氧乙燒-環氧丁燒之&Γ /環氧城之嵌段及/或環 材料可包含且有下^在—_繼具體财,含趣基 1下钱學式之嵌段聚合物: (Π) HO-(〇-CRRCRR〜γ、^It1'3-pentanediol, 2-methyl~1,3-pentanediol pentanediol, 2,4- and pentanediol, 2'5-hexanediol and 1,6-hexanediol, 2,4_heptane: alcohol, 2-ethyl #hexanediol, 2 2 dimethyloctanediol, 19-+ - *: - alcohol, hydrazine, 10-nonanediol, 1,4-cyclohexane Glycol, 1,4-dioxanol, 1,2~bis (ethylcyclohexanone, glycerol, tetramethylammonium pentaerythritol, trimethylacetone and trimethyl ketone) And its isomers. 10 15 20, 纟 non-limiting specific examples, the secret material may have at least 'ear knife 1, or at least 1000 g / m, or at least 2000, the ear is replaced by non-limiting In a specific example, the impurity-containing material may have an average molecular weight of less than 10,000 g/l and an average of less than 15,0 //mole, or less than 20 ηηη * .. ^ , 000克/莫耳, or less than 32,000 g / 旲 ear. The specific singularity of the scooping _ _ limit, the hydroxyl-containing material used in the present invention may include at least one, for example, ρ _ ester. In a specific example of the limitation of the three substances ^ mountain # produced by the carboxylic acid, the warp-containing material may include the fungus A The block polymer includes JS Κσ oxyethene-epoxy butyl sulphide & Γ / epoxy block and / or ring material can contain and have the following - in the specific financial, including interesting base 1 Qian Xueyi block polymer: (Π) HO-(〇-CRRCRR~γ, ^
D n)-(CRRCRR^Yn^〇)b>(CRRCRR-Yn-〇)c_H 其中R可代表氫或Γ Λ 卜C6烷基;Υη可代表C〇 -C6烴,· η可& 整數0至6 ; a、b及 4 C可各自為整數0至300,其中a、k c係經選擇以致於夕— 、夕兀醇的數量平均分子量不超過 19 1287481 32, 000克/莫耳。 在其他替換的非限制的具體例中,在商業上可購自 BASF的例如但不限制於Plur〇nic. RTM R、rtm、D n)-(CRRCRR^Yn^〇)b>(CRRCRR-Yn-〇)c_H wherein R may represent hydrogen or C C C6 alkyl; Υη may represent C〇-C6 hydrocarbon, ·η可& integer 0 To a; a, b and 4 C each may be an integer from 0 to 300, wherein a, kc are selected such that the number average molecular weight of the ceramyl alcohol does not exceed 19 1287481 33,000 g/mole. In other alternative non-limiting specific examples, commercially available from BASF, for example, but not limited to, Plur〇nic. RTM R, rtm,
Tetronic· RTM R及Tetronic· RTM嵌段共聚物界面活性劑之 5含羥基材料,可使用於作為本發明之含羥基材料。 適合使用於本發明之多元醇的其他非限制的例子,可 包括直鏈或分支的鏈烧多元醇,例如但不限制於I 乙二 醇1,3-丙二醇、^―丙二醇、丨,4_丁二醇、i 3—丁二醇、 甘油、新戊二醇、三羥甲基乙烷、三羥甲基丙烷、二-三羥 甲基丙燒、赤轉、季戊四醇及二季細醇;聚伸烧基二 醇例如但不限制於二甘醇、一縮二丙二醇及高級聚伸烷 基一醇,例如但不限制於聚乙二醇,其數量平均分子量可 為200克/莫耳至2, 000克/莫耳;環狀鏈烷多元醇,例 士仁不限制於環戊二醇、環己二醇、環己三醇、環己二甲 ,、二丙基環己醇及環己二乙醇;芳族多元醇,例如但不 限制; 、一羥基本、苯三醇、羥苯甲基醇,以及二羥基甲苯; 又酚例如4, 4’ -異亞丙基二酚、4, 4,-氧雙酚、4, 4,- 羟基笨蜩、4, 4’ -硫代雙酚、酚酞、雙(4-羥苯基)甲烷、 4,4,〜(1 9 一乙烯二基)雙酚及4, 4’ -磺醯基雙酚;鹵化雙 ,例如但不限制於4, 4,-異亞丙基雙(2, 6_二溴酚)、 ’ 異亞丙基雙(2, 6-二氯酚)及4,4,-異亞丙基雙 (2, 3, 5 - ’〜四氯酚);烧氧基化酚,例如但不限制於烧氧基 化 4, 4, ® _ 異亞丙基二酚,其可具有1至70個烷氧基,舉例 ° 乙氧基、丙氧基、α-丁氧基以及β-丁氧基;以及雙 20 1287481 %己醉’其可藉由氫化對應的雙齡來製備,該雙環己醇例 如但不限制於4,4, _異亞丙基—雙環己醇、4 4,—氧雙環己 知、4,4 '硫代雙環己醇及雙(4,基環己醇)甲烧;聚氨 面曰或聚錢脲多元醇、聚醋多元醇、聚蜮多元醇、聚乙稀 5知、含有經基官能性丙烯酸酷之聚合物,含有經基官能性 甲基丙_酿之聚合物,以及含有締丙醇之聚合物。 在1_的具體例中’多元醇可選自於多官能性多 兀醇^括但不限制於三經甲基邮、乙氧基化三經甲基 丙烧、季戊四醇。 10 纟替換的非限制的具體例中’聚氨S旨預聚物具有小於 50’ 000克/莫耳之數量平均分子量⑽),或小於如酬 克/莫耳,或小於10,000克/莫耳,可使用各種不同的 ‘头方法來測疋。在一非限制的具體例中,此可藉由凝膠 滲透層析法(GPC) ’使用聚笨乙烯標準品來測定。 15 在替換的非限制的具體例中,使用於本發明之含羥基 材料可選自於聚_ 一醇及聚酷二醇,其具有至少2QQ克/ 莫耳之數量平均分子量,或至少300克/莫耳,或至少750 克/莫耳;或不大於1,500克/莫耳,或不大於2, 5〇〇克 /莫耳,或不大於4, 000克/莫耳。 20 在另一非限制的具體例中,使用於本發明之聚醚二醇 可包括但不限制於聚四亞甲基醚二醇。 在一非限制的具體例中,含羥基材料可同時具有羥基 及硫醇基,例如但不限制於2-巯基乙醇、3-巯基—1,2-丙二 醇、甘油雙(2-巯基乙酸酯)及1-羥基_4—巯基環己烷。 21 1287481 一般而言,聚氨酯及聚氨酯預聚物可使用習知技術領 域中已知的各種不同技術來聚合。在本發明之一非限制的 具體例中,聚合方法可包括用於固化之含胺材料的使用。 使用於本發明之含胺固化劑為種類繁多且廣泛變化。 5 適當之含胺固化劑的非限制的例子可包括但不限制於脂族 聚胺、環脂族聚胺、芳族聚胺及其混合物。在替換的非限 制的具體例中,含胺固化劑可為具有至少二官能基的聚 胺,該二官能基係各自獨立地選自於一級胺(-NH2)、二級 胺(-NH-)及其組合。在其他非限制的具體例中,含胺固化 10 劑可具有至少二個一級胺基。在另一非限制的具體例中, 含胺固化劑可包含聚胺及至少一選自於多硫醇及多元醇之 材料的混合物。適當之多硫醇及多元醇的非限制的例子包 括該等先前已描述於本案說明書中者。在又另一非限制的 具體例中,含胺固化劑可為含硫含胺之固化劑。含硫含胺 15 之固化劑的非限制的例子可包括Ethacure 300,其在市面 上可由 Albemarle Corporation 購得。 適合使用於本發明之含胺固化劑可包括但不限制於具 有下述化學式之材料:The hydroxyl-containing material of Tetronic·RTM R and Tetronic·RTM block copolymer surfactant can be used as the hydroxyl group-containing material of the present invention. Other non-limiting examples of polyols suitable for use in the present invention may include linear or branched chain burn polyols such as, but not limited to, I ethylene glycol 1,3-propanediol, propylene glycol, hydrazine, 4_ Butanediol, i3-butanediol, glycerin, neopentyl glycol, trimethylolethane, trimethylolpropane, di-trimethylolpropane, red, pentaerythritol and diquaternol; The alkylene glycol is, for example but not limited to, diethylene glycol, dipropylene glycol, and higher polyalkylene alcohol, such as but not limited to polyethylene glycol, and may have an average molecular weight of 200 g/m to 2 , 000 g / mol; cyclic alkane polyol, the case is not limited to cyclopentanediol, cyclohexanediol, cyclohexanetriol, cyclohexane, dipropyl cyclohexanol and cyclohexane Diethanol; an aromatic polyol such as, but not limited to; monohydroxyl, benzenetriol, hydroxybenzyl alcohol, and dihydroxytoluene; and phenol such as 4,4'-isopropylidenediphenol, 4, 4,-oxybisphenol, 4,4,-hydroxy alum, 4,4'-thiobisphenol, phenolphthalein, bis(4-hydroxyphenyl)methane, 4,4,~(1 9-ethylenediyl )double And 4, 4'-sulfonyl bisphenol; halogenated double, such as but not limited to 4, 4,-isopropylidene bis(2,6-dibromophenol), 'isopropylidene bis (2, 6 -dichlorophenol) and 4,4,-isopropylidene bis(2,3,5 - '~tetrachlorophenol); alkoxylated phenols such as, but not limited to, alkoxylated 4, 4, ® _ isopropylidene diphenol, which may have from 1 to 70 alkoxy groups, such as ethoxy, propoxy, a-butoxy and beta-butoxy; and double 20 1287481% It can be prepared by hydrogenating the corresponding double age, such as but not limited to 4,4, isopropylidene-dicyclohexanol, 4 4 -oxybicyclohexane, 4,4 'thiobicyclo ring Hexanol and bis(4,ylcyclohexanol)-combustion; polyaluminium or polyglycol polyol, polyglycol polyol, polyfluorene polyol, polyethylene 5, containing trans-functional acrylic acid A polymer comprising a transfunctional methyl methacrylate polymer and a polymer comprising a propanol. In the specific example of 1_, the polyol may be selected from polyfunctional polyols, but is not limited to trimethylmethyl, ethoxylated tris-methylpropane, and pentaerythritol. In the non-limiting specific example of 10 纟 replacement, the 'polyamine S prepolymer has a number average molecular weight (10) of less than 50' 000 g/mole), or less than, for example, a gram/mole, or less than 10,000 g/mole. You can use a variety of different 'head methods to measure 疋. In a non-limiting embodiment, this can be determined by gel permeation chromatography (GPC) using a polystyrene standard. In an alternative, non-limiting embodiment, the hydroxyl-containing material used in the present invention may be selected from the group consisting of poly-alcohols and polycarbodiols having a number average molecular weight of at least 2QQ g/mol, or at least 300 g. / Mohr, or at least 750 g / mol; or no more than 1,500 g / m, or no more than 2, 5 g / m, or no more than 4,000 g / m. In another non-limiting embodiment, the polyether diol used in the present invention may include, but is not limited to, polytetramethylene ether glycol. In a non-limiting embodiment, the hydroxyl-containing material may have both a hydroxyl group and a thiol group, such as but not limited to 2-mercaptoethanol, 3-mercapto-1,2-propanediol, glycerol bis(2-mercaptoacetate) And 1-hydroxy-4-indolylcyclohexane. 21 1287481 In general, polyurethane and polyurethane prepolymers can be polymerized using a variety of different techniques known in the art of the prior art. In one non-limiting embodiment of the invention, the polymerization process can include the use of an amine-containing material for curing. The amine-containing curing agents used in the present invention are numerous and widely varied. Non-limiting examples of suitable amine-containing curing agents can include, but are not limited to, aliphatic polyamines, cycloaliphatic polyamines, aromatic polyamines, and mixtures thereof. In an alternative, non-limiting embodiment, the amine-containing curing agent can be a polyamine having at least a difunctional group, each independently selected from the group consisting of a primary amine (-NH2) and a secondary amine (-NH-). ) and its combination. In other non-limiting embodiments, the amine-containing curing agent can have at least two primary amine groups. In another non-limiting embodiment, the amine-containing curing agent may comprise a mixture of a polyamine and at least one material selected from the group consisting of polythiols and polyols. Non-limiting examples of suitable polythiols and polyols include those previously described in the present specification. In yet another non-limiting embodiment, the amine-containing curing agent can be a sulfur-containing amine-containing curing agent. Non-limiting examples of sulfur-containing amine-containing curing agents can include Ethacure 300, which is commercially available from Albemarle Corporation. The amine-containing curing agent suitable for use in the present invention may include, but is not limited to, a material having the following chemical formula:
