JP5230227B2 - Polishing pad - Google Patents

Description

  The present invention relates to a polishing pad (for rough polishing or finish polishing) used for polishing surfaces of optical materials such as lenses and reflection mirrors, silicon wafers, glass substrates for hard disks, and aluminum substrates. In particular, the polishing pad of the present invention is suitably used as a polishing pad for finishing.

  In general, mirror polishing of semiconductor wafers such as silicon wafers, lenses, and glass substrates mainly involves rough polishing for the purpose of adjusting flatness and in-plane uniformity, improvement of surface roughness, and removal of scratches. There is intended finish polishing.

  The finish polishing is usually performed by attaching a suede-like artificial leather made of soft urethane foam on a rotatable surface plate and supplying an abrasive containing colloidal silica to an alkali-based aqueous solution. (Patent Document 1).

  In addition to the above, the following have been proposed as polishing pads used for finish polishing.

  A suede-like finish polishing pad consisting of a nap layer in which polyurethane foam is formed with a number of elongated fine holes (nap) formed in the thickness direction using a foaming agent and a base fabric that reinforces the nap layer has been proposed. (Patent Document 2).

  In addition, a polishing cloth for finish polishing that is suede-like and has a surface roughness of 5 μm or less in arithmetic mean roughness (Ra) has been proposed (Patent Document 3).

  Also, a polishing cloth for finishing polishing comprising a base material part and a surface layer (nap layer) formed on the base material part, wherein the surface layer contains a polyvinyl halide or a vinyl halide copolymer. Has been proposed (Patent Document 4).

  Conventional polishing pads have been manufactured by a so-called wet curing method. The wet curing method is a method in which a urethane resin solution in which a urethane resin is dissolved in a water-soluble organic solvent such as dimethylformamide is applied onto a substrate, which is treated in water and wet solidified to form a porous silver surface layer. The surface layer (nap layer) is formed by grinding the surface of the silver surface layer after washing and drying. For example, in Patent Document 5, a polishing pad for finishing having a substantially spherical hole with an average diameter of 1 to 30 μm is manufactured by a wet curing method.

  However, the conventional polishing pad has a long and narrow structure of the bubbles or the mechanical strength of the material of the surface layer itself is low, so that the durability is poor, the planarization characteristics are gradually deteriorated, and the stability of the polishing rate is inferior. There was a problem.

  On the other hand, the following has been proposed as a polishing pad used for rough polishing.

  In Patent Document 6, the main component (A) containing the isocyanate group-terminated urethane prepolymer (A), the isocyanate group-reactive compound (B), water (C) as a foaming agent, the inorganic abrasive (D) and the catalyst ( E) is a glass polishing polyurethane pad obtained by reacting a curing agent (a) containing the isocyanate group-terminated urethane prepolymer (A) with at least tolylene diisocyanate (A1) and poly (tetramethylene ether). ) Glycol (A2) and polycaprolactone triol (A3) are reacted with each other so that the average number of functional groups within the range of 2.1 to 2.7 when (A2) and (A3) are mixed. Is an isocyanate group-terminated urethane prepolymer, and the isocyanate group-reactive compound (B) is a small amount. Both of the above glass polishing polyurethane pads are characterized by comprising 4,4'-diamino-3,3'-dichlorodiphenylmethane (B1) and poly (tetramethylene ether) glycol (A2). .

  In Patent Document 7, the isocyanate-terminated reaction product has 4.5 to 8.7% by weight of unreacted NCO, and the isocyanate-terminated reaction product is converted into a curing agent polyamine, a curing agent polyol, A polishing pad that has been cured with a curing agent selected from the group consisting of curing agent alcohol amines and mixtures thereof and containing at least 0.1 volume% filler or pores has been proposed.

  However, the conventional polishing pad for rough polishing has a problem that the stability of the polishing rate is inferior due to large variation in bubble diameter.

JP 2003-37089 A JP 2003-1000068 A1 JP 2004-291155 A JP 2004-335713 A JP 2006-75914 A JP 2005-68168 A Special table 2007-520617

  An object of this invention is to provide the polishing pad which is excellent in durability and excellent in the stability of polishing characteristics.

  As a result of intensive studies to solve the above problems, the present inventors have found that the above object can be achieved by the polishing pad described below, and have completed the present invention.

  That is, the present invention provides a polishing pad in which a polishing layer is provided on a base material layer, wherein the polishing layer comprises a thermosetting polyurethane foam having substantially spherical open cells, and the thermosetting polyurethane foam Is a prepolymer composition comprising an isocyanate component and an active hydrogen group-containing component in a functional group molar ratio of 1.5 to 2 (number of moles of isocyanate group in the isocyanate component / number of moles of active hydrogen group in the active hydrogen group-containing component). The present invention relates to a polishing pad comprising an isocyanate-terminated prepolymer obtained by reacting and a chain extender as raw material components.

  The conventional polishing pad for finishing has a long and slender structure or the mechanical strength of the material of the polishing layer itself is low. Therefore, when pressure is repeatedly applied to the polishing layer, “sagging” occurs, resulting in poor durability. It is considered to be. On the other hand, as described above, the durability of the polishing layer can be improved by forming the polishing layer with a thermosetting polyurethane foam having substantially spherical open cells. Therefore, when the polishing pad of the present invention is used, the planarization characteristic can be kept high for a long time, and the stability of the polishing rate is also improved. Here, the substantially spherical shape means a spherical shape and an elliptical shape. Oval and spherical bubbles are those having a major axis L to minor axis S ratio (L / S) of 5 or less, preferably 3 or less, more preferably 1.5 or less.

