TWI287481B - Polyurethane urea polishing pad - Google Patents

Abstract

The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material can be prepared by combining polyisocyanate and/or polyurethane prepolymer, hydroxyl-containing material, amine-containing material and blowing agent. The polishing pad according to the present invention is useful for polishing articles, and is especially useful for chemical mechanical polishing or planarization of microelectronic and optical electronic devices such as but not limited to semiconductor wafers. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with polishing or planarizing tools that are equipped with through-the-platen wafer metrology.

Description

1287481 IX. INSTRUCTIONS: [Technical Fields to Which the Invention pertains] Field of the Invention The present invention relates to an article for changing the surface of a work piece. In particular, the present invention focuses on a polishing pad having a window portion. More particularly, the polishing pad can comprise a polyurethaneurea material wherein at least a portion of the gas-filled cells are substantially uniformly distributed throughout the material and/or polishing pad. The polyurethaneurea material can be prepared by combining a polyisocyanate and a ruthenium or polyurethane prepolymer; a hydroxyl group-containing material; an amine-containing material and a foaming agent. The polishing pad according to the present invention 10 can be used for polishing articles, and is particularly useful for chemical mechanical polishing or planarization of, for example, but not limited to, microelectronic components and optical electronic components of semiconductor wafers. The window of the polishing pad is at least partially transparent and is therefore particularly useful in conjunction with polishing or planarization tools equipped with through-the-platen wafer metrology. BACKGROUND OF THE INVENTION Polishing or planarizing a rough surface of an article such as a microelectronic component into a substantially smooth surface generally involves the use of a controlled and repeated action to rub the roughened surface with a polished working surface. A polishing fluid clip 20 is placed between the rough surface of the article to be polished and the working surface of the polishing pad. Fabrication of electronic components can include forming a plurality of integrated circuits on a semiconductor substrate. The composition of the substrate includes Shi Xi or Kun. The integrated circuit can generally be formed by a method of forming a pattern in which a patterned layer of a material such as conductivity, insulating, and semi-conductive material 1287481 7Y is formed on the substrate. In order to maximize the integrated circuit density per wafer, it is desirable to have a flat polished substrate throughout the entire manufacturing process. Therefore, the manufacture of microelectronics - slaves, . One involves a polishing step and typically involves a majority of polishing steps, and the basin can lead to the use of more than one polishing pad. The light v may include rotating the polishing crucible and the semiconductor substrate against each other in the presence of a polishing fluid. The polishing fluid can be weakly and optionally 3 with an abrasive particulate material such as, but not limited to, particulate cerium oxide, particulate oxidation, or particulate oxidized oxide. The polishing fluid promotes the removal of material from the rough surface of the article and transport away. Polishing pad characteristics such as hole volume and hole size can vary from polishing to polishing and can change over the life of a particular polishing pad. Changes in the polishing characteristics of the polishing pad can result in improperly polished and planarized substrates that are not suitable for fabricating semiconductor wafers. Therefore, there is a desire to develop a polishing pad that exhibits reduced polishing pad differences in polishing and planarization characteristics. It is further desired to develop a polishing pad that exhibits reduced polishing and planarization characteristics throughout the operational life of the polishing crucible. It is known in the art that when a wafer is held in a planarizing tool and brought into contact with a polishing pad, the planarizing tool has the ability to measure the progress of the planarization process. The measurement of the progress of planarizing a microelectronic component during the planarization process can be referred to "in situ metrology" in the prior art. Polishing or planarizing tools, as well as in situ metrology systems, are described in U.S. Patent Nos. 5,964,643 and 6,159,073, and European Patent No. 1,108,501. In general, in situ metrology can include directing a beam of light through a portion of the transparent window located at the 1287481 plate, the beam can be ejected from the surface of the wafer to return to the window of the plate. 'And enter a detector. Polished 塾 Lesser: The wavelength used for the metrology system is up to 5 and is aligned with the window of the plate. Quantitative and desired to develop a polished enamel that contains areas that can be used in situ. The step is to provide proper transparency for the window during the entire operation of the pad. One disadvantage of conventional polishing crucibles having a window portion that is coplanar with the polishing surface can include a wear rate of the window portion that is greater than the wear rate of the polishing pad surface. Another disadvantage of utilizing conventional polishing pads having coplanar windows can include scratches in the bakes that are the result of contact of the window with abrasive particles in the slurry during the polishing or planarization process. The scratched window generally reduces the transparency of the window and reduces the attenuation of the metrology signal. SUMMARY OF THE INVENTION 15 SUMMARY OF THE INVENTION The present invention includes a crucible suitable for polishing an electronic substrate. This polishing includes a polishing layer containing a polyurethane urea. The polishing layer can include a cell that is at least partially filled with a gas, and at least a portion of the at least partially gas-filled cell can be formed by in situ reaction. The polishing layer has an opening formed in the layer. The pad of the present invention 20 includes a second layer, wherein at least a portion of the second layer can include a window portion that is at least partially transparent. A polishing layer is at least partially coupled to the second layer, and an opening in the polishing layer is at least partially aligned with the window portion of the second layer. The invention includes a polishing pad having a window portion. This polishing pad can cover 7 !28748l including the first layer and the second layer. The second layer can be at least partially connected to the first layer. A connection to a "-" means a relationship that is joined in a direct or direct placement, or a relationship that is created by one or more materials in the middle. The first 52 can be used as the jade of the pad. The polishing layer can be in contact with the substrate to be polished and the polishing liquid at least 5 minutes. In the non-limiting embodiment, at least part of the second layer of the pad can comprise a window portion, the window portion The wavelength of the polishing tool is at least partially transparent. In a non-limiting embodiment, the polishing pad of the present invention may comprise a primary pad, the secondary layer being at least partially connected to the The second layer. In a non-limiting 10 embodiment, the cells may be substantially uniformly distributed throughout the material and/or the polishing layer. In an alternative, non-limiting embodiment, the polyurethaneurea of the present invention may be combined Prepared with a polyisocyanate containing a base material, an amine-containing material, and a foaming agent; or by reacting a combination of a polyisocyanate and a hydroxyl-containing material to form a two-component composition of a known amino acid prepolymer, and then prepolymerizing And % amine-containing materials and Foaming agent was prepared; or by a combination of polyisocyanate and / or polyurethane urea prepolymer, the optional hydroxyl-containing materials, amine-containing material and a blowing agent is prepared.

t. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a non-limiting embodiment, the cells may be substantially uniformly distributed throughout the material and/or polishing pad. In another non-limiting embodiment, the polyurethane carbamide can be prepared by combining a polyisocyanate, a hydroxyl-containing material, an amine-containing material, and a hair/bag. In another non-limiting embodiment, the polyurethaneurea can be prepared by condensation polymerization of 81287481 polyisocyanate functional polyurethane prepolymer with a polyamine and a blowing agent. In yet another non-limiting embodiment, the polyurethaneurea can be formed by combining a polyisocyanate and a polyurethane prepolymer, optionally a hydroxyl-containing material, an amine-containing material, and a blowing agent. In a non-limiting embodiment, at least a portion of the polishing pad can comprise a window portion that is at least partially transparent to the wavelength used by the metrology device of the polishing tool.