Ri RiRi Ri
R3 (III) 其中匕及1?2可各自獨立地選自於甲基、乙基、丙基及異丙 基,以及R3可選自於氫及氣。使用於本發明之含胺固化劑 22 20 1287481 之非限制的例子包括下述化合物,其係由L〇nza Ltd.製造 (Base 1 ’ 瑞士):R3 (III) wherein 匕 and 1-2 are each independently selected from the group consisting of methyl, ethyl, propyl and isopropyl, and R3 is selected from hydrogen and gas. Non-limiting examples of the amine-containing curing agent 22 20 1287481 used in the present invention include the following compounds, which are manufactured by L〇nza Ltd. (Base 1 'Switzerland):
LONZACURE· RTM. M-DIPA : RfCsHt ; R2<3h7 ; R3=HLONZACURE· RTM. M-DIPA : RfCsHt ; R2 <3h7; R3=H
LONZACURE. RTM. M-DMA : Ri=CH3 ; R2=CH3 ; R3=H 5 LONZACURE· RTM· M-MEA : Ri=CH3 ; R2=C2H5 ; R3=H LONZACURE· RTM· M_DEA : RfGHs ; R2<2H5 ; R3=H LONZACURE· RTM. M-MIPA : R1=CH3 ; R2=C3H? ; R3=H LONZACURE· RTM· M-CDEA : Ri=C2H5 ; R2=C2H5 ; R3=C1 其中R!、R2及R3對應上述的化學式。 10 在一非限制的具體例中,含胺固化劑可包括但不限制 於二胺固化劑,例如4, 4’-亞甲基雙(3-氯—2, 6-二乙基苯 胺),(Lonzacure.RTM. M-CDEA),其在美國可由 Air Products and Chemical, Inc· (Allentown,Pa.)講得。 在替換的非限制的具體例中,使用於本發明之含胺固化劑 15可包括2, 4-二胺基-3, 5-二乙基-甲苯、2, 6-二胺基-3, 5-二乙基-甲苯及其混合物(集體地稱為“二乙基甲苯二 胺’或DETDA )’其在市面上可由Albemarle Corporation購得,商品名為Ethacure 100 ;二甲基硫代 甲苯二胺(DMTDA ) ’其在市面上可由A1 bemar 1 e 20 Corporation 購得,商品名為 Ethacure 300 ; 4, 4’ -亞甲 基-雙-(2-氯苯胺)’其在市面上可由Kingyorker Chemicals購得,商品名為MOCA。DETDA在室溫下可為液 體,在25°C下的黏度為156 cPs at 25X。DETDA可為同分 異構物,具有範圍為75至81百分比之2,4-異構物,以及 25 範圍為18至24百分比之2, 6-異構物。 23 1287481 含胺固化劑之非限制的例子可包括伸乙胺。適當之伸 乙胺可包括但不限制於乙二胺(EDA)、二伸乙基三胺 (DETA)、三伸乙基四胺(ΊΈΤΑ)、四伸乙基五胺(ΤΕΡΑ)、 五伸乙基六胺(ΡΕΗΑ)、旅嗉、嗎琳、經取代之嗎琳、°辰 5 喙、經取代之哌喙、二伸乙基二胺(DEDA),以及2-胺基 -1-乙基哌嗉。在替換的非限制的具體例中,含胺固化劑可 選自於CrG二烷基甲苯二胺之一或多種異構物,例如但不 限制於3,5-二甲基-2, 4-甲苯二胺、3,5-二甲基-2,6-甲苯 二胺、3,5-二乙基-2, 4-甲苯二胺、3,5-二乙基-2,6-甲苯 10 二胺、3,5-二異丙基-2, 4-甲苯二胺、3, 5-二異丙基-2, 6-甲苯二胺,及其混合物。在替換的非限制的具體例中,含 胺固化劑可為二苯胺基甲烷,或三亞曱基二醇二(對-胺基 苯甲酸酯)。 在本發明之替換的非限制的具體例中,含胺固化劑可 15 包括下述通式結構中之一者:LONZACURE. RTM. M-DMA : Ri=CH3 ; R2=CH3 ; R3=H 5 LONZACURE· RTM· M-MEA : Ri=CH3 ; R2=C2H5 ; R3=H LONZACURE· RTM· M_DEA : RfGHs ; R2<2H5 R3=H LONZACURE· RTM. M-MIPA : R1=CH3 ; R2=C3H? ; R3=H LONZACURE· RTM· M-CDEA : Ri=C2H5 ; R2=C2H5 ; R3=C1 where R!, R2 and R3 Corresponds to the above chemical formula. In a non-limiting embodiment, the amine-containing curing agent may include, but is not limited to, a diamine curing agent such as 4,4'-methylenebis(3-chloro-2,6-diethylaniline). (Lonzacure.RTM. M-CDEA), which is available in the United States by Air Products and Chemical, Inc. (Allentown, Pa.). In an alternative non-limiting embodiment, the amine-containing curing agent 15 used in the present invention may include 2,4-diamino-3,5-diethyl-toluene, 2,6-diamino-3, 5-Diethyl-toluene and mixtures thereof (collectively referred to as "diethyltoluenediamine" or DETDA) which are commercially available from Albemarle Corporation under the trade name Ethacure 100; dimethylthiotoluene II Amine (DMTDA) 'It is commercially available from A1 bemar 1 e 20 Corporation under the trade name Ethacure 300; 4, 4'-methylene-bis-(2-chloroaniline)' which is commercially available from Kingyorker Chemicals Available under the trade name MOCA. DETDA can be liquid at room temperature with a viscosity of 156 cPs at 25X at 25 ° C. DETDA can be an isomer with a range of 75 to 81 percent 2,4 - isomers, and 25, 2, 6-isomers ranging from 18 to 24%. 23 1287481 Non-limiting examples of amine-containing curing agents may include ethylamine. Suitable ethylamines may include, but are not limited to, Ethylenediamine (EDA), diethylidene triamine (DETA), tri-extension ethyltetramine (ΊΈΤΑ), tetra-extension ethyl pentamine (ΤΕΡΑ), penta-ethyl Amine (ΡΕΗΑ), 嗉, 吗琳, substituted 吗琳, ° 辰5 喙, substituted hydrazine, diethylidene diamine (DEDA), and 2-amino-1-ethylpiperidinium In an alternative, non-limiting embodiment, the amine-containing curing agent may be selected from one or more isomers of CrG dialkyl toluenediamine, such as, but not limited to, 3,5-dimethyl-2,4. -toluenediamine, 3,5-dimethyl-2,6-toluenediamine, 3,5-diethyl-2,4-toluenediamine, 3,5-diethyl-2,6-toluene 10 diamine, 3,5-diisopropyl-2, 4-toluenediamine, 3, 5-diisopropyl-2,6-toluenediamine, and mixtures thereof. Non-limiting examples of substitutions In the non-limiting specific example of the present invention, the amine-containing curing agent may be 15 Including one of the following general structure:
νη2 24 (VI) 20 1287481 在另一替換的非限制的具體例中,含胺固化劑可包括 一或多種亞曱基雙苯胺,其可由通式VII-ΧΙ所代表;一或 多種苯胺硫化物,其可由通式XII-XVI所代表;以及/或 一或多種二苯胺,其可由通式XVII-XX所代表, (VII)Ηη2 24 (VI) 20 1287481 In another alternative, non-limiting embodiment, the amine-containing curing agent may comprise one or more fluorenyl bisanilines, which may be represented by the formula VII-ΧΙ; one or more aniline sulfides , which may be represented by the general formula XII-XVI; and/or one or more diphenylamines, which may be represented by the general formula XVII-XX, (VII)
10 15 (VIII)10 15 (VIII)
(IX)(IX)
25 20 128748125 20 1287481
1010
(XIII) 义3(XIII) meaning 3
H2NVSH2NVS
I R4^V^I R4^V^
r5R5
26 15 1287481 (XV) 义3H2NVS IR4^S^\ r526 15 1287481 (XV) Meaning 3H2NVS IR4^S^\ r5
义5 nh2 R4 (xvi) 、nh2Meaning 5 nh2 R4 (xvi), nh2
R5 R4 (XVII)R5 R4 (XVII)
nh2 10Nh2 10
27 128748127 1287481
—R4 r5 其中r3及R4可各自獨立地代表0至c3烷基,以及r5可選 自於氫及_素,例如但不限制於氣及溴。由通式VII所代 5 表之二胺大致上可描述為4, 4’-亞甲基-雙(二烷基苯胺)。 二胺之適當的非限制的例子可由通式VII所代表,包括但 不限制於4, 4’-亞甲基-雙(2, 6-二甲基苯胺)、4, 4’-亞甲基 -雙(2, 6-二乙基苯胺)、4, 4’ -亞甲基-雙(2-乙基-6-甲基苯 胺)、4, 4’-亞甲基-雙(2, 6-二異丙基苯胺)、4, 4’-亞甲基-10 雙(2-異丙基-6-甲基苯胺)及4, 4’ -亞甲基-雙(2, 6-二乙基 -3-氣苯胺)。 在其他非限制的具體例中,含胺固化劑可包括由下述 通式(XXI)所代表之材料: 28 1287481 (XXI)—R4 r5 wherein r3 and R4 each independently represent a 0 to c3 alkyl group, and r5 is optionally selected from hydrogen and _, such as, but not limited to, gas and bromine. The diamine represented by the formula VII can be roughly described as 4,4'-methylene-bis(dialkylaniline). Suitable non-limiting examples of diamines can be represented by the general formula VII, including but not limited to 4,4'-methylene-bis(2,6-dimethylaniline), 4,4'-methylene - bis(2,6-diethylaniline), 4,4'-methylene-bis(2-ethyl-6-methylaniline), 4,4'-methylene-bis (2, 6 -diisopropylaniline), 4,4'-methylene-10bis(2-isopropyl-6-methylaniline) and 4,4'-methylene-bis(2,6-diethyl) Base-3-air aniline). In other non-limiting specific examples, the amine-containing curing agent may comprise a material represented by the following formula (XXI): 28 1287481 (XXI)
5 其中R2G、R21、R22,及R23可獨立地選自於Η、Cl至C3烧基、 CH3-S-及鹵素,例如但不限制於氯或溴。在本發明之一非 限制的具體例中,可由通式XXI所代表之含胺固化劑可包 括二乙基甲苯二胺(DETDA),其中R23為曱基,R2。及1?21各 自為乙基,以及R22為氫。在另一非限制的具體例中,含胺 10 固化劑可包括4, 4’ -二苯胺基甲烷。 在替換的非限制的具體例中,使用各種不同的方法及 設備,例如但不限制於高速攪拌機或擠壓機,可將含胺材 料、發泡劑、聚異氰酸酯及含羥基材料混合。在一非限制 的具體例中,混合設備可包括在例如小於20巴之低壓下操 15 作的機械攪拌器。在另一非限制的具體例中,成分可藉由 撞擊混合方式來混合,其中成分係在高速及高壓下注入混 合室中,以及接著利用動能使成分在室中混合。在此具體 例中,成分一般係在100至200米/秒的速度及20至3000 巴的壓力下注入。 2〇 在替換的非限制的具體例中,聚氨酯預聚物及任擇的 聚異氰酸酯可包含於混合單元的第一進料中,含胺材料及 任擇的含羥基材料可包含於第二進料中,以及發泡劑可包 29 1287481 δ於苐二進料中;或第一進料可包括含胺材料及發泡劑, 以及任擇地含經基材料。 在另一非限制的具體例中,聚氨酯脲可藉由單罐裝方 法,藉由組合聚異氰酸酯、含羥基材料、含胺材料及發泡 5劑來製備。在另一非限制的具體例中,聚氨自旨脲可藉由單 罐裝方法,藉由組合聚異氰酸酯及聚氨酯預聚物,任擇地 含羥基材料、含胺材料及發泡劑來製備。 在本發明之非限制的具體例中,具有三進料之混合單 元可用於組合聚異氰酸酯及/或聚氨酯預聚物、含經基材 10料、含胺材料及發泡劑。組分可利用各種不同的構形添加 至進料中。在替換的非限制的具體例中,混合單元之第一 、 進料可含有聚異氰酸酯及/或聚氨酯預聚物,以及第二進 料可含有含羥基材料、含胺材料及發泡劑;或第二進料可 含有羥基官能性材料以及含胺材料,以及第三進料可含有 15發泡劑;或第二進料可含有含胺材料,以及第三進料可含 有含羥基材料以及發泡劑;或第二進料可含有含羥基材 料,以及第三進料可含有含胺材料及發泡劑。在另一非限 制的具體例中,其中聚氨酯預聚物係存在於第一進料中, 含羥基材料在另一材料中的存在是任擇的。 20 發泡劑可使用於本發明中,以供在聚氨酯脲材料内形 成至少部分充填有氣體之胞室。在一非限制的具體例中, 胞室係實質均-地分佈在整個聚氨_脲材料内。胞室的尺 寸可廣泛地改變。在替換的非限制的具體例中,胞室可為 至少1微米,或至少20微米,或至少30微米,或至少40 30 1287481 微米;至小於1000微米,或小於500微米,或小於1〇〇微 米。 在一非限制的具體例中,發泡劑可為水。水可與氰酸 酯(NCO)原地反應以產生二氧化碳。在另一非限制的具艨 5例中,一或多種輔助發泡劑可與該發泡劑組合使用。<適 合使用於本發明之輔助發泡劑可廣泛地改變且可包栝在反 應溫度下可實質揮發的物質。此輔助發泡劑可選自於習知 技術領域中已知者。非限制的例子可包括但不限制於丙 酮、乙酸乙酯、_化烷類,例如二氣甲烷、氣仿、二氯乙 10烧、二氣乙烯、一氟三氯乙烷、一氯二氟甲烷、二氯二氟 甲烷、二氯一氟甲烷、丁烷、戊烷、環戊烷、己烷、庚烷、 乙醚及其混合物。 使用於本發明之發泡劑量可改變。在替換的非限制的 具體例中,發泡劑的存在量係使得所選擇或所欲的抛光塾 15的挽度及/或孔洞體積可達到。在替換的非限制的具體例 中,密度可為0· 50 i 1· 10 g/cc ;孔洞體積以聚氨酿服材 料為基準,可為5%至55%。密度可使用各種不同熟習此 項技術者已知的各種不同方法來測定。在本案說明書中所 描述之密度值係根據ASTM 1622-88測定。孔洞體積亦可使 20用各種不同熟習此項技術者已知的各種不同方法來測定。