  In addition, the present inventors have prepared a prepolymer composition containing an isocyanate component and an active hydrogen group-containing component at a functional group molar ratio of 1.5 to 2 as an isocyanate-terminated prepolymer that is a raw material of a thermosetting polyurethane foam. It has been found that by using the prepolymer obtained by the reaction, the cell diameter distribution of the open cells in the thermosetting polyurethane foam can be reduced, and the stability of the polishing rate is further improved.

  When the functional group molar ratio is outside the range of 1.5 to 2, it becomes a prepolymer containing a large amount of unreacted monomer components, and when a thermosetting polyurethane foam is produced using the prepolymer, Heat tends to be generated during the reaction between the prepolymer and the chain extender, whereby the bubbles are easily expanded and the variation in the bubble diameter is increased.

  Further, the thermosetting polyurethane foam of the present invention has an open cell structure, and fine pores are formed on the surface of the cell, so that it has an appropriate water retention.

  The polishing layer is preferably self-adhering to the base material layer. Thereby, it can prevent effectively that a grinding | polishing layer and a base material layer peel during grinding | polishing.

  The present invention also includes an isocyanate component and an active hydrogen group-containing component in a functional group molar ratio of 1.5 to 2 (number of moles of isocyanate group in the isocyanate component / number of moles of active hydrogen group in the active hydrogen group-containing component). A silicon-based surfactant is added to the first component containing an isocyanate-terminated prepolymer obtained by reacting the prepolymer composition so as to be 0.1 to 10% by weight in the thermosetting polyurethane foam, and further, A step of preparing a bubble dispersion in which the first component is stirred with a non-reactive gas to disperse the non-reactive gas as fine bubbles, and a second component containing a chain extender is mixed with the bubble dispersion to produce bubbles. A step of preparing a dispersed urethane composition, a step of applying a cell-dispersed urethane composition on a substrate layer, a thermosetting polyurethane having substantially spherical open cells by curing the cell-dispersed urethane composition Forming a down foam, and a method of manufacturing a polishing pad comprising the steps of uniformly regulating the thickness of the thermosetting polyurethane foam, about.

  The present invention also includes an isocyanate component and an active hydrogen group-containing component in a functional group molar ratio of 1.5 to 2 (number of moles of isocyanate group in the isocyanate component / number of moles of active hydrogen group in the active hydrogen group-containing component). A silicon-based surfactant is added to the first component containing an isocyanate-terminated prepolymer obtained by reacting the prepolymer composition so as to be 0.1 to 10% by weight in the thermosetting polyurethane foam, and further, A step of preparing a bubble dispersion in which the first component is stirred with a non-reactive gas to disperse the non-reactive gas as fine bubbles, and a second component containing a chain extender is mixed with the bubble dispersion to produce bubbles. The step of preparing the dispersed urethane composition, the step of applying the cell-dispersed urethane composition on the release sheet, the step of laminating the base material layer on the cell-dispersed urethane composition, and the thickness by the pressing means And a step of curing a cell-dispersed urethane composition to form a thermosetting polyurethane foam having substantially spherical open cells, and a step of peeling a release sheet under the thermosetting polyurethane foam. Manufacturing method.

  Furthermore, this invention relates to the manufacturing method of the semiconductor device including the process of grind | polishing the surface of a semiconductor wafer using the said polishing pad.

  The polishing pad of the present invention includes a polishing layer made of a thermosetting polyurethane foam (hereinafter referred to as polyurethane foam) having substantially spherical open cells, and a base material layer.

  Polyurethane resin is excellent in abrasion resistance, and it is possible to easily obtain polymers having desired physical properties by changing the raw material composition. Also, it is easy to form almost spherical fine bubbles by mechanical foaming (including mechanical flossing). Since it can be formed, it is a preferable material for forming the polishing layer.

  The polyurethane foam of the present invention is produced by reacting an isocyanate-terminated prepolymer with a chain extender. The isocyanate-terminated prepolymer is synthesized by reacting a prepolymer composition containing an isocyanate component and an active hydrogen group-containing component (high molecular weight polyol, low molecular weight polyol, low molecular weight polyamine, etc.).

  As the isocyanate component, a known compound in the field of polyurethane can be used without particular limitation. For example, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 2,2′-diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, 4,4′-diphenylmethane diisocyanate, polymeric MDI, carbodiimide-modified MDI (for example, commercial products) Name Millionate MTL, manufactured by Nippon Polyurethane Industry), 1,5-naphthalene diisocyanate, p-phenylene diisocyanate, m-phenylene diisocyanate, p-xylylene diisocyanate, m-xylylene diisocyanate and other aromatic diisocyanates, ethylene diisocyanate, 2,2 1,4-trimethylhexamethylene diisocyanate, aliphatic diisocyanates such as 1,6-hexamethylene diisocyanate, 1,4-cyclohexane San diisocyanate, cyclohexane diisocyanate, 4,4'-dicyclohexyl methane diisocyanate, isophorone diisocyanate, and cycloaliphatic diisocyanates such as norbornane diisocyanate. These may be used alone or in combination of two or more.