In an alternative non-limiting embodiment, the amount of polyisocyanate, hydroxyl-containing material, and amine-containing material may be selected such that the equivalent ratio of (NC〇+ NCS) :(NH + 0H) may be greater than 〇·95, or At least 1〇, or at least 1〇1· 05 ' or less than 1.3, or less than 1.2, or less than 1.1. 15 π; The polyisocyanate of the polyurethaneurea of the present invention is a wide variety and widely varied. Suitable polyisocyanates may include, but are not limited to, polymerizable and C2-C2Q linear, branched, cyclic, and aromatic polyisocyanates. Non-limiting examples may include polyisocyanuric acid having a backbone linkage selected from the group consisting of urethane linkages (-NH-C(0)-oxime-). The molecular weight of polyisocyanuric acid can vary widely. In a non-limiting, specific example of substitution, the number average molecular weight (?n) may be at least gram/mo = 150 g/mole, or less than 15, gram, mole or less than gram per mole. The number average molecular weight can be measured using known methods. ^The number of the average molecular weight recorded in the patent and the patent patents = wrong by the gel permeation chromatography (GPC) using the polystyrene standard is not limited to the non-isocyanic acid of the field Examples of the restrictions may include polyisocyanuric acid having at least diisocyanate. 20 1287481 Non-limiting examples of isocyanates may include, but are not limited to, aliphatic polyisocyanates, cycloaliphatic polyisocyanates in which one or more isocyanato groups are attached directly to a cycloaliphatic ring, a cycloaliphatic polyisocyanate, wherein One or more isocyanato groups are not directly bonded to a cycloaliphatic ring, an aromatic polyisocyanate, wherein one or more isocyanato groups in 5 are directly bonded to an aromatic ring, and an aromatic polyisocyanate, one of which A plurality of isocyanato groups are not directly attached to the aromatic ring. In a non-limiting embodiment of the invention, the polyisocyanate may include, but is not limited to, an aliphatic or cycloaliphatic diisocyanate, an aromatic diisocyanate, a cyclic monomer thereof, and a cyclic trimer, and mixtures thereof. Non-limiting examples of suitable poly-p-isocyanate may include, but are not limited to, Desm〇dur N 3300A (hexamethylene diisocyanate trimer), which is commercially available from Bayer; Desmodur N 3400 ( 60% hexamethylene diisocyanate dimer and 4〇/6/, fluorenylene-iso-fat vinegar terpolymer). In a non-limiting embodiment, the polyisocyanate may comprise dicyclohexylmethane diisocyanate and a mixture of isomers thereof. As used in the description of this case and in the scope of the patent, "isomer mixture," means a mixture of cis-trans, anti-trans, and cis-trans isomers of polyisocyanate. Non-limiting examples of the isomers of the invention may include the inverse of 4,4'-fluorenylene bis(cyclohexylisocyano-) (hereinafter referred to as "PICM" (for cyclohexylmethyl 20-alkane) - anti-isomers, cis-trans isomers of PICM, cis-isomers of PICM, and mixtures thereof. In a non-limiting embodiment, the PICMs used in the present invention can be used in the art of 4 A known process, phosgenation of 4, 4, methylene bis(cyclohexyl virgin) (PACM) is prepared, for example, U.S. Patent No. 2, material 4, 〇〇7 1287481 and 2, 680. , the disclosure of which is hereby incorporated by reference herein in its entirety in its entirety in its entirety in the entire disclosure in the the the the the the the the the the the the the the (10) The mixture of the isomers can be hydrogenated by a 5-diphenylamine group in the presence of water and an alcohol such as methanol and ethanol. And/or obtained by fractional crystallization of a mixture of hydrazines. In a non-limiting embodiment, the mixture of isomers may contain 1 〇 (10) hundred knives of 4,4-methylene bis(cyclohexyliso) In the non-limiting embodiment, the polyisocyanate may include 2,4-methylisocyanurate, 2,6-toluene diisocyanate, and the like. Mixture of ("TDi"). Other aliphatic and cycloaliphatic diisocyanates which may be used in the non-limiting specific examples of the present invention include 3-isocyanate 15-cyclohexyl-isoacetoic acid vinegar ("belly" ;), which is commercially available commercially, and m-tetramethylxylene diisocyanate (1,3-bis(1-isocyanate-1-methylethyl)-stupid), which is commercially available The above is commercially available from Cytec Industries Inc. under the trade name TMXDIRTM aliphatic isocyanate. 20 As used in the specification and claims, the terms aliphatic and cycloaliphatic diisocyanate mean two diisocyanates. 6 to 100 of the reactive end groups are bonded to a linear or cyclic carbon atom. In the present invention In a non-limiting specific example, the aliphatic and cycloaliphatic diisocyanate 11 1287481 acid esters useful in the present invention may include TMXDI and a compound of the formula R-(NC0)2 wherein R represents an aliphatic group or a cycloaliphatic Other non-limiting examples of suitable polyisocyanates may include, but are not limited to, aliphatic polyisocyanates; ethylenically unsaturated polyisocyanates; cycloaliphatic 5 polyisocyanates; aromatic polyisocyanates in which isocyanate groups are not directly bonded. To an aromatic ring, such as α,α'-xylene diisocyanate; an aromatic polyisocyanate in which an isocyanate group is directly bonded to an aromatic ring, such as phenyl diisocyanate; polyisocyanate i, alkylation, alkoxylation , nitrification, modification by carbodiimide, modification by urea and modification by biuret; and dimerization and trimerization of ίο polyisocyanate. Other non-limiting examples of aliphatic polyisocyanates may include ethylene glycol diisocyanate, trimethylene diisocyanate, tetradecyl diisocyanate, hexamethylene diisocyanate, octamethylene diisocyanate, nonamethylene di Isocyanate, 2,2'-dimethylpentane diisocyanate, 2,2,4-trimethyl 15 hexane diisocyanate, decamethylene diisocyanate, 2, 4, 4,-trimethyl hexamethylene Diisocyanate, 1,6,11-undecane triisocyanate, 1,3,6-hexadecylene triisocyanate, 1,8-diisocyanato-4-(isocyanatomethyl)octane , 2, 5, 7-Dimethyl-1,8-diisocyanato-5-(decyl isocyanate) octane, bis(isocyanatoethyl)-carbonate, bis(isocyanide) Acid ethyl ester)ether, 2-20 isocyanate-2,6-diisocyanatohexanoate, methyl cis-aminoisocyanate and decyl isocyanate. Examples of the ethylenically unsaturated polyisocyanate may include, but are not limited to, butadiene diisocyanate and 1,3-butadiene-1,4-diisocyanate. The alicyclic polyisocyanate may include, but is not limited to, isophorone diisocyanate, cyclohexane di 12 1287481 isochloric acid, decyl cyclohexane diisocyanate, bis(isocyanatomethyl) cyclohexane (isohalic acid cyclohexyl vinegar) bismuth, bis(isocyanatocyclohexanyl)-2, 2-propane, bis(cyclohexyl isocyanate, 2-ethane, 2-iso Methyl cyanate-3-(3-isocyanate)-5-isocyanatomethyl-bicyclo 5 [2·2·1 heptane, 2-isocyanatomethyl group- 3-(3-Isocyanate)-6-isoxanoate-dicyclo[2·2·1]-heptane, 2-isocyanatomethyl-2-(3-iso) Propyl cyanate) 5-isocyanate-dicyclo[2.2.1]-heptane, 2-isoxanosium sulfonate S- 2-(3-isocyanatopropyl) - 6-Iso isocyanyl-bicyclo[2·2·1]-heptane, 2-isocyanatomethyl 3-(3-isocyanatopropyl) (2-isocyanatoethyl)-bicyclo[2·2·heptane, 2-isocyanatosyl-2-(3~isocyanatopropyl)_5-(2-isocyanate Ethyl))bicyclo[2·2]-heptane and 2-isocyanatomethyl- 2_(3-isocyanate Ethyl) 6-(2-isocyanatoethyl)-bicyclo[2·2·J]-heptane. In the case of an aromatic polyisocyanate, an isocyanate group which is not directly bonded to the aromatic ring 15 Including but not limited to bis(isocyanatoethyl)benzene, α,α,α,α-tetramethylxylene diisocyanate, 込3-biguanide-isocyanato-1-methylethyl Benzene, bis(isobutyloctylate)benzene, bis(isocyanatomethyl)naphthalene, bis(isocyanatomethyl)diphenyl ether, bis(isocyanatoethyl) phthalate Formic acid vinegar, lysine triisocyanate and 2, 5-di(isocyanatoacetate) oxime. The aromatic polyisocyanate having an isocyanate group directly bonded to the aromatic ring includes, but is not limited to, phenyl diisocyanate, ethyl phenyl diisocyanate, isopropyl phenyl diisocyanate, and Methyl phenyl diisocyanate, diethylphenyl diisocyanate, diisopropyl phenyl diisocyanate, dimethyl benzene triisocyanate, benzene triisocyanate, naphthalene diisocyanate, 13 1287481 Exo-naphthyl diisocyanate, biphenyl diisocyanate, o-nonanilide diisocyanate, o-tolyl diisocyanate, o-toluene diisocyanate, 4, 4'-diphenylmethane diisocyanate, bis (3- Methyl 4-isocyanatophenyl)methane, bis(phenylisocyanate)ethylene, 3,3'-dimethoxy-biphenyl-5-yl-4,4'-diisocyanate, triphenyl Methane triisocyanate, polymerizable 4,4'-diphenylmethane diisocyanate, naphthyltriisocyanate, diphenylmethane-2,4,4'-triisocyanate, 4-methyldiphenylmethane-3 ,5,2',4',6'-penta-isocyanate, diphenyl ether diisocyanate, double (different Acid phenyl ester ether) glycol, bis (phenyl isocyanate ether) -1,3-propanediol, 10 one benzene diisocyanate, carbazole diisocyanate, ethylcarbazole diisocyanate and dichloro-carbazole diisocyanate. In an alternative, non-limiting embodiment of the invention, a polyisothiocyanate or a combination of a polyisocyanate and a polyisothiocyanate can be used in place of the polyisocyanate. In such non-limiting, specific examples, the isothiocyanate may have 15 at least diisothiocyanate groups. In a non-limiting embodiment of the invention, the polyisocyanate used in the present invention may comprise a polyurethane prepolymer. In a non-limiting embodiment, the polyisocyanate can be reacted with a hydroxyl-containing material to form a polyurethane prepolymer, and the prepolymer can be reacted with an amine-containing material and a foaming agent to produce the polyurethaneurea of the present invention. In another non-limiting embodiment, the polyisocyanate and polyurethane prepolymer can be reacted with a hydroxyl-containing material, an amine-containing material, and a blowing agent. In another non-limiting embodiment, the polyisocyanate and polyurethane prepolymer can be reacted with an amine-containing material and a blowing agent. Hydroxyl-containing materials can vary and are known in the art. Examples of non-limiting 14 1287481 may include, but are not limited to, polyols; sulfur-containing materials such as, but not limited to, hydroxy-functional polysulfides, and ruthenium-containing materials such as, but not limited to, polythiols; A material of a thiol functional group. The hydroxyl-containing materials used in the present invention may include a wide variety of materials which are known in the prior art. Non-limiting examples can include, but are not limited to, polyglycols, polyester polyols, polycaprolactone polyols, polycarbonate polyols, and mixtures thereof. Polyether polyols and methods for their preparation are known to those skilled in the art. Polyether polyols of various forms and molecular weights are commercially available from more than 10 different manufacturers. Non-limiting examples of polyether polyols can include, but are not limited to, polyoxyalkylene polyols, as well as polyalkoxylated polyols. Polyoxyalkylene polyols can be prepared according to known methods. In a non-limiting embodiment, the polyoxyalkylene-based polyol can be subjected to an acid-catalyzed or base-catalyzed addition using a mixture of a polyhydric radical initiator or a polyhydric radical initiator, 15 condensation. Preparing a mixture of a base oxide or an alkyl oxide, such as, but not limited to, ethylene glycol, propylene glycol, glycerol, and sorbose. alcohol. Non-limiting examples of alkylene oxides can include ethylene oxide, propylene oxide, butylene oxide, oxane, extended aralkyl oxides such as, but not limited to, styrene oxide, 20 a mixture of ethylene oxide and propylene oxide. In other non-limiting examples, polyoxyalkylene polyols can be prepared from alkylene oxides by random or stepwise oxyalkylation. Non-limiting examples of such polyoxyalkylene polyols include polyoxyethylene such as, but not limited to, polyethylene glycol; polyoxypropylene, such as but not limited to polypropylene glycol. 15 1287481 In a non-limiting embodiment, the poly(O)lated polyhydric alcohol can be represented by the following formula:

10 15

Rl R2 wherein each of m and n may be a positive integer '5 to 7 〇; minus R2 is each hydrogen, methyl or ethyl; and A is a divalent linking group such as a straight or branched hetero group' It may contain 8 carbon atoms of 丨i, a phenyl group, and a phenyl group substituted by d C9. The value of the selected melon and n can be combined with the two-valent county of Qing Dynasty to determine the & The polyalkylenoxylated polyols can be prepared by methods known in the art. In a non-limiting specific example, for example, 4 4, _ isopropylidene can be read with, for example, but not limited to, ethylene bromide, propylene bromide, and butyl bromide. The material reacts to form a sufficiency called ethoxylation, propoxylation or butoxylation. Non-limiting examples of polyols suitable for use in the preparation of polyethoxylated polyols may include polyols described in U.S. Patent No. 6,187,444 B1, column 1, column (d), disclosure of the patent document. The content is incorporated into the description of the case for reference. ... Kenting 20 As used in the present specification and the scope of the patent application, the term "poly-polyol" may include the generally known poly(oxytetramethylene) glycol, which is, for example, but The secret is tetrahydrogen in the presence of a catalyst such as trifluoride, vaporized tin (ιν) and calcite. The polymerization of Furan is prepared. In a non-limiting specific example, the polyether polyol can include τ(iv) for the capture of 16 1287481 which is commercially available from DuPon. Also * includes, for example, but not limited to, a ring of ethylene oxide, propylene oxide, oxetane, and tetrahydrofuran, with, for example, but not limited to, ethylene glycol, hydrazine, butanediol, 1, A polyether prepared by copolymerization of 4-butanediol, diethylene glycol, dipropylene glycol '1,2-propanediethanol, and 1,3-propanediol. A compatible mixture of polyether polyols can also be used. As used in the specification of the present specification, the term "phase" means that the polyols are mutually soluble so as to form a single phase. A wide variety of polyester polyesters known in the art of the prior art can be used in the present invention. Suitable polyester polyols include, but are not limited to, polyester diols. The polyester diol used in the present invention may include an esterification product having one or more dicarboxylic acids of 4 to 1 iron atoms, and a diol having 2 to 10 carbon atoms or a plurality of ruthenium molecular weights, the second The carboxylic acid is, for example but not limited to, adipic acid, succinic acid or sebacic acid, such as but not limited to ethylene glycol, propylene glycol, diethylene glycol, 1,4-butanediol, neopentyl glycol, 1 , 6-hexane diprotein and 1,1 〇 ~ 15 癸 diol. The esterification process for the manufacture of polyester polyols is described, for example, in the literature published by F. Hostettler et al., "Polyester s fr〇m

Lactone", Union Carbide F-40, page 147. In a non-limiting embodiment, the polyol used in the present invention may comprise a polycaprolactone polyol. Suitable polycaprolactone polyols are It can be varied and is known in the art of 〇 = know. In a non-limiting embodiment, the polycaprolactone polyol can be obtained by, for example, but not limited to, water or a low-bulb diol as described in the present specification. Non-limiting examples of suitable polycaprolactone polyols may be included in the presence of a difunctional active hydrogen compound. Commercially available (4), such as those available from solvaychemical 17 1287481 The purchased CAPA series includes, but is not limited to, CAPA 2047A, and TONETM, available from Dow Chem i ca 1, which is for example but not limited to TONE 0 2 01. The polycarbonate polyol used in the present invention is It can be varied and is known in the art. Suitable polycarbonate polyols can include those commercially available (e.g., but not limited to, RavecarbTM 107 available from Enichem SpA). Specific examples of restrictions, polycarbonate The alcohol can be produced by reacting an organic diol such as a diol described hereinafter with a diol component of a polyurethane or a polyurethane urea, which is described, for example, in the reaction with a dialkyl carbonate. U.S. Patent No. 4,160,853, the disclosure of which is incorporated herein by reference in its entirety, in its entirety, in its entirety, in the non-limiting embodiment, the polyol may include polyhexamethyl carbonate, such as HO-(CH2)6-[〇-C(〇)-0-( CH2)6]n-〇H, wherein n is an integer of 4 to 24, or 4 to 1 〇, or 5 to 7. 15 20 In a specific example of a sigh, the diol material may comprise a low molecular weight polyol 'For example, a polyol having a number average molecular weight of less than 5 (10) g/mol and its compatible mixture. As used in the specification of the present specification, 'compatible: the word means that the diols are mutually soluble' so as to form Non-limiting examples of such readings may include, but are not limited to, low molecular weight diols and triols. In other non-limiting specific examples, the selected three = amount can be used to avoid polyammonia The amount of high cross-linking of Saki. In the non-limiting specific example of the shirt: the organic diol may contain 2 to 16 carbon atoms or 2 6 slave atoms, or 2 to 1 carbon atoms. Non-limiting examples of such diols may include 1 to no limitation to ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, tricondensate Tetrahydrin, - one-one - propylene glycol, tripropylene ..., 1, - butanediol, 1,3-butanediol and U-butylene glycol, 2, 2, 4 - 3 18 1287481

It1'3-pentanediol, 2-methyl~1,3-pentanediol pentanediol, 2,4- and pentanediol, 2'5-hexanediol and 1,6-hexanediol, 2,4_heptane: alcohol, 2-ethyl #hexanediol, 2 2 dimethyloctanediol, 19-+ - *: - alcohol, hydrazine, 10-nonanediol, 1,4-cyclohexane Glycol, 1,4-dioxanol, 1,2~bis (ethylcyclohexanone, glycerol, tetramethylammonium pentaerythritol, trimethylacetone and trimethyl ketone) And its isomers. 10 15 20, 纟 non-limiting specific examples, the secret material may have at least 'ear knife 1, or at least 1000 g / m, or at least 2000, the ear is replaced by non-limiting In a specific example, the impurity-containing material may have an average molecular weight of less than 10,000 g/l and an average of less than 15,0 //mole, or less than 20 ηηη * .. ^ , 000克/莫耳, or less than 32,000 g / 旲 ear. The specific singularity of the scooping _ _ limit, the hydroxyl-containing material used in the present invention may include at least one, for example, ρ _ ester. In a specific example of the limitation of the three substances ^ mountain # produced by the carboxylic acid, the warp-containing material may include the fungus A The block polymer includes JS Κσ oxyethene-epoxy butyl sulphide & Γ / epoxy block and / or ring material can contain and have the following - in the specific financial, including interesting base 1 Qian Xueyi block polymer: (Π) HO-(〇-CRRCRR~γ, ^

D n)-(CRRCRR^Yn^〇)b>(CRRCRR-Yn-〇)c_H wherein R may represent hydrogen or C C C6 alkyl; Υη may represent C〇-C6 hydrocarbon, ·η可& integer 0 To a; a, b and 4 C each may be an integer from 0 to 300, wherein a, kc are selected such that the number average molecular weight of the ceramyl alcohol does not exceed 19 1287481 33,000 g/mole. In other alternative non-limiting specific examples, commercially available from BASF, for example, but not limited to, Plur〇nic. RTM R, rtm,

The hydroxyl-containing material of Tetronic·RTM R and Tetronic·RTM block copolymer surfactant can be used as the hydroxyl group-containing material of the present invention. Other non-limiting examples of polyols suitable for use in the present invention may include linear or branched chain burn polyols such as, but not limited to, I ethylene glycol 1,3-propanediol, propylene glycol, hydrazine, 4_ Butanediol, i3-butanediol, glycerin, neopentyl glycol, trimethylolethane, trimethylolpropane, di-trimethylolpropane, red, pentaerythritol and diquaternol; The alkylene glycol is, for example but not limited to, diethylene glycol, dipropylene glycol, and higher polyalkylene alcohol, such as but not limited to polyethylene glycol, and may have an average molecular weight of 200 g/m to 2 , 000 g / mol; cyclic alkane polyol, the case is not limited to cyclopentanediol, cyclohexanediol, cyclohexanetriol, cyclohexane, dipropyl cyclohexanol and cyclohexane Diethanol; an aromatic polyol such as, but not limited to; monohydroxyl, benzenetriol, hydroxybenzyl alcohol, and dihydroxytoluene; and phenol such as 4,4'-isopropylidenediphenol, 4, 4,-oxybisphenol, 4,4,-hydroxy alum, 4,4'-thiobisphenol, phenolphthalein, bis(4-hydroxyphenyl)methane, 4,4,~(1 9-ethylenediyl )double And 4, 4'-sulfonyl bisphenol; halogenated double, such as but not limited to 4, 4,-isopropylidene bis(2,6-dibromophenol), 'isopropylidene bis (2, 6 -dichlorophenol) and 4,4,-isopropylidene bis(2,3,5 - '~tetrachlorophenol); alkoxylated phenols such as, but not limited to, alkoxylated 4, 4, ® _ isopropylidene diphenol, which may have from 1 to 70 alkoxy groups, such as ethoxy, propoxy, a-butoxy and beta-butoxy; and double 20 1287481% It can be prepared by hydrogenating the corresponding double age, such as but not limited to 4,4, isopropylidene-dicyclohexanol, 4 4 -oxybicyclohexane, 4,4 'thiobicyclo ring Hexanol and bis(4,ylcyclohexanol)-combustion; polyaluminium or polyglycol polyol, polyglycol polyol, polyfluorene polyol, polyethylene 5, containing trans-functional acrylic acid A polymer comprising a transfunctional methyl methacrylate polymer and a polymer comprising a propanol. In the specific example of 1_, the polyol may be selected from polyfunctional polyols, but is not limited to trimethylmethyl, ethoxylated tris-methylpropane, and pentaerythritol. In the non-limiting specific example of 10 纟 replacement, the 'polyamine S prepolymer has a number average molecular weight (10) of less than 50' 000 g/mole), or less than, for example, a gram/mole, or less than 10,000 g/mole. You can use a variety of different 'head methods to measure 疋. In a non-limiting embodiment, this can be determined by gel permeation chromatography (GPC) using a polystyrene standard. In an alternative, non-limiting embodiment, the hydroxyl-containing material used in the present invention may be selected from the group consisting of poly-alcohols and polycarbodiols having a number average molecular weight of at least 2QQ g/mol, or at least 300 g. / Mohr, or at least 750 g / mol; or no more than 1,500 g / m, or no more than 2, 5 g / m, or no more than 4,000 g / m. In another non-limiting embodiment, the polyether diol used in the present invention may include, but is not limited to, polytetramethylene ether glycol. In a non-limiting embodiment, the hydroxyl-containing material may have both a hydroxyl group and a thiol group, such as but not limited to 2-mercaptoethanol, 3-mercapto-1,2-propanediol, glycerol bis(2-mercaptoacetate) And 1-hydroxy-4-indolylcyclohexane. 21 1287481 In general, polyurethane and polyurethane prepolymers can be polymerized using a variety of different techniques known in the art of the prior art. In one non-limiting embodiment of the invention, the polymerization process can include the use of an amine-containing material for curing. The amine-containing curing agents used in the present invention are numerous and widely varied. Non-limiting examples of suitable amine-containing curing agents can include, but are not limited to, aliphatic polyamines, cycloaliphatic polyamines, aromatic polyamines, and mixtures thereof. In an alternative, non-limiting embodiment, the amine-containing curing agent can be a polyamine having at least a difunctional group, each independently selected from the group consisting of a primary amine (-NH2) and a secondary amine (-NH-). ) and its combination. In other non-limiting embodiments, the amine-containing curing agent can have at least two primary amine groups. In another non-limiting embodiment, the amine-containing curing agent may comprise a mixture of a polyamine and at least one material selected from the group consisting of polythiols and polyols. Non-limiting examples of suitable polythiols and polyols include those previously described in the present specification. In yet another non-limiting embodiment, the amine-containing curing agent can be a sulfur-containing amine-containing curing agent. Non-limiting examples of sulfur-containing amine-containing curing agents can include Ethacure 300, which is commercially available from Albemarle Corporation. The amine-containing curing agent suitable for use in the present invention may include, but is not limited to, a material having the following chemical formula:

Ri Ri

R3 (III) wherein 匕 and 1-2 are each independently selected from the group consisting of methyl, ethyl, propyl and isopropyl, and R3 is selected from hydrogen and gas. Non-limiting examples of the amine-containing curing agent 22 20 1287481 used in the present invention include the following compounds, which are manufactured by L〇nza Ltd. (Base 1 'Switzerland):

LONZACURE· RTM. M-DIPA : RfCsHt ; R2 <3h7; R3=H

LONZACURE. RTM. M-DMA : Ri=CH3 ; R2=CH3 ; R3=H 5 LONZACURE· RTM· M-MEA : Ri=CH3 ; R2=C2H5 ; R3=H LONZACURE· RTM· M_DEA : RfGHs ; R2<2H5 R3=H LONZACURE· RTM. M-MIPA : R1=CH3 ; R2=C3H? ; R3=H LONZACURE· RTM· M-CDEA : Ri=C2H5 ; R2=C2H5 ; R3=C1 where R!, R2 and R3 Corresponds to the above chemical formula. In a non-limiting embodiment, the amine-containing curing agent may include, but is not limited to, a diamine curing agent such as 4,4'-methylenebis(3-chloro-2,6-diethylaniline). (Lonzacure.RTM. M-CDEA), which is available in the United States by Air Products and Chemical, Inc. (Allentown, Pa.). In an alternative non-limiting embodiment, the amine-containing curing agent 15 used in the present invention may include 2,4-diamino-3,5-diethyl-toluene, 2,6-diamino-3, 5-Diethyl-toluene and mixtures thereof (collectively referred to as "diethyltoluenediamine" or DETDA) which are commercially available from Albemarle Corporation under the trade name Ethacure 100; dimethylthiotoluene II Amine (DMTDA) 'It is commercially available from A1 bemar 1 e 20 Corporation under the trade name Ethacure 300; 4, 4'-methylene-bis-(2-chloroaniline)' which is commercially available from Kingyorker Chemicals Available under the trade name MOCA. DETDA can be liquid at room temperature with a viscosity of 156 cPs at 25X at 25 ° C. DETDA can be an isomer with a range of 75 to 81 percent 2,4 - isomers, and 25, 2, 6-isomers ranging from 18 to 24%. 23 1287481 Non-limiting examples of amine-containing curing agents may include ethylamine. Suitable ethylamines may include, but are not limited to, Ethylenediamine (EDA), diethylidene triamine (DETA), tri-extension ethyltetramine (ΊΈΤΑ), tetra-extension ethyl pentamine (ΤΕΡΑ), penta-ethyl Amine (ΡΕΗΑ), 嗉, 吗琳, substituted 吗琳, ° 辰5 喙, substituted hydrazine, diethylidene diamine (DEDA), and 2-amino-1-ethylpiperidinium In an alternative, non-limiting embodiment, the amine-containing curing agent may be selected from one or more isomers of CrG dialkyl toluenediamine, such as, but not limited to, 3,5-dimethyl-2,4. -toluenediamine, 3,5-dimethyl-2,6-toluenediamine, 3,5-diethyl-2,4-toluenediamine, 3,5-diethyl-2,6-toluene 10 diamine, 3,5-diisopropyl-2, 4-toluenediamine, 3, 5-diisopropyl-2,6-toluenediamine, and mixtures thereof. Non-limiting examples of substitutions In the non-limiting specific example of the present invention, the amine-containing curing agent may be 15 Including one of the following general structure:

Ηη2 24 (VI) 20 1287481 In another alternative, non-limiting embodiment, the amine-containing curing agent may comprise one or more fluorenyl bisanilines, which may be represented by the formula VII-ΧΙ; one or more aniline sulfides , which may be represented by the general formula XII-XVI; and/or one or more diphenylamines, which may be represented by the general formula XVII-XX, (VII)

10 15 (VIII)

(IX)

25 20 1287481

10

(XIII) meaning 3

H2NVS

I R4^V^

R5

26 15 1287481 (XV) Meaning 3H2NVS IR4^S^\ r5

Meaning 5 nh2 R4 (xvi), nh2

R5 R4 (XVII)

Nh2 10

27 1287481

—R4 r5 wherein r3 and R4 each independently represent a 0 to c3 alkyl group, and r5 is optionally selected from hydrogen and _, such as, but not limited to, gas and bromine. The diamine represented by the formula VII can be roughly described as 4,4'-methylene-bis(dialkylaniline). Suitable non-limiting examples of diamines can be represented by the general formula VII, including but not limited to 4,4'-methylene-bis(2,6-dimethylaniline), 4,4'-methylene - bis(2,6-diethylaniline), 4,4'-methylene-bis(2-ethyl-6-methylaniline), 4,4'-methylene-bis (2, 6 -diisopropylaniline), 4,4'-methylene-10bis(2-isopropyl-6-methylaniline) and 4,4'-methylene-bis(2,6-diethyl) Base-3-air aniline). In other non-limiting specific examples, the amine-containing curing agent may comprise a material represented by the following formula (XXI): 28 1287481 (XXI)

5 wherein R 2 G, R 21 , R 22 , and R 23 are independently selected from the group consisting of ruthenium, Cl to C 3 alkyl, CH 3 -S-, and halogen, such as, but not limited to, chlorine or bromine. In a non-limiting embodiment of the invention, the amine-containing curing agent represented by the general formula XXI may comprise diethyltoluenediamine (DETDA) wherein R23 is a fluorenyl group, R2. And 1?21 are each ethyl and R22 is hydrogen. In another non-limiting embodiment, the amine-containing 10 curing agent can include 4,4'-diphenylaminomethane. In alternative non-limiting examples, amine-containing materials, blowing agents, polyisocyanates, and hydroxyl-containing materials can be combined using a variety of different methods and equipment, such as, but not limited to, high speed mixers or extruders. In a non-limiting embodiment, the mixing apparatus can include a mechanical agitator that operates at a low pressure of, for example, less than 20 bar. In another non-limiting embodiment, the ingredients can be mixed by impingement mixing wherein the ingredients are injected into the mixing chamber at high speed and pressure, and then the kinetic ingredients are mixed in the chamber. In this embodiment, the composition is generally injected at a speed of 100 to 200 m/sec and a pressure of 20 to 3000 bar. In an alternative, non-limiting embodiment, the polyurethane prepolymer and optional polyisocyanate may be included in the first feed of the mixing unit, and the amine-containing material and optionally the hydroxyl-containing material may be included in the second feed. In the feed, the blowing agent may comprise 29 1287481 δ in the second feed; or the first feed may comprise an amine-containing material and a blowing agent, and optionally a warp-containing material. In another non-limiting embodiment, the polyurethaneurea can be prepared by combining a polyisocyanate, a hydroxyl-containing material, an amine-containing material, and a foaming agent by a single-pack method. In another non-limiting embodiment, the polyurethane can be prepared by a single can process by combining a polyisocyanate and a polyurethane prepolymer, optionally a hydroxyl-containing material, an amine-containing material, and a blowing agent. . In a non-limiting embodiment of the invention, a three-feed mixing unit can be used to combine the polyisocyanate and/or polyurethane prepolymer, the substrate-containing material, the amine-containing material, and the blowing agent. The components can be added to the feed using a variety of different configurations. In an alternative non-limiting embodiment, the first of the mixing units may comprise a polyisocyanate and/or a polyurethane prepolymer, and the second feed may comprise a hydroxyl-containing material, an amine-containing material, and a blowing agent; The second feed may comprise a hydroxyl functional material and an amine containing material, and the third feed may contain 15 blowing agents; or the second feed may contain an amine containing material, and the third feed may contain hydroxyl containing materials and hair The blowing agent; or the second feed may contain a hydroxyl-containing material, and the third feed may contain an amine-containing material and a blowing agent. In another non-limiting embodiment wherein a polyurethane prepolymer is present in the first feed, the presence of the hydroxyl containing material in the other material is optional. 20 A blowing agent can be used in the present invention to form a cell that is at least partially filled with a gas within the polyurethaneurea material. In a non-limiting embodiment, the cell system is substantially uniformly distributed throughout the polyurethane-urea material. The size of the cell can vary widely. In an alternative, non-limiting embodiment, the cells can be at least 1 micron, or at least 20 microns, or at least 30 microns, or at least 40 30 1287481 microns; to less than 1000 microns, or less than 500 microns, or less than 1 inch. Micron. In a non-limiting embodiment, the blowing agent can be water. Water can react in situ with cyanate esters (NCO) to produce carbon dioxide. In another non-limiting embodiment, one or more auxiliary blowing agents can be used in combination with the blowing agent. < Auxiliary blowing agents suitable for use in the present invention are widely variable and can enclose substances which are substantially volatile at the reaction temperature. This auxiliary blowing agent can be selected from those known in the art. Non-limiting examples may include, but are not limited to, acetone, ethyl acetate, alkylenes such as di-methane, gas, dichloroethane, diethylene, trifluoroethane, chlorodifluoroethane. Methane, dichlorodifluoromethane, dichlorofluoromethane, butane, pentane, cyclopentane, hexane, heptane, diethyl ether and mixtures thereof. The foaming dose used in the present invention can be varied. In an alternative, non-limiting embodiment, the blowing agent is present in an amount such that the selected and desired polishing enthalpy 15 and/or void volume are achievable. In a non-limiting specific example of substitution, the density may be 0·50 i 1·10 g/cc; the pore volume may be from 5% to 55% based on the polyurethane material. Density can be determined using a variety of different methods known to those skilled in the art. The density values described in the present specification are determined in accordance with ASTM 1622-88. The void volume can also be determined by a variety of different methods known to those skilled in the art.