5 wherein R 2 G, R 21 , R 22 , and R 23 are independently selected from the group consisting of ruthenium, Cl to C 3 alkyl, CH 3 -S-, and halogen, such as, but not limited to, chlorine or bromine. In a non-limiting embodiment of the invention, the amine-containing curing agent represented by the general formula XXI may comprise diethyltoluenediamine (DETDA) wherein R23 is a fluorenyl group, R2. And 1?21 are each ethyl and R22 is hydrogen. In another non-limiting embodiment, the amine-containing 10 curing agent can include 4,4'-diphenylaminomethane. In alternative non-limiting examples, amine-containing materials, blowing agents, polyisocyanates, and hydroxyl-containing materials can be combined using a variety of different methods and equipment, such as, but not limited to, high speed mixers or extruders. In a non-limiting embodiment, the mixing apparatus can include a mechanical agitator that operates at a low pressure of, for example, less than 20 bar. In another non-limiting embodiment, the ingredients can be mixed by impingement mixing wherein the ingredients are injected into the mixing chamber at high speed and pressure, and then the kinetic ingredients are mixed in the chamber. In this embodiment, the composition is generally injected at a speed of 100 to 200 m/sec and a pressure of 20 to 3000 bar. In an alternative, non-limiting embodiment, the polyurethane prepolymer and optional polyisocyanate may be included in the first feed of the mixing unit, and the amine-containing material and optionally the hydroxyl-containing material may be included in the second feed. In the feed, the blowing agent may comprise 29 1287481 δ in the second feed; or the first feed may comprise an amine-containing material and a blowing agent, and optionally a warp-containing material. In another non-limiting embodiment, the polyurethaneurea can be prepared by combining a polyisocyanate, a hydroxyl-containing material, an amine-containing material, and a foaming agent by a single-pack method. In another non-limiting embodiment, the polyurethane can be prepared by a single can process by combining a polyisocyanate and a polyurethane prepolymer, optionally a hydroxyl-containing material, an amine-containing material, and a blowing agent. . In a non-limiting embodiment of the invention, a three-feed mixing unit can be used to combine the polyisocyanate and/or polyurethane prepolymer, the substrate-containing material, the amine-containing material, and the blowing agent. The components can be added to the feed using a variety of different configurations. In an alternative non-limiting embodiment, the first of the mixing units may comprise a polyisocyanate and/or a polyurethane prepolymer, and the second feed may comprise a hydroxyl-containing material, an amine-containing material, and a blowing agent; The second feed may comprise a hydroxyl functional material and an amine containing material, and the third feed may contain 15 blowing agents; or the second feed may contain an amine containing material, and the third feed may contain hydroxyl containing materials and hair The blowing agent; or the second feed may contain a hydroxyl-containing material, and the third feed may contain an amine-containing material and a blowing agent. In another non-limiting embodiment wherein a polyurethane prepolymer is present in the first feed, the presence of the hydroxyl containing material in the other material is optional. 20 A blowing agent can be used in the present invention to form a cell that is at least partially filled with a gas within the polyurethaneurea material. In a non-limiting embodiment, the cell system is substantially uniformly distributed throughout the polyurethane-urea material. The size of the cell can vary widely. In an alternative, non-limiting embodiment, the cells can be at least 1 micron, or at least 20 microns, or at least 30 microns, or at least 40 30 1287481 microns; to less than 1000 microns, or less than 500 microns, or less than 1 inch. Micron. In a non-limiting embodiment, the blowing agent can be water. Water can react in situ with cyanate esters (NCO) to produce carbon dioxide. In another non-limiting embodiment, one or more auxiliary blowing agents can be used in combination with the blowing agent. < Auxiliary blowing agents suitable for use in the present invention are widely variable and can enclose substances which are substantially volatile at the reaction temperature. This auxiliary blowing agent can be selected from those known in the art. Non-limiting examples may include, but are not limited to, acetone, ethyl acetate, alkylenes such as di-methane, gas, dichloroethane, diethylene, trifluoroethane, chlorodifluoroethane. Methane, dichlorodifluoromethane, dichlorofluoromethane, butane, pentane, cyclopentane, hexane, heptane, diethyl ether and mixtures thereof. The foaming dose used in the present invention can be varied. In an alternative, non-limiting embodiment, the blowing agent is present in an amount such that the selected and desired polishing enthalpy 15 and/or void volume are achievable. In a non-limiting specific example of substitution, the density may be 0·50 i 1·10 g/cc; the pore volume may be from 5% to 55% based on the polyurethane material. Density can be determined using a variety of different methods known to those skilled in the art. The density values described in the present specification are determined in accordance with ASTM 1622-88. The void volume can also be determined by a variety of different methods known to those skilled in the art.
在本案説明書中所描述之孔洞體積值係根據Astm D 4284-88 測定’使用 Micromeritics 製造的 Autop〇re ίΠ 水銀孔隙度分析儀。在另一非限制的具體例中,發泡劑的 量可為反應混合物之0重量%至5重量%。 31 1287481 在一非限制的具體例中,含胺材料可含有至少一小濃 度之足以與發泡劑反應的殘餘水氣或水。 在另一非限制的具體例中,胺甲酸酿形成催化劑及/ 或發泡催化劑可使用於本發明中,以增進聚氨醋脈形成材 5料與發泡劑的反應,及^/或加速聚氨醋脲形成材料與發泡 劑的反應。在又一非限制的具體例中,可使用一或多種材 料,其中每一材料可呈現胺甲酸酯形成催化劑及發泡催化 劑的特性。 適當之胺甲酸酯形成催化劑可改變,例如適當的胺甲 10酸酯形成催化劑可包括該等習知技術領域中已知可用於藉 由含有NC0及0H之材料的反應形成胺甲酸酯的催化劑。適 當之催化劑的非限制的例子可選自於路易士鹼(Lewis bases)、路易士酸(Lewis acids)及插入催化劑,如 Ullmann’ s Encyclopedia of Industrial Chemistry ,第 15 5th版,1992,第A21卷,第673至674頁所述。在一非限 制的具體例中,催化劑可為有機酸之亞錫鹽,例如但不限 制於辛酸亞錫、二月桂酸二丁錫、二乙酸二丁錫、硫醇二 丁錫、二順丁稀一酸-一 丁锡、二乙酸二甲錫、—月桂酸— 甲錫,及其混合物。在替換的非限制的具體例中,催化劑 20 可為辛酸辞、乙酸丙嗣絲或乙酿丙綱鐵。 適當之發泡催化劑的非限制的例子可包括三級胺,例 如但不限制於1,4-二氮雜二環[2· 2. 2]辛烷、雙—2一二甲基 胺乙基醚、五甲基二伸乙基三胺、三乙基胺、三異丙基胺、 N-甲基嗎啉,以及N,N—二甲基笨甲基胺。此類適當之三級 32 1287481 胺係描述於美國專利第5,693,738號,第1()攔,第6_38 饤°亥專利文獻的揭露内容係併入本案說明書中以供參 考。三級胺催化劑亦可包括該等含有經基官能性者,例如 5 10 N,N,N, N’N-二甲基乙醇胺、2_(2_二甲基胺乙氧基_)乙醇、 一甲基-N -經乙基-雙胺基_、n,n一(二甲 基)N,N ~二異丙醇-1,3-丙二胺,以及Ν,Ν-雙-(3-二甲芙 胺丙基異丙醇胺。 —土 践在-非限制的具體例中’催化劑可選自於鱗、三級錢 鹽以及三級胺’例如但不限制於三丁基鱗、三乙基胺;三 異丙基胺,以及Ν,Ν-二甲基苯甲基胺。適當之三級胺之額 相非限制的例子係描述於美國專利第5,693,;;8^額 在第1G欄’第6至38行,該專利文獻的揭露内容係併入 本案說明書中以供參考。 在另一非限制的具體例中,在聚合作用期間可存在有 U界面活性劑。界面活性劑可影響至少部分充填氣體之胞室 φ ㈣成及安定化。在一非限制的具體例中,界面活性劑可 選擇以使其對於胞室之成核及安定化具有高表面活性。在 另一非限制的具體例中,界面活性劑可選擇以使其具有作 為發泡劑之良好的乳化能力。適合用於本發明之界面活性 20劑是廣泛的且可改變。在一非限制的具體例中,可使用聚 石夕氧烧界面活性劑。聚石夕氧燒界面活性劑可選自於石夕氧尸 聚氧伸烷基共聚物界面活性劑。此類界面活性劑之非限制 的例子可包括但不限制於聚二甲基矽氧烷-聚氧伸燒基參 段共聚物,其可自GE Silicons Incorporated購得,商〇 33 1287481 名為 Niax RTM.聚矽氧烷 L-1800、L-5420 及 L-5340 ; Dow Corning Corporation,商品名為 D0193、DC-5357 及 DC-5315 ;以及 Goldschmidt Chemical Corporation,商品 名為 B-8404 及 B-8407。 5 在又一非限制的具體例中,矽氧烷-聚氧伸烷基共聚物 界面活性劑可由下述通式代表:The pore volume values described in the present specification are determined according to Astm D 4284-88 using an Autop〇re Π mercury porosimeter manufactured by Micromeritics. In another non-limiting embodiment, the amount of blowing agent can range from 0% to 5% by weight of the reaction mixture. 31 1287481 In a non-limiting embodiment, the amine-containing material may contain at least a small concentration of residual moisture or water sufficient to react with the blowing agent. In another non-limiting embodiment, a urethane formic acid forming catalyst and/or a foaming catalyst can be used in the present invention to enhance the reaction of the polyurethane foam forming material with the blowing agent, and/or accelerate. The reaction of the polyurethane forming material with the blowing agent. In yet another non-limiting embodiment, one or more materials may be used, each of which may exhibit the characteristics of a urethane forming catalyst and a foaming catalyst. Suitable urethane forming catalysts may vary, for example, suitable amine form 10 acid forming catalysts may include those known in the art to be useful for forming urethanes by reaction of materials containing NC0 and OH. catalyst. Non-limiting examples of suitable catalysts may be selected from the group consisting of Lewis bases, Lewis acids, and intercalation catalysts, such as Ullmann's Encyclopedia of Industrial Chemistry, 15th Edition, 1992, Volume A21. , as described on pages 673 to 674. In a non-limiting embodiment, the catalyst may be a stannous salt of an organic acid such as, but not limited to, stannous octoate, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin thiolate, dicis Dilute acid-butyltin, dimethyltin diacetate, lauric acid-tin, and mixtures thereof. In an alternative, non-limiting embodiment, the catalyst 20 can be a caprylic acid, a propionate acetate or an iron. Non-limiting examples of suitable blowing catalysts may include tertiary amines such as, but not limited to, 1,4-diazabicyclo[2.2.2]octane, bis-dimethyl dimethylamine ethyl Ether, pentamethyldiethylamine, triethylamine, triisopropylamine, N-methylmorpholine, and N,N-dimethylbenzylamine. Such suitable tertiary grades 32 1287481 Amines are described in U.S. Patent No. 5,693,738, the disclosure of which is incorporated herein by reference in its entirety in its entirety in its entirety in its entirety in The