  As the isocyanate component, a trifunctional or higher polyfunctional polyisocyanate compound can be used in addition to the diisocyanate compound. As a polyfunctional isocyanate compound, a series of diisocyanate adduct compounds are commercially available as Desmodur-N (manufactured by Bayer) or trade name Duranate (manufactured by Asahi Kasei Kogyo Co., Ltd.).

  Of the above isocyanate components, 4,4'-diphenylmethane diisocyanate is preferably used.

  Examples of the high molecular weight polyol include those usually used in the technical field of polyurethane. Examples include polyether polyols typified by polytetramethylene ether glycol, polyethylene glycol, etc., polyester polyols typified by polybutylene adipate, polycaprolactone polyols, reactants of polyester glycols such as polycaprolactone and alkylene carbonate, etc. Polyester polycarbonate polyol obtained by reacting ethylene carbonate with polyhydric alcohol, and then reacting the obtained reaction mixture with organic dicarboxylic acid, polycarbonate polyol obtained by transesterification of polyhydroxyl compound and aryl carbonate And polymer polyol which is a polyether polyol in which polymer particles are dispersed.These may be used alone or in combination of two or more.

  The high molecular weight polyol is preferably contained in an active hydrogen group-containing component in an amount of 70% by weight or more, more preferably 75 to 95% by weight. By using a specific amount of the high molecular weight polyol, the cell membrane is easily broken, and an open cell structure is easily formed.

  Of the high molecular weight polyols, it is preferable to use a high molecular weight polyol having a hydroxyl value of 30 to 250 mgKOH / g. The hydroxyl value is more preferably 35 to 130 mgKOH / g. When the hydroxyl value is less than 30 mgKOH / g, the amount of hard segments of the polyurethane foam tends to decrease and the durability tends to decrease. When it exceeds 250 mgKOH / g, the degree of crosslinking of the polyurethane foam increases. It tends to be too brittle.

  The number average molecular weight of the high molecular weight polyol is not particularly limited, but is preferably 500 to 3500 from the viewpoint of the elastic properties of the resulting polyurethane. When the number average molecular weight is less than 500, gelation tends to occur during the synthesis of the prepolymer. On the other hand, when the number average molecular weight exceeds 3500, polyurethane using the same becomes too soft. Therefore, the durability of the polishing layer made of this polyurethane foam tends to deteriorate.

  Along with high molecular weight polyol, ethylene glycol, 1,2-propylene glycol, 1,3-propylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 1,6-hexanediol, neopentyl glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, diethylene glycol, triethylene glycol, 1,4-bis (2-hydroxyethoxy) benzene, tri Methylolpropane, glycerin, 1,2,6-hexanetriol, pentaerythritol, tetramethylolcyclohexane, methylglucoside, sorbitol, mannitol, dulcitol, sucrose, 2,2,6,6-tetrakis (hydroxymethyl) cyclo Hexanol, diethanolamine, N- methyldiethanolamine, and low molecular weight polyols such as triethanolamine may be used in combination. Moreover, low molecular weight polyamines, such as ethylenediamine, tolylenediamine, diphenylmethanediamine, and diethylenetriamine, can also be used in combination. Also, alcohol amines such as monoethanolamine, 2- (2-aminoethylamino) ethanol, and monopropanolamine can be used in combination. These low molecular weight polyols and low molecular weight polyamines may be used alone or in combination of two or more.

  Among these, it is preferable to use a low molecular weight polyol having a hydroxyl value of 700 to 1830 mgKOH / g. The hydroxyl value is more preferably 900 to 1500 mgKOH / g. When the hydroxyl value is less than 700 mgKOH / g, the effect of improving the formation of open cells tends to be insufficient. On the other hand, when the hydroxyl value exceeds 1830 mgKOH / g, scratches tend to occur on the wafer surface. In particular, it is preferable to use diethylene glycol, 1,2-propylene glycol, 1,3-butanediol, or 1,4-butanediol.

  In order to make the polyurethane foam into an open-cell structure, the low molecular weight polyol or the like is preferably contained in a total of 30% by weight or less, more preferably 5 to 25% by weight, in the active hydrogen group-containing component. By using a specific amount of a low molecular weight polyol or the like, not only the bubble film is easily broken and it becomes easy to form open cells, but also the mechanical properties of the polyurethane foam are improved.

  In order to make the polyurethane foam into an open-cell structure, a polymer polyol may be used, and examples thereof include a polymer polyol in which polymer particles made of acrylonitrile and / or a styrene-acrylonitrile copolymer are dispersed.

  In the present invention, when the isocyanate-terminated prepolymer is synthesized, the isocyanate component and the active hydrogen group-containing component are mixed in a functional group molar ratio of 1.5 to 2 (number of moles of isocyanate groups in the isocyanate component / active hydrogen group-containing component). It is necessary to blend in the number of moles of active hydrogen groups). Here, the active hydrogen group means hydrogen of a hydroxyl group and hydrogen of an amino group. The functional group molar ratio is preferably 1.55 to 1.95, more preferably 1.6 to 1.9. In this case, a prepolymer containing almost no unreacted monomer component is obtained. And when this prepolymer is used, the heat_generation | fever at the time of reaction with a chain extension agent can be suppressed, and since expansion | swelling of a bubble can be suppressed by it, the variation in a bubble diameter can be made small.

