JP4722446B2 - 研磨パッド - Google Patents

研磨パッド Download PDF

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Publication number
JP4722446B2
JP4722446B2 JP2004295816A JP2004295816A JP4722446B2 JP 4722446 B2 JP4722446 B2 JP 4722446B2 JP 2004295816 A JP2004295816 A JP 2004295816A JP 2004295816 A JP2004295816 A JP 2004295816A JP 4722446 B2 JP4722446 B2 JP 4722446B2
Authority
JP
Japan
Prior art keywords
polishing
polishing pad
rad
sec
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004295816A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005136400A (ja
JP2005136400A5 (enExample
Inventor
デビッド・ビー・ジェームス
メアリー・ジョー・カルプ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
DuPont Electronic Materials Holding Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34316904&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP4722446(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US10/937,914 external-priority patent/US7074115B2/en
Application filed by DuPont Electronic Materials Holding Inc filed Critical DuPont Electronic Materials Holding Inc
Publication of JP2005136400A publication Critical patent/JP2005136400A/ja
Publication of JP2005136400A5 publication Critical patent/JP2005136400A5/ja
Application granted granted Critical
Publication of JP4722446B2 publication Critical patent/JP4722446B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/147—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face comprising assemblies of felted or spongy material; comprising pads surrounded by a flexible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
JP2004295816A 2003-10-09 2004-10-08 研磨パッド Expired - Lifetime JP4722446B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US68215803A 2003-10-09 2003-10-09
US10/682,158 2003-10-09
US10/937,914 2004-09-10
US10/937,914 US7074115B2 (en) 2003-10-09 2004-09-10 Polishing pad

Publications (3)

Publication Number Publication Date
JP2005136400A JP2005136400A (ja) 2005-05-26
JP2005136400A5 JP2005136400A5 (enExample) 2011-03-31
JP4722446B2 true JP4722446B2 (ja) 2011-07-13

Family

ID=34316904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004295816A Expired - Lifetime JP4722446B2 (ja) 2003-10-09 2004-10-08 研磨パッド

Country Status (6)

Country Link
EP (1) EP1522385B1 (enExample)
JP (1) JP4722446B2 (enExample)
KR (1) KR101092944B1 (enExample)
CN (1) CN100353502C (enExample)
DE (1) DE602004010871T2 (enExample)
SG (1) SG111222A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
WO2006026343A1 (en) * 2004-08-25 2006-03-09 J.H. Rhodes, Inc. Polishing pad and methods of improving pad removal rates and planarization
JP4757562B2 (ja) * 2005-08-04 2011-08-24 東洋ゴム工業株式会社 Ｃｕ膜研磨用研磨パッド
US7445847B2 (en) * 2006-05-25 2008-11-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7169030B1 (en) * 2006-05-25 2007-01-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7569268B2 (en) * 2007-01-29 2009-08-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US8303375B2 (en) * 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
KR101352235B1 (ko) * 2009-05-27 2014-01-15 로저스코포레이션 연마 패드, 이를 위한 폴리우레탄층, 및 규소 웨이퍼의 연마 방법
US20150059254A1 (en) * 2013-09-04 2015-03-05 Dow Global Technologies Llc Polyurethane polishing pad
US9463550B2 (en) 2014-02-19 2016-10-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US9731398B2 (en) * 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
US10688621B2 (en) * 2016-08-04 2020-06-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-defect-porous polishing pad
US20180345449A1 (en) * 2017-06-06 2018-12-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads for improved removal rate and planarization
JP6968651B2 (ja) 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
CN108047420B (zh) * 2017-11-28 2021-01-12 湖北鼎龙控股股份有限公司 一种聚氨酯抛光层及其制备方法
JP7141230B2 (ja) 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
CN112512747B (zh) 2018-09-28 2024-04-05 富士纺控股株式会社 研磨垫及研磨加工物的制造方法
KR102423956B1 (ko) * 2020-09-07 2022-07-21 에스케이씨솔믹스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
KR102811921B1 (ko) 2020-09-30 2025-05-22 후지보 홀딩스 가부시키가이샤 연마 패드 및 연마 가공물의 제조 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI228522B (en) * 1999-06-04 2005-03-01 Fuji Spinning Co Ltd Urethane molded products for polishing pad and method for making same
JP2000344902A (ja) * 1999-06-04 2000-12-12 Fuji Spinning Co Ltd 研磨パッド用ウレタン成形物の製造法及び研磨パッド用ウレタン成形物
EP1284842B1 (en) * 2000-05-27 2005-10-19 Rohm and Haas Electronic Materials CMP Holdings, Inc. Polishing pads for chemical mechanical planarization
US6454634B1 (en) * 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
JP2002124491A (ja) 2000-08-10 2002-04-26 Toray Ind Inc 研磨パッド
JP2002192457A (ja) * 2000-12-26 2002-07-10 Toyo Tire & Rubber Co Ltd 研磨材組成物及び研磨シート
JP4409758B2 (ja) * 2000-12-26 2010-02-03 東洋ゴム工業株式会社 研磨シートの製造方法
JP3359629B1 (ja) * 2001-04-09 2002-12-24 東洋紡績株式会社 ポリウレタン組成物からなる研磨パッド
US7378454B2 (en) * 2001-04-09 2008-05-27 Toyo Tire & Rubber Co., Ltd. Polyurethane composition and polishing pad
JP2004083722A (ja) * 2002-08-26 2004-03-18 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド

Also Published As

Publication number Publication date
SG111222A1 (en) 2005-05-30
KR101092944B1 (ko) 2011-12-12
KR20050034554A (ko) 2005-04-14
EP1522385B1 (en) 2007-12-26
EP1522385A3 (en) 2006-03-15
JP2005136400A (ja) 2005-05-26
DE602004010871T2 (de) 2008-12-11
CN100353502C (zh) 2007-12-05
EP1522385A2 (en) 2005-04-13
DE602004010871D1 (de) 2008-02-07
CN1638056A (zh) 2005-07-13

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