tertiary amine catalyst may also include such a group-containing functional group, such as 5 10 N, N, N, N'N-dimethylethanolamine, 2-(2-dimethylamine ethoxy) ethanol, methyl-N-ethyl-diamino-, n,n-(dimethyl)N,N-diisopropanol-1,3-propanediamine, and oxime, fluorene-bis-(3- Dimethyl propyl propyl isopropanolamine - soil practice - in non-limiting specific examples 'catalyst may be selected from the group consisting of scales, tertiary salt and tertiary amines' such as but not limited to tributyl scales, three Ethylamine; triisopropylamine, and hydrazine, hydrazine-dimethylbenzylamine. Non-limiting examples of the appropriate phase of the tertiary amine are described in U.S. Patent No. 5,693,; 1G column 'Lines 6 to 38, the disclosure of which is incorporated herein by reference. In another non-limiting embodiment, a U-surfactant may be present during polymerization. It can affect at least part of the filling gas chamber φ (4) formation and stabilization. In a non-limiting embodiment, the surfactant can be selected to have high surface activity for cell nucleation and stabilization. In another non-limiting embodiment, the surfactant may be selected to provide good emulsifying power as a blowing agent. The surfactant 20 suitable for use in the present invention is broad and variable. In a specific example of the limitation, a polysulfide-oxygenated surfactant may be used. The polyoxo-oxygenated surfactant may be selected from the group consisting of a ceramide oxygen-polyalkylene copolymer surfactant. Non-limiting examples can include, but are not limited to, polydimethyl siloxane-polyoxyalkylene-based segmented copolymers available from GE Silicons Incorporated, quot. 33 1287481 entitled Niax RTM. Polyoxane L-1800, L-5420 and L-5340; Dow Corning Corporation under the trade names D0193, DC-5357 and DC-5315; and Goldschmidt Chemical Corporation under the trade names B-8404 and B-8407. In a specific example of the limitation, the siloxane-polyoxyalkylene copolymer surfactant can be represented by the following formula:
(XXII) CH3 CH3 丫 H3 CH3 CH3 R CH3(XXII) CH3 CH3 丫 H3 CH3 CH3 R CH3
其中x為數字1至150,y為數字1至50,χ: y的比 例為10 ·· 1至1 : 1,以及R為烷基烷氧基化物。參考通式 10 I,X可為10至50,或10至42,或13至42 ;以及y可為 2至20,或5至20,或7至20,或7至10。x:y的比例 可界於2. 4至6. 8之間。 其中R可為烷基烷氧基化物,其可由下述通式XXIII 所代表:Wherein x is a number from 1 to 150, y is a number from 1 to 50, and a ratio of χ:y is from 10··1 to 1:1, and R is an alkyl alkoxylate. Referring to the general formula 10 I, X may be 10 to 50, or 10 to 42, or 13 to 42; and y may be 2 to 20, or 5 to 20, or 7 to 20, or 7 to 10. The ratio of x: y is between 2.4 and 6.8. Wherein R can be an alkyl alkoxylate which can be represented by the following formula XXIII:
15 XXIII R’0(C2H40)m(C3H60)nH 其中R’為伸烷基,含有3至6個碳原子,^為數字5 至200,以及η為數字0至20,或2至18。R的分子量範 圍為400至4000,以及由通式XXII所代表之界面活性劑 的分子量為6, 000至50, 〇〇〇。 20 矽氧烷-聚氧伸烷基共聚物界面活性劑可如美國專利 第5, 691,392號,第3棚’第25行至弟4欄第18行所述,該專 34 1287481 利文獻係併入本文中以供參考。 可使用於本發明之界面活性劑的量可廣泛地改變。在 替換的非限制的具體例中,界面活性劑的量為占反應混合 物之0.001重量%至10重量%,或0 01重量%至1重量%, 5 或〇· 05重量%至〇· 5重量%。15 XXIII R'0(C2H40)m(C3H60)nH wherein R' is an alkylene group having 3 to 6 carbon atoms, ^ is a number 5 to 200, and η is a number 0 to 20, or 2 to 18. R has a molecular weight in the range of 400 to 4000, and the surfactant represented by the formula XXII has a molecular weight of 6,000 to 50, 〇〇〇. 20 oxane-polyoxyalkylene copolymer surfactants can be as described in U.S. Patent No. 5,691,392, the third shed '25th line to the fourth column, line 18, the special 34 1287481 This is incorporated herein by reference. The amount of surfactant useful in the present invention can vary widely. In an alternative, non-limiting embodiment, the amount of surfactant is from 0.001% to 10% by weight of the reaction mixture, or from 0.01% to 1% by weight, 5 or 〇0.00% by weight to 〇·5 by weight %.
在另一非限制的具體例中,在製備本發明之聚氨酯脲 之聚合作用期間,可使用成核劑。適合使用於本發明之成 核劑可包括增進相對微小之實質均一的胞室之生成的材 料。成核劑可選自於習知技術領域中已知者。非限制的例 10子可包括但不限制於相對小尺寸的聚合物顆粒(例如丨〇微 米或更小),例如但不限制於聚丙烯、聚乙烯、聚苯乙烯、 聚氨S曰、聚酯及聚丙烯酸酯。所使用之成核劑的量可廣泛 地改變。一般而言,成核劑可以有效產生該胞室的量來使 用在#換的非限制的具體例中,成核劑的存在量可為占 15反應混合物之0·01重量〇〇重量%,或〇 〇5重量%至 0· 5重量%。 t …糊具體例中,含有聚異氰酸醋及/或聚氨 20 含錄㈣、含胺材料、發泡劑及任何視需要 包的進枓可導人—混合單元中。視需要之添加劑可 的例子可包括但不關於抗氧化添加物。非限制 吸收劍、塑化劑、内模脫模劑、;㈣胺uv妓劑、uv 的非限制的具體例中,可將任何及色料。在又-替換 進料及/或所得混合物_度。=有進料加熱,以降低 Θ展合單元之反應混合 35 1287481 物可接著倒入一開放模槽以形成一拋光墊。在一非限制的 具體例中’模槽可控制在溫度為22°C至15(TC,或60°C至110 〇C。 本發明之拋光墊可具有一或多個工作表面,其中如同 5使用於本案說明書及申請專利範圍中者,“工作表面,,一 *司思、指可與待拋光之物件表面及拋光漿液接觸的拋光墊表 面。在一非限制的具體例,待拋光之物件可為一矽晶圓。 在又一非限制的具體例中,拋光墊之工作表面可具有表面 結構,例如但不限制於通道、溝槽、穿孔及其等之組合。 10 表面結構可藉由熟習此項技術者已知的方法併入拋光 墊之工作表面。在一非限制的具體例中,拋光墊的工作表 面可機械地改質,例如藉由研磨或切割。在另一非限制的 具體例中’表面結構可在模塑製程期間併入拋光墊的工作 表面中’例如藉由提供具有突起結構之至少一壓模的内表 15面,該突起結構在拋光墊形成期間,可壓印至該拋光塾的 作表面表面結構可以無規或均—圖案的形式分佈橫越 光塾之作表面。表面結構圖案的非限制的例子可包 括不限制於螺方疋形、圓形、正方形、斷面線及似格狀圖 案。 在#限制的具體例中,聚氨酿脈可包含一研磨劑顆 粒材料。研磨劑顆粒材料可實質均—地或非均一地分佈於 整個聚氨醋脲中。在替換的非限制的具體例中,研磨劑顆 ί材料的存在量,以抛光塾的總重為基準,可為小於70重 刀比或至夕5重!百分比,或5重量百分比至65重量 36 1287481 百分比。 在替換的非限制的具體例中,研磨劑顆粒材料可為個 別顆粒、個別顆粒的聚集體,或個別顆粒及聚集體之組合 的形式。在又一替換的非限制的具體例中,研磨劑顆粒材 5 料的形狀可包括但不限制於球形、桿狀、三角形、角錐體、 圓錐體、規則立方體、不規則立方體,及其等之混合物及 /或組合物。 一般而言,研磨劑顆粒材料的平均顆粒尺寸可廣泛地 改變。在替換的非限制的具體例中,平均顆粒尺寸可為至 10 少0. 001微米,或至少0. 01微米,或至少0. 1微米。在又一 替換的非限制的具體例中,研磨劑顆粒材料的平均顆粒尺 寸可為小於50微米,或小於10微米,或小於1微米。在一非 限制的具體例中,研磨劑顆粒材料的平均顆粒尺寸可沿著 顆粒的最長維度來測量。 15 適合使用於本發明之研磨劑顆粒材料的非限制的例子 可包括但不限制於r -氧化鋁、熔融氧化鋁、經熱處理之氧 化鋁、白色熔融氧化鋁,以及衍生自氧化鋁之溶膠;碳化 矽,例如但不限制於綠色碳化矽及黑色碳化矽;二硼化鈦; 碳化硼;氮化矽;碳化鎢;碳化鈦;鑽石;氮化硼,例如 20 但不限制於立方體氮化硼及六面體氮化硼;石榴石;熔融 氧化铭氧化錯;氧化碎,例如但不限制於熱解氧化ί夕;氧 化鐵;氧化鉻;氧化鈽;氧化鍅;氧化鈦;氧化錫;氧化 錳;及其混合物。在又一非限制的具體例中,研磨劑顆粒 材料可選自於氧化鋁、氧化矽、氧化鈽、氧化鍅及其混合 37 1287481 物0 在一非限制的具體例中, 材料上可具有—表面改質劑 < =之研磨劑顆粒 的例子可包括界面活性劑、之==的非限制 5限制的具體例中,界面、、舌柯% 及/、〜合物。在一非 磨劑顆粒的分散性。在另’:可使用於改良聚氨醋脲中研 使用於增進研磨劑顆粒與聚氨_基質二。 = 中】’表面改f劑的存在量’以研磨劑顆粒材 枓及表面改貝劑的總重為基準,可小於 K) 0.5重量百分比至1〇重量百分比。、里百刀比’或 非二1::為本發明之表面改質劑之適當界面活性劑的 非限制的例子可包括陰離子性、陽離子性、兩性離子性以 及非離子性界面活性劑,例如但不限制於金屬燒氧化物、 聚伸烧基氧化物、長鏈脂肪酸之鹽類。適合使用於本發明 15之搞合劑的非限制的例子可包括石夕烧,例如但不限制於有 機石夕烧、鈦酸鹽及馳酸鹽。在一非限制的具體例中,麵 合劑可包括SILQUEST矽烷A-174及A-1230,其在商業上可自 Witco Corporation購得。 在又一非限制的具體例中,拋光層的厚度可由〇. 5匪 20 改變至5 mm。 在一非限制的具體例中,本發明之拋光層的密度藉由 ASTM 1622-88測量,可為〇·5克/立方公分(g/cc)至^ g/cc。在一另一非限制的具體例中,拋光層根據ASTM D 224〇 測定之蕭氏A硬度值可為至少8〇,或85至98,以及蕭氏D硬 38 1287481 度值可為至少35,或85或更低,或45至80。 雖然不欲受到任何理論的限制,據信當使用時,在抛 、,或平坦切晶K的表面時,本發明之拋光墊之工作表面 的孔隙度可維持實質一定。當抛光塾之工作表面在例如抛 5光墊调整過程中磨耗時,因為暴露出位在鄰近工作表面下 方之包埋的孔洞,所以形成新的表面孔洞。再者,因為拋 ^之工作表面在拋光過程中磨耗,可釋放出包含在該至 / Ρ刀充填氣體之胞室内的氣體。氣體可釋放至工作環境 中,且餘留的孔洞可至少部分充填拋光漿液。 本毛月之拋光墊包括一第二層,該第二層係至少部分 地連接至5亥抛光墊。此第二層可包括習知技術領域中已知 的各種不同材料。第二層可選自於實質非體積可壓縮性聚 合,及金屬膜及金屬箱。如同使用於本案說明書及申請專 利乾圍中者,“實質非體積可壓縮性,,一詞意指當施與20 15 psi之載荷時,體積減少小於1%。 貫質非體積可壓縮性聚合物之非限制的例子包括聚烯 烴,例如但不限制於低密度聚乙烯、高密度聚乙烯、超高 分子量聚乙烯及聚丙烯;聚氣乙烯;例如但不限制於纖維 素乙酸酯及纖維素丁酸酯之以纖維素為主的聚合物;丙烯 20 k如類、聚_及共聚酯’例如但不限制於pet及PETG ;聚 碳酸酯;例如但不限制於耐綸6//6及耐綸6/12之聚醯 胺;以及高性能塑料,例如但不限制於聚醚醚酮 (P〇lyetheretherket〇ne)、聚苯醚、聚颯、聚醯亞胺, 及聚醚醯亞胺,及其等之混合物。 39 1287481 金屬膜之非限制的例子可包括但不限制純、銅、黃 銅、鎳、不銹鋼及其等之組合。 第二層之厚度可改變。在替換的非限制的具體例中, 第二層的厚度可為至少〇· 0005英吋,或至少〇 〇〇1〇英吋; 5或〇. 0650英吋或更小,或0.0030英吋或更小。 在一非限制的具體例中,第二層可為撓性的以增進或 增加拋光墊及被拋光之基板之表面之間的接觸的均一性。 第二層材料之選擇的一考量可為材料提供拋光墊之工作表 面適當支持的能力,以致於拋光整實質上與被拋光之元件 1〇之巨觀外形或長期表面一致。具有此能力的材料可為使用 於作為本發明之第二層的理想材料。 第二層之可撓性可改變。可撓性可使用習知技術領域 中已知的各種不同習知技術來測定。如同使用於本案說明 書及申請專利範圍中者,“可撓性”⑺―詞意指第二層 15厚度之三次方(t3)與第二層材料之撓曲模數(E)之反比 關係,亦即F = 在替換的非限制的具體例中,第二 層之可撓性可為至少0.5 ;或至少1〇〇in_llb-1;或 由 1 iflb-1 至 100 ir^lb-1。 在非限制的具體例中,第二層可具有容許拋光墊實質 20符合待拋光物件之表面的壓縮性。例如半導體晶圓之微電 子基板的表面,可具有因製造方法所導致的“波浪狀,,外 形。可預期到,若抛光塾無法適當地與基板表面之波浪狀 外形一致,可使拋光性能之—致性劣化。舉例而言,若拋 光墊實質上符合該“波浪狀”的端部,但無法實質符合該 40 1287481 “波浪狀”的中間部及與其接觸,則只有該“波浪狀”的 端部可被拋光或平坦化,且該中間部可實質維持未拋光或 未平坦化。 第二層之壓縮性可改變。“壓縮性”一詞意指當施與 5 20 psi之載荷時之麼縮體積百分比測量。在替換的非限制 的具體例中,第二層之壓縮體積百分比可至少為1百分比; 或3百分比或更低;或1至3百分比。壓縮體積百分比可 使用習知技術領域中已知的各種不同方法來測定。 在一非限制的具體例中,第二層為實質非體積可壓縮 10 的。 在另一非限制的具體例中,第二層可分散在次墊之較 大面積上感受到之壓縮力。 在一非限制的具體例中,本發明之拋光墊可在未用次 墊層之下,直接放置在電動拋光工具、機械或裝置的壓板 15 上使用。在又一非限制的具體例中,拋光塾可包含於一拋 光墊總成中,其中背襯層可黏著至拋光墊的背面。在一非 限制的具體例中,拋光墊總成可包含: (a) 具有工作表面及背面的拋光墊; (b) 具有上表面及下表面之背襯層;以及 20 (C)夾置於該拋光墊之背面之至少一部分及該背襯層 之上表面之至少一部分之間並與該等部分接觸的黏著裝 置。 在一非限制的具體例中,拋光墊總成之背襯片材可為 硬質的或撓性的,且在拋光操作期間可支持或安定化或緩 41 1287481 衝拋光墊。背襯片材可由熟習是項技術者已知的材料來製 造。在替換的非限制的具體例中,背襯片材可由有機聚合 物材料製造,例如但不限制於聚酯,例如聚乙烯對苯二甲 酸酯片材,以及聚烯烴,例如聚乙烯片材以及聚丙烯片材。 5 在另一非限制的具體例中,本發明之拋光墊總成的背 襯片材可為一離形片材,其可自該黏著裝置剝離,藉此容 許該拋光墊藉由暴露之黏著裝置黏附至另一表面,例如, 拋光裝置之壓板。一般而言,離形片材為熟習此項技術者 所知。在一非限制的具體例中,離形片材可由紙或有機聚 10 合物材料製造,該有機聚合物材料例如但不限制於聚乙稀 對苯二甲酸酯片材、聚烯烴,例如聚乙烯片材及聚丙烯片 材’以及氟化聚浠烴,例如聚四氟乙稀。在又一非限制的 具體例中,離形片材的上表面可包含離形塗層,其可與黏 著裝置接觸。離形塗層為熟習此項技術者所熟知。離形塗 15 層之非限制的例子可包括氟化聚合物及聚矽氧烧。 黏著劑可選自於習知技術領域中已知的廣泛不同的黏 著性材料。適合使用於本發明之黏著劑可提供充分的剝離 強度,以致於拋光墊層在使用時大致上保持定位。再者, 黏著劑可經選擇以充分地抵抗在拋光或平坦化過程期間存 扣在的剪切應力,以及再者,在使用時可充分地阻抗化學品 2水分的劣化作用。㈣劑可使用熟f此項技術者所知的 習知技術來施用。在-非限制的具體例中,黏著劑可施覆 至彼此平行之拋光塾的下表面及/或背概層的上表面。 42 1287481 適當之黏著裝置的非限制的例子可包括但不限制於接 觸性黏著劑、壓感性黏著劑、結構性黏著劑、熱溶性黏著 劑、熱塑性黏著劑,以及固化性黏著劑,例如熱固化黏著 劑。結構性黏著劑的非限制的例子可選自於聚氨酯黏著 5劑,以及環氧樹脂黏著劑,例如以雙酚A之二環氧甘油醚 為主要成分者。壓感性黏著劑之非限制的例子可包括彈性 體聚合物及增稠樹脂。 彈性體聚合物可選自於天然橡膠、丁基橡膠、氯化橡 膠、聚異氰酸酯、聚(乙烯基烷基醚)、醇酸黏著劑、例如 10以2-乙基己基丙烯酸酯及丙烯酸之共聚物為主要成分之丙 烯酸酯類黏著劑、例如苯乙烯—丁二烯_苯乙浠之嵌段共聚 物,及其等之混合物。在一非限制的具體例中,壓感性黏 著劑可使用一有機溶劑,或自以水為主之乳化液,或自一 熔融物施覆至一基材,該有機溶劑例如甲苯或己烷。如同 15本案說明書中所使用者,“熱融性黏著劑,,一詞意指一黏 著劑係由非揮發性熱塑性材料所組成,該熱塑性材料可加 熱成一溶融物,且接著以液體方式施覆至一基材上。