  When the polyurethane foam is produced by the prepolymer method, a chain extender is used for curing the isocyanate-terminated prepolymer. The chain extender is an organic compound having at least two or more active hydrogen groups, and examples of the active hydrogen group include an active hydrogen group, a primary or secondary amino group, and a thiol group (SH). Specifically, 4,4′-methylenebis (o-chloroaniline) (MOCA), 2,6-dichloro-p-phenylenediamine, 4,4′-methylenebis (2,3-dichloroaniline), 3,5 -Bis (methylthio) -2,4-toluenediamine, 3,5-bis (methylthio) -2,6-toluenediamine, 3,5-diethyltoluene-2,4-diamine, 3,5-diethyltoluene-2 , 6-diamine, trimethylene glycol-di-p-aminobenzoate, 1,2-bis (2-aminophenylthio) ethane, 4,4′-diamino-3,3′-diethyl-5,5′-dimethyl Diphenylmethane, N, N′-di-sec-butyl-4,4′-diaminodiphenylmethane, 3,3′-diethyl-4,4′-diaminodiphenylmethane, m-xyl And polyamines exemplified by N diamine, N, N′-di-sec-butyl-p-phenylenediamine, m-phenylenediamine, and p-xylylenediamine, or the low molecular weight polyol described above. . These may be used alone or in combination of two or more.

  The ratio of the isocyanate-terminated prepolymer and the chain extender can vary depending on the molecular weight of each and the desired physical properties of the polyurethane foam. In order to obtain a foam having desired characteristics, the number of isocyanate groups of the isocyanate component relative to the total number of active hydrogen groups (active hydrogen groups + amino groups) of the chain extender is preferably 0.80 to 1.20. More preferably, it is 0.99 to 1.15. When the number of isocyanate groups is outside the above range, curing failure occurs and the required specific gravity, hardness, compression ratio, etc. tend not to be obtained.

  The polyurethane resin can be produced by applying a known urethanization technique such as a melting method or a solution method, but it is preferably produced by a melting method in consideration of cost, working environment, and the like.

  As the isocyanate-terminated prepolymer, a polymer having a molecular weight of about 800 to 5,000 is preferable because it has excellent processability and physical properties.

  The polyurethane resin is produced by mixing and curing a first component containing an isocyanate-terminated prepolymer and a second component containing a chain extender.

  The polyurethane foam, which is a material for forming the polishing layer of the present invention, can be produced by a mechanical foaming method (including a mechanical floss method) using a silicon surfactant.

  In particular, a mechanical foaming method using a silicon surfactant which is a polyalkylsiloxane or a copolymer of an alkylsiloxane and a polyetheralkylsiloxane is preferable. Examples of suitable silicon surfactants include SH-192 and L-5340 (manufactured by Toray Dow Corning Silicone), B-8443 (manufactured by Goldschmidt), and the like.

  The silicon-based surfactant is preferably added to the polyurethane foam in an amount of 0.1 to 10% by weight, and more preferably 0.5 to 7% by weight.

  In addition, you may add stabilizers, such as antioxidant, a lubricant, a pigment, a filler, an antistatic agent, and another additive as needed.

  An example of a method for producing a polyurethane foam constituting the polishing layer will be described below. The manufacturing method of this polyurethane foam has the following processes.

  (1) A first component obtained by adding a silicon-based surfactant to an isocyanate-terminated prepolymer is mechanically stirred in the presence of a non-reactive gas to disperse the non-reactive gas as fine bubbles to obtain a cell dispersion. Then, a second component containing a chain extender is added to the cell dispersion and mixed to prepare a cell-dispersed urethane composition. A high molecular weight polyol and a catalyst may be added to the second component.

  (2) A silicon-based surfactant is added to at least one of the first component including the isocyanate-terminated prepolymer and the second component including the chain extender, and the component to which the silicon-based surfactant is added is converted into a non-reactive gas. The mixture is mechanically stirred in the presence to disperse the non-reactive gas as fine bubbles to obtain a bubble dispersion. Then, the remaining components are added to the cell dispersion and mixed to prepare a cell-dispersed urethane composition. A high molecular weight polyol and a catalyst may be added to the second component.

  (3) A silicon-based surfactant is added to at least one of the first component including the isocyanate-terminated prepolymer and the second component including the chain extender, and the first component and the second component are present in the presence of a non-reactive gas. Under mechanical stirring, a non-reactive gas is dispersed as fine bubbles to prepare a cell-dispersed urethane composition. A high molecular weight polyol and a catalyst may be added to the second component.

  The cell dispersed urethane composition may be prepared by a mechanical floss method. The mechanical floss method is a method in which raw material components are put into a mixing chamber of a mixing head and a non-reactive gas is mixed and mixed and stirred by a mixer such as an Oaks mixer to make the non-reactive gas into a fine bubble state in the raw material mixture. It is a method of dispersing in. The mechanical floss method is a preferable method because the density of the polyurethane foam can be easily adjusted by adjusting the amount of the non-reactive gas mixed therein. Moreover, since the polyurethane foam which has a fine cell with an average cell diameter of 35-300 micrometers can be continuously shape | molded, manufacturing efficiency is good.