The pore volume values described in the present specification are determined according to Astm D 4284-88 using an Autop〇re Π mercury porosimeter manufactured by Micromeritics. In another non-limiting embodiment, the amount of blowing agent can range from 0% to 5% by weight of the reaction mixture. 31 1287481 In a non-limiting embodiment, the amine-containing material may contain at least a small concentration of residual moisture or water sufficient to react with the blowing agent. In another non-limiting embodiment, a urethane formic acid forming catalyst and/or a foaming catalyst can be used in the present invention to enhance the reaction of the polyurethane foam forming material with the blowing agent, and/or accelerate. The reaction of the polyurethane forming material with the blowing agent. In yet another non-limiting embodiment, one or more materials may be used, each of which may exhibit the characteristics of a urethane forming catalyst and a foaming catalyst. Suitable urethane forming catalysts may vary, for example, suitable amine form 10 acid forming catalysts may include those known in the art to be useful for forming urethanes by reaction of materials containing NC0 and OH. catalyst. Non-limiting examples of suitable catalysts may be selected from the group consisting of Lewis bases, Lewis acids, and intercalation catalysts, such as Ullmann's Encyclopedia of Industrial Chemistry, 15th Edition, 1992, Volume A21. , as described on pages 673 to 674. In a non-limiting embodiment, the catalyst may be a stannous salt of an organic acid such as, but not limited to, stannous octoate, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin thiolate, dicis Dilute acid-butyltin, dimethyltin diacetate, lauric acid-tin, and mixtures thereof. In an alternative, non-limiting embodiment, the catalyst 20 can be a caprylic acid, a propionate acetate or an iron. Non-limiting examples of suitable blowing catalysts may include tertiary amines such as, but not limited to, 1,4-diazabicyclo[2.2.2]octane, bis-dimethyl dimethylamine ethyl Ether, pentamethyldiethylamine, triethylamine, triisopropylamine, N-methylmorpholine, and N,N-dimethylbenzylamine. Such suitable tertiary grades 32 1287481 Amines are described in U.S. Patent No. 5,693,738, the disclosure of which is incorporated herein by reference in its entirety in its entirety in its entirety in its entirety in The tertiary amine catalyst may also include such a group-containing functional group, such as 5 10 N, N, N, N'N-dimethylethanolamine, 2-(2-dimethylamine ethoxy) ethanol, methyl-N-ethyl-diamino-, n,n-(dimethyl)N,N-diisopropanol-1,3-propanediamine, and oxime, fluorene-bis-(3- Dimethyl propyl propyl isopropanolamine - soil practice - in non-limiting specific examples 'catalyst may be selected from the group consisting of scales, tertiary salt and tertiary amines' such as but not limited to tributyl scales, three Ethylamine; triisopropylamine, and hydrazine, hydrazine-dimethylbenzylamine. Non-limiting examples of the appropriate phase of the tertiary amine are described in U.S. Patent No. 5,693,; 1G column 'Lines 6 to 38, the disclosure of which is incorporated herein by reference. In another non-limiting embodiment, a U-surfactant may be present during polymerization. It can affect at least part of the filling gas chamber φ (4) formation and stabilization. In a non-limiting embodiment, the surfactant can be selected to have high surface activity for cell nucleation and stabilization. In another non-limiting embodiment, the surfactant may be selected to provide good emulsifying power as a blowing agent. The surfactant 20 suitable for use in the present invention is broad and variable. In a specific example of the limitation, a polysulfide-oxygenated surfactant may be used. The polyoxo-oxygenated surfactant may be selected from the group consisting of a ceramide oxygen-polyalkylene copolymer surfactant. Non-limiting examples can include, but are not limited to, polydimethyl siloxane-polyoxyalkylene-based segmented copolymers available from GE Silicons Incorporated, quot. 33 1287481 entitled Niax RTM. Polyoxane L-1800, L-5420 and L-5340; Dow Corning Corporation under the trade names D0193, DC-5357 and DC-5315; and Goldschmidt Chemical Corporation under the trade names B-8404 and B-8407. In a specific example of the limitation, the siloxane-polyoxyalkylene copolymer surfactant can be represented by the following formula:

(XXII) CH3 CH3 丫 H3 CH3 CH3 R CH3

Wherein x is a number from 1 to 150, y is a number from 1 to 50, and a ratio of χ:y is from 10··1 to 1:1, and R is an alkyl alkoxylate. Referring to the general formula 10 I, X may be 10 to 50, or 10 to 42, or 13 to 42; and y may be 2 to 20, or 5 to 20, or 7 to 20, or 7 to 10. The ratio of x: y is between 2.4 and 6.8. Wherein R can be an alkyl alkoxylate which can be represented by the following formula XXIII:

15 XXIII R'0(C2H40)m(C3H60)nH wherein R' is an alkylene group having 3 to 6 carbon atoms, ^ is a number 5 to 200, and η is a number 0 to 20, or 2 to 18. R has a molecular weight in the range of 400 to 4000, and the surfactant represented by the formula XXII has a molecular weight of 6,000 to 50, 〇〇〇. 20 oxane-polyoxyalkylene copolymer surfactants can be as described in U.S. Patent No. 5,691,392, the third shed '25th line to the fourth column, line 18, the special 34 1287481 This is incorporated herein by reference. The amount of surfactant useful in the present invention can vary widely. In an alternative, non-limiting embodiment, the amount of surfactant is from 0.001% to 10% by weight of the reaction mixture, or from 0.01% to 1% by weight, 5 or 〇0.00% by weight to 〇·5 by weight %.