熱溶 勘者劑之非限制的例子可選自於乙稀—乙酸乙稀g旨共聚 、笨乙烯-丁二烯共聚物、乙烯-丙烯酸乙酯共聚物、聚 2〇 酉匕、/ | 9 列如由一胺及二聚酸之反應所形成之聚醯胺,以及聚 氨酸。 在一非限制的具體例中,黏著劑層可在將拋光墊及背 概片材壓合在一起之前,施覆至拋光墊之背面及/或背襯 片材之上表面。 43 1287481 在一替換的非限制的具體例中,拋光墊總成的黏著裝 置可選自於黏著劑總成或黏著劑層。 在又一非限制的具體例中,黏著劑總成可包含一黏著 劑支持片材,其係夾置於上黏著劑層及下黏著劑層之間。 5 黏著劑總成之上黏著劑層可與拋光墊的背面接觸,以及下 黏著劑層可與背襯片材的上表面接觸。黏著劑支持片材可 由有機聚合物材料製造,該有機聚合物材料例如但不限制 於聚酯,例如聚乙烯對苯二曱酸酯片材,及聚烯烴,例如 聚乙烯片材及聚丙烯片材。在又一非限制的具體例中,黏 10 著劑總成之上及下黏著劑層可選自於在上文中有關黏著劑 層之内容中所述的該等黏著劑。在一非限制的具體例中, 上及下黏著劑層可分別為接觸性黏著劑。在又一非限制的 具體例中,黏著劑總成可為雙面或雙塗覆之膠帶,例如但 不限制於雙塗覆膜膠帶,其在商業上可獲自於3M公司,工 15 業膠帶及特殊產品部(Industrial Tape and SpecialtiesIn another non-limiting embodiment, a nucleating agent can be used during the polymerization to prepare the polyurethaneurea of the present invention. Nucleating agents suitable for use in the present invention may include materials which enhance the formation of relatively small, substantially uniform cells. The nucleating agent can be selected from those known in the art. Non-limiting Examples 10 may include, but are not limited to, relatively small sized polymer particles (e.g., micron or smaller) such as, but not limited to, polypropylene, polyethylene, polystyrene, polyaza, poly Ester and polyacrylate. The amount of nucleating agent used can vary widely. In general, the nucleating agent can effectively produce the amount of the cell to be used in a non-limiting specific example of #换, the nucleating agent can be present in an amount of 0.101 wt% by weight of the 15 reaction mixture. Or 〇〇 5 wt% to 0.5 wt%. In the specific example, the polyisocyanuric acid and/or the polyamine 20 contains the (IV), the amine-containing material, the foaming agent and any optional package. Examples of optional additives may include, but are not related to, antioxidant additives. Non-limiting absorption of swords, plasticizers, internal mold release agents, (4) amine uv 妓, uv, non-limiting specific examples, can be any color. In turn - replace the feed and / or the resulting mixture _ degrees. = There is feed heating to reduce the reaction mixing of the bismuth unit. 35 1287481 can then be poured into an open cavity to form a polishing pad. In a non-limiting embodiment, the 'cavity can be controlled at a temperature of 22 ° C to 15 (TC, or 60 ° C to 110 ° C. The polishing pad of the present invention can have one or more working surfaces, like 5 For use in the present specification and the scope of the patent application, "working surface, a surface of a polishing pad that can be in contact with the surface of the object to be polished and the polishing slurry. In a non-limiting example, the object to be polished In one non-limiting embodiment, the working surface of the polishing pad can have a surface structure such as, but not limited to, a combination of channels, trenches, perforations, and the like. A method known to those skilled in the art is incorporated into the working surface of the polishing pad. In a non-limiting embodiment, the working surface of the polishing pad can be mechanically modified, such as by grinding or cutting. In a specific example, 'the surface structure can be incorporated into the working surface of the polishing pad during the molding process', for example by providing an inner surface 15 of at least one stamp having a raised structure that is compressible during formation of the polishing pad Printed to The surface structure of the polished crucible may be distributed in a random or uniform-pattern form across the surface of the aperture. Non-limiting examples of surface structure patterns may include, without limitation, a spiral shape, a circle, a square, a section. Line and lattice-like pattern. In the specific example of #limit, the polyurethane brewing vein may comprise an abrasive particulate material. The abrasive particulate material may be substantially uniformly or non-uniformly distributed throughout the polyurethane. In a non-limiting embodiment of the alternative, the amount of abrasive material present, based on the total weight of the polished crucible, may be less than 70 weight ratio or 5 weight percent! percent, or 5 weight percent to 65 weight 36 1287481 Percent. In an alternative non-limiting embodiment, the abrasive particulate material can be in the form of individual particles, aggregates of individual particles, or a combination of individual particles and aggregates. In yet another alternative, non-limiting embodiment The shape of the abrasive particle material 5 may include, but is not limited to, a mixture of spheres, rods, triangles, pyramids, cones, regular cubes, irregular cubes, and the like, and/or groups thereof. The average particle size of the abrasive particle material may vary widely. In an alternative non-limiting embodiment, the average particle size may be less than 0.1 0.001 μm, or at least 0.01 μm, or At least 0.1 micron. In yet another alternative, non-limiting embodiment, the abrasive particulate material may have an average particle size of less than 50 microns, or less than 10 microns, or less than 1 micron. In a non-limiting embodiment. The average particle size of the abrasive particulate material can be measured along the longest dimension of the particle. 15 Non-limiting examples of abrasive particulate materials suitable for use in the present invention can include, but are not limited to, r-alumina, fused alumina, Heat treated alumina, white fused alumina, and sol derived from alumina; tantalum carbide, such as but not limited to green tantalum carbide and black tantalum carbide; titanium diboride; boron carbide; tantalum nitride; tungsten carbide; Titanium carbide; diamond; boron nitride, such as 20 but not limited to cubic boron nitride and hexahedral boron nitride; garnet; oxidized oxidation oxidization error; Xi pyrolysis oxidation ί; iron oxide; chromium; cerium oxide; francium oxide; titanium oxide; tin oxide; manganese oxide; and mixtures thereof. In still another non-limiting embodiment, the abrasive particulate material may be selected from the group consisting of alumina, cerium oxide, cerium oxide, cerium oxide, and mixtures thereof. 37 1287481 0 In a non-limiting embodiment, the material may have - Examples of the surface modifying agent <= abrasive particles may include a specific example of a surfactant, a non-limiting 5 limit of ==, interface, 舌%%, and/or a compound. The dispersibility of a non-abrasive particle. In another step: it can be used to improve the polyurethane urethane to improve the abrasive particles and the polyurethane-matrix. = Medium] The amount of surface modification agent present may be less than K) 0.5% by weight to 1% by weight based on the total weight of the abrasive particle 枓 and the surface scalloping agent. Rare-knife ratio 'or non-two 1:: Non-limiting examples of suitable surfactants for the surface modifiers of the present invention may include anionic, cationic, zwitterionic, and nonionic surfactants, for example However, it is not limited to metal oxide oxides, polyalkylene oxides, and salts of long-chain fatty acids. Non-limiting examples of suitable combinations for use in the present invention may include, for example, but not limited to, organic calcination, titanate, and gallate. In a non-limiting embodiment, the surfactants can include SILQUEST decane A-174 and A-1230, which are commercially available from Witco Corporation. In still another non-limiting embodiment, the thickness of the polishing layer can be changed from 匪. 5匪 20 to 5 mm. In a non-limiting embodiment, the density of the polishing layer of the present invention, as measured by ASTM 1622-88, can range from 5 grams per cubic centimeter (g/cc) to 2 g/cc. In a further non-limiting embodiment, the polishing layer may have a Shore A hardness value of at least 8 Å, or 85 to 98, as measured according to ASTM D 224, and a Shore D hardness of 38 1287481 degrees may be at least 35. Or 85 or lower, or 45 to 80. While not wishing to be bound by any theory, it is believed that when used, the porosity of the working surface of the polishing pad of the present invention can be maintained substantially constant when throwing, or flattening the surface of the K. When the working surface of the polished crucible is worn during, for example, the polishing process, a new surface hole is formed because the embedded hole located below the working surface is exposed. Furthermore, since the working surface of the throwing surface is worn during the polishing process, the gas contained in the cell chamber of the to-crush filling gas can be released. The gas can be released into the working environment and the remaining holes can be at least partially filled with the polishing slurry. The polishing pad of the present month includes a second layer that is at least partially attached to the 5 liter polishing pad. This second layer may comprise a variety of different materials known in the art. The second layer can be selected from