  As the non-reactive gas used to form the fine bubbles, non-flammable gases are preferable, and specific examples include nitrogen, oxygen, carbon dioxide, rare gases such as helium and argon, and mixed gases thereof. In view of cost, it is most preferable to use air that has been dried to remove moisture.

  As a stirring device for dispersing the non-reactive gas in the form of fine bubbles, a known stirring device can be used without any particular limitation. Specifically, a homogenizer, a dissolver, a two-axis planetary mixer (planetary mixer), a mechanical A floss foaming machine etc. are illustrated. The shape of the stirring blade of the stirring device is not particularly limited, but it is preferable to use a whipper type stirring blade because fine bubbles can be obtained. In order to obtain the target polyurethane foam, the rotational speed of the stirring blade is preferably 500 to 2000 rpm, more preferably 800 to 1500 rpm. The stirring time is appropriately adjusted according to the target density.

  In addition, it is also a preferable aspect that the stirring for preparing the cell dispersion in the foaming step and the stirring for mixing the first component and the second component use different stirring devices. The agitation in the mixing step may not be agitation that forms bubbles, and it is preferable to use an agitation device that does not involve large bubbles. As such an agitator, a planetary mixer is suitable. There is no problem even if the same stirring device is used as the stirring device for the foaming step for preparing the bubble dispersion and the mixing step for mixing each component, and the stirring conditions such as adjusting the rotation speed of the stirring blades are adjusted as necessary. It is also suitable to use after adjustment.

  The pot life of the cell dispersed urethane composition is preferably 60 to 300 seconds. If it is less than 60 seconds, it is difficult to form a polyurethane foam. If it exceeds 300 seconds, the formation of the polyurethane resin skeleton is slowed down, and the bubbles expand due to heating during post-cure. The variation tends to increase.

  Thereafter, the cell-dispersed urethane composition prepared by the above method is applied onto the base material layer, and the cell-dispersed urethane composition is cured to form a polyurethane foam (polishing layer) directly on the base material layer.

  The substrate layer is not particularly limited. For example, plastic films such as polypropylene, polyethylene, polyester, polyamide, and polyvinyl chloride, polymer resin foams such as polyurethane foam and polyethylene foam, rubber properties such as butadiene rubber and isoprene rubber. Examples thereof include resins and photosensitive resins. Among these, it is preferable to use polymer resin foams such as plastic films such as polypropylene, polyethylene, polyester, polyamide, and polyvinyl chloride, polyurethane foam, and polyethylene foam. Moreover, you may use a double-sided tape and a single-sided adhesive tape (a single-sided adhesive layer is for affixing on a platen) as a base material layer.

  The base material layer is preferably as hard as a polyurethane foam or harder in order to impart toughness to the polishing pad. Moreover, the thickness of the base material layer (the base material in the case of double-sided tape and single-sided adhesive tape) is not particularly limited, but is preferably 20 to 1000 μm, more preferably 50 to 50 μm from the viewpoint of strength, flexibility, and the like. 800 μm.

  As a method for applying the cell-dispersed urethane composition onto the base material layer, for example, a roll coater such as gravure, kiss, or comma, a die coater such as slot or phanten, a squeeze coater, or a curtain coater is adopted. Any method may be used as long as a uniform coating film can be formed on the base material layer.

  Heating and post-curing the polyurethane foam that has reacted until the cell-dispersed urethane composition is applied to the base material layer and no longer flows is effective in improving the physical properties of the polyurethane foam and is extremely suitable. is there. Post-cure is preferably performed at 30 to 80 ° C. for 10 minutes to 6 hours, and it is preferable to perform at normal pressure because the bubble shape becomes stable.

  In the production of a polyurethane foam, a known catalyst for promoting a polyurethane reaction such as a tertiary amine may be used. The type and addition amount of the catalyst are selected in consideration of the flow time for coating on the substrate layer after the mixing step of each component.

  The polyurethane foam may be produced by a batch method in which each component is weighed and put into a container and mechanically stirred, and each component and a non-reactive gas are continuously supplied to a stirring device and mechanically stirred. Further, a continuous production method in which a cell-dispersed urethane composition is sent out to produce a molded product may be used.

  Moreover, after forming a polyurethane foam on a base material layer, or forming a polyurethane foam simultaneously, it is preferable to adjust the thickness of a polyurethane foam uniformly. The method for uniformly adjusting the thickness of the polyurethane foam is not particularly limited, and examples thereof include a method of buffing with an abrasive, a method of pressing with a press plate, and a method of slicing with a slicer. When pressing, it is preferable to make the thickness of the cell-dispersed urethane composition as close as possible to the thickness of the intended polishing layer. Specifically, the thickness of the cell-dispersed urethane composition is adjusted to 80 to 100% of the thickness of the intended polishing layer. By keeping the thickness of the cell-dispersed urethane composition as thin as possible, internal heat generation during curing can be suppressed, and thereby variation in cell diameter can be suppressed.

  Moreover, the cell-dispersed urethane composition prepared by the above method is applied on the base material layer, and a release sheet is laminated on the cell-dispersed urethane composition. Thereafter, the polyurethane foam may be formed by curing the cell-dispersed urethane composition while making the thickness uniform by a pressing means.