In another non-limiting embodiment, a nucleating agent can be used during the polymerization to prepare the polyurethaneurea of the present invention. Nucleating agents suitable for use in the present invention may include materials which enhance the formation of relatively small, substantially uniform cells. The nucleating agent can be selected from those known in the art. Non-limiting Examples 10 may include, but are not limited to, relatively small sized polymer particles (e.g., micron or smaller) such as, but not limited to, polypropylene, polyethylene, polystyrene, polyaza, poly Ester and polyacrylate. The amount of nucleating agent used can vary widely. In general, the nucleating agent can effectively produce the amount of the cell to be used in a non-limiting specific example of #换, the nucleating agent can be present in an amount of 0.101 wt% by weight of the 15 reaction mixture. Or 〇〇 5 wt% to 0.5 wt%. In the specific example, the polyisocyanuric acid and/or the polyamine 20 contains the (IV), the amine-containing material, the foaming agent and any optional package. Examples of optional additives may include, but are not related to, antioxidant additives. Non-limiting absorption of swords, plasticizers, internal mold release agents, (4) amine uv 妓, uv, non-limiting specific examples, can be any color. In turn - replace the feed and / or the resulting mixture _ degrees. = There is feed heating to reduce the reaction mixing of the bismuth unit. 35 1287481 can then be poured into an open cavity to form a polishing pad. In a non-limiting embodiment, the 'cavity can be controlled at a temperature of 22 ° C to 15 (TC, or 60 ° C to 110 ° C. The polishing pad of the present invention can have one or more working surfaces, like 5 For use in the present specification and the scope of the patent application, "working surface, a surface of a polishing pad that can be in contact with the surface of the object to be polished and the polishing slurry. In a non-limiting example, the object to be polished In one non-limiting embodiment, the working surface of the polishing pad can have a surface structure such as, but not limited to, a combination of channels, trenches, perforations, and the like. A method known to those skilled in the art is incorporated into the working surface of the polishing pad. In a non-limiting embodiment, the working surface of the polishing pad can be mechanically modified, such as by grinding or cutting. In a specific example, 'the surface structure can be incorporated into the working surface of the polishing pad during the molding process', for example by providing an inner surface 15 of at least one stamp having a raised structure that is compressible during formation of the polishing pad Printed to The surface structure of the polished crucible may be distributed in a random or uniform-pattern form across the surface of the aperture. Non-limiting examples of surface structure patterns may include, without limitation, a spiral shape, a circle, a square, a section. Line and lattice-like pattern. In the specific example of #limit, the polyurethane brewing vein may comprise an abrasive particulate material. The abrasive particulate material may be substantially uniformly or non-uniformly distributed throughout the polyurethane. In a non-limiting embodiment of the alternative, the amount of abrasive material present, based on the total weight of the polished crucible, may be less than 70 weight ratio or 5 weight percent! percent, or 5 weight percent to 65 weight 36 1287481 Percent. In an alternative non-limiting embodiment, the abrasive particulate material can be in the form of individual particles, aggregates of individual particles, or a combination of individual particles and aggregates. In yet another alternative, non-limiting embodiment The shape of the abrasive particle material 5 may include, but is not limited to, a mixture of spheres, rods, triangles, pyramids, cones, regular cubes, irregular cubes, and the like, and/or groups thereof. The average particle size of the abrasive particle material may vary widely. In an alternative non-limiting embodiment, the average particle size may be less than 0.1 0.001 μm, or at least 0.01 μm, or At least 0.1 micron. In yet another alternative, non-limiting embodiment, the abrasive particulate material may have an average particle size of less than 50 microns, or less than 10 microns, or less than 1 micron. In a non-limiting embodiment. The average particle size of the abrasive particulate material can be measured along the longest dimension of the particle. 15 Non-limiting examples of abrasive particulate materials suitable for use in the present invention can include, but are not limited to, r-alumina, fused alumina, Heat treated alumina, white fused alumina, and sol derived from alumina; tantalum carbide, such as but not limited to green tantalum carbide and black tantalum carbide; titanium diboride; boron carbide; tantalum nitride; tungsten carbide; Titanium carbide; diamond; boron nitride, such as 20 but not limited to cubic boron nitride and hexahedral boron nitride; garnet; oxidized oxidation oxidization error; Xi pyrolysis oxidation ί; iron oxide; chromium; cerium oxide; francium oxide; titanium oxide; tin oxide; manganese oxide; and mixtures thereof. In still another non-limiting embodiment, the abrasive particulate material may be selected from the group consisting of alumina, cerium oxide, cerium oxide, cerium oxide, and mixtures thereof. 37 1287481 0 In a non-limiting embodiment, the material may have - Examples of the surface modifying agent <= abrasive particles may include a specific example of a surfactant, a non-limiting 5 limit of ==, interface, 舌%%, and/or a compound. The dispersibility of a non-abrasive particle. In another step: it can be used to improve the polyurethane urethane to improve the abrasive particles and the polyurethane-matrix. = Medium] The amount of surface modification agent present may be less than K) 0.5% by weight to 1% by weight based on the total weight of the abrasive particle 枓 and the surface scalloping agent. Rare-knife ratio 'or non-two 1:: Non-limiting examples of suitable surfactants for the surface modifiers of the present invention may include anionic, cationic, zwitterionic, and nonionic surfactants, for example However, it is not limited to metal oxide oxides, polyalkylene oxides, and salts of long-chain fatty acids. Non-limiting examples of suitable combinations for use in the present invention may include, for example, but not limited to, organic calcination, titanate, and gallate. In a non-limiting embodiment, the surfactants can include SILQUEST decane A-174 and A-1230, which are commercially available from Witco Corporation. In still another non-limiting embodiment, the thickness of the polishing layer can be changed from 匪. 5匪 20 to 5 mm. In a non-limiting embodiment, the density of the polishing layer of the present invention, as measured by ASTM 1622-88, can range from 5 grams per cubic centimeter (g/cc) to 2 g/cc. In a further non-limiting embodiment, the polishing layer may have a Shore A hardness value of at least 8 Å, or 85 to 98, as measured according to ASTM D 224, and a Shore D hardness of 38 1287481 degrees may be at least 35. Or 85 or lower, or 45 to 80. While not wishing to be bound by any theory, it is believed that when used, the porosity of the working surface of the polishing pad of the present invention can be maintained substantially constant when throwing, or flattening the surface of the K. When the working surface of the polished crucible is worn during, for example, the polishing process, a new surface hole is formed because the embedded hole located below the working surface is exposed. Furthermore, since the working surface of the throwing surface is worn during the polishing process, the gas contained in the cell chamber of the to-crush filling gas can be released. The gas can be released into the working environment and the remaining holes can be at least partially filled with the polishing slurry. The polishing pad of the present month includes a second layer that is at least partially attached to the 5 liter polishing pad. This second layer may comprise a variety of different materials known in the art. The second layer can be selected from the group consisting of substantially non-volumetric compressible polymerization, and metal films and metal boxes. As used in the present specification and in the patent pending enclosure, "substantially non-volutable compressibility," means a volume reduction of less than 1% when applied to a load of 20 15 psi. Permeable non-volume compressible polymerization Non-limiting examples of materials include polyolefins such as, but not limited to, low density polyethylene, high density polyethylene, ultra high molecular weight polyethylene and polypropylene; polyethylene; for example but not limited to cellulose acetate and fiber a cellulose-based polymer of butyl butyrate; propylene 20 k such as poly, and copolyesters such as but not limited to pet and PETG; polycarbonate; for example but not limited to nylon 6// 6 and nylon 6/12 polyamide; and high performance plastics such as, but not limited to, polyetheretherketone (P〇lyetheretherketne), polyphenylene ether, polyfluorene, polyimine, and polyether oxime Imines, and mixtures thereof, etc. 39 1287481 Non-limiting examples of metal films may include, but are not limited to, combinations of pure, copper, brass, nickel, stainless steel, and the like. The thickness of the second layer may vary. In a non-limiting specific example, the thickness of the second layer may be at least 〇 0005 inches, or at least 1 inch; 5 or 〇. 0650 inches or less, or 0.0030 inches or less. In a non-limiting example, the second layer may be flexible To enhance or increase the uniformity of the contact between the polishing pad and the surface of the substrate to be polished. The consideration of the choice of the second layer of material can provide the material with the ability to properly support the working surface of the polishing pad, so that the polishing is substantially It conforms to the giant profile or long-term surface of the polished component. The material having this ability can be an ideal material for use as the second layer of the present invention. The flexibility of the second layer can be changed. It is determined using a variety of different conventional techniques known in the art, as used in the present specification and the scope of the patent application, "flexibility" (7) - word means the third layer of the thickness of the second layer 15 (t3) Inverse relationship with the flexural modulus (E) of the second layer of material, that is, F = in the non-limiting embodiment of the alternative, the flexibility of the second layer may be at least 0.5; or at least 1 〇〇 in_llb- 1; or from 1 iflb-1 to 100 ir^lb-1. In non-limiting In a specific example, the second layer may have a compressibility that allows the polishing pad substantially 20 to conform to the surface of the article to be polished. For example, the surface of the microelectronic substrate of the semiconductor wafer may have a "wavy, outer shape" caused by the manufacturing method. It is expected that if the polishing flaw is not properly aligned with the wavy shape of the substrate surface, the deterioration of the polishing performance can be deteriorated. For example, if the polishing pad substantially conforms to the "wavy" end, but does not substantially conform to and is in contact with the "wavy" intermediate portion of the 40 1287481, only the "wavy" end can be polished. Or planarization, and the intermediate portion can substantially remain unpolished or unplanarized. The compressibility of the second layer can vary. The term "compressibility" means the measurement of the percent volume when applied to a load of 5 20 psi. In an alternative non-limiting embodiment, the second layer may have a percent compression volume of at least 1 percent; or 3 percent or less; or 1 to 3 percent. The percent compression volume can be determined using a variety of different methods known in the art. In a non-limiting embodiment, the second layer is substantially non-volitable and compressible. In another non-limiting embodiment, the second layer can be dispersed in a compressive force felt over a relatively large area of the secondary mat. In a non-limiting embodiment, the polishing pad of the present invention can be placed directly onto the platen 15 of an electric polishing tool, machine or device without the use of a secondary mat. In yet another non-limiting embodiment, the polishing pad can be included in a polishing pad assembly wherein the backing layer can be adhered to the back of the polishing pad. In a non-limiting embodiment, the polishing pad assembly can comprise: (a) a polishing pad having a working surface and a back surface; (b) a backing layer having an upper surface and a lower surface; and 20 (C) sandwiching An adhesive means between at least a portion of the back side of the polishing pad and at least a portion of the upper surface of the backing layer and in contact with the portions. In a non-limiting embodiment, the backing sheet of the polishing pad assembly can be rigid or flexible and can support or stabilize or retard the 41 1287481 polishing pad during the polishing operation. The backing sheet can be made from materials known to those skilled in the art. In an alternative, non-limiting embodiment, the backing sheet may be fabricated from an organic polymeric material such as, but not limited to, a polyester, such as a polyethylene terephthalate sheet, and a polyolefin, such as a polyethylene sheet. And polypropylene sheets. In another non-limiting embodiment, the backing sheet of the polishing pad assembly of the present invention can be a release sheet that can be peeled from the adhesive device, thereby allowing the polishing pad to be adhered by exposure. The device is adhered to another surface, for example, a platen of the polishing apparatus. In general, release sheets are known to those skilled in the art. In a non-limiting embodiment, the release sheet can be made of paper or an organic polymeric material such as, but not limited to, a polyethylene terephthalate sheet, a polyolefin, for example Polyethylene sheets and polypropylene sheets' and fluorinated polyfluorenes such as polytetrafluoroethylene. In yet another non-limiting embodiment, the upper surface of the release sheet can include a release coating that can be in contact with the adhesive device. Release coatings are well known to those skilled in the art. Non-limiting examples of the off-coat 15 layer may include fluorinated polymers and polyoxymethane. The adhesive may be selected from a wide variety of adhesive materials known in the art. Adhesives suitable for use in the present invention provide sufficient peel strength such that the polishing pad remains substantially positioned during use. Further, the adhesive may be selected to sufficiently resist the shear stress that is retained during the polishing or planarization process, and further, to sufficiently impede the deterioration of the chemical 2 moisture during use. (d) The agent can be administered using conventional techniques known to those skilled in the art. In a non-limiting embodiment, the adhesive may be applied to the lower surface of the polishing crucible and/or the upper surface of the backing layer that are parallel to each other. 42 1287481 Non-limiting examples of suitable adhesive devices can include, but are not limited to, contact adhesives, pressure sensitive adhesives, structural adhesives, hot soluble adhesives, thermoplastic adhesives, and curable adhesives such as heat curing. Adhesive. Non-limiting examples of the structural adhesive may be selected from the group consisting of polyurethane adhesives, and epoxy resin adhesives such as diglycidyl ether of bisphenol A. Non-limiting examples of pressure sensitive adhesives may include elastomeric polymers and thickening resins. The elastomeric polymer may be selected from the group consisting of natural rubber, butyl rubber, chlorinated rubber, polyisocyanate, poly(vinyl alkyl ether), alkyd adhesive, for example, copolymerization of 10 with 2-ethylhexyl acrylate and acrylic acid. An acrylate-based adhesive having a main component, such as a block copolymer of styrene-butadiene-styrene, and the like. In a non-limiting embodiment, the pressure sensitive adhesive may be applied to an organic solvent, or a water-based emulsion, or from a molten material, such as toluene or hexane, to a substrate. As used in the specification of the present invention, the term "hot melt adhesive" means that an adhesive consists of a non-volatile thermoplastic material which can be heated into a melt and then applied in a liquid form. On a substrate, a non-limiting example of a hot melter can be selected from the group consisting of ethylene-ethylene acetate, copolymers, stupid ethylene-butadiene copolymers, ethylene-ethyl acrylate copolymers, polyfluorenes.酉匕, / | 9 columns such as polyamine formed by the reaction of a monoamine and a dimer acid, and poly-amino acid. In a non-limiting embodiment, the adhesive layer can be used in polishing pads and back sheets Before the materials are pressed together, they are applied to the back of the polishing pad and/or the upper surface of the backing sheet. 43 1287481 In an alternative, non-limiting embodiment, the bonding device of the polishing pad assembly may be selected from the group consisting of In another non-limiting embodiment, the adhesive assembly can comprise an adhesive support sheet that is sandwiched between an upper adhesive layer and a lower adhesive layer. The adhesive layer on the agent assembly can be in contact with the back surface of the polishing pad to The lower adhesive layer may be in contact with the upper surface of the backing sheet. The adhesive support sheet may be made of an organic polymeric material such as, but not limited to, a polyester such as a polyethylene terephthalate sheet. And polyolefin, such as polyethylene sheet and polypropylene sheet. In still another non-limiting embodiment, the adhesive layer assembly and the lower adhesive layer may be selected from the above related adhesives. The adhesives described in the contents of the layers. In a non-limiting embodiment, the upper and lower adhesive layers may be contact adhesives, respectively. In yet another non-limiting embodiment, the adhesive assembly may Double or double coated tape, such as but not limited to double coated film tape, commercially available from 3M Company, Industrial Tape and Specialties (Industrial Tape and Specialties)