the group consisting of substantially non-volumetric compressible polymerization, and metal films and metal boxes. As used in the present specification and in the patent pending enclosure, "substantially non-volutable compressibility," means a volume reduction of less than 1% when applied to a load of 20 15 psi. Permeable non-volume compressible polymerization Non-limiting examples of materials include polyolefins such as, but not limited to, low density polyethylene, high density polyethylene, ultra high molecular weight polyethylene and polypropylene; polyethylene; for example but not limited to cellulose acetate and fiber a cellulose-based polymer of butyl butyrate; propylene 20 k such as poly, and copolyesters such as but not limited to pet and PETG; polycarbonate; for example but not limited to nylon 6// 6 and nylon 6/12 polyamide; and high performance plastics such as, but not limited to, polyetheretherketone (P〇lyetheretherketne), polyphenylene ether, polyfluorene, polyimine, and polyether oxime Imines, and mixtures thereof, etc. 39 1287481 Non-limiting examples of metal films may include, but are not limited to, combinations of pure, copper, brass, nickel, stainless steel, and the like. The thickness of the second layer may vary. In a non-limiting specific example, the thickness of the second layer may be at least 〇 0005 inches, or at least 1 inch; 5 or 〇. 0650 inches or less, or 0.0030 inches or less. In a non-limiting example, the second layer may be flexible To enhance or increase the uniformity of the contact between the polishing pad and the surface of the substrate to be polished. The consideration of the choice of the second layer of material can provide the material with the ability to properly support the working surface of the polishing pad, so that the polishing is substantially It conforms to the giant profile or long-term surface of the polished component. The material having this ability can be an ideal material for use as the second layer of the present invention. The flexibility of the second layer can be changed. It is determined using a variety of different conventional techniques known in the art, as used in the present specification and the scope of the patent application, "flexibility" (7) - word means the third layer of the thickness of the second layer 15 (t3) Inverse relationship with the flexural modulus (E) of the second layer of material, that is, F = in the non-limiting embodiment of the alternative, the flexibility of the second layer may be at least 0.5; or at least 1 〇〇 in_llb- 1; or from 1 iflb-1 to 100 ir^lb-1. In non-limiting In a specific example, the second layer may have a compressibility that allows the polishing pad substantially 20 to conform to the surface of the article to be polished. For example, the surface of the microelectronic substrate of the semiconductor wafer may have a "wavy, outer shape" caused by the manufacturing method. It is expected that if the polishing flaw is not properly aligned with the wavy shape of the substrate surface, the deterioration of the polishing performance can be deteriorated. For example, if the polishing pad substantially conforms to the "wavy" end, but does not substantially conform to and is in contact with the "wavy" intermediate portion of the 40 1287481, only the "wavy" end can be polished. Or planarization, and the intermediate portion can substantially remain unpolished or unplanarized. The compressibility of the second layer can vary. The term "compressibility" means the measurement of the percent volume when applied to a load of 5 20 psi. In an alternative non-limiting embodiment, the second layer may have a percent compression volume of at least 1 percent; or 3 percent or less; or 1 to 3 percent. The percent compression volume can be determined using a variety of different methods known in the art. In a non-limiting embodiment, the second layer is substantially non-volitable and compressible. In another non-limiting embodiment, the second layer can be dispersed in a compressive force felt over a relatively large area of the secondary mat. In a non-limiting embodiment, the polishing pad of the present invention can be placed directly onto the platen 15 of an electric polishing tool, machine or device without the use of a secondary mat. In yet another non-limiting embodiment, the polishing pad can be included in a polishing pad assembly wherein the backing layer can be adhered to the back of the polishing pad. In a non-limiting embodiment, the polishing pad assembly can comprise: (a) a polishing pad having a working surface and a back surface; (b) a backing layer having an upper surface and a lower surface; and 20 (C) sandwiching An adhesive means between at least a portion of the back side of the polishing pad and at least a portion of the upper surface of the backing layer and in contact with the portions. In a non-limiting embodiment, the backing sheet of the polishing pad assembly can be rigid or flexible and can support or stabilize or retard the 41 1287481 polishing pad during the polishing operation. The backing sheet can be made from materials known to those skilled in the art. In an alternative, non-limiting embodiment, the backing sheet may be fabricated from an organic polymeric material such as, but not limited to, a polyester, such as a polyethylene terephthalate sheet, and a polyolefin, such as a polyethylene sheet. And polypropylene sheets. In another non-limiting embodiment, the backing sheet of the polishing pad assembly of the present invention can be a release sheet that can be peeled from the adhesive device, thereby allowing the polishing pad to be adhered by exposure. The device is adhered to another surface, for example, a platen of the polishing apparatus. In general, release sheets are known to those skilled in the art. In a non-limiting embodiment, the release sheet can be made of paper or an organic polymeric material such as, but not limited to, a polyethylene terephthalate sheet, a polyolefin, for example Polyethylene sheets and polypropylene sheets' and fluorinated polyfluorenes such as polytetrafluoroethylene. In yet another non-limiting embodiment, the upper surface of the release sheet can include a release coating that can be in contact with the adhesive device. Release coatings are well known to those skilled in the art. Non-limiting examples of the off-coat 15 layer may include fluorinated polymers and polyoxymethane. The adhesive may be selected from a wide variety of adhesive materials known in the art. Adhesives suitable for use in the present invention provide sufficient peel strength such that the polishing pad remains substantially positioned during use. Further, the adhesive may be selected to sufficiently resist the shear stress that is retained during the polishing or planarization process, and further, to sufficiently impede the deterioration of the chemical 2 moisture during use. (d) The agent can be administered using conventional techniques known to those skilled in the art. In a non-limiting embodiment, the adhesive may be applied to the lower surface of the polishing crucible and/or the upper surface of the backing layer that are parallel to each other. 42 1287481 Non-limiting examples of suitable adhesive devices can include, but are not limited to, contact adhesives, pressure sensitive adhesives, structural adhesives, hot soluble adhesives, thermoplastic adhesives, and curable adhesives such as heat curing. Adhesive. Non-limiting examples of the structural adhesive may be selected from the group consisting of polyurethane adhesives, and epoxy resin adhesives such as diglycidyl ether of bisphenol A. Non-limiting examples of pressure sensitive adhesives may include elastomeric polymers and thickening resins. The elastomeric polymer may be selected from the group consisting of natural rubber, butyl rubber, chlorinated rubber, polyisocyanate, poly(vinyl alkyl ether), alkyd adhesive, for example, copolymerization of 10 with 2-ethylhexyl acrylate and acrylic acid. An acrylate-based adhesive having a main component, such as a block copolymer of styrene-butadiene-styrene, and the like. In a non-limiting embodiment, the pressure sensitive adhesive may be applied to an organic solvent, or a water-based emulsion, or from a molten material, such as toluene or hexane, to a substrate. As used in the specification of the present invention, the term "hot melt adhesive" means that an adhesive consists of a non-volatile thermoplastic material which can be heated into a melt and then applied in a liquid form. On a substrate, a non-limiting example of a hot melter can be selected from the group consisting of ethylene-ethylene acetate, copolymers, stupid ethylene-butadiene copolymers, ethylene-ethyl acrylate copolymers, polyfluorenes.