  On the other hand, the cell-dispersed urethane composition prepared by the above method is applied onto a release sheet, and a base material layer is laminated on the cell-dispersed urethane composition. Thereafter, the polyurethane foam may be formed by curing the cell-dispersed urethane composition while making the thickness uniform by a pressing means.

  The material for forming the release sheet is not particularly limited, and examples thereof include general resin and paper. The release sheet preferably has a small dimensional change due to heat. The surface of the release sheet may be subjected to a release treatment.

  The pressing means for making the thickness of the sandwich sheet composed of the base material layer, the cell-dispersed urethane composition (cell-dispersed urethane layer), and the release sheet is not particularly limited. For example, the thickness may be constant by a coater roll, a nip roll, or the like. The method of compressing is mentioned. In consideration of the fact that the bubbles in the foam increase by about 1.1 to 1.5 times after compression, (compressor or nip clearance) − (thickness of substrate layer and release sheet) = ( The thickness of the polyurethane foam after curing is preferably 80 to 90%.

  Then, after the thickness of the sandwich sheet is made uniform, the reacted polyurethane foam is heated until it does not flow and post-cured to form a polishing layer. Post cure conditions are the same as described above.

  Thereafter, the release sheet on the upper surface side or the lower surface side of the polyurethane foam is peeled to obtain a polishing pad. In this case, since the skin layer is formed on the polyurethane foam, the skin layer is removed by buffing or the like. Further, when the polyurethane foam is formed by the mechanical foaming method as described above, the variation in bubbles is smaller on the lower surface side than on the upper surface side of the polyurethane foam. Therefore, when the release sheet on the lower surface side is peeled off and the lower surface side of the polyurethane foam is used as the polishing surface, the polishing surface has a small variation in bubbles, and the stability of the polishing rate is further improved.

  Alternatively, the polyurethane foam (polishing layer) may not be formed directly on the base material layer, but may be bonded to the base material layer using a double-sided tape after forming the polishing layer.

  The shape of the polishing pad of the present invention is not particularly limited, and may be a long shape of about several meters in length or a round shape having a diameter of several tens of centimeters.

  The average cell diameter of the polyurethane foam is preferably 35 to 300 μm, more preferably 35 to 100 μm, and particularly preferably 40 to 80 μm. When deviating from this range, the polishing rate decreases or the durability decreases.

  The specific gravity of the polyurethane foam is preferably 0.2 to 0.6, more preferably 0.3 to 0.5. When the specific gravity is less than 0.2, the durability of the polishing layer tends to decrease. On the other hand, if it is larger than 0.6, the material needs to have a low crosslinking density in order to obtain a certain elastic modulus. In that case, the permanent set increases and the durability tends to deteriorate.

  The hardness of the polyurethane foam is preferably 10 to 95 degrees, more preferably 40 to 90 degrees, as measured by an Asker C hardness meter. When the Asker C hardness is less than 10 degrees, the durability of the polishing layer tends to decrease, or the surface smoothness of the polished material after polishing tends to deteriorate. On the other hand, when it exceeds 95 degrees, scratches are likely to occur on the surface of the material to be polished.

  The surface of the polishing layer may have a concavo-convex structure for holding and renewing the slurry. The polishing layer made of foam has many openings on the polishing surface and has the function of holding and updating the slurry. By forming a concavo-convex structure on the polishing surface, the slurry can be held and updated more efficiently. It can be performed well, and destruction of the polishing object due to adsorption with the polishing object can be prevented. The concavo-convex structure is not particularly limited as long as it is a shape that holds and renews the slurry. For example, an XY lattice groove, a concentric circular groove, a through hole, a hole that does not penetrate, a polygonal column, a cylinder, a spiral groove, Examples include eccentric circular grooves, radial grooves, and combinations of these grooves. In addition, these uneven structures are generally regular, but in order to make the slurry retention and renewability desirable, the groove pitch, groove width, groove depth, etc. should be changed for each range. Is also possible.

  The method for producing the concavo-convex structure is not particularly limited. For example, a method of machine cutting using a jig such as a tool of a predetermined size, pouring a resin into a mold having a predetermined surface shape, and curing. Using a press plate having a predetermined surface shape, a method of producing a resin by pressing, a method of producing using photolithography, a method of producing using a printing technique, a carbon dioxide laser, etc. Examples include a manufacturing method using laser light.

  The thickness of the polishing layer is not particularly limited, but is usually about 0.2 to 2 mm, and preferably 0.5 to 1.5 mm.

  The polishing pad of the present invention may be provided with a double-sided tape on the surface to be bonded to the platen.

  The semiconductor device is manufactured through a step of polishing the surface of the semiconductor wafer using the polishing pad. A semiconductor wafer is generally a laminate of a wiring metal and an oxide film on a silicon wafer. The method and apparatus for polishing the semiconductor wafer are not particularly limited. For example, as shown in FIG. 1, a polishing surface plate 2 that supports the polishing pad 1, a support table (polishing head) 5 that supports the semiconductor wafer 4, and the wafer. This is performed using a backing material for performing uniform pressurization and a polishing apparatus equipped with a polishing agent 3 supply mechanism. The polishing pad 1 is attached to the polishing surface plate 2 by attaching it with a double-sided tape, for example. The polishing surface plate 2 and the support base 5 are disposed so that the polishing pad 1 and the semiconductor wafer 4 supported on each of the polishing surface plate 2 and the support table 5 face each other, and are provided with rotating shafts 6 and 7 respectively. Further, a pressurizing mechanism for pressing the semiconductor wafer 4 against the polishing pad 1 is provided on the support base 5 side. In polishing, the semiconductor wafer 4 is pressed against the polishing pad 1 while rotating the polishing surface plate 2 and the support base 5, and polishing is performed while supplying slurry. The flow rate of the slurry, the polishing load, the polishing platen rotation speed, and the wafer rotation speed are not particularly limited and are appropriately adjusted.