Division 0 In the non-limiting embodiment of the alternative, the material of the secondary mat may be foamed or blown to create a porous structure. The porous structure can be an open cell, a closed cell, or a combination thereof. 20 Non-limiting examples of synthetic rubber may include neoprene, polyoxyalkylene rubber, chloroprene rubber, ethylene-propylene rubber, butyl rubber, polybutadiene rubber, polyisoprene rubber, EPDM polymerization. , styrene-butadiene copolymer, copolymer of ethylene and ethyl vinyl acetate, gas rubber / vinyl nitrile rubber, neoprene / EPDM / SBR rubber, and combinations thereof. Heat 44 1287481 Non-limiting examples of plastic elastomers may include polyurethanes, such as polyethers and polyesters, and copolymers thereof. Non-limiting examples of the foam sheet may include an ethylene vinyl acetate sheet and a polyethylene foam sheet; a polyurethane foam sheet, and a poly-smoke foam sheet such as, but not limited to, 5 Offenders are available from R〇gers Corporation, Woodstock, CT. In yet another non-limiting embodiment, the secondary mat may comprise a nonwoven or woven fibrous mat and combinations thereof, such as, but not limited to, polyolefin, polyester, polyamide or acrylic fibers, which may be via Resin infiltration. The fibers of the fiber mat may be short fibers or substantially continuous fibers. Non-limiting examples may include, but are not limited to, a nonwoven fabric made of t-gas/texture, such as a wool impregnated with polyurethane. A non-limiting example of a commercially available non-woven mat may be from

Rode 1, Inc. Newark DE SubaTM IV. The thickness of the secondary flaw can be changed. In general, the thickness of the secondary mat should be too thick to use the stacked polishing pad. Too thick stacked polishing pads can be difficult to place on and removed from the flattening device. 2至2毫米。 Thus, in a non-limiting embodiment, the thickness of the secondary pad may be 0. 2 to 2 mm. In a non-limiting embodiment, the polishing pad of the present invention can comprise a primary pad, and the secondary pad can serve as a bottom layer of the polishing pad that can be attached to the platen of the polishing apparatus. 20 纟—Unrestricted specific examples, the secondary enthalpy may be substantially void-free and substantially impermeable to the polishing slurry. As used in this case, Quin and the patent applicant, "substantially no hole" - the word means that the passage of liquid, gas and bacteria is substantially impermeable. On the scale of the giant scale, if there is any hole in the material of the perforated non-porous hole, it is rarely present. For example, 45 1287481 is used in the scope of the present specification and the scope of the patent application, "porosity," means having a hole, and "hole," means a very small opening through which a substance can pass. In yet another non-limiting embodiment, a three layer stacking mat can be constructed by attaching the polishing pad at least partially to the second layer and at least partially connecting the second layer to the primary mat. In yet another non-limiting embodiment, a SUBAIV-human pad of commercially available 2, Incorporated diameter 22.0" can be included in the secondary pad. As described above, an opening can be cut into the polishing layer, second In another non-limiting embodiment, the opening 1 can be a rectangle having a size of 0·5" X 2.0", which is positioned along the radial direction to the long axis, center and The center of the pad is 4" apart. As mentioned above, a window can be

Formed in the first layer. In an alternative non-limiting embodiment, the opening can be cut into the SUBA IV pad prior to at least partially connecting the SUBA IV pad to the second layer, or the opening can be at least partially joined to the polishing layer, the second layer, and After the 15th cushion, cut into the mat. In another non-limiting embodiment, the window portion may be formed on the polishing layer and the second shot of the second portion as described above, and the second layer having the opening σ is at least partially connected to the second portion. The layer is such that the opening in the secondary layer is at least partially aligned with the opening of the polishing pad and the window in the second layer. The opening may be cut into the crucible before or after the assembly of the polishing pad and the second layer is at least partially joined. In an alternative non-limiting example of W, the opening can be made by any suitable method known in the art, such as the description of the opening in the _optical layer. Further, 46 1287481 As described above, the size, shape and position of the opening can be determined by the application of the equipment and the polishing apparatus. In another non-limiting embodiment, the polishing pad of the present invention can comprise a polishing layer, a second layer, and a primary backing layer. The polishing layer and the sub-layer layer each have 5 openings. The openings in the two layers are at least partially aligned with one another. At least a portion of the second layer can include an at least partially transparent window portion. The window portion can be coated with a contact adhesive at least partially on both sides, and the layers can be pressed together to form a stacked mat assembly. The adhesive can then be stripped from the upper and lower surfaces of the window portion of the second layer using a material that is substantially adhered by the adhesive. A non-limiting example of a material that adheres to the adhesive is Teslin8.

Sp-1000 is a synthetic sheet material commercially available from PPG Industries, Inc, Pittsburgh, PA. In a non-limiting embodiment, the polishing pad of the present invention can be used in combination with polishing slurries known in the art. Non-limiting examples of suitable slurries for use with the polishing pad of the present invention include, but are not limited to, the slurries described in U.S. Patent Application Serial Nos. 09/882,548 and 09/882,549. The two US applications were filed on June 2, 2001 and are under review. In a non-limiting embodiment, the polishing slurry can be sandwiched between the polishing crucible and the substrate being polished. The polishing or planarization method can include moving the polishing pad relative to the substrate being polished. A variety of different polishing slurries are known in the art. Non-limiting examples of suitable slurries for use in the present invention include slurries containing abrasive particles. Abrasives which can be used in the slurry include particulate cerium oxide, particulate alumina, particulate cerium oxide and the like. Commercial slurries for polishing of semiconductor substrates include, but are not limited to, 47 1287481 from ILD1200 and ILD1300 available from Rodel, Inc. Newark DE, and Semi-Sperse available from Cabot Microelectronics Materials Division. AM100 and Semi-Sperse 12 o 5 The window mat of the present invention can be used with a variety of different polishing equipment known in the prior art. In a non-limiting specific example, it can be used

Mirra polisher, manufactured by Applied Materials Inc, Santa ClaraCA, where the opening is rectangular in shape and has a size of 〇·5” X2. 〇,,, positioned along the radial axis toward the long axis, centered and center of the polishing pad 4" apart. The 1 〇Mirra polisher has a platen diameter of 20". The pad used with this polisher can comprise a 20 inch diameter circle with a window located in this area. In yet another non-limiting embodiment, A Teres polisher is commercially available from Lam Research Corporation, FVemont, CA. This polisher replaces the circular platen with a continuous strip. The 15 pads of this polisher can be twisted 12 and perimeter 93. A 25" continuous belt having a window region that is sized to align with the metrology window of the Teres polisher. It can be at least partially aligned with at least partially transparent portions of the second layer. The polishing pad of the present invention may have a shape selected from, but not limited to, the following shapes: 2 〇 circular, elliptical, square, rectangular, and triangular. In a non-limiting embodiment, the polishing pad can be in the form of a continuous strip. The polishing crucible according to the present invention can have a wide range of sizes and thicknesses. In a non-limiting embodiment, the circular polishing pad can range in diameter from 3.8 cm to 137 cm. 48 1287481~ The present invention is described in more detail in the following examples, which are intended to be merely illustrative, as many modifications and variations are apparent to those skilled in the art. All parts and all percentages are by weight unless otherwise indicated. EXAMPLES Example 1 An airfane PHP-75D polyurethane prepolymer of 36·00 kg, a 1.6 kg of Des_ur N 33_ and a 19 kg L_per surfactant were fed to Uaule, a three-component low pressure dispenser. The first tank was maintained at a nitrogen pressure of 140 F and 15 PSI. Wo] Mix the tank with low speed stirring. The straw was prepared by dissolving 35 5 kg of [cheat coffee MCDEA] at a temperature of 2 UTF, and then adding 5.5 kg of v(10) Mink p_25〇 by stirring. Next, add 21. 21 kg of appendage 118 〇〇 and stir until homogeneously mixed. The curing agent mixture was then poured into a second tank, I5, and maintained under a nitrogen pressure of 210 F and 40 pSi, and mixed at a low speed. Next, 219 g of Versalink P 650, 60 g of DABCO BL-1 Θ catalyst and 21 g of deionized water were mixed at room temperature and atmospheric pressure. Pour into the second tank. By fixing the transfer pump, take 242 grams from the first tank · take 100 grams from the second tank: take the weight ratio of 1.80 grams from the third tank, ° pour the fluid of the first tank, the second tank and the third tank Into the mixer. The fluid was mixed under high speed agitation and dispensed into an open circular mold having a diameter of 31 inches and a thickness of 0. 090 inches. The mold was preheated to 16 inches. The open mold was placed in an oven at 160 °F for 15 minutes. Thereafter, the product was allowed to stand in the mold and cured at 230 F for 18 hours. The product is then allowed to cool to 49 1287481 to μ. A circular pad having a diameter of 2 inches was cut from the molded part. Then, the crucible is cut to a thickness of 090 090 ft, and a grinder is used to make the upper and lower surfaces of the crucible parallel. A concentric circular groove having a width of 0.060" pitch 〇·〇20" Χ0.030"' wood is processed into a working surface. Then a window 5 w opening is cut in the pad. The tool is rectangular and the size is Q 5 , The m opening is positioned along the radial direction toward the long axis, and the center is 4" from the center of the polishing pad. Applying a double-coated film tape having a liner/pad to the surface of the dish, the dish is not grooved, so that the rectangular opening in the first layer is substantially covered by the tape Cross. Membrane tape is commercially available from 3M and is a 95"pc ίο high-performance double-coated tape. The stacking is constructed by mounting the polishing pad assembly on the third layer of the secondary pad having openings. The secondary oxime system consisting of a polyurethane foam dish having a diameter of 2 〇" was die-cut from PORON FH 48 sheet (available from Rogers Corporation, Woodstock, CT) having a thickness of l 5

15 cm and density 〇 48 g/cm3. Another double coated film with a release liner is commercially available from Adhesives Research, Inc. under the trade name ARclad 90334. Apply an adhesive tape to one surface of the polyurethane foam. Then, the 20" diameter foam pad and the double-coated film tape with the release liner are cut into the window opening. The opening shape is rectangular, and the opening 2 is an inch of 0. 5 x 2 · 0. The control position is positioned to the long axis, and the center is 4" from the center of the pad. Next, the 3M 9500PC release liner on the polishing pad assembly was removed to expose the adhesive. Next, the polishing enamel assembly fe is fixedly bonded to the side of the foam of the secondary enthalpy by the adhesive. Care must be taken during installation so that the window of the secondary file is aligned with the window of the pad. The three 50 1287481 layer stack assembly is then passed through a calender roll set. The adhesive on the upper and lower surfaces of the second layer of the window region was removed by contact with a %"x2" rectangular sheet commercially available from PPG Industries, Incorporated, Teslin SP-1000. This was accompanied by pressing the sheet by hand to ensure good contact between the adhesive and the 5 Teslin SP-1000, followed by peeling off the Teslin SP-1000. The adhesive selectively adheres to the Teslin SP-1000, leaving a substantially transparent film of the window without the adhesive. The resulting mat stack has a transparent rectangular window that measures 5" x 2". The remaining liner on the secondary mat can be removed to allow for adhesion to a commercial flattening device. 10 [Simple diagram]: None [Main component symbol description]: No 51

Claims (1)

1287481 X. Patent Application Range: 1. A pad suitable for polishing a microelectronic substrate, the pad comprising: (a) a polishing layer containing polyurethane urea, the polishing layer comprising at least a portion of a gas filled chamber, at least a portion of the at least portion a chamber 5 filled with gas formed by in situ reaction, wherein an opening is formed in the polishing layer; and (b) a second layer, wherein at least a portion of the second layer comprises an at least partially transparent window Wherein the polishing layer is at least partially connected to the second layer, and the opening in the polishing layer is at least partially aligned with the window portion in the second layer. 2. A pad suitable for polishing a microelectronic substrate, the pad comprising: (a) a polishing layer comprising a polyurethane urea, the polishing layer comprising a cell at least partially filled with a gas, the polishing layer being comprised by a polyurethane prepolymer and Forming a reaction of an amine material and a blowing agent, wherein an opening is formed in the polishing layer; and (b) a second layer, wherein at least a portion of the second layer comprises an at least partially transparent window portion; Wherein the polishing layer is at least partially joined to the second layer, and the opening in the 20 polishing layer is at least partially aligned with the window portion in the second layer. 3. A pad suitable for polishing a microelectronic substrate, the pad comprising: (a) a polishing layer comprising a polyurethane urea, the polishing layer comprising a chamber at least partially filled with a gas, the polishing layer being formed by a polyisocyanate and a hydroxyl group 52 Forming a reaction of a base material, an amine-containing material, and a blowing agent, wherein an opening is formed in the polishing layer; and (b) a second layer, wherein at least a portion of the second layer comprises an at least partially transparent layer a window portion; wherein the polishing layer is at least partially connected to the second layer, and the opening in the polishing layer is at least partially aligned with the window portion in the second layer. 4. A pad suitable for polishing a microelectronic substrate, the pad comprising: (a) a polishing layer comprising a polyurethane urea, the polishing layer comprising at least a portion of a gas filled chamber, the polishing layer being pre-polyisocyanate and polyurethane Forming a reaction of a polymer, an amine-containing material, and a blowing agent, wherein an opening is formed in the polishing layer; and (b) a second layer, wherein at least a portion of the second layer comprises an at least partially transparent layer a window portion; 15 wherein the polishing layer is at least partially connected to the second layer, and the opening in the polishing layer is at least partially aligned with the window portion in the second layer. 5. The pad of claim 1, wherein the polishing pad comprises a hydroxyl-containing material, an amine-containing material, a foaming agent, and at least one selected from the group consisting of polyisocyanate 20 ester, polyurethane prepolymer, and A reaction of a substance of the group consisting of the mixture is formed. 6. The pad of claim 1, wherein when at least a portion of the working surface of the pad is in contact with the substrate to be polished, at least a portion of the working surface of the pad is at least partially at least partially The gas in the cell of the partially filled gas 53 1287481 is exposed. 7. The pad of claim 3, wherein the polyisocyanate has at least a diisocyanate functional group. 8. The pad of claim 3, wherein the polyisocyanate is selected from the group consisting of polymerizable and C2-C2. a group consisting of linear, branched, cyclic, and aromatic polyisocyanates. 9. The pad of claim 2, wherein the hydroxyl-containing material is selected from the group consisting of polyether polyols, polyester polyols, polycaprolactone polyols, polycarbonate polyols, and mixtures thereof. group. 10. The pad of claim 2, wherein the amine-containing material is selected from the group consisting of a polyamine, a cycloaliphatic polyamine, an aromatic polyamine, and mixtures thereof. 11. The pad of claim 2, wherein the amine-containing material comprises a polyamine and at least one material selected from the group consisting of polythiols and polyols. 12. The pad of claim 2, wherein the amine-containing material further comprises sulfur. 13. The pad of claim 2, further comprising at least one material selected from the group consisting of a urethane catalyst, a foaming catalyst, a surfactant, and a nucleating agent. 14. The pad of claim 1, wherein the pad has a working surface and the surface comprises at least one structure selected from the group consisting of a combination of channels, grooves, perforations, and the like. 15. The pad of claim 1, wherein the polyurethaneurea comprises a particulate material of 541287481. 16. The pad of claim 15 wherein the abrasive particulate material is substantially uniformly distributed in the polyurethaneurea. 17. The pad of claim 15 wherein the abrasive particulate material 5 is present in an amount of from 5% by weight to less than 70% by weight based on the total weight of the mat. The granules of the abrasive particles have an average particle size of from 0.001 μm to less than 50 μm. 19. The pad of claim 15 wherein the abrasive particulate material 10 is cerium oxide. 20. The pad of claim 1 wherein the second layer is selected from the group consisting of polyolefins, cellulose-based polymers, acrylates, polyesters and copolyesters, polycarbonates, polyamines. , plastics and combinations thereof. 21. The pad of claim 1, wherein the second layer is selected from the group consisting of a solid non-vvable compressible polymer, a metal film and a metal foil, and the like. 22. The pad of claim 1, further comprising a primary layer, the secondary layer forming an opening, the secondary layer being at least partially connected to the second layer, and wherein the secondary layer is The opening is at least partially aligned with the window opening of the second layer and the opening in the polishing layer. 23. The pad of claim 22, wherein the underlayer is selected from the group consisting of a nonwoven fibrous mat, a woven fibrous mat, and the like. 24. The pad of claim 22, wherein the sublayer is selected from the group consisting of a polyurethane infiltrated felt, a polyurethane urea infiltrated felt, and the like, and a combination of 55 1287481. 25. The pad of claim 22, wherein the underlayer is selected from the group consisting of natural rubber, synthetic rubber, thermoplastic rubber or the like. 5 26. A method of preparing a pad suitable for polishing a microelectronic substrate, comprising: (a) forming a polishing layer comprising a polyurethaneurea, wherein the polyurethaneurea comprises a cell that is at least partially filled with a gas, and wherein at least a portion of the at least a portion of the gas-filled cell is formed by in situ reaction; (b) forming an opening in the polishing layer; 10 (c) forming a second layer comprising an at least partially transparent window; (d) at least Partially aligning the opening in the polishing layer with the window portion of the second layer; and (e) at least partially joining the polishing layer and the second layer. 27. The method of claim 26, wherein the polishing layer is formed by combining a polyisocyanate with a hydroxyl-containing material, an amine-containing material, and a blowing agent to produce a polyurethaneurea, wherein At least a portion of the urea contains a chamber that is at least partially filled with a gas. 28. The method of claim 26, wherein the polishing layer is formed by combining a polyisocyanate and a hydroxyl-containing material to form a 20 polyurethane prepolymer; and combining the polyurethane prepolymerization And an amine-containing material and a blowing agent to form a polyurethaneurea, wherein at least a portion of the urea contains a cell that is at least partially filled with a gas. 29. The method of claim 27, wherein the polishing layer is formed by combining a polyisocyanate and a polyurethane prepolymer with a hydroxy 56 1287481 based material, an amine-containing material, and a hair _, A county ship reduction wherein at least a portion of the urea contains a chamber that is at least partially filled with a gas. 3. The method of claim 27, wherein the ingredients are combined under low pressure. 31. The method of claim 28, wherein the ingredients are combined under the pressure of Ba. U. The method of claim 5, wherein the at least partially enriched gas cell comprises carbon dioxide. 33. If the patent application scope is the 10th item of the 10th item, the average size of the cells of the gas / /, medium "> partial filling _ please patent _ 2 1 micro gas of the cell system is substantially equal to eight 15 points Filling 35. If Shen _ _ _ 27 # = in the entire _ service. 36. The method of claim 1, wherein the blowing agent comprises water. For example, the method of claim 27, wherein the blowing agent is water. Co-blowing agent. The method further comprises the addition-auxiliary 38. The method of claim 2, wherein the combination of the poly-prepolymer and the auxiliary blowing agent is further included. 39. The method of claim 3, wherein the auxiliary blowing agent is selected from the group consisting of acetone, 7 "ethyl esters" and "alkylenes". 40. The auxiliary foaming agent system in acetone and B = 41. The group consisting of the "burning class" of the patent application scope. The method of the 26th item of the ceremony, further comprising: (4) forming a secondary layer, after the time Forming an opening in the layer; 57 1287481 (b) at least partially aligning the opening in the sub-layer with the window of the second layer and the opening in the polishing layer; and (c) at least partially connecting The underlayer and the second layer. 42. A pad assembly comprising: 5 a polishing layer comprising a polyurethaneurea, wherein at least a portion of the polyurethaneurea comprises at least a portion of a gas-filled cell, wherein at least a portion thereof The at least partially filled gas chamber is formed by in situ reaction, the polishing layer having a working surface and a back surface; a backing sheet having an upper surface and a lower surface; and 10 an adhesive device a clip placed on the back of the polishing layer And at least partially interconnecting the face and the upper surface of the backing sheet, at least a portion of the adhesive means being at least partially transparent, wherein the polishing layer and the backing sheet are each formed with an opening, and wherein the polishing The respective openings of the layer and the backing sheet are at least partially aligned with the transparent portion of the adhesive device, and wherein the polishing layer is at least partially coupled to the adhesive device and the adhesive device is at least partially coupled to the back 43. The pad assembly of claim 42, wherein the polyurethaneurea comprises a combination of a hydroxyl-containing material, an amine-containing material, a blowing agent, and at least one selected from the group consisting of poly(cyanoisocyanate), It is formed by a group of polyurethane prepolymers and mixtures thereof.