酉匕, / | 9 columns such as polyamine formed by the reaction of a monoamine and a dimer acid, and poly-amino acid. In a non-limiting embodiment, the adhesive layer can be used in polishing pads and back sheets Before the materials are pressed together, they are applied to the back of the polishing pad and/or the upper surface of the backing sheet. 43 1287481 In an alternative, non-limiting embodiment, the bonding device of the polishing pad assembly may be selected from the group consisting of In another non-limiting embodiment, the adhesive assembly can comprise an adhesive support sheet that is sandwiched between an upper adhesive layer and a lower adhesive layer. The adhesive layer on the agent assembly can be in contact with the back surface of the polishing pad to The lower adhesive layer may be in contact with the upper surface of the backing sheet. The adhesive support sheet may be made of an organic polymeric material such as, but not limited to, a polyester such as a polyethylene terephthalate sheet. And polyolefin, such as polyethylene sheet and polypropylene sheet. In still another non-limiting embodiment, the adhesive layer assembly and the lower adhesive layer may be selected from the above related adhesives. The adhesives described in the contents of the layers. In a non-limiting embodiment, the upper and lower adhesive layers may be contact adhesives, respectively. In yet another non-limiting embodiment, the adhesive assembly may Double or double coated tape, such as but not limited to double coated film tape, commercially available from 3M Company, Industrial Tape and Specialties (Industrial Tape and Specialties)
Division) 0 在替換的非限制的具體例中,次墊之材料可經發泡或 吹塑以產生多孔性結構。多孔性結構可為開放胞室、密閉 胞室,或其等之組合。 20 合成橡膠之非限制的例子可包括氯丁橡膠、聚矽氧烷 橡膠、氯丁二烯橡膠、乙烯-丙烯橡膠、丁基橡膠、聚丁二 烯橡膠、聚異戊二烯橡膠、EPDM聚合物、苯乙烯-丁二烯共 聚物、乙烯及乙基乙酸乙烯酯之共聚物、氣丁橡膠/乙烯 腈橡膠、氯丁橡膠/EPDM/SBR橡膠,以及其等之組合。熱 44 1287481 塑性彈性體之非限制的例子可包括聚氨醋,例如以聚醚及 聚酯為主者,以及其等之共聚物。發泡體片材之非限制的 例子可包括乙烯乙酸乙烯酯片材及聚乙烯發泡體片材;聚 氨酯發泡體片材,以及聚晞煙發泡體片材,例如但不限制 5 於違專可由 R〇gers Corporation, Woodstock,CT 購得者。 在又一非限制的具體例中,次墊可包括不織的或經編 織的纖維墊及其等之組合;例如但不限制於聚烯烴、聚酯、 聚醯胺或丙烯酸纖維,其可經由樹脂浸潤。纖維墊之纖維 可為短纖維或實質連續纖維。非限制的例子可包括但不限 10制於經t氣/文潤之不織織物’例如經聚氨g旨浸潤的毛 毯。商業上可取得之不織次墊的非限制的例子可為來自Division 0 In the non-limiting embodiment of the alternative, the material of the secondary mat may be foamed or blown to create a porous structure. The porous structure can be an open cell, a closed cell, or a combination thereof. 20 Non-limiting examples of synthetic rubber may include neoprene, polyoxyalkylene rubber, chloroprene rubber, ethylene-propylene rubber, butyl rubber, polybutadiene rubber, polyisoprene rubber, EPDM polymerization. , styrene-butadiene copolymer, copolymer of ethylene and ethyl vinyl acetate, gas rubber / vinyl nitrile rubber, neoprene / EPDM / SBR rubber, and combinations thereof. Heat 44 1287481 Non-limiting examples of plastic elastomers may include polyurethanes, such as polyethers and polyesters, and copolymers thereof. Non-limiting examples of the foam sheet may include an ethylene vinyl acetate sheet and a polyethylene foam sheet; a polyurethane foam sheet, and a poly-smoke foam sheet such as, but not limited to, 5 Offenders are available from R〇gers Corporation, Woodstock, CT. In yet another non-limiting embodiment, the secondary mat may comprise a nonwoven or woven fibrous mat and combinations thereof, such as, but not limited to, polyolefin, polyester, polyamide or acrylic fibers, which may be via Resin infiltration. The fibers of the fiber mat may be short fibers or substantially continuous fibers. Non-limiting examples may include, but are not limited to, a nonwoven fabric made of t-gas/texture, such as a wool impregnated with polyurethane. A non-limiting example of a commercially available non-woven mat may be from
Rode 1,Inc· Newark DE 之 SubaTM IV。 次蟄的厚度可改變。-般而言,次墊的厚度應使用堆 疊之拋光墊不會太厚。太厚之堆疊拋光墊會難以放置在平 15坦化設備上及自平坦化設備移除。因此,在非限制的具體 例中,次墊的厚度可為0. 2至2 mm。 在一非限制的具體例中,本發明之拋光墊可包含一次 墊,以及次墊可作為拋光墊的底部層,該底部層可連接至 拋光裝置之壓板。 20 纟—非限制的具體例中,次塾可實質上無孔洞,以及 對拋光漿液為實質不可滲透的。如同使用於本案說明奎及 申請專利範财者,“實質上無孔洞”―詞意指對液^、 氣體及細菌的通過大致上是不可滲透的。在巨觀規模上, 貫質無孔洞的材料若有任何孔洞的話,也是呈現極少。如 45 1287481 同使用於本案說明書及申請專利範圍中者,“多孔性,,一 岡意指具有孔洞,以及“孔洞,,一詞意指可由物質通過之 極小的開口。 在又一非限制的具體例中,藉由將該拋光墊至少部分 5地連接至该弟二層以及將該第二層至少部分地連接至一次 墊層,可建構三層堆疊墊。在又一非限制的具體例中,商 業上可購自此加1,Incorporated的直徑22.0”之SUBAIV -人墊可包含該次墊。如上文中所述,一開口可切入該拋光 層、第二層及次墊層中。在又一非限制的具體例中,該開 1〇 口可為具有尺寸0·5” X2.0”之矩形,沿著徑向位向之長軸 定位,中心與墊之中心相距4” 。如上文中所述,一窗部可Rode 1, Inc. Newark DE SubaTM IV. The thickness of the secondary flaw can be changed. In general, the thickness of the secondary mat should be too thick to use the stacked polishing pad. Too thick stacked polishing pads can be difficult to place on and removed from the flattening device. 2至2毫米。 Thus, in a non-limiting embodiment, the thickness of the secondary pad may be 0. 2 to 2 mm. In a non-limiting embodiment, the polishing pad of the present invention can comprise a primary pad, and the secondary pad can serve as a bottom layer of the polishing pad that can be attached to the platen of the polishing apparatus. 20 纟—Unrestricted specific examples, the secondary enthalpy may be substantially void-free and substantially impermeable to the polishing slurry. As used in this case, Quin and the patent applicant, "substantially no hole" - the word means that the passage of liquid, gas and bacteria is substantially impermeable. On the scale of the giant scale, if there is any hole in the material of the perforated non-porous hole, it is rarely present. For example, 45 1287481 is used in the scope of the present specification and the scope of the patent application, "porosity," means having a hole, and "hole," means a very small opening through which a substance can pass. In yet another non-limiting embodiment, a three layer stacking mat can be constructed by attaching the polishing pad at least partially to the second layer and at least partially connecting the second layer to the primary mat. In yet another non-limiting embodiment, a SUBAIV-human pad of commercially available 2, Incorporated diameter 22.0" can be included in the secondary pad. As described above, an opening can be cut into the polishing layer, second In another non-limiting embodiment, the opening 1 can be a rectangle having a size of 0·5" X 2.0", which is positioned along the radial direction to the long axis, center and The center of the pad is 4" apart. As mentioned above, a window can be
形成於第一層中。在替換的非限制的具體例中,開口可在 至少部分地連接該SUBA IV墊至第二層之前,切入該SUBA IV墊,或該開口可在至少部分地連接該拋光層、第二層及 15准墊層之後,切入該墊中。 在另-非限制的具體例中,窗部可形成於拋光層及第 二2之總射’如上文巾所述,以及含有開σ之次塾層可 接者至少部分地連接至該第二層,以致使次塾層中的開口 係至少部分地與該拋光墊的開口及第二層中的窗部對齊。 -開口可在至少部分地連接該次塾至該拋光墊及第二層的 總成之前或之後,切入該次塾中。在替換的非限制的W 例中,開口可藉由習知技術領域已知的任何適當方法^ 生’例如上文中有_光層中開口的描述内容。再者士 46 1287481 上文中所描述者,開口之尺寸、形狀及位置可依所應用之 计里學设備及拋光裝置來決定。 在另一非限制的具體例中,本發明之拋光墊可包含一 拋光層、一第二層,以及一次墊層。拋光層及次墊層各自 5包έ開口。此二層中的開口係至少部分地彼此對齊。至 少一部分之第二層可包括一至少部分透明的窗部。該窗部 可至少部分地在二側塗覆上接觸性黏著劑,以及此等層可 壓合在一起以形成一堆疊墊總成。黏著劑可接著使用黏著 劑實質黏附的材料’自第二層之窗部區域的上及下表面剝 10除。黏著劑實質黏附之材料的非限制的例子為Teslin⑧Formed in the first layer. In an alternative non-limiting embodiment, the opening can be cut into the SUBA IV pad prior to at least partially connecting the SUBA IV pad to the second layer, or the opening can be at least partially joined to the polishing layer, the second layer, and After the 15th cushion, cut into the mat. In another non-limiting embodiment, the window portion may be formed on the polishing layer and the second shot of the second portion as described above, and the second layer having the opening σ is at least partially connected to the second portion. The layer is such that the opening in the secondary layer is at least partially aligned with the opening of the polishing pad and the window in the second layer. The opening may be cut into the crucible before or after the assembly of the polishing pad and the second layer is at least partially joined. In an alternative non-limiting example of W, the opening can be made by any suitable method known in the art, such as the description of the opening in the _optical layer. Further, 46 1287481 As described above, the size, shape and position of the opening can be determined by the application of the equipment and the polishing apparatus. In another non-limiting embodiment, the polishing pad of the present invention can comprise a polishing layer, a second layer, and a primary backing layer. The polishing layer and the sub-layer layer each have 5 openings. The openings in the two layers are at least partially aligned with one another. At least a portion of the second layer can include an at least partially transparent window portion. The window portion can be coated with a contact adhesive at least partially on both sides, and the layers can be pressed together to form a stacked mat assembly. The adhesive can then be stripped from the upper and lower surfaces of the window portion of the second layer using a material that is substantially adhered by the adhesive. A non-limiting example of a material that adheres to the adhesive is Teslin8.