  Thereby, the surface roughness of the surface of the semiconductor wafer 4 is improved, and scratches are removed. Thereafter, a semiconductor device is manufactured by dicing, bonding, packaging, or the like. The semiconductor device is used for an arithmetic processing device, a memory, and the like. Further, a glass substrate for a lens or hard disk can be finished and polished by the same method as described above.

  Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to these examples.

[Measurement and evaluation methods]
(Pot life measurement method)
Using a TV-10H viscometer (rotor: H-3, rotation speed 100 rpm, manufactured by Toki Sangyo Co., Ltd.), the increase in viscosity of the cell-dispersed urethane compositions prepared by the methods of Examples and Comparative Examples was measured. The pot life was defined as the time from the start of mixing when the mixture was added to the container until the viscosity of the cell dispersed urethane composition reached 50 Pa · s.

(Measurement of average bubble diameter)
A sample obtained by cutting the produced polyurethane foam in parallel with a razor blade as thin as possible to a thickness of 1 mm or less was used as a sample. The sample was fixed on a glass slide and observed at 100 times using SEM (S-3500N, Hitachi Science Systems, Ltd.). Using the image analysis software (WinRoof, Mitani Shoji Co., Ltd.) for the obtained image, the total bubble diameter in an arbitrary range was measured, and the average bubble diameter was calculated. However, in the case of an oval spherical bubble, the area was converted to a circle area, and the equivalent circle diameter was taken as the bubble diameter.

(Measurement of bubble size distribution)
The standard deviation was calculated based on the total bubble diameter measured by the above method to obtain the bubble diameter distribution. The value of the bubble diameter distribution is preferably 13 or less, more preferably 11 or less.

(Measurement of specific gravity)
This was performed according to JIS Z8807-1976. The produced polyurethane foam was cut into a 4 cm × 8.5 cm strip (thickness: arbitrary) as a sample and allowed to stand for 16 hours in an environment of temperature 23 ° C. ± 2 ° C. and humidity 50% ± 5%. The specific gravity was measured using a hydrometer (manufactured by Sartorius).

(Measurement of hardness)
This was performed according to JIS K-7312. The produced polyurethane foam was cut into a size of 5 cm × 5 cm (thickness: arbitrary) as a sample and allowed to stand for 16 hours in an environment of temperature 23 ° C. ± 2 ° C. and humidity 50% ± 5%. At the time of measurement, the samples were overlapped to have a thickness of 10 mm or more. Using a hardness meter (manufactured by Kobunshi Keiki Co., Ltd., Asker C type hardness meter, pressure surface height: 3 mm), the hardness 60 seconds after contacting the pressure surface was measured.

(Evaluation of polishing rate stability)
Using SPP600S (manufactured by Okamoto Machine Tool Co., Ltd.) as a polishing apparatus, the polishing rate stability of the manufactured polishing pad was evaluated. The evaluation results are shown in Table 3. The polishing conditions are as follows.
Glass plate: 6 inches φ, thickness 1.1 mm (optical glass, BK7)
Slurry: Ceria slurry (Showa Denko GPL C1010)
Slurry amount: 100 ml / min
Polishing pressure: 10kPa
Polishing platen rotation speed: 55rpm
Glass plate rotation speed: 50 rpm
Polishing time: 10 min / number of polished glass plates: 500 First, the polishing rate (Å / min) for each polished glass plate is calculated. The calculation method is as follows.
Polishing rate = [weight change amount of glass plate before and after polishing [g] / (glass plate density [g / cm ³ ] × polishing area of glass plate [cm ² ] × polishing time [min])] × 10 ⁸
The polishing rate stability (%) is the maximum polishing rate, the minimum polishing rate, and the total average polishing rate from the first glass plate to the number of processed sheets (100, 300, or 500 sheets). Is calculated by substituting that value into the following equation. As the polishing rate stability (%) is lower, the polishing rate is less likely to change even when a large number of glass plates are polished. In the present invention, the polishing rate stability after processing 500 sheets is preferably within 10%.
Polishing rate stability (%) = {(maximum polishing rate−minimum polishing rate) / total average polishing rate} × 100