Sp-1000,為一種商業上可購自於PPG Industries,Inc, Pittsburgh,PA之合成片材材料。 在一非限制的具體例中,本發明之拋光墊可與習知技 術領域中已知的拋光漿液組合使用。與本發明之拋光墊一 15起使用之適當漿液的非限制的例子包括但不限制於描述於 美國專利申請案序號第09/882, 548號及第09/882, 549號 中的浆液’該二美國申請案皆在2〇〇1年6月μ日提出申 請且皆在審查中。在一非限制的具體例中,拋光漿液可夾 置於抛光塾及被拋光之基板之間。拋光或平坦化方法可包 20括使抛光墊相對被拋光之基板移動。各種不同之拋光漿液 為習知技術領域中已知。使用於本發明之適當漿液的非限 制的例子包括含有研磨劑顆粒的漿液。可使用於漿液中的 研磨劑包括顆粒氧化鈽、顆粒氧化鋁、顆粒氧化矽及其類 似物。使用於半導體基板之拋光的商業漿液包括但不限制 47 1287481 於可購自 Rodel,Inc· Newark DE 之 ILD1200 及 ILD1300, 以及可購自於Cabot微電子材料部門(Cabot Microelectronics Materials Division)之 Semi-Sperse AM100 及 Semi-Sperse 12 o 5 本發明之窗部墊可與各種不同的習知技術領域中已知 的拋光設備一起使用。在一非限制的具體例中,可使用Sp-1000 is a synthetic sheet material commercially available from PPG Industries, Inc, Pittsburgh, PA. In a non-limiting embodiment, the polishing pad of the present invention can be used in combination with polishing slurries known in the art. Non-limiting examples of suitable slurries for use with the polishing pad of the present invention include, but are not limited to, the slurries described in U.S. Patent Application Serial Nos. 09/882,548 and 09/882,549. The two US applications were filed on June 2, 2001 and are under review. In a non-limiting embodiment, the polishing slurry can be sandwiched between the polishing crucible and the substrate being polished. The polishing or planarization method can include moving the polishing pad relative to the substrate being polished. A variety of different polishing slurries are known in the art. Non-limiting examples of suitable slurries for use in the present invention include slurries containing abrasive particles. Abrasives which can be used in the slurry include particulate cerium oxide, particulate alumina, particulate cerium oxide and the like. Commercial slurries for polishing of semiconductor substrates include, but are not limited to, 47 1287481 from ILD1200 and ILD1300 available from Rodel, Inc. Newark DE, and Semi-Sperse available from Cabot Microelectronics Materials Division. AM100 and Semi-Sperse 12 o 5 The window mat of the present invention can be used with a variety of different polishing equipment known in the prior art. In a non-limiting specific example, it can be used
Mirra 拋光器,由 Applied Materials Inc,SantaClaraCA 所製造,其中該開口的形狀為矩形,尺寸為〇· 5” X2. 〇,,, 沿著徑向位向之長軸定位,中心與拋光墊之中心相距4” 。 1〇 Mirra拋光器的壓板直徑為20” 。與此拋光器一起使用的 墊可包含直徑20英吋圓形,其具有位於此區域中的窗部。 在又一非限制的具體例中,可應用Teres拋光器,其 在商業上可購自於 Lam Research Corporation,FVemont, CA。此拋光器使用一連續帶來取代圓形壓板。此拋光器的 15墊可為覓度12及周長93· 25”的連續帶,其具有依適當 尺寸製造且與Teres拋光器之計量學窗部對齊定位的窗部 區域。以致於其可至少部分地與該第二層之至少部分透明 的窗部對齊。 本發明之拋光墊可具有選自於但不受限於下述形狀: 2〇圓形、橢圓形、正方形、矩形及三角形。在一非限制的具 體例中’拋光墊可為連續帶的形式。根據本發明之抛光塾 可具有廣範圍的尺寸及厚度。在一非限制的具體例中,圓 形拋光墊的直徑範圍可為3.8 cm至137 cm。 48 1287481 〜本發明更特職描述於後文的實施例中,其僅欲供例 不》兒明,因為其中許多改良及變化對熟習該項技術者可言 是明顯的。除非另外說明,所有部分及所有百分比皆以重 量表示。 實施例 實施例1 將36· 00么斤之Airthane PHP—75D聚氨酯預聚物、1· 26 公斤之Des_ur N 33_及19公斤之L_围界 面活性劑進料Uaule,三成分低壓分配機的第一槽中,且 保持在140 F及15 PSI之氮氣壓下。禾】用低速攪拌混合此 槽。稭由在2UTF之溫度下,溶化35 5公斤之[隱咖 MCDEA,以及接著利用攪拌添加5· 5公斤之v⑽Mink p_25〇 來製備固化劑混合物。接下來,添加〇. 21公斤之附狀118〇〇 並攪拌至均-地混合。接著將固化劑混合物倒入第二槽中 I5並保持在210 F及40 pSi之氮氣壓下,以及利用低速撲拌 混合。接著在室溫及大氣壓力下,將219克之Versalink P 650、60克之DABCO BL-1Θ催化劑及21克之去離水的混 。物,倒入第二槽中。藉由固定輸送泵,以自第一槽取242 克·自第二槽取100克:自第三槽取1.80克的重量比例, °將第一槽、第二槽及第三槽的流體倒入混合器中。在高速 攪拌下混合流體,並分配至開放圓形模中,該模具有31英 吋的直徑及0· 090英吋的厚度,該模已預熱至16〇卞。將開 放模放置於160°F的烘箱中15分鐘。之後,將產物自模中 私出在230 F下持續固化18小時。接著容許產物冷卻至 49 1287481 至μ。自經模塑的部件切下直徑2〇,,的圓形墊。接著將該 塾切』成厚度〇· 090英忖,及利用研磨機,使塾之上及下 表面呈平行。將具有節距0.060”之寬度〇·〇20” Χ0.030” ’木度的同心圓形槽加工成工作表面。接著於墊中切割出窗 5 w開口。械為矩形且尺寸為Q 5,m開口係沿著徑 向位向之長軸定位,中心與拋光墊之中心相距4”。將具有 離^/襯塾之雙面塗覆膜膠帶施覆至此碟狀物的一表面,該 碟狀物未形成溝槽,以致於在第一層中的矩形開口係實質 上由该膠帶所橫越。膜膠帶在商業上可購自於3M,為95〇〇pc ίο 型高效能雙面塗覆膠帶。 堆璺塾係藉由將拋光墊總成安裝在具有開口之次墊第 三層上來建構。由具有直徑2〇”之聚氨酯發泡體碟形物構 成的次塾係由PORON FH 48片材(可購自Rogers Corporation,Woodstock,CT)模切出來,具有厚度為 l 5Mirra polisher, manufactured by Applied Materials Inc, Santa ClaraCA, where the opening is rectangular in shape and has a size of 〇·5” X2. 〇,,, positioned along the radial axis toward the long axis, centered and center of the polishing pad 4" apart. The 1 〇Mirra polisher has a platen diameter of 20". The pad used with this polisher can comprise a 20 inch diameter circle with a window located in this area. In yet another non-limiting embodiment, A Teres polisher is commercially available from Lam Research Corporation, FVemont, CA. This polisher replaces the circular platen with a continuous strip. The 15 pads of this polisher can be twisted 12 and perimeter 93. A 25" continuous belt having a window region that is sized to align with the metrology window of the Teres polisher. It can be at least partially aligned with at least partially transparent portions of the second layer. The polishing pad of the present invention may have a shape selected from, but not limited to, the following shapes: 2 〇 circular, elliptical, square, rectangular, and triangular. In a non-limiting embodiment, the polishing pad can be in the form of a continuous strip. The polishing crucible according to the present invention can have a wide range of sizes and thicknesses. In a non-limiting embodiment, the circular polishing pad can range in diameter from 3.8 cm to 137 cm. 48 1287481~ The present invention is described in more detail in the following examples, which are intended to be merely illustrative, as many modifications and variations are apparent to those skilled in the art. All parts and all percentages are by weight unless otherwise indicated. EXAMPLES Example 1 An airfane PHP-75D polyurethane prepolymer of 36·00 kg, a 1.6 kg of Des_ur N 33_ and a 19 kg L_per surfactant were fed to Uaule, a three-component low pressure dispenser. The first tank was maintained at a nitrogen pressure of 140 F and 15 PSI. Wo] Mix the tank with low speed stirring. The straw was prepared by dissolving 35 5 kg of [cheat coffee MCDEA] at a temperature of 2 UTF, and then adding 5.5 kg of v(10) Mink p_25〇 by stirring. Next, add 21. 21 kg of appendage 118 〇〇 and stir until homogeneously mixed. The curing agent mixture was then poured into a second tank, I5, and maintained under a nitrogen pressure of 210 F and 40 pSi, and mixed at a low speed. Next, 219 g of Versalink P 650, 60 g of DABCO BL-1 Θ catalyst and 21 g of deionized water were mixed at room temperature and atmospheric pressure. Pour into the second tank. By fixing the transfer pump, take 242 grams from the first tank · take 100 grams from the second tank: take the weight ratio of 1.80 grams from the third tank, ° pour the fluid of the first tank, the second tank and the third tank Into the mixer. The fluid was mixed under high speed agitation and dispensed into an open circular mold having a diameter of 31 inches and a thickness of 0. 090 inches. The mold was preheated to 16 inches. The open mold was placed in an oven at 160 °F for 15 minutes. Thereafter, the product was allowed to stand in the mold and cured at 230 F for 18 hours. The product is then allowed to cool to 49 1287481 to μ. A circular pad having a diameter of 2 inches was cut from the molded part. Then, the crucible is cut to a thickness of 090 090 ft, and a grinder is used to make the upper and lower surfaces of the crucible parallel. A concentric circular groove having a width of 0.060" pitch 〇·〇20" Χ0.030"' wood is processed into a working surface. Then a window 5 w opening is cut in the pad. The tool is rectangular and the size is Q 5 , The m opening is positioned along the radial direction toward the long axis, and the center is 4" from the center of the polishing pad. Applying a double-coated film tape having a liner/pad to the surface of the dish, the dish is not grooved, so that the rectangular opening in the first layer is substantially covered by the tape Cross. Membrane tape is commercially available from 3M and is a 95"pc ίο high-performance double-coated tape. The stacking is constructed by mounting the polishing pad assembly on the third layer of the secondary pad having openings. The secondary oxime system consisting of a polyurethane foam dish having a diameter of 2 〇" was die-cut from PORON FH 48 sheet (available from Rogers Corporation, Woodstock, CT) having a thickness of l 5
15厘米及密度為〇· 48 g/cm3。另一具有離形襯墊之雙面塗覆 膜勝▼在商業上可獲自於Adhesives Research,Inc·,其 商品名為ARclad 90334。將黏著劑膠帶應用至聚氨酯發泡 體的一表面。接著對直徑20”之發泡體墊及具有離形襯墊 的雙面塗覆膜膠帶,切入窗部開口。開口形狀為矩形,尺 2〇寸為0· 5 x2 · 0的開口係沿者控向位向之長轴定位,中 心與墊之中心相距4” 。接下來,去除拋光墊總成上的3M 9500PC離形襯塾,暴露出黏著劑。接著利用黏著劑,將拋 光塾總成fe固地結合至次塾的聚氣g旨發泡體側。在安裝時 必須小心,以致使次塾的窗部與墊的窗部對齊。接著使三 50 1287481 層堆疊總成通過砑光輥組。藉由與商業上可購自PPG Industries, Incorporated 之 Teslin SP-1000 的%” x2” 矩形片接觸,去除窗部區域之第二層之上及下表面上的黏 著劑。此係伴隨藉由手壓抵該片以確保該黏著劑及該 5 Teslin SP-1000之間的良好接觸,接著剝離該Teslin SP-1000。黏著劑係選擇性地黏附至TeslinSP-1000,留下 無黏著劑之窗部的實質透明膜。所得之墊堆疊具有一透明 的矩形窗部,其尺寸為5Γ x2” 。可去除次墊上餘留的離形 襯墊,以容許黏附至商業上平坦化裝置。 10 【圖式簡單說明】:無 【主要元件符號說明】:無 5115 cm and density 〇 48 g/cm3. Another double coated film with a release liner is commercially available from Adhesives Research, Inc. under the trade name ARclad 90334. Apply an adhesive tape to one surface of the polyurethane foam. Then, the 20" diameter foam pad and the double-coated film tape with the release liner are cut into the window opening. The opening shape is rectangular, and the opening 2 is an inch of 0. 5 x 2 · 0. The control position is positioned to the long axis, and the center is 4" from the center of the pad. Next, the 3M 9500PC release liner on the polishing pad assembly was removed to expose the adhesive. Next, the polishing enamel assembly fe is fixedly bonded to the side of the foam of the secondary enthalpy by the adhesive. Care must be taken during installation so that the window of the secondary file is aligned with the window of the pad. The three 50 1287481 layer stack assembly is then passed through a calender roll set. The adhesive on the upper and lower surfaces of the second layer of the window region was removed by contact with a %"x2" rectangular sheet commercially available from PPG Industries, Incorporated, Teslin SP-1000. This was accompanied by pressing the sheet by hand to ensure good contact between the adhesive and the 5 Teslin SP-1000, followed by peeling off the Teslin SP-1000. The adhesive selectively adheres to the Teslin SP-1000, leaving a substantially transparent film of the window without the adhesive. The resulting mat stack has a transparent rectangular window that measures 5" x 2". The remaining liner on the secondary mat can be removed to allow for adhesion to a commercial flattening device. 10 [Simple diagram]: None [Main component symbol description]: No 51
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US10/974,517 US20060089094A1 (en) | 2004-10-27 | 2004-10-27 | Polyurethane urea polishing pad |
Publications (2)
Publication Number | Publication Date |
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TW200621426A TW200621426A (en) | 2006-07-01 |
TWI287481B true TWI287481B (en) | 2007-10-01 |
Family
ID=34972592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW094133710A TWI287481B (en) | 2004-10-27 | 2005-09-28 | Polyurethane urea polishing pad |
Country Status (3)
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US (2) | US20060089094A1 (en) |
TW (1) | TWI287481B (en) |
WO (1) | WO2006049654A1 (en) |
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TWI553108B (en) * | 2011-10-18 | 2016-10-11 | 富士紡控股股份有限公司 | Polishing pad and method for producing the same |
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US11986922B2 (en) | 2015-11-06 | 2024-05-21 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
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-
2004
- 2004-10-27 US US10/974,517 patent/US20060089094A1/en not_active Abandoned
-
2005
- 2005-06-15 WO PCT/US2005/021176 patent/WO2006049654A1/en active Application Filing
- 2005-09-28 TW TW094133710A patent/TWI287481B/en active
-
2006
- 2006-08-23 US US11/466,641 patent/US20070021045A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI553108B (en) * | 2011-10-18 | 2016-10-11 | 富士紡控股股份有限公司 | Polishing pad and method for producing the same |
US11986922B2 (en) | 2015-11-06 | 2024-05-21 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
TWI789412B (en) * | 2017-08-04 | 2023-01-11 | 美商應用材料股份有限公司 | Polishing pad with window and manufacturing methods thereof |
Also Published As
Publication number | Publication date |
---|---|
US20060089094A1 (en) | 2006-04-27 |
US20070021045A1 (en) | 2007-01-25 |
WO2006049654A1 (en) | 2006-05-11 |
TW200621426A (en) | 2006-07-01 |
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