Example 1
In a container, 44 parts by weight of 4,4′-diphenylmethane diisocyanate (hereinafter abbreviated as MDI), 51 parts by weight of polytetramethylene ether glycol (hereinafter abbreviated as PTMG1000) having a number average molecular weight of 1000, and 1,2-propylene glycol (hereinafter referred to as “MDI”) 5 parts by weight were added and reacted at 70 ° C. for 2 hours to obtain an isocyanate-terminated prepolymer. A container was charged with 100 parts by weight of an isocyanate-terminated prepolymer and 6 parts by weight of a silicon surfactant (manufactured by Goldschmidt, B-8443), adjusted to 70 ° C. and degassed under reduced pressure. Thereafter, vigorous stirring was performed for about 4 minutes using a stirring blade so that bubbles were taken into the reaction system at a rotation speed of 900 rpm. Thereafter, PTMG1000 (5 parts by weight), PCL305 (manufactured by Daicel Chemical Industries, polyester polyol) 2 parts by weight, 1,4-butanediol (hereinafter abbreviated as 1,4-BG) 3 parts by weight, A mixture (70 ° C.) containing 1 part by weight of methylolpropane (hereinafter abbreviated as TMP) and 0.14 part by weight of a catalyst (manufactured by Kao, Kao Raiser No. 25) was added and stirred for about 1 minute to produce a cell dispersed urethane composition A product was prepared.

  The prepared cell-dispersed urethane composition was applied onto a release-treated release sheet (manufactured by Toyobo, polyethylene terephthalate, thickness: 0.1 mm) to form a cell-dispersed urethane layer. And the base material layer (polyethylene terephthalate, thickness: 0.2 mm) was covered on this cell dispersion | distribution urethane layer. The cell-dispersed urethane layer was made 1.2 mm thick with a nip roll, and then cured at 70 ° C. for 3 hours to obtain a polyurethane foam (open cell structure, average cell diameter: 65 μm, specific gravity: 0.47, C hardness: 49 degrees. ) Was formed. Thereafter, the release sheet under the polyurethane foam was peeled off. Next, the surface of the polyurethane foam was sliced using a band saw type slicer (manufactured by Fecken) to adjust the thickness accuracy to 1.0 mm, thereby adjusting the thickness accuracy. Thereafter, a double-sided tape (double tack tape, manufactured by Sekisui Chemical Co., Ltd.) was bonded to the surface of the base material layer using a laminator to prepare a polishing pad.

Examples 2, 3 and Comparative Examples 1-3
An isocyanate-terminated prepolymer was synthesized in the same manner as in Example 1 except that the blending ratios shown in Tables 1 and 2 were adopted, and a cell-dispersed urethane composition was prepared to prepare a polishing pad. 1,3-BG in Table 1 is 1,3-butanediol.

Schematic configuration diagram showing an example of a polishing apparatus used in CMP polishing

Explanation of symbols

1: Polishing pad 2: Polishing surface plate 3: Abrasive (slurry)
4: Polishing target (semiconductor wafer, lens, glass plate)
5: Support base (polishing head)
6, 7: Rotating shaft

Claims (5)

In the polishing pad provided with the polishing layer on the base material layer, the polishing layer is made of a thermosetting polyurethane foam having substantially spherical open cells, and the thermosetting polyurethane foam has an isocyanate component and an active component. Obtained by reacting a prepolymer composition containing a hydrogen group-containing component at a functional group molar ratio of 1.55 to 2 (number of moles of isocyanate group of isocyanate component / number of moles of active hydrogen group of active hydrogen group-containing component) A polishing pad comprising an isocyanate-terminated prepolymer and a chain extender as raw material components. The polishing pad according to claim 1, wherein the polishing layer is self-adhering to the base material layer. Reacting a prepolymer composition containing an isocyanate component and an active hydrogen group-containing component in a functional group molar ratio of 1.55 to 2 (number of moles of isocyanate group in the isocyanate component / number of moles of active hydrogen group in the active hydrogen group-containing component) A silicon-based surfactant is added to the first component containing the isocyanate-terminated prepolymer obtained in this manner so as to be 0.1 to 10% by weight in the thermosetting polyurethane foam, and the first component is not reacted. Preparing a bubble dispersion in which the non-reactive gas is dispersed as fine bubbles by stirring with a reactive gas, and preparing a cell-dispersed urethane composition by mixing the bubble dispersion with a second component containing a chain extender. Forming a thermosetting polyurethane foam having substantially spherical open cells by curing the cell dispersed urethane composition. The manufacturing method of the polishing pad including the process to adjust, and the process of adjusting the thickness of a thermosetting polyurethane foam uniformly. Reacting a prepolymer composition containing an isocyanate component and an active hydrogen group-containing component in a functional group molar ratio of 1.55 to 2 (number of moles of isocyanate group in the isocyanate component / number of moles of active hydrogen group in the active hydrogen group-containing component) A silicon-based surfactant is added to the first component containing the isocyanate-terminated prepolymer obtained in this manner so as to be 0.1 to 10% by weight in the thermosetting polyurethane foam, and the first component is not reacted. Preparing a bubble dispersion in which the non-reactive gas is dispersed as fine bubbles by stirring with a reactive gas, and preparing a cell-dispersed urethane composition by mixing the bubble dispersion with a second component containing a chain extender. The step of applying the cell-dispersed urethane composition on the release sheet, the step of laminating the base material layer on the cell-dispersed urethane composition, and the bubbles while making the thickness uniform by the pressing means A method for producing a polishing pad, comprising a step of curing a dispersed urethane composition to form a thermosetting polyurethane foam having substantially spherical open cells, and a step of peeling a release sheet under the thermosetting polyurethane foam. A method for manufacturing a semiconductor device, comprising a step of polishing a surface of a semiconductor wafer using the polishing pad according